TWI579095B - Copper wire - Google Patents

Copper wire Download PDF

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Publication number
TWI579095B
TWI579095B TW101125590A TW101125590A TWI579095B TW I579095 B TWI579095 B TW I579095B TW 101125590 A TW101125590 A TW 101125590A TW 101125590 A TW101125590 A TW 101125590A TW I579095 B TWI579095 B TW I579095B
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TW
Taiwan
Prior art keywords
wire
copper
ppm
mass
grain size
Prior art date
Application number
TW101125590A
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English (en)
Chinese (zh)
Other versions
TW201306985A (zh
Inventor
Hideyuki Sagawa
Seigi Aoyama
Hiromitsu Kuroda
Toru Sumi
Keisuke Fujito
Ryohei Okada
Original Assignee
Hitachi Metals Ltd
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Publication of TW201306985A publication Critical patent/TW201306985A/zh
Application granted granted Critical
Publication of TWI579095B publication Critical patent/TWI579095B/zh

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
TW101125590A 2011-07-21 2012-07-16 Copper wire TWI579095B (zh)

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TWI548480B (zh) * 2015-03-26 2016-09-11 樂金股份有限公司 銅銲線及其製造方法
CN104810111A (zh) * 2015-04-23 2015-07-29 德州学院 信号传输用电缆线芯
MY162048A (en) 2015-06-15 2017-05-31 Nippon Micrometal Corp Bonding wire for semiconductor device
CN105161476B (zh) * 2015-06-19 2018-10-30 汕头市骏码凯撒有限公司 一种用于细间距ic封装的键合铜丝及其制造方法
EP3136435B1 (en) 2015-07-23 2022-08-31 Nippon Micrometal Corporation Bonding wire for semiconductor device
TWI556337B (zh) * 2015-07-24 2016-11-01 Nippon Micrometal Corp Connection lines for semiconductor devices
CN107887053B (zh) * 2016-09-29 2019-12-31 日立金属株式会社 镀敷铜线、镀敷绞线和绝缘电线以及镀敷铜线的制造方法
JP7468358B2 (ja) * 2018-11-29 2024-04-16 株式会社レゾナック 接合体及び半導体装置の製造方法、並びに接合用銅ペースト
CN109735738A (zh) * 2019-03-07 2019-05-10 山东融金粉末科技股份有限公司 一种低温高韧性软铜合金材料及其制备方法
EP4071256A4 (en) * 2019-12-02 2023-11-29 Nippon Micrometal Corporation COPPER CONNECTION WIRE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
CN111599782B (zh) * 2020-04-03 2022-02-22 广东佳博电子科技有限公司 一种表面镀镍的铜基键合丝及其制备方法
CN115148419B (zh) * 2022-07-14 2023-03-24 四川威纳尔特种电子材料有限公司 一种高导电抗氧微合金化铜合金键合丝及其制备方法

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JP6019547B2 (ja) 2016-11-02

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