TW200828603A - Masking of and material constraint for depositing battery layers on flexible substrates - Google Patents

Masking of and material constraint for depositing battery layers on flexible substrates Download PDF

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Publication number
TW200828603A
TW200828603A TW096136394A TW96136394A TW200828603A TW 200828603 A TW200828603 A TW 200828603A TW 096136394 A TW096136394 A TW 096136394A TW 96136394 A TW96136394 A TW 96136394A TW 200828603 A TW200828603 A TW 200828603A
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Taiwan
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substrate
sheet
curved surface
curved
spring
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TW096136394A
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English (en)
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Shawn W Snyder
Paul C Brantner
Henry L Zoetewey
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Infinite Power Solutions Inc
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Publication of TW200828603A publication Critical patent/TW200828603A/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/04Processes of manufacture in general
    • H01M4/0402Methods of deposition of the material
    • H01M4/0421Methods of deposition of the material involving vapour deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00Primary cells; Manufacture thereof
    • H01M6/40Printed batteries, e.g. thin film batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1002Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1028Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Secondary Cells (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Primary Cells (AREA)
  • Electroluminescent Light Sources (AREA)

Description

200828603 九、發明說明: 【發明所屬之技術領域】 本發明係關於遮罩技術及設備,且尤其是關於一種用 以遮軍一撓性基材(欲以一或更多材料層塗覆)的方法及設 備。 【先則技術】 固態薄膜電池及其它薄膜元件通常需要陰影遮罩以界 定電池結構之各種層。傳統平面元件結構仰賴剛性基材及 遮罩材料以及堅硬邊緣之對準程序,以將基材及遮罩對應 至一起。撓性固態薄膜電池技術之出現以及伴隨之較薄基 材及遮罩材料(兩者通常為箔片或條片形式)的運用,皆使 得限制這些撓性材料面臨更大挑戰。此外,在應用一傳統 薄膜沉積技術(例如,物理氣相沉積或化學氣相沉積)的過 程中,亦提高準確界定相關之薄膜塗覆區域的挑戰性。如 第1圖所示之既有方式係將一電池基材110置於一金屬板 115中之一袋部内,裝置一厚的剛性遮罩框架105且接著 以一鉗制構件(clamPing mechanism)120捆缚此組件。既有 方式有許多缺點。舉例而言,厚的剛性遮罩在使用時易於 變形,且不論使用多少的鉗制壓力都無法保持平坦◊傳統 的真空沉積塗覆易於在遮罩邊緣下方滲漏,因而產生一種 界限不明之薄膜廣邊緣。試圖將薄撓性基材運用於既有設 備並不順利,因為薄撓性基材及遮罩鮮少能夠平坦並平順 地放置於一平面表面上,且因而無法平滑地倚靠一既定之 5 200828603 袋部的邊緣而排列。這種配置錯誤會導致在基材表面上形 成一種位置對應不良之塗覆。在這些多層電池結構中,一 位置對應不良或邊緣界限不明之電池層易於產生不適當之 電池層互動,而導致電池失效。通常由超過一薄膜層組成 之其它薄獏元件(例如,薄膜電容器或電晶體)而言,亦有 相同之缺點。
【發明内容】 本發明係關於一種遮罩一基材之方法及設備。在一具 體實施例中,該方法包括彎曲一基材以提供一彎曲基材表 面並在該曲面上提供至少一撓性片材。舉例而言,該基材 及至少一撓性片材可以為一箔片或一條片。在一特定具體 實施例中,該曲面可以為一弧狀。在本發明之另一具體實 施例中’可提供至少一基材或片材、或複數個基材及片材。
在本發明之一具體實施例中,舉例而言,可將至少一 撓性片材和/或基材置於張力中。可藉由在大致上和該曲面 正切之方向上施加一力量以產生張力。例如,在一特定具 體實施例令可利用一彈簧銷來產生張力。彈簧銷可包含下 列之任一者,舉例而言:板片彈簧(flat leaf spring)、曲片 彈簧(bent leaf spring) '圈狀彈簧負載插銷(c〇u spHng loaded pin)、成形與/或曲片彈簧、扭轉彈簧(t〇rsi〇n spring)、或一管狀彈簧。在另一具體實施例中,可利用一 彈性材料(例如,一彈簧構件)來產生張力。在一進一步具 體實施例巾’舉例而t,可利用_離轴滾桿(r〇u_d〇wn 6 200828603 產生張力。更可利用扭矩向基材和/或撓性材料之至少—者 施加張力。 在本發明之一進一步具體實施例中,舉例而言,可單 獨對提供之每一基材和/或撓性片材產生張力。 本發明之另一具體實施例,舉例而言,提出一遮罩設 備’其包括一基材支架,以將一撓性基材固定於一彎曲狀 態;以及一張力器,以在置於撓性基材之一曲面上方的一 遮罩中產生一張力。在一具體實施例中,舉例而言,張力 器可以是一彈簧銷或一離轴滾桿。舉例而言,彎曲狀態可 以為一弧狀。 本發明之另一具體實施例,舉例而言,提出一種用以 遮罩一基材之方法,其包括下列步驟:提供一基材、在該 基材上提供至少一撓性片材、及在該至少一片材或基材中 產生張力以將每一片材之一表面形成一彎曲形狀。在本發 明之一具體實施例中,舉例而言,該基材和/或撓性片材包 括—羯片或一條片,且舉例而言,該彎曲形為一弧狀之外 形。在本發明之一具體實施例中,舉例而言,可利用一彈 菁鎖或離軸滾桿來產生張力。 【實施方式】 可以理解’本發明不限於本說明書所述之特定方法、 化合物、材料、製造技術、使用、及運用,因上述各項可 月匕有所改變。亦應理解,此處所用之名詞僅用以描述特定 具體實施例,且其本意並非限制本發明之範圍。必須注意, 7 200828603 在本說明書及附隨申請專利範圍中,單數形「一」、「一種」、 「該j包括複數型態,除非本文另有明示。因此,舉例而 言,提及「一元件」時係指稱一或更多元件且包括習知枝 藝人士已知的等價物。相似地,再舉一例,提及「一步驟」 或「一手段」時係指稱一或更多步驟或手段,且可包括子 步驟及子手段。應盡可能以最開放性之概念來理解此處所 用之所有連接詞。因此,應將「或」字理解為具有一種邏 輯上「或」之概念,而非一種邏輯上「互斥或」的概念, 除非根據上下文清楚明確地必須做不同之解釋。必須理 解,此處所述之結構亦可指稱此結構之功能等價物。能约 表達近似概念之語言應依此解釋,除非本文另有明示。 除非另有定義,此處所用之所有技術及科學名詞的意 義,跟本發明所屬領域之習知技藝人士所理解的相同。說 明書中描述較佳的方法、技術、元件、及材料,然而任何 與此處所述類似或等價之方法、技術、元件、或材料皆可 用以實作或測試本發明。可理解,此處所述結構亦可指稱 此結構之功能等價物。此處引用之所有參考文獻均以其全 文倂入作為參照。 將一乾淨、均勻之薄條片或猪片材料置於張力中以 橫越-平面、平坦表面,這會在條片或箱片及表面間產生 -區域,肖區域具有兩個大致平行且不會接觸之平面。在 引發張力之力向量(force vector)以及平面、平坦表面間 存在實質互動,因而不會產生向下夕鼓狡+ t θ J卜之轉移力。相反地,當 向橫跨一曲面之一薄箔片狀或條只始 田 求片施加一切線力時,會產 8 200828603 生向下力。簡單的向量分析顯示,即 亦會產生H ^ 隹曲辜+徑报小時, 較大之向下力。所產生之向下力妒 於產生緊漆卜力犯夠有效地用 、 之遮罩與基材介面,且因而可搖$|丨目上 定邊緣的^塗覆。 ^到具有明確界 平挺=2®,製造薄的箱狀或條片時鮮少得到均勻且 錯誤,仍:導通常會存在某些錯誤1然都是微不足道的
箔片或條片— 舉例而言, 於此箱ΠΓ 有凹壓…、及扭轉…卜,塗覆 舉例而言,即便達到一種完全平坦的箱片誤。 影遮罩,合“ q片或條片基材或陰 覆薄膜展該表面上形成時’和該表面接觸之塗 y固有的應力可能引發一變形。傳統上,在真空沉 中為了進行陰影遮罩而必須彼此堆#之基材及遮 田會因為切割、搬運及使用而彎曲。如第2圖所示,备 顯著::!表面205進行堆叠時,即使平行於該平面施加 " 、時,通常很難讓箔片或條片215、210、217係 持平坦,例如220。用以將落片或條 力 可能超過馆Η七从μ u <力 過/白片或條片材料之屈服抵抗性(yield 轡* je),而造成箔片或條片之損壞。帛3圖闡明當將 考之箔片或條片315、316、317橫過 31〇)而放i時,利用其產生之轉“ 面(例如,狐 轉移向下力之結果32〇。測 j顯不,在例如第3圖之具趙實施例的此一配置中, 泊片或條片彼此齊平所須之力相對較小。 在示範性具雜實施例中,舉例來說,可將猪片或條片 200828603 之基材及遮罩材料置於 固定於適當處,以便唯以秘過一弧型’且之後將之 支架中的位置。此_=罩與基材之關係並維持基材在 其橫過由-螺栓限制於 簡單限制構件可為-桿件, 之每一端。或者,„ 、μ弧形支架之本體中的箔片或條片 ^ ^ r ^ 可將泊片或條片之基材及遮罩材料的一 端釘扎、箝制、或以其 端對材料施加張力,且在伴;:定於適當位置,可由第二 Ο ί 針扎、箱制、或以A他方Γ 的㈣,將該第二端 洛也署拉 ,、他方式固定於適當位置。當固定於適 此時該釘扎或鉗制構件可維m或條片上之 端上之=移除外部的張力源、。此種簡單方法可包括每一 端上之固定箝制方法。 士同材料在不同應用溫度下會以不同速率膨服。舉例 而口 #統真空沉積處理會在接收塗覆之材料 能。可在此_虚饰士&热 、 、 中塗覆遮罩及基材二者。因而,產生之 溫度改變會導^絲、洛s 於 ”、罩相對於基材、相對於彼此、和/或相對 支架發生不-致的熱膨脹。材料間之熱膨脹的差異亦可 、導致該表面彼此分離,因而經常造成遮罩下發生塗覆渗 漏一:了避免此一問題,一示範性具體實施例可獨立地將 每二片或條片s於張力中,使得可藉自張力裝置中之移 周#熱膨脹造成之箔片或條片的長度變化。可想見多 種月b對這些條片材料施加必要之切線力的方式。 第4A至9C圖中闡明某些施加張力之方法的實施 例第8A及8B圖之策略和第4A至7C圖以及第9A至9C 圖所示有所不同,因為其可運用一種簡單之記憶材料塊(例 10 f t. 200828603 如,橡膠)來取代例如一金屬彈簧或复6 一八匕張力產生 然第4…CW之實施例閣明以—插槽及插鎖配 張力裝置接合至欲置於張力之條片材料的一種方 可運用箝制、連接、結合及其他方式。 第4A圖為本發明之一具體實施例的一剖面 將一板片彈簧430固定至具有一曲面46〇之一丈 而使得一彈簧力44〇載入一插銷42〇,以將基材 材415固定於具有一曲面46 0之一支架41〇。 第4B圖為本發明之一具體實施例的一剖面 將一曲片彈簧435固定至具有一曲面460之一支 而使得一彈簧力445載入一插銷420,以將基材 材415固定於具有一曲面460之一支架41〇。 第5 A圖為本發明之一具體實施例的一剖面 一圈狀彈簧530载入一插銷520,以將基材及撓性 固定於具有一曲面560之一支架510。 第5 B圖為本發明之一具體實施例的一剖面 將一成形570和/或曲片580之板片彈簧535固定 曲面560之一支架510,而使得一彈簧力載入成? 或曲片580之板片彈簧535,以將基材及撓性片 定於具有一曲面5 60之一支架510。 第5C圖闡明一成形570和/或曲片580之板片 之一具體實施例。 第6A圖為本發明之一具體實施例的一剖面 一扭轉掸簧630固定至具有一曲面66〇之一支架 裝置。雖 置作為將 法,但亦 圖’其中 架 410, 及撓性片 圖,其中 架 410, 及撓性片 圖,其中 片材515 圖,其中 至具有一 杉5 7 0和/ 材515固 彈簧535 圖,其中 6 1 0 » 而 11 200828603 使得一彈簧力載入一插銷620,以確保將基材及撓性片材 615固定於具有一曲面660之一支架610。 ^ 第6B圖為第6A圖之一剖面圖,闡明彈簧630之弯曲 端650用以將彈簧630固定至具有一曲面660之一支架 610,並以接合於插銷620之基材及撓性片材615將彈簧 630之長度640置於扭力中。 第6C圖為第6A圖之一剖面圖,闡明彈簧630之塊端 ζ、 655用以將彈簧630固定至具有一曲面660之一支架610, 並以接合於插銷62 0之基材及撓性片材615將彈簧630之 長度640置於扭力中。 第7Α圖為本發明之一具體實施例的一剖面圖,其中 裝载一傳統扭轉彈簧730,以將基材及撓性片材715緊固 至具有一曲面760之一支架710。 第7Β圖為本發明之一具體實施例的一剖面圖,其中 一矩形扭轉彈簧735載入一插銷72〇,以在基材及撓性片 材715中產生一張力,並將其緊固至具有一曲面760之一 I 支架7 1 0。 第7C圖揭示第7Β圖之扭轉彈簧的翼形設計,闡明彈 菁735之彈簧端750用以將彈簧735固定至具有一曲面760 - 之一支架710,並以接合於插銷720之基材及撓性片材715 將彈簧735之長度740置於扭力中。 • 第8Α圖為本發明之一具體實施例的一剖面圖,其中 將一彈性材料830嵌入具有一曲面86〇之一支架810的上 部中’而使得一彈簧力载入插銷820將基材及撓性片材815 12 200828603 緊固至具有一曲面860之一支架810。 第8B圖為本發明之一具體實施例的一剖面圖, 將一彈性材料830嵌入具有一曲面860之一支架810 部中’而使得一彈簧力載入插銷820將基材及撓性片材 緊固至具有一曲面860之一支架810。 第9 A圖為本發明之一具體實施例的一剖面圖, 將一管狀彈簧元件93〇固定至一插銷92〇,以將基材 性片材緊固至具有一曲面960之一支架910。 第9B圖揭示第9A圖之管狀彈簧93〇的剖視 931、932,以及可鍛接、焊接、硬焊接、壓入或錘入 中之插銷920。 第9C圖為一進一步具體實施例,其揭示第9A圖 狀彈簧930的一螺旋剖視設計931、932,以及可鍛接 接、硬焊接、壓入或錘入該管中之插銷92〇。 應特別指出’雖然第4A至7C及9A至9C圖所 實施例闡明以一彈簧銷配置將基材曲面之上的條片材 持在張力中’但亦可利用例如一離軸滾桿。 本具體實施例之一遮罩方法可利用較不昂責之遮 料。舉例而言,將薄的箔片或條片原料轉變成必須之 開孔相較於切削相同材料之較厚塊而言,前者通常較 價且耗費的時間及勞力較低。此外,薄的箔片或條片 其本身可用於更具成本效益之轉變形式,例如雷射及 切削、钱刻、塑模切削、剪力及模鍛。 將一基材绪片或條片之下表面 其中 的底 815 其中 及撓 部分 該管 之管 、焊 示之 料保 罩材 遮罩 為廉 使得 水刀 弧形 13 200828603 支架上,在一傳統真空沉積處理中產生之 比一平坦支架更為均勻。此種示範性處理 • 膜成長、沉積速率及整個塗覆區域中之性 成更一致的電池產品性能。 在不•障離本發明之精神及範圍之情形 士能夠對本發明之方法及設備進行各種修 本發明運用於各種用途及條件中。舉例而 ζ^) 範性方法及設備係用於遮罩一撓性電池, 本發明運用於多種應用,例如薄膜電子元 件,例如用於圖形設計。此外,欲產生曲 元件基材。舉例而言,可在設計及製造時 罩之一裝置基材彎曲。因此,可將這些及 恰當且合理地視為屬於下列申請專利範圍 範圍中。 【圖式簡單說明】 第1圖為一設備,用以將基材或薄膜 平坦位置中(先前技藝)。 第2圖闡明一平坦、平面保持結構中 性片材並非處於一致地平坦/平面中。 第3圖闡明具有一曲面之一支架,其 . 一曲面。其亦闡明本發明之一具體實施例 一基材來拉緊該基材及撓性片材,提供 並將一撓性片材置於該曲面上。 傳導性冷卻可能 有助於一致的薄 質,且因而能達 下,習知技藝人 改及修飾,以將 言,雖然上述示 可以理解,可將 件、及非電子元 面不必然要彎曲 ,將欲施用一遮 其它修改及修飾 之等價物的完整 保持於一固定及 ’其中基材及撓 可提供撓性片材 ’其中藉由彎曲 一彎曲基材表面 14 200828603 第4A及4B圖為本發明之具體實施例的剖面圖’其中 • 分別利用一板片彈簧及一曲片彈簧將基材及撓性片材緊固 • 至一曲面。 第5A及5B圖為本發明之具體實施例的剖面圖’其中 分別利用一圈狀彈簧負載插銷及一成形和/或曲片彈簧將 基材及撓性片材緊固至一曲面。第5C圖中闡明該成形和/ 或曲片彈簧。 ζ\ 第6Α圖為一具體實施例中的一剖面圖,其中利用一 扭轉彈簧將基材及撓性片材緊固至一曲面。 第6Β及6C圖為第6Α圖之剖面圖,闡明用以將彈簧 固定至該曲面之彈簧末端。 第7Α圖為一具體實施例的一剖面圖,其中利用一傳 統扭轉彈簧將基材及撓性片材緊固至一曲面。 第7Β及7C圖闡明一矩形扭轉彈簧之具體實施例,其 可用以在基材及撓性片材中產生張力。第7C圖詳細闡明 該矩形扭轉彈簧,並揭露其翼狀設計。 I" 第8Α及8Β圖闡明利用一彈性材料作為一彈簧之一具 體實施例。 第9Α圖闡明一管狀彈簧之一具體實施例。 第9Β圖闡明一管狀彈簧之一具體實施例。 第9C圖為一進一步具體實施例,其中該管狀彈簧元 • 件為螺旋形。 【主要元件符號說明】 15 200828603 105 厚剛性遮罩框架 115 金屬板 205 平坦表面 215 、 216 、 217 、 220 、 315 、 310 、 460 ' 560 ' 660 ' 760 > 410、 510、 610 ^ 710' 810 - 415 、 515 、 615 、 715 、 815 、 420 、 520 、 620 、 720 ' 820 ' 430 板片彈簧 440、445 彈簧力 535 板片彈簧 570 成形彈簧 640、740 彈簧長度 65 5 塊端 750 彈簧端 930 管狀彈簧元件 電池基材 鉗制構件 、317、320 箔片或條片 、960 曲面(弧) 支架 基材及撓性片材 插銷 曲片彈簀 圈狀彈簧 曲片彈簧 、735 扭轉彈簧 弯曲端 傳統扭轉彈簧 彈性材料 、93 2 剖視部分 16

Claims (1)

  1. 200828603 十、申請專利範圍: 1. 一種遮罩一基材之方法,其至少包含: 彎曲至少一基材,以提供一彎曲基材表面;以及 在該曲面上提供至少一撓性片材。 2. 如申請專利範圍第1項所述之方法,其中上述之基材至 少包括一箔片或一條片。 3. 如申請專利範圍第1項所述之方法,其更包含提供該曲 面一弧狀之外形。 4. 如申請專利範圍第1項所述之方法,其中上述之撓性片 材至少包括一箔片或條片。 5. 如申請專利範圍第1項所述之方法,其更包含將上述至 少一片材置於張力中。 6. 如申請專利範圍第1項所述之方法,其更包含將上述至 少一基材置於張力中。 7. 如申請專利範圍第5項所述之方法,其更包含在大致上 和該曲面成切線之一方向上向上述至少一片材施加一力 量0 17 200828603 8·如申請專利範圍第7項所述之方法,其更包含利用選自 • 一彈簀銷及一離軸滾桿(roll-down bar)所構成之群組的一 構件。 9.如申請專利範圍第6項所述之方法,其更包含在大致上 和該曲面成切線之一方向上向上述至少一基材施加一力 Γ 量。 10·如申請專利範圍第9項所述之方法,其更包含利用選 自一彈簧銷及一離軸滾桿所構成之群組的一構件。 11.如申請專利範圍第1項所述之方法,其更包含藉由向 上述至少一基材施加扭矩以產生張力。 c., 12.如申請專利範圍第1項所述之方法,其更包含向上述 至少一片材施加一扭矩。 13. —種遮罩設備,其至少包含: 一基材支架,用以將一撓性基材固定於一彎曲狀態中; 一張力器,用以在置於該撓性基材之一曲面上方的一遮 . 罩中產生一張力。 18 200828603 1 4.如申請專利範圍第1 3項所述之設備,其中上述之張力 * 器至少包含: • 至少一接合構件,其可和上述之片材接合,並適以在和 上述之曲面成切線的一方向上施加一力量。 15.如申請專利範圍第13項所述之設備,其中上述之張力 器係選自一彈簧銷及一離軸滾桿所構成的群組中。 C . 1 6.如申請專利範圍第1 3項所述之設備,其中上述之彎曲 狀態為一蘇狀。 1 7.如申請專利範圍第1 3項所述之設備,其中上述之張力 器係適以向上述之基材施加張力。 18. —種遮罩一基材之方法,其至少包含: C 提供至少一基材; 在上述之基材上提供至少一撓性片材;以及 在上述至少一片材或基材中產生張力,以將每一片材之 一表面形成一蠻曲外形。 • 19.如申請專利範圍第18項所述之方法,其更包含在大致 . 上和該曲面成切線之一方向上向上述至少一片材施加力 量0 19 200828603 ' 20.如申請專利範圍第18項所述之方法,其更包含在大致 • 上和該曲面成切線之方向上向上述至少一基材施加力量。 21.如申請專利範圍第18項所述之方法,其中上述之基材 至少包含一箔片或一條片。 f 22.如申請專利範圍第18項所述之方法,其更包含提供該 彎曲外形一弧狀之外形。 23. 如申請專利範圍第18項所述之方法,其中上述之撓性 片材至少包含一箔片或一條片。 24. 如申請專利範圍第18項所述之方法,其更包含對該至 少一基材施加一扭矩。 ί: 2 5.如申請專利範圍第24項所述之方法,其更包含利用選 自一彈簧銷及一離軸滾桿所構成之群組的一構件。 20
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KR101977143B1 (ko) * 2013-06-10 2019-05-10 엘지디스플레이 주식회사 표시장치 및 그 제조 방법
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KR102235338B1 (ko) 2014-09-03 2021-04-05 삼성디스플레이 주식회사 곡면형 액정표시패널 제조방법 및 곡면형 액정표시패널 제조설비
US10679853B2 (en) 2018-02-08 2020-06-09 International Business Machines Corporation Self-aligned, over etched hard mask fabrication method and structure
CN115352180B (zh) * 2022-08-08 2023-10-10 深圳市首瓷新技术科技有限公司 非平面型外观结构件背板印刷型腔结构及其治具和应用

Family Cites Families (660)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US712316A (en) 1899-10-26 1902-10-28 Francois Loppe Electric accumulator.
US948562A (en) * 1907-01-12 1910-02-08 George Hughes Signaling apparatus.
US2970180A (en) * 1959-06-17 1961-01-31 Union Carbide Corp Alkaline deferred action cell
US3616403A (en) 1968-10-25 1971-10-26 Ibm Prevention of inversion of p-type semiconductor material during rf sputtering of quartz
US3790432A (en) * 1971-12-30 1974-02-05 Nasa Reinforced polyquinoxaline gasket and method of preparing the same
US3797091A (en) 1972-05-15 1974-03-19 Du Pont Terminal applicator
US3850604A (en) 1972-12-11 1974-11-26 Gte Laboratories Inc Preparation of chalcogenide glass sputtering targets
US4111523A (en) 1973-07-23 1978-09-05 Bell Telephone Laboratories, Incorporated Thin film optical waveguide
US3939008A (en) * 1975-02-10 1976-02-17 Exxon Research And Engineering Company Use of perovskites and perovskite-related compounds as battery cathodes
US4127424A (en) 1976-12-06 1978-11-28 Ses, Incorporated Photovoltaic cell array
US4082569A (en) 1977-02-22 1978-04-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Solar cell collector
DE2849294C3 (de) 1977-11-22 1982-03-04 Asahi Kasei Kogyo K.K., Osaka Dünne Metall-Halogen-Zelle und Verfahren zu ihrer Herstellung
IE49121B1 (en) 1978-12-11 1985-08-07 Triplex Safety Glass Co Producing glass sheets of required curved shape
US4318938A (en) 1979-05-29 1982-03-09 The University Of Delaware Method for the continuous manufacture of thin film solar cells
US4442144A (en) 1980-11-17 1984-04-10 International Business Machines Corporation Method for forming a coating on a substrate
US4328297A (en) 1981-03-27 1982-05-04 Yardngy Electric Corporation Electrode
US5055704A (en) 1984-07-23 1991-10-08 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with battery housing
US4664993A (en) 1981-08-24 1987-05-12 Polaroid Corporation Laminar batteries and methods of making the same
US4756717A (en) 1981-08-24 1988-07-12 Polaroid Corporation Laminar batteries and methods of making the same
JPS58216476A (ja) 1982-06-11 1983-12-16 Hitachi Ltd 光発電蓄電装置
JPS5950027A (ja) * 1982-09-13 1984-03-22 Hitachi Ltd 二硫化チタン薄膜およびその形成法
US4518661A (en) 1982-09-28 1985-05-21 Rippere Ralph E Consolidation of wires by chemical deposition and products resulting therefrom
US4437966A (en) 1982-09-30 1984-03-20 Gte Products Corporation Sputtering cathode apparatus
JPS59217964A (ja) 1983-05-26 1984-12-08 Hitachi Ltd 薄膜電池の正極構造
JPS59227090A (ja) 1983-06-06 1984-12-20 Hitachi Ltd 不揮発性メモリ装置
DE3345659A1 (de) 1983-06-16 1984-12-20 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Keramikkoerper aus zirkoniumdioxid (zro(pfeil abwaerts)2(pfeil abwaerts)) und verfahren zu seiner herstellung
AU573631B2 (en) 1983-10-17 1988-06-16 Tosoh Corporation High strength zirconia type sintered body
DE3417732A1 (de) 1984-05-12 1986-07-10 Leybold-Heraeus GmbH, 5000 Köln Verfahren zum aufbringen von siliziumhaltigen schichten auf substraten durch katodenzerstaeubung und zerstaeubungskatode zur durchfuehrung des verfahrens
GB8414878D0 (en) 1984-06-11 1984-07-18 Gen Electric Co Plc Integrated optical waveguides
JPH06101335B2 (ja) * 1984-11-26 1994-12-12 株式会社日立製作所 全固体リチウム電池
US4785459A (en) 1985-05-01 1988-11-15 Baer Thomas M High efficiency mode matched solid state laser with transverse pumping
US4710940A (en) 1985-10-01 1987-12-01 California Institute Of Technology Method and apparatus for efficient operation of optically pumped laser
US5296089A (en) 1985-12-04 1994-03-22 Massachusetts Institute Of Technology Enhanced radiative zone-melting recrystallization method and apparatus
US5173271A (en) 1985-12-04 1992-12-22 Massachusetts Institute Of Technology Enhanced radiative zone-melting recrystallization method and apparatus
US4964877A (en) 1986-01-14 1990-10-23 Wilson Greatbatch Ltd. Non-aqueous lithium battery
US4668593A (en) 1986-08-29 1987-05-26 Eltron Research, Inc. Solvated electron lithium electrode for high energy density battery
US4977007A (en) 1986-09-19 1990-12-11 Matsushita Electrical Indust. Co. Solid electrochemical element and production process therefor
US4740431A (en) 1986-12-22 1988-04-26 Spice Corporation Integrated solar cell and battery
US4728588A (en) 1987-06-01 1988-03-01 The Dow Chemical Company Secondary battery
US4865428A (en) 1987-08-21 1989-09-12 Corrigan Dennis A Electrooptical device
JP2692816B2 (ja) 1987-11-13 1997-12-17 株式会社きもと 薄型一次電池
US4826743A (en) 1987-12-16 1989-05-02 General Motors Corporation Solid-state lithium battery
US4878094A (en) 1988-03-30 1989-10-31 Minko Balkanski Self-powered electronic component and manufacturing method therefor
US4915810A (en) 1988-04-25 1990-04-10 Unisys Corporation Target source for ion beam sputter deposition
US4903326A (en) * 1988-04-27 1990-02-20 Motorola, Inc. Detachable battery pack with a built-in broadband antenna
US5096852A (en) 1988-06-02 1992-03-17 Burr-Brown Corporation Method of making plastic encapsulated multichip hybrid integrated circuits
US5403680A (en) 1988-08-30 1995-04-04 Osaka Gas Company, Ltd. Photolithographic and electron beam lithographic fabrication of micron and submicron three-dimensional arrays of electronically conductive polymers
FR2638764B1 (fr) 1988-11-04 1993-05-07 Centre Nat Rech Scient Element composite comportant une couche en chalcogenure ou oxychalcogenure de titane, utilisable en particulier comme electrode positive dans une cellule electrochimique en couches minces
JPH02133599A (ja) 1988-11-11 1990-05-22 Agency Of Ind Science & Technol 酸化イリジウム膜の製造方法
US5100821A (en) 1989-04-24 1992-03-31 Motorola, Inc. Semiconductor AC switch
US5006737A (en) 1989-04-24 1991-04-09 Motorola Inc. Transformerless semiconductor AC switch having internal biasing means
US5540742A (en) 1989-05-01 1996-07-30 Brother Kogyo Kabushiki Kaisha Method of fabricating thin film cells and printed circuit boards containing thin film cells using a screen printing process
US5217828A (en) 1989-05-01 1993-06-08 Brother Kogyo Kabushiki Kaisha Flexible thin film cell including packaging material
JP2808660B2 (ja) 1989-05-01 1998-10-08 ブラザー工業株式会社 薄膜電池内蔵プリント基板の製造方法
US5221891A (en) 1989-07-31 1993-06-22 Intermatic Incorporated Control circuit for a solar-powered rechargeable power source and load
US5119269A (en) 1989-08-23 1992-06-02 Seiko Epson Corporation Semiconductor with a battery unit
US5792550A (en) 1989-10-24 1998-08-11 Flex Products, Inc. Barrier film having high colorless transparency and method
JP2758948B2 (ja) 1989-12-15 1998-05-28 キヤノン株式会社 薄膜形成方法
DE4022090A1 (de) 1989-12-18 1991-06-20 Forschungszentrum Juelich Gmbh Elektro-optisches bauelement und verfahren zu dessen herstellung
US5169408A (en) 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5252194A (en) 1990-01-26 1993-10-12 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
US5196374A (en) 1990-01-26 1993-03-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
US5124782A (en) 1990-01-26 1992-06-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
US5085904A (en) * 1990-04-20 1992-02-04 E. I. Du Pont De Nemours And Company Barrier materials useful for packaging
US5306569A (en) 1990-06-15 1994-04-26 Hitachi Metals, Ltd. Titanium-tungsten target material and manufacturing method thereof
JP2755471B2 (ja) 1990-06-29 1998-05-20 日立電線株式会社 希土類元素添加光導波路及びその製造方法
US5225288A (en) 1990-08-10 1993-07-06 E. I. Du Pont De Nemours And Company Solvent blockers and multilayer barrier coatings for thin films
US5645626A (en) 1990-08-10 1997-07-08 Bend Research, Inc. Composite hydrogen separation element and module
US5147985A (en) 1990-08-14 1992-09-15 The Scabbard Corporation Sheet batteries as substrate for electronic circuit
US5110694A (en) 1990-10-11 1992-05-05 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Secondary Li battery incorporating 12-Crown-4 ether
US5110696A (en) 1990-11-09 1992-05-05 Bell Communications Research Rechargeable lithiated thin film intercalation electrode battery
US5273608A (en) 1990-11-29 1993-12-28 United Solar Systems Corporation Method of encapsulating a photovoltaic device
US5493177A (en) * 1990-12-03 1996-02-20 The Regents Of The University Of California Sealed micromachined vacuum and gas filled devices
US5057385A (en) 1990-12-14 1991-10-15 Hope Henry F Battery packaging construction
NL9002844A (nl) 1990-12-21 1992-07-16 Philips Nv Systeem omvattende een apparaat en een cassette, alsmede een apparaat en een cassette geschikt voor toepassing in een dergelijk systeem.
CA2056139C (en) 1991-01-31 2000-08-01 John C. Bailey Electrochromic thin film state-of-charge detector for on-the-cell application
US5227264A (en) 1991-02-14 1993-07-13 Hydro-Quebec Device for packaging a lithium battery
US6110531A (en) 1991-02-25 2000-08-29 Symetrix Corporation Method and apparatus for preparing integrated circuit thin films by chemical vapor deposition
US5180645A (en) * 1991-03-01 1993-01-19 Motorola, Inc. Integral solid state embedded power supply
US5119460A (en) 1991-04-25 1992-06-02 At&T Bell Laboratories Erbium-doped planar optical device
US5200029A (en) 1991-04-25 1993-04-06 At&T Bell Laboratories Method of making a planar optical amplifier
US5107538A (en) 1991-06-06 1992-04-21 At&T Bell Laboratories Optical waveguide system comprising a rare-earth Si-based optical device
US5208121A (en) 1991-06-18 1993-05-04 Wisconsin Alumni Research Foundation Battery utilizing ceramic membranes
US5153710A (en) 1991-07-26 1992-10-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with laminated backup cell
US5187564A (en) * 1991-07-26 1993-02-16 Sgs-Thomson Microelectronics, Inc. Application of laminated interconnect media between a laminated power source and semiconductor devices
US5171413A (en) 1991-09-16 1992-12-15 Tufts University Methods for manufacturing solid state ionic devices
US5196041A (en) 1991-09-17 1993-03-23 The Charles Stark Draper Laboratory, Inc. Method of forming an optical channel waveguide by gettering
US5355089A (en) 1992-07-22 1994-10-11 Duracell Inc. Moisture barrier for battery with electrochemical tester
JP2755844B2 (ja) 1991-09-30 1998-05-25 シャープ株式会社 プラスチック基板液晶表示素子
US5702829A (en) 1991-10-14 1997-12-30 Commissariat A L'energie Atomique Multilayer material, anti-erosion and anti-abrasion coating incorporating said multilayer material
EP0570590B1 (en) 1991-12-06 1997-03-26 Yuasa Corporation Thin battery and monolithic thin battery
ATE153912T1 (de) * 1991-12-11 1997-06-15 Mobil Oil Corp Hoch sperrender film
US5287427A (en) * 1992-05-05 1994-02-15 At&T Bell Laboratories Method of making an article comprising an optical component, and article comprising the component
US5497140A (en) * 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
US6144916A (en) 1992-05-15 2000-11-07 Micron Communications, Inc. Itinerary monitoring system for storing a plurality of itinerary data points
SE470081B (sv) 1992-05-19 1993-11-01 Gustavsson Magnus Peter M Elektriskt uppvärmt plagg eller liknande
US6045652A (en) 1992-06-17 2000-04-04 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5779839A (en) 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US6741178B1 (en) 1992-06-17 2004-05-25 Micron Technology, Inc Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
US5326652A (en) 1993-01-25 1994-07-05 Micron Semiconductor, Inc. Battery package and method using flexible polymer films having a deposited layer of an inorganic material
DE4345610B4 (de) 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5338625A (en) * 1992-07-29 1994-08-16 Martin Marietta Energy Systems, Inc. Thin film battery and method for making same
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
JP3214910B2 (ja) * 1992-08-18 2001-10-02 富士通株式会社 平面導波路型光増幅器の製造方法
JPH0680284A (ja) * 1992-08-31 1994-03-22 Sony Magnescale Inc 回転体保持装置
US5538796A (en) 1992-10-13 1996-07-23 General Electric Company Thermal barrier coating system having no bond coat
US5597661A (en) * 1992-10-23 1997-01-28 Showa Denko K.K. Solid polymer electrolyte, battery and solid-state electric double layer capacitor using the same as well as processes for the manufacture thereof
JP3231900B2 (ja) 1992-10-28 2001-11-26 株式会社アルバック 成膜装置
US5326653A (en) 1992-10-29 1994-07-05 Valence Technology, Inc. Battery unit with reinforced current collector tabs and method of making a battery unit having strengthened current collector tabs
JP3214107B2 (ja) * 1992-11-09 2001-10-02 富士電機株式会社 電池搭載集積回路装置
US5942089A (en) 1996-04-22 1999-08-24 Northwestern University Method for sputtering compounds on a substrate
JPH06158308A (ja) 1992-11-24 1994-06-07 Hitachi Metals Ltd インジウム・スズ酸化物膜用スパッタリング用ターゲットおよびその製造方法
US5279624A (en) 1992-11-27 1994-01-18 Gould Inc. Solder sealed solid electrolyte cell housed within a ceramic frame and the method for producing it
US5307240A (en) 1992-12-02 1994-04-26 Intel Corporation Chiplid, multichip semiconductor package design concept
US6022458A (en) 1992-12-07 2000-02-08 Canon Kabushiki Kaisha Method of production of a semiconductor substrate
AU669754B2 (en) 1992-12-18 1996-06-20 Becton Dickinson & Company Barrier coating
US5303319A (en) 1992-12-28 1994-04-12 Honeywell Inc. Ion-beam deposited multilayer waveguides and resonators
SE500725C2 (sv) 1992-12-29 1994-08-15 Volvo Ab Anordning vid paneler för farkoster
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5427669A (en) 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
US5547780A (en) 1993-01-18 1996-08-20 Yuasa Corporation Battery precursor and a battery
US5300461A (en) 1993-01-25 1994-04-05 Intel Corporation Process for fabricating sealed semiconductor chip using silicon nitride passivation film
US5338624A (en) 1993-02-08 1994-08-16 Globe-Union Inc. Thermal management of rechargeable batteries
JPH06279185A (ja) 1993-03-25 1994-10-04 Canon Inc ダイヤモンド結晶およびダイヤモンド結晶膜の形成方法
US5262254A (en) 1993-03-30 1993-11-16 Valence Technology, Inc. Positive electrode for rechargeable lithium batteries
US5613995A (en) 1993-04-23 1997-03-25 Lucent Technologies Inc. Method for making planar optical waveguides
US5665490A (en) * 1993-06-03 1997-09-09 Showa Denko K.K. Solid polymer electrolyte, battery and solid-state electric double layer capacitor using the same as well as processes for the manufacture thereof
US5464692A (en) * 1993-06-17 1995-11-07 Quality Manufacturing Incorporated Flexible masking tape
SG46607A1 (en) 1993-07-28 1998-02-20 Asahi Glass Co Ltd Method of an apparatus for sputtering
US5499207A (en) 1993-08-06 1996-03-12 Hitachi, Ltd. Semiconductor memory device having improved isolation between electrodes, and process for fabricating the same
US5360686A (en) 1993-08-20 1994-11-01 The United States Of America As Represented By The National Aeronautics And Space Administration Thin composite solid electrolyte film for lithium batteries
US5599355A (en) * 1993-08-20 1997-02-04 Nagasubramanian; Ganesan Method for forming thin composite solid electrolyte film for lithium batteries
JP2642849B2 (ja) 1993-08-24 1997-08-20 株式会社フロンテック 薄膜の製造方法および製造装置
US5478456A (en) 1993-10-01 1995-12-26 Minnesota Mining And Manufacturing Company Sputtering target
DE69430230T2 (de) 1993-10-14 2002-10-31 Mega Chips Corp., Osaka Verfahren und Vorrichtung zur Herstellung eines Einkristallinen dünnen Films
US5314765A (en) 1993-10-14 1994-05-24 Martin Marietta Energy Systems, Inc. Protective lithium ion conducting ceramic coating for lithium metal anodes and associate method
US5411537A (en) 1993-10-29 1995-05-02 Intermedics, Inc. Rechargeable biomedical battery powered devices with recharging and control system therefor
US5445856A (en) 1993-11-10 1995-08-29 Chaloner-Gill; Benjamin Protective multilayer laminate for covering an electrochemical device
US5738731A (en) 1993-11-19 1998-04-14 Mega Chips Corporation Photovoltaic device
US5512387A (en) 1993-11-19 1996-04-30 Ovonic Battery Company, Inc. Thin-film, solid state battery employing an electrically insulating, ion conducting electrolyte material
US5985485A (en) 1993-11-19 1999-11-16 Ovshinsky; Stanford R. Solid state battery having a disordered hydrogenated carbon negative electrode
US5487822A (en) 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
US5433835B1 (en) * 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
US5387482A (en) 1993-11-26 1995-02-07 Motorola, Inc. Multilayered electrolyte and electrochemical cells used same
US5654984A (en) 1993-12-03 1997-08-05 Silicon Systems, Inc. Signal modulation across capacitors
US5419982A (en) 1993-12-06 1995-05-30 Valence Technology, Inc. Corner tab termination for flat-cell batteries
US5569520A (en) 1994-01-12 1996-10-29 Martin Marietta Energy Systems, Inc. Rechargeable lithium battery for use in applications requiring a low to high power output
US5961672A (en) 1994-02-16 1999-10-05 Moltech Corporation Stabilized anode for lithium-polymer batteries
US5561004A (en) 1994-02-25 1996-10-01 Bates; John B. Packaging material for thin film lithium batteries
US5464706A (en) 1994-03-02 1995-11-07 Dasgupta; Sankar Current collector for lithium ion battery
US6408402B1 (en) * 1994-03-22 2002-06-18 Hyperchip Inc. Efficient direct replacement cell fault tolerant architecture
US5475528A (en) 1994-03-25 1995-12-12 Corning Incorporated Optical signal amplifier glasses
US5470396A (en) 1994-04-12 1995-11-28 Amoco Corporation Solar cell module package and method for its preparation
US5805223A (en) 1994-05-25 1998-09-08 Canon Kk Image encoding apparatus having an intrapicture encoding mode and interpicture encoding mode
US5411592A (en) 1994-06-06 1995-05-02 Ovonic Battery Company, Inc. Apparatus for deposition of thin-film, solid state batteries
CA2169350A1 (en) 1994-06-13 1995-12-21 Mitsui Chemicals, Incorporated Lithium ionic conducting glass thin film and carbon dioxide sensor comprising the glass thin film
US5472795A (en) 1994-06-27 1995-12-05 Board Of Regents Of The University Of The University Of Wisconsin System, On Behalf Of The University Of Wisconsin-Milwaukee Multilayer nanolaminates containing polycrystalline zirconia
WO1996000996A1 (en) 1994-06-30 1996-01-11 The Whitaker Corporation Planar hybrid optical amplifier
US5457569A (en) 1994-06-30 1995-10-10 At&T Ipm Corp. Semiconductor amplifier or laser having integrated lens
JP3407409B2 (ja) 1994-07-27 2003-05-19 富士通株式会社 高誘電率薄膜の製造方法
US5504041A (en) 1994-08-01 1996-04-02 Texas Instruments Incorporated Conductive exotic-nitride barrier layer for high-dielectric-constant materials
US6181283B1 (en) * 1994-08-01 2001-01-30 Rangestar Wireless, Inc. Selectively removable combination battery and antenna assembly for a telecommunication device
US5445906A (en) 1994-08-03 1995-08-29 Martin Marietta Energy Systems, Inc. Method and system for constructing a rechargeable battery and battery structures formed with the method
US5458995A (en) 1994-08-12 1995-10-17 The United States Of America As Represented By The Secretary Of The Army Solid state electrochemical cell including lithium iodide as an electrolyte additive
US5483613A (en) * 1994-08-16 1996-01-09 At&T Corp. Optical device with substrate and waveguide structure having thermal matching interfaces
US5909346A (en) 1994-08-26 1999-06-01 Aiwa Research & Development, Inc. Thin magnetic film including multiple geometry gap structures on a common substrate
US5498489A (en) 1995-04-14 1996-03-12 Dasgupta; Sankar Rechargeable non-aqueous lithium battery having stacked electrochemical cells
US5437692A (en) 1994-11-02 1995-08-01 Dasgupta; Sankar Method for forming an electrode-electrolyte assembly
JPH08148709A (ja) 1994-11-15 1996-06-07 Mitsubishi Electric Corp 薄型太陽電池の製造方法及び薄型太陽電池の製造装置
US7162392B2 (en) * 1994-11-21 2007-01-09 Phatrat Technology, Inc. Sport performance systems for measuring athletic performance, and associated methods
US6025094A (en) * 1994-11-23 2000-02-15 Polyplus Battery Company, Inc. Protective coatings for negative electrodes
US6204111B1 (en) 1994-12-28 2001-03-20 Matsushita Electronics Corporation Fabrication method of capacitor for integrated circuit
CN1075243C (zh) 1994-12-28 2001-11-21 松下电器产业株式会社 集成电路用电容元件及其制造方法
US5555342A (en) 1995-01-17 1996-09-10 Lucent Technologies Inc. Planar waveguide and a process for its fabrication
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US5755831A (en) 1995-02-22 1998-05-26 Micron Communications, Inc. Method of forming a button-type battery and a button-type battery with improved separator construction
US6444750B1 (en) 1995-03-06 2002-09-03 Exxonmobil Oil Corp. PVOH-based coating solutions
CA2218279A1 (en) 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
US5771562A (en) 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
US6248291B1 (en) 1995-05-18 2001-06-19 Asahi Glass Company Ltd. Process for producing sputtering targets
US5645960A (en) 1995-05-19 1997-07-08 The United States Of America As Represented By The Secretary Of The Air Force Thin film lithium polymer battery
US5601952A (en) * 1995-05-24 1997-02-11 Dasgupta; Sankar Lithium-Manganese oxide electrode for a rechargeable lithium battery
US5622652A (en) 1995-06-07 1997-04-22 Img Group Limited Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid
US6265652B1 (en) 1995-06-15 2001-07-24 Kanegafuchi Kagaku Kogyo Kabushiki Kabushiki Kaisha Integrated thin-film solar battery and method of manufacturing the same
KR100342189B1 (ko) 1995-07-12 2002-11-30 삼성전자 주식회사 휘발성복합체를사용한희토류원소첨가광섬유제조방법
US6459418B1 (en) 1995-07-20 2002-10-01 E Ink Corporation Displays combining active and non-active inks
US6639578B1 (en) 1995-07-20 2003-10-28 E Ink Corporation Flexible displays
US6118426A (en) 1995-07-20 2000-09-12 E Ink Corporation Transducers and indicators having printed displays
US5677784A (en) 1995-07-24 1997-10-14 Ellis D. Harris Sr. Family Trust Array of pellicle optical gates
EP0761838B1 (de) 1995-08-18 2001-08-08 W.C. Heraeus GmbH & Co. KG Target für die Kathodenzerstäubung und Verfahren zur Herstellung eines solchen Targets
US5563979A (en) 1995-08-31 1996-10-08 Lucent Technologies Inc. Erbium-doped planar optical device
US5582935A (en) 1995-09-28 1996-12-10 Dasgupta; Sankar Composite electrode for a lithium battery
US5689522A (en) 1995-10-02 1997-11-18 The Regents Of The University Of California High efficiency 2 micrometer laser utilizing wing-pumped Tm3+ and a laser diode array end-pumping architecture
US5716736A (en) 1995-10-06 1998-02-10 Midwest Research Institute Solid lithium-ion electrolyte
US5616933A (en) 1995-10-16 1997-04-01 Sony Corporation Nitride encapsulated thin film transistor fabrication technique
US5719976A (en) * 1995-10-24 1998-02-17 Lucent Technologies, Inc. Optimized waveguide structure
JP3298799B2 (ja) 1995-11-22 2002-07-08 ルーセント テクノロジーズ インコーポレイテッド クラッディングポンプファイバとその製造方法
US5686360A (en) 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5811177A (en) 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US6608464B1 (en) 1995-12-11 2003-08-19 The Johns Hopkins University Integrated power source layered with thin film rechargeable batteries, charger, and charge-control
US5644207A (en) 1995-12-11 1997-07-01 The Johns Hopkins University Integrated power source
US5897522A (en) 1995-12-20 1999-04-27 Power Paper Ltd. Flexible thin layer open electrochemical cell and applications of same
US5955161A (en) 1996-01-30 1999-09-21 Becton Dickinson And Company Blood collection tube assembly
US5637418A (en) 1996-02-08 1997-06-10 Motorola, Inc. Package for a flat electrochemical device
US5721067A (en) * 1996-02-22 1998-02-24 Jacobs; James K. Rechargeable lithium battery having improved reversible capacity
US5845990A (en) 1996-03-11 1998-12-08 Hilite Systems, L.L.C. High signal lights for automotive vehicles
US5930584A (en) 1996-04-10 1999-07-27 United Microelectronics Corp. Process for fabricating low leakage current electrode for LPCVD titanium oxide films
JPH1010675A (ja) 1996-04-22 1998-01-16 Fuji Photo Film Co Ltd 記録材料
JP3346167B2 (ja) * 1996-05-27 2002-11-18 三菱マテリアル株式会社 高強度誘電体スパッタリングターゲットおよびその製造方法並びに膜
WO1997047695A1 (en) 1996-06-12 1997-12-18 Hoechst Trespaphan Gmbh Transparent barrier coatings exhibiting reduced thin film interference
US5948464A (en) 1996-06-19 1999-09-07 Imra America, Inc. Process of manufacturing porous separator for electrochemical power supply
EP0814529A1 (fr) 1996-06-19 1997-12-29 Koninklijke Philips Electronics N.V. Carte mince comprenant un accumulateur plat et des contacts
US5731661A (en) 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5855744A (en) 1996-07-19 1999-01-05 Applied Komatsu Technology, Inc. Non-planar magnet tracking during magnetron sputtering
US5693956A (en) 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
JP3825843B2 (ja) 1996-09-12 2006-09-27 キヤノン株式会社 太陽電池モジュール
EP0951742A1 (en) 1996-10-11 1999-10-27 Massachusetts Institute Of Technology Polymer electrolyte, intercalation compounds and electrodes for batteries
US6007945A (en) 1996-10-15 1999-12-28 Electrofuel Inc. Negative electrode for a rechargeable lithium battery comprising a solid solution of titanium dioxide and tin dioxide
JP3631341B2 (ja) * 1996-10-18 2005-03-23 Tdk株式会社 積層型複合機能素子およびその製造方法
US5841931A (en) 1996-11-26 1998-11-24 Massachusetts Institute Of Technology Methods of forming polycrystalline semiconductor waveguides for optoelectronic integrated circuits, and devices formed thereby
US5783333A (en) 1996-11-27 1998-07-21 Polystor Corporation Lithium nickel cobalt oxides for positive electrodes
KR100498563B1 (ko) 1996-12-11 2005-10-06 도넨카가쿠가부시키가이샤 비프로톤성전해질박막,고정화액막도전체및폴리머전지
US6144795A (en) * 1996-12-13 2000-11-07 Corning Incorporated Hybrid organic-inorganic planar optical waveguide device
US6289209B1 (en) * 1996-12-18 2001-09-11 Micron Technology, Inc. Wireless communication system, radio frequency communications system, wireless communications method, radio frequency communications method
US5842118A (en) * 1996-12-18 1998-11-24 Micron Communications, Inc. Communication system including diversity antenna queuing
JPH10195649A (ja) 1996-12-27 1998-07-28 Sony Corp マグネトロンスパッタ装置および半導体装置の製造方法
US5705293A (en) * 1997-01-09 1998-01-06 Lockheed Martin Energy Research Corporation Solid state thin film battery having a high temperature lithium alloy anode
US5882812A (en) 1997-01-14 1999-03-16 Polyplus Battery Company, Inc. Overcharge protection systems for rechargeable batteries
US5790489A (en) 1997-01-21 1998-08-04 Dell Usa, L.P. Smart compact disk including a processor and a transmission element
JP4104187B2 (ja) 1997-02-06 2008-06-18 株式会社クレハ 二次電池電極用炭素質材料
US5944964A (en) 1997-02-13 1999-08-31 Optical Coating Laboratory, Inc. Methods and apparatus for preparing low net stress multilayer thin film coatings
JPH10229201A (ja) 1997-02-14 1998-08-25 Sony Corp 薄膜半導体装置の製造方法
JP3345878B2 (ja) 1997-02-17 2002-11-18 株式会社デンソー 電子回路装置の製造方法
US5847865A (en) 1997-02-18 1998-12-08 Regents Of The University Of Minnesota Waveguide optical amplifier
US5970393A (en) 1997-02-25 1999-10-19 Polytechnic University Integrated micro-strip antenna apparatus and a system utilizing the same for wireless communications for sensing and actuation purposes
JP3767151B2 (ja) 1997-02-26 2006-04-19 ソニー株式会社 薄型電池
JPH10302843A (ja) 1997-02-28 1998-11-13 Mitsubishi Electric Corp 電池用接着剤及びそれを用いた電池とその製造法
JP3098204B2 (ja) 1997-03-07 2000-10-16 ティーディーケイ株式会社 光磁気記録用合金ターゲット、その製造方法およびその再生方法
US5952778A (en) 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
JPH10265948A (ja) 1997-03-25 1998-10-06 Rohm Co Ltd 半導体装置用基板およびその製法
ATE199196T1 (de) 1997-03-27 2001-02-15 Tno Erbiumdotierter planarer wellenleiter
US6106933A (en) 1997-04-03 2000-08-22 Toray Industries, Inc. Transparent gas barrier biaxially oriented polypropylene film, a laminate film, and a production method thereof
US6242132B1 (en) 1997-04-16 2001-06-05 Ut-Battelle, Llc Silicon-tin oxynitride glassy composition and use as anode for lithium-ion battery
US5948215A (en) 1997-04-21 1999-09-07 Tokyo Electron Limited Method and apparatus for ionized sputtering
DE69802134T2 (de) * 1997-04-23 2002-03-07 Hydro-Quebec, Montreal Dünnschicht Feststoff Lithiumzellen und Verfahren zur Herstellung
US6422698B2 (en) 1997-04-28 2002-07-23 Binney & Smith Inc. Ink jet marker
US6394598B1 (en) 1997-04-28 2002-05-28 Binney & Smith Inc. Ink jet marker
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
US5882721A (en) 1997-05-01 1999-03-16 Imra America Inc Process of manufacturing porous separator for electrochemical power supply
JP3290375B2 (ja) 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
JP3045998B2 (ja) 1997-05-15 2000-05-29 エフエムシー・コーポレイション 層間化合物およびその作製方法
US5895731A (en) 1997-05-15 1999-04-20 Nelson E. Smith Thin-film lithium battery and process
US5830330A (en) 1997-05-22 1998-11-03 Tokyo Electron Limited Method and apparatus for low pressure sputtering
US5977582A (en) 1997-05-23 1999-11-02 Lucent Technologies Inc. Capacitor comprising improved TaOx -based dielectric
US6000603A (en) 1997-05-23 1999-12-14 3M Innovative Properties Company Patterned array of metal balls and methods of making
US6316563B2 (en) 1997-05-27 2001-11-13 Showa Denko K.K. Thermopolymerizable composition and use thereof
US6077106A (en) 1997-06-05 2000-06-20 Micron Communications, Inc. Thin profile battery mounting contact for printed circuit boards
KR19990007150A (ko) 1997-06-20 1999-01-25 이데이 노부유끼 전지
US5865860A (en) * 1997-06-20 1999-02-02 Imra America, Inc. Process for filling electrochemical cells with electrolyte
US6051114A (en) 1997-06-23 2000-04-18 Applied Materials, Inc. Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition
US5831262A (en) 1997-06-27 1998-11-03 Lucent Technologies Inc. Article comprising an optical fiber attached to a micromechanical device
JP3813740B2 (ja) 1997-07-11 2006-08-23 Tdk株式会社 電子デバイス用基板
US5982144A (en) 1997-07-14 1999-11-09 Johnson Research & Development Company, Inc. Rechargeable battery power supply overcharge protection circuit
JP3335884B2 (ja) 1997-07-16 2002-10-21 株式会社荏原製作所 腐食・防食解析方法
US5973913A (en) 1997-08-12 1999-10-26 Covalent Associates, Inc. Nonaqueous electrical storage device
KR100250855B1 (ko) 1997-08-28 2000-04-01 손욱 하이브리드 폴리머 전해질, 그 제조 방법 및 이를 사용하여제조한 리튬 전지
US6252564B1 (en) 1997-08-28 2001-06-26 E Ink Corporation Tiled displays
JPH11111273A (ja) 1997-09-29 1999-04-23 Furukawa Battery Co Ltd:The リチウム二次電池用極板の製造法及びリチウム二次電池
US6156452A (en) 1997-10-07 2000-12-05 Matsushita Electric Indsutrial Co., Ltd. Non-aqueous electrolyte secondary cell
US5916704A (en) 1997-10-10 1999-06-29 Ultralife Batteries Low pressure battery vent
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
US6094292A (en) 1997-10-15 2000-07-25 Trustees Of Tufts College Electrochromic window with high reflectivity modulation
US6982132B1 (en) * 1997-10-15 2006-01-03 Trustees Of Tufts College Rechargeable thin film battery and method for making the same
US5985484A (en) 1997-10-20 1999-11-16 Amtek Research International Llc Battery separation
US6084285A (en) * 1997-10-20 2000-07-04 The Board Of Trustees Of The Leland Stanford Junior University Lateral flux capacitor having fractal-shaped perimeters
DE69807513T2 (de) 1997-10-22 2003-04-24 Cambridge Consultants Ltd., Cambridge Tragbare chipkarte
US5948562A (en) 1997-11-03 1999-09-07 Motorola, Inc. Energy storage device
US6041734A (en) 1997-12-01 2000-03-28 Applied Materials, Inc. Use of an asymmetric waveform to control ion bombardment during substrate processing
US6052397A (en) 1997-12-05 2000-04-18 Sdl, Inc. Laser diode device having a substantially circular light output beam and a method of forming a tapered section in a semiconductor device to provide for a reproducible mode profile of the output beam
US6042965A (en) 1997-12-12 2000-03-28 Johnson Research & Development Company, Inc. Unitary separator and electrode structure and method of manufacturing separator
US6120890A (en) 1997-12-12 2000-09-19 Seagate Technology, Inc. Magnetic thin film medium comprising amorphous sealing layer for reduced lithium migration
US5976327A (en) 1997-12-12 1999-11-02 Applied Materials, Inc. Step coverage and overhang improvement by pedestal bias voltage modulation
US6045942A (en) 1997-12-15 2000-04-04 Avery Dennison Corporation Low profile battery and method of making same
US6019284A (en) * 1998-01-27 2000-02-01 Viztec Inc. Flexible chip card with display
US6137671A (en) 1998-01-29 2000-10-24 Energenius, Inc. Embedded energy storage device
EP1055020A2 (en) 1998-02-12 2000-11-29 ACM Research, Inc. Plating apparatus and method
US6402795B1 (en) 1998-02-18 2002-06-11 Polyplus Battery Company, Inc. Plating metal negative electrodes under protective coatings
US6753108B1 (en) 1998-02-24 2004-06-22 Superior Micropowders, Llc Energy devices and methods for the fabrication of energy devices
US6223317B1 (en) 1998-02-28 2001-04-24 Micron Technology, Inc. Bit synchronizers and methods of synchronizing and calculating error
US6080508A (en) 1998-03-06 2000-06-27 Electrofuel Inc. Packaging assembly for a lithium battery
US6610440B1 (en) 1998-03-10 2003-08-26 Bipolar Technologies, Inc Microscopic batteries for MEMS systems
US6004660A (en) 1998-03-12 1999-12-21 E.I. Du Pont De Nemours And Company Oxygen barrier composite film structure
US5889383A (en) 1998-04-03 1999-03-30 Advanced Micro Devices, Inc. System and method for charging batteries with ambient acoustic energy
GB9808061D0 (en) 1998-04-16 1998-06-17 Cambridge Display Tech Ltd Polymer devices
US6563998B1 (en) 1999-04-15 2003-05-13 John Farah Polished polymide substrate
US6753114B2 (en) 1998-04-20 2004-06-22 Electrovaya Inc. Composite electrolyte for a rechargeable lithium battery
US6175075B1 (en) * 1998-04-21 2001-01-16 Canon Kabushiki Kaisha Solar cell module excelling in reliability
US6169474B1 (en) * 1998-04-23 2001-01-02 Micron Technology, Inc. Method of communications in a backscatter system, interrogator, and backscatter communications system
US6324211B1 (en) 1998-04-24 2001-11-27 Micron Technology, Inc. Interrogators communication systems communication methods and methods of processing a communication signal
US6459726B1 (en) 1998-04-24 2002-10-01 Micron Technology, Inc. Backscatter interrogators, communication systems and backscatter communication methods
US6905578B1 (en) 1998-04-27 2005-06-14 Cvc Products, Inc. Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure
US6214061B1 (en) 1998-05-01 2001-04-10 Polyplus Battery Company, Inc. Method for forming encapsulated lithium electrodes having glass protective layers
US6420961B1 (en) 1998-05-14 2002-07-16 Micron Technology, Inc. Wireless communication systems, interfacing devices, communication methods, methods of interfacing with an interrogator, and methods of operating an interrogator
US6075973A (en) 1998-05-18 2000-06-13 Micron Technology, Inc. Method of communications in a backscatter system, interrogator, and backscatter communications system
US6115616A (en) 1998-05-28 2000-09-05 International Business Machines Corporation Hand held telephone set with separable keyboard
JP3126698B2 (ja) 1998-06-02 2001-01-22 富士通株式会社 スパッタ成膜方法、スパッタ成膜装置及び半導体装置の製造方法
US6093944A (en) 1998-06-04 2000-07-25 Lucent Technologies Inc. Dielectric materials of amorphous compositions of TI-O2 doped with rare earth elements and devices employing same
US7854684B1 (en) * 1998-06-24 2010-12-21 Samsung Electronics Co., Ltd. Wearable device
KR100287176B1 (ko) 1998-06-25 2001-04-16 윤종용 고온산화를이용한반도체소자의커패시터형성방법
US6058233A (en) 1998-06-30 2000-05-02 Lucent Technologies Inc. Waveguide array with improved efficiency for wavelength routers and star couplers in integrated optics
GB9814123D0 (en) 1998-07-01 1998-08-26 British Gas Plc Electrochemical fuel cell
EP0969521A1 (de) 1998-07-03 2000-01-05 ISOVOLTAÖsterreichische IsolierstoffwerkeAktiengesellschaft Fotovoltaischer Modul sowie ein Verfahren zu dessen Herstellung
DE19831719A1 (de) 1998-07-15 2000-01-20 Alcatel Sa Verfahren zur Herstellung planarer Wellenleiterstrukturen sowie Wellenleiterstruktur
US6358810B1 (en) 1998-07-28 2002-03-19 Applied Materials, Inc. Method for superior step coverage and interface control for high K dielectric capacitors and related electrodes
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
US6579728B2 (en) 1998-08-03 2003-06-17 Privicom, Inc. Fabrication of a high resolution, low profile credit card reader and card reader for transmission of data by sound
US6129277A (en) 1998-08-03 2000-10-10 Privicon, Inc. Card reader for transmission of data by sound
US6160373A (en) 1998-08-10 2000-12-12 Dunn; James P. Battery operated cableless external starting device and methods
KR100305903B1 (ko) 1998-08-21 2001-12-17 박호군 수직으로통합연결된박막형전지를구비하는전기및전자소자와그제작방법
JP2000067852A (ja) 1998-08-21 2000-03-03 Pioneer Electronic Corp リチウム二次電池
JP3386756B2 (ja) 1998-08-31 2003-03-17 松下電池工業株式会社 薄膜形成方法および薄膜形成装置
US6210832B1 (en) 1998-09-01 2001-04-03 Polyplus Battery Company, Inc. Mixed ionic electronic conductor coatings for redox electrodes
US6192222B1 (en) * 1998-09-03 2001-02-20 Micron Technology, Inc. Backscatter communication systems, interrogators, methods of communicating in a backscatter system, and backscatter communication methods
JP4014737B2 (ja) 1998-09-17 2007-11-28 昭和電工株式会社 熱重合性組成物及びその用途
US6236793B1 (en) 1998-09-23 2001-05-22 Molecular Optoelectronics Corporation Optical channel waveguide amplifier
US6159635A (en) 1998-09-29 2000-12-12 Electrofuel Inc. Composite electrode including current collector
US7323634B2 (en) * 1998-10-14 2008-01-29 Patterning Technologies Limited Method of forming an electronic device
US6605228B1 (en) 1998-10-19 2003-08-12 Nhk Spring Co., Ltd. Method for fabricating planar optical waveguide devices
KR100282487B1 (ko) 1998-10-19 2001-02-15 윤종용 고유전 다층막을 이용한 셀 캐패시터 및 그 제조 방법
JP4126711B2 (ja) 1998-10-23 2008-07-30 ソニー株式会社 非水電解質電池
JP3830008B2 (ja) 1998-10-30 2006-10-04 ソニー株式会社 非水電解質電池
US6157765A (en) 1998-11-03 2000-12-05 Lucent Technologies Planar waveguide optical amplifier
KR100280705B1 (ko) 1998-11-05 2001-03-02 김순택 리튬 이온 폴리머 전지용 전극 활물질 조성물 및 이를 이용한리튬 이온 폴리머 전지용 전극판의 제조방법
CN1330019C (zh) 1998-11-06 2007-08-01 株式会社杰士汤浅 非水二次电解质电池
DE69932304T2 (de) 1998-11-09 2007-12-06 Ballard Power Systems Inc., Burnaby Elektrische Kontaktvorrichtung für eine Brennstoffzelle
US6384573B1 (en) 1998-11-12 2002-05-07 James Dunn Compact lightweight auxiliary multifunctional reserve battery engine starting system (and methods)
US6117279A (en) 1998-11-12 2000-09-12 Tokyo Electron Limited Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition
EP1052718B1 (en) 1998-12-03 2007-08-01 Sumitomo Electric Industries, Ltd. Lithium storage battery
EP1145338B1 (en) 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
JP2000188099A (ja) 1998-12-22 2000-07-04 Mitsubishi Chemicals Corp 薄膜型電池の製造方法
US6599662B1 (en) 1999-01-08 2003-07-29 Massachusetts Institute Of Technology Electroactive material for secondary batteries and methods of preparation
GB9900396D0 (en) 1999-01-08 1999-02-24 Danionics As Arrangements of electrochemical cells
JP4074418B2 (ja) 1999-01-11 2008-04-09 三菱化学株式会社 薄膜型リチウム二次電池
US6379835B1 (en) 1999-01-12 2002-04-30 Morgan Adhesives Company Method of making a thin film battery
US6290822B1 (en) 1999-01-26 2001-09-18 Agere Systems Guardian Corp. Sputtering method for forming dielectric films
US6302939B1 (en) 1999-02-01 2001-10-16 Magnequench International, Inc. Rare earth permanent magnet and method for making same
US6306265B1 (en) 1999-02-12 2001-10-23 Applied Materials, Inc. High-density plasma for ionized metal deposition capable of exciting a plasma wave
DE60044384D1 (de) 1999-02-25 2010-06-24 Kaneka Corp Photoelektrische Dünnschicht-Umwandlungsvorrichtung und Verfahren zur Abscheidung durch Zerstäubung
US6210544B1 (en) 1999-03-08 2001-04-03 Alps Electric Co., Ltd. Magnetic film forming method
US6356764B1 (en) 1999-03-09 2002-03-12 Micron Technology, Inc. Wireless communication systems, interrogators and methods of communicating within a wireless communication system
US6603391B1 (en) 1999-03-09 2003-08-05 Micron Technology, Inc. Phase shifters, interrogators, methods of shifting a phase angle of a signal, and methods of operating an interrogator
US6379846B1 (en) 1999-03-16 2002-04-30 Sumitomo Chemical Company, Limited Non-aqueous electrolyte and lithium secondary battery using the same
US6277520B1 (en) 1999-03-19 2001-08-21 Ntk Powerdex, Inc. Thin lithium battery with slurry cathode
US6280875B1 (en) 1999-03-24 2001-08-28 Teledyne Technologies Incorporated Rechargeable battery structure with metal substrate
DE69907866T2 (de) 1999-03-25 2004-03-11 Kaneka Corp. Verfahren zum Herstellen von Dünnschicht-Solarzellen-Modulen
US6160215A (en) 1999-03-26 2000-12-12 Curtin; Lawrence F. Method of making photovoltaic device
US6148503A (en) 1999-03-31 2000-11-21 Imra America, Inc. Process of manufacturing porous separator for electrochemical power supply
US6398824B1 (en) 1999-04-02 2002-06-04 Excellatron Solid State, Llc Method for manufacturing a thin-film lithium battery by direct deposition of battery components on opposite sides of a current collector
US6242129B1 (en) 1999-04-02 2001-06-05 Excellatron Solid State, Llc Thin lithium film battery
US6168884B1 (en) * 1999-04-02 2001-01-02 Lockheed Martin Energy Research Corporation Battery with an in-situ activation plated lithium anode
WO2000062365A1 (en) 1999-04-14 2000-10-19 Power Paper Ltd. Functionally improved battery and method of making same
US6855441B1 (en) 1999-04-14 2005-02-15 Power Paper Ltd. Functionally improved battery and method of making same
US6416598B1 (en) 1999-04-20 2002-07-09 Reynolds Metals Company Free machining aluminum alloy with high melting point machining constituent and method of use
KR100296741B1 (ko) 1999-05-11 2001-07-12 박호군 트렌치 구조를 갖는 전지 및 그 제조방법
US6281142B1 (en) 1999-06-04 2001-08-28 Micron Technology, Inc. Dielectric cure for reducing oxygen vacancies
JP3736205B2 (ja) 1999-06-04 2006-01-18 三菱電機株式会社 バッテリ蓄電装置
US6046081A (en) 1999-06-10 2000-04-04 United Microelectronics Corp. Method for forming dielectric layer of capacitor
US6133670A (en) 1999-06-24 2000-10-17 Sandia Corporation Compact electrostatic comb actuator
US6413676B1 (en) 1999-06-28 2002-07-02 Lithium Power Technologies, Inc. Lithium ion polymer electrolytes
JP2001021744A (ja) 1999-07-07 2001-01-26 Shin Etsu Chem Co Ltd 光導波路基板の製造方法
JP2001020065A (ja) * 1999-07-07 2001-01-23 Hitachi Metals Ltd スパッタリング用ターゲット及びその製造方法ならびに高融点金属粉末材料
JP2001025666A (ja) 1999-07-14 2001-01-30 Nippon Sheet Glass Co Ltd 積層体およびその製造方法
US6290821B1 (en) 1999-07-15 2001-09-18 Seagate Technology Llc Sputter deposition utilizing pulsed cathode and substrate bias power
KR100456647B1 (ko) * 1999-08-05 2004-11-10 에스케이씨 주식회사 리튬 이온 폴리머 전지
US6344795B1 (en) * 1999-08-17 2002-02-05 Lucent Technologies Inc. Method and apparatus for generating temperature based alerting signals
US6249222B1 (en) 1999-08-17 2001-06-19 Lucent Technologies Inc. Method and apparatus for generating color based alerting signals
US6356230B1 (en) 1999-08-20 2002-03-12 Micron Technology, Inc. Interrogators, wireless communication systems, methods of operating an interrogator, methods of monitoring movement of a radio frequency identification device, methods of monitoring movement of a remote communication device and movement monitoring methods
US6414626B1 (en) 1999-08-20 2002-07-02 Micron Technology, Inc. Interrogators, wireless communication systems, methods of operating an interrogator, methods of operating a wireless communication system, and methods of determining range of a remote communication device
US6664006B1 (en) 1999-09-02 2003-12-16 Lithium Power Technologies, Inc. All-solid-state electrochemical device and method of manufacturing
US6537428B1 (en) 1999-09-02 2003-03-25 Veeco Instruments, Inc. Stable high rate reactive sputtering
US6645675B1 (en) 1999-09-02 2003-11-11 Lithium Power Technologies, Inc. Solid polymer electrolytes
US6392565B1 (en) 1999-09-10 2002-05-21 Eworldtrack, Inc. Automobile tracking and anti-theft system
US6528212B1 (en) 1999-09-13 2003-03-04 Sanyo Electric Co., Ltd. Lithium battery
US6344366B1 (en) * 1999-09-15 2002-02-05 Lockheed Martin Energy Research Corporation Fabrication of highly textured lithium cobalt oxide films by rapid thermal annealing
US6296949B1 (en) 1999-09-16 2001-10-02 Ga-Tek Inc. Copper coated polyimide with metallic protective layer
JP4240679B2 (ja) 1999-09-21 2009-03-18 ソニー株式会社 スパッタリング用ターゲットの製造方法
US6296967B1 (en) 1999-09-24 2001-10-02 Electrofuel Inc. Lithium battery structure incorporating lithium pouch cells
TW457767B (en) * 1999-09-27 2001-10-01 Matsushita Electric Works Ltd Photo response semiconductor switch having short circuit load protection
US6368275B1 (en) 1999-10-07 2002-04-09 Acuson Corporation Method and apparatus for diagnostic medical information gathering, hyperthermia treatment, or directed gene therapy
DE19948839A1 (de) 1999-10-11 2001-04-12 Bps Alzenau Gmbh Leitende transparente Schichten und Verfahren zu ihrer Herstellung
US6500287B1 (en) 1999-10-14 2002-12-31 Forskarpatent I Uppsala Ab Color-modifying treatment of thin films
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US20070196682A1 (en) 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6548912B1 (en) 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6413285B1 (en) 1999-11-01 2002-07-02 Polyplus Battery Company Layered arrangements of lithium electrodes
US6413284B1 (en) 1999-11-01 2002-07-02 Polyplus Battery Company Encapsulated lithium alloy electrodes having barrier layers
US6271793B1 (en) 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
CN1258830C (zh) 1999-11-11 2006-06-07 皇家菲利浦电子有限公司 含凝胶电解质的锂电池
JP3999424B2 (ja) 1999-11-16 2007-10-31 ローム株式会社 端子基板、端子基板を備えた電池パック、および端子基板の製造方法
US6511516B1 (en) * 2000-02-23 2003-01-28 Johnson Research & Development Co., Inc. Method and apparatus for producing lithium based cathodes
US7247408B2 (en) 1999-11-23 2007-07-24 Sion Power Corporation Lithium anodes for electrochemical cells
US6797428B1 (en) 1999-11-23 2004-09-28 Moltech Corporation Lithium anodes for electrochemical cells
US6582481B1 (en) 1999-11-23 2003-06-24 Johnson Research & Development Company, Inc. Method of producing lithium base cathodes
US6733924B1 (en) 1999-11-23 2004-05-11 Moltech Corporation Lithium anodes for electrochemical cells
US6350353B2 (en) * 1999-11-24 2002-02-26 Applied Materials, Inc. Alternate steps of IMP and sputtering process to improve sidewall coverage
US6426863B1 (en) 1999-11-25 2002-07-30 Lithium Power Technologies, Inc. Electrochemical capacitor
US6294288B1 (en) 1999-12-01 2001-09-25 Valence Technology, Inc. Battery cell having notched layers
CA2389347A1 (en) 1999-12-02 2001-06-07 Tony C. Kowalczyk Photodefinition of optical devices
US6344419B1 (en) * 1999-12-03 2002-02-05 Applied Materials, Inc. Pulsed-mode RF bias for sidewall coverage improvement
JP3611765B2 (ja) 1999-12-09 2005-01-19 シャープ株式会社 二次電池及びそれを用いた電子機器
JP2001176464A (ja) 1999-12-17 2001-06-29 Sumitomo Electric Ind Ltd 非水電解質電池
US6426163B1 (en) 1999-12-21 2002-07-30 Alcatel Electrochemical cell
US6576546B2 (en) 1999-12-22 2003-06-10 Texas Instruments Incorporated Method of enhancing adhesion of a conductive barrier layer to an underlying conductive plug and contact for ferroelectric applications
US6534809B2 (en) 1999-12-22 2003-03-18 Agilent Technologies, Inc. Hardmask designs for dry etching FeRAM capacitor stacks
CN1307376A (zh) 2000-01-27 2001-08-08 钟馨稼 一种可反复充放电的铬氟锂固体动力电池
US6372383B1 (en) 2000-01-31 2002-04-16 Korea Advanced Institute Of Science And Technology Method for preparing electrodes for Ni/Metal hydride secondary cells using Cu
US6627056B2 (en) 2000-02-16 2003-09-30 Applied Materials, Inc. Method and apparatus for ionized plasma deposition
TW523615B (en) 2000-02-17 2003-03-11 L3 Optics Inc Guided wave optical switch based on an active semiconductor amplifier and a passive optical component
DE60133453T2 (de) 2000-02-18 2009-05-07 Cypak Ab Verfahren und vorrichtung zur identifizierung und authentisierung
US6768246B2 (en) 2000-02-23 2004-07-27 Sri International Biologically powered electroactive polymer generators
TW584905B (en) 2000-02-25 2004-04-21 Tokyo Electron Ltd Method and apparatus for depositing films
US6410471B2 (en) 2000-03-07 2002-06-25 Shin-Etsu Chemical Co., Ltd. Method for preparation of sintered body of rare earth oxide
ATE407004T1 (de) * 2000-03-09 2008-09-15 Isovolta Verfahren zum herstellen eines photovoltaischen dünnfilm-moduls
JP2001259494A (ja) 2000-03-17 2001-09-25 Matsushita Battery Industrial Co Ltd 薄膜形成方法
AU2001247746A1 (en) 2000-03-24 2001-10-08 Cymbet Corporation Device enclosures and devices with integrated battery
US6387563B1 (en) 2000-03-28 2002-05-14 Johnson Research & Development, Inc. Method of producing a thin film battery having a protective packaging
JP4106644B2 (ja) 2000-04-04 2008-06-25 ソニー株式会社 電池およびその製造方法
US6423106B1 (en) 2000-04-05 2002-07-23 Johnson Research & Development Method of producing a thin film battery anode
US6709778B2 (en) 2000-04-10 2004-03-23 Johnson Electro Mechanical Systems, Llc Electrochemical conversion system
GB2361244B (en) 2000-04-14 2004-02-11 Trikon Holdings Ltd A method of depositing dielectric
US6365319B1 (en) 2000-04-20 2002-04-02 Eastman Kodak Company Self-contained imaging media comprising opaque laminated support
US20010052752A1 (en) 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
KR100341407B1 (ko) 2000-05-01 2002-06-22 윤덕용 플라즈마 처리에 의한 리튬전이금속 산화물 박막의 결정화방법
US6423776B1 (en) 2000-05-02 2002-07-23 Honeywell International Inc. Oxygen scavenging high barrier polyamide compositions for packaging applications
US6433465B1 (en) 2000-05-02 2002-08-13 The United States Of America As Represented By The Secretary Of The Navy Energy-harvesting device using electrostrictive polymers
US6760520B1 (en) 2000-05-09 2004-07-06 Teralux Corporation System and method for passively aligning and coupling optical devices
US6261917B1 (en) 2000-05-09 2001-07-17 Chartered Semiconductor Manufacturing Ltd. High-K MOM capacitor
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
JP4432206B2 (ja) 2000-05-18 2010-03-17 株式会社ブリヂストン 積層膜の形成方法
US6436156B1 (en) 2000-05-25 2002-08-20 The Gillette Company Zinc/air cell
EP1160900A3 (en) * 2000-05-26 2007-12-12 Kabushiki Kaisha Riken Embossed current collector separator for electrochemical fuel cell
US6284406B1 (en) 2000-06-09 2001-09-04 Ntk Powerdex, Inc. IC card with thin battery
US6524750B1 (en) * 2000-06-17 2003-02-25 Eveready Battery Company, Inc. Doped titanium oxide additives
US6432577B1 (en) 2000-06-29 2002-08-13 Sandia Corporation Apparatus and method for fabricating a microbattery
JP2002026173A (ja) * 2000-07-10 2002-01-25 Fuji Photo Film Co Ltd Ic装置、基板、およびic組付基板
US20040247921A1 (en) 2000-07-18 2004-12-09 Dodsworth Robert S. Etched dielectric film in hard disk drives
US6524466B1 (en) * 2000-07-18 2003-02-25 Applied Semiconductor, Inc. Method and system of preventing fouling and corrosion of biomedical devices and structures
KR100336407B1 (ko) 2000-07-19 2002-05-10 박호군 박막 전지를 위한 전해질용 리튬인산염 스퍼터링 타겟제조방법
JP3608507B2 (ja) 2000-07-19 2005-01-12 住友電気工業株式会社 アルカリ金属薄膜部材の製造方法
US6506289B2 (en) * 2000-08-07 2003-01-14 Symmorphix, Inc. Planar optical devices and methods for their manufacture
US6402796B1 (en) 2000-08-07 2002-06-11 Excellatron Solid State, Llc Method of producing a thin film battery
AU2002227426A1 (en) 2000-08-15 2002-06-24 World Properties Inc. Multi-layer circuits and methods of manufacture thereof
US6572173B2 (en) 2000-08-28 2003-06-03 Mueller Hermann-Frank Sun shield for vehicles
KR100387121B1 (ko) 2000-08-31 2003-06-12 주식회사 애니셀 수직 방향으로 집적된 다층 박막전지 및 그의 제조방법
US6866963B2 (en) 2000-09-04 2005-03-15 Samsung Sdi Co., Ltd. Cathode active material and lithium battery employing the same
US7056620B2 (en) 2000-09-07 2006-06-06 Front Edge Technology, Inc. Thin film battery and method of manufacture
US6632563B1 (en) 2000-09-07 2003-10-14 Front Edge Technology, Inc. Thin film battery and method of manufacture
EP1364424A2 (de) 2000-09-14 2003-11-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrochemisch aktivierbare schicht oder folie
US6628876B1 (en) 2000-09-15 2003-09-30 Triquint Technology Holding Co. Method for making a planar waveguide
TW448318B (en) 2000-09-18 2001-08-01 Nat Science Council Erbium, Yttrium co-doped Titanium oxide thin film material for planar optical waveguide amplifier
DE10165080B4 (de) * 2000-09-20 2015-05-13 Hitachi Metals, Ltd. Siliciumnitrid-Pulver und -Sinterkörper sowie Verfahren zu deren Herstellung und Leiterplatte damit
US6637916B2 (en) 2000-10-05 2003-10-28 Muellner Hermann-Frank Lamp for vehicles
US6660660B2 (en) 2000-10-10 2003-12-09 Asm International, Nv. Methods for making a dielectric stack in an integrated circuit
JP4532713B2 (ja) 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
KR100389655B1 (ko) 2000-10-14 2003-06-27 삼성에스디아이 주식회사 우수한 사이클링 안정성과 높은 이온 전도도를 갖는리튬-이온 이차 박막 전지
US6622049B2 (en) 2000-10-16 2003-09-16 Remon Medical Technologies Ltd. Miniature implantable illuminator for photodynamic therapy
US6488822B1 (en) 2000-10-20 2002-12-03 Veecoleve, Inc. Segmented-target ionized physical-vapor deposition apparatus and method of operation
US6525976B1 (en) * 2000-10-24 2003-02-25 Excellatron Solid State, Llc Systems and methods for reducing noise in mixed-mode integrated circuits
US6413382B1 (en) 2000-11-03 2002-07-02 Applied Materials, Inc. Pulsed sputtering with a small rotating magnetron
US6863699B1 (en) 2000-11-03 2005-03-08 Front Edge Technology, Inc. Sputter deposition of lithium phosphorous oxynitride material
JP3812324B2 (ja) 2000-11-06 2006-08-23 日本電気株式会社 リチウム二次電池とその製造方法
US6494999B1 (en) 2000-11-09 2002-12-17 Honeywell International Inc. Magnetron sputtering apparatus with an integral cooling and pressure relieving cathode
KR100389908B1 (ko) 2000-11-18 2003-07-04 삼성에스디아이 주식회사 리튬 2차 전지용 음극 박막
ATE356444T1 (de) 2000-11-18 2007-03-15 Samsung Sdi Co Ltd Dünnschicht anode für lithium enthaltende sekundärbatterie
US20020106297A1 (en) 2000-12-01 2002-08-08 Hitachi Metals, Ltd. Co-base target and method of producing the same
NL1016779C2 (nl) * 2000-12-02 2002-06-04 Cornelis Johannes Maria V Rijn Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs.
JP4461656B2 (ja) * 2000-12-07 2010-05-12 セイコーエプソン株式会社 光電変換素子
US20020071989A1 (en) 2000-12-08 2002-06-13 Verma Surrenda K. Packaging systems and methods for thin film solid state batteries
US20020091929A1 (en) 2000-12-19 2002-07-11 Jakob Ehrensvard Secure digital signing of data
WO2002050933A2 (en) 2000-12-21 2002-06-27 Moltech Corporation Lithium anodes for electrochemical cells
US6444336B1 (en) 2000-12-21 2002-09-03 The Regents Of The University Of California Thin film dielectric composite materials
US6620545B2 (en) 2001-01-05 2003-09-16 Visteon Global Technologies, Inc. ETM based battery
US6650000B2 (en) 2001-01-16 2003-11-18 International Business Machines Corporation Apparatus and method for forming a battery in an integrated circuit
US6533907B2 (en) 2001-01-19 2003-03-18 Symmorphix, Inc. Method of producing amorphous silicon for hard mask and waveguide applications
US6673716B1 (en) * 2001-01-30 2004-01-06 Novellus Systems, Inc. Control of the deposition temperature to reduce the via and contact resistance of Ti and TiN deposited using ionized PVD techniques
US6558836B1 (en) 2001-02-08 2003-05-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Structure of thin-film lithium microbatteries
US6589299B2 (en) 2001-02-13 2003-07-08 3M Innovative Properties Company Method for making electrode
US20020139662A1 (en) 2001-02-21 2002-10-03 Lee Brent W. Thin-film deposition of low conductivity targets using cathodic ARC plasma process
US20020164441A1 (en) 2001-03-01 2002-11-07 The University Of Chicago Packaging for primary and secondary batteries
US7048400B2 (en) 2001-03-22 2006-05-23 Lumimove, Inc. Integrated illumination system
US7164206B2 (en) 2001-03-28 2007-01-16 Intel Corporation Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer
US6797137B2 (en) 2001-04-11 2004-09-28 Heraeus, Inc. Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal
US7033406B2 (en) 2001-04-12 2006-04-25 Eestor, Inc. Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries
US7914755B2 (en) 2001-04-12 2011-03-29 Eestor, Inc. Method of preparing ceramic powders using chelate precursors
US7595109B2 (en) 2001-04-12 2009-09-29 Eestor, Inc. Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries
US6677070B2 (en) 2001-04-19 2004-01-13 Hewlett-Packard Development Company, L.P. Hybrid thin film/thick film solid oxide fuel cell and method of manufacturing the same
US6782290B2 (en) 2001-04-27 2004-08-24 Medtronic, Inc. Implantable medical device with rechargeable thin-film microbattery power source
US7744735B2 (en) 2001-05-04 2010-06-29 Tokyo Electron Limited Ionized PVD with sequential deposition and etching
US6743488B2 (en) * 2001-05-09 2004-06-01 Cpfilms Inc. Transparent conductive stratiform coating of indium tin oxide
JP2002344115A (ja) 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 成膜方法及びプリント基板の製造方法
US6650942B2 (en) 2001-05-30 2003-11-18 Medtronic, Inc. Implantable medical device with dual cell power source
US6517968B2 (en) * 2001-06-11 2003-02-11 Excellatron Solid State, Llc Thin lithium film battery
US6752842B2 (en) 2001-06-18 2004-06-22 Power Paper Ltd. Manufacture of flexible thin layer electrochemical cell
JP3737389B2 (ja) 2001-06-19 2006-01-18 京セラ株式会社 バッテリー
JP3929839B2 (ja) 2001-06-28 2007-06-13 松下電器産業株式会社 電池及び電池パック
US6768855B1 (en) 2001-07-05 2004-07-27 Sandia Corporation Vertically-tapered optical waveguide and optical spot transformer formed therefrom
US7469558B2 (en) 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
US20030029715A1 (en) * 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
US6758404B2 (en) * 2001-08-03 2004-07-06 General Instrument Corporation Media cipher smart card
US7022431B2 (en) * 2001-08-20 2006-04-04 Power Paper Ltd. Thin layer electrochemical cell with self-formed separator
US7335441B2 (en) 2001-08-20 2008-02-26 Power Paper Ltd. Thin layer electrochemical cell with self-formed separator
US6500676B1 (en) 2001-08-20 2002-12-31 Honeywell International Inc. Methods and apparatus for depositing magnetic films
KR100848972B1 (ko) * 2001-08-24 2008-07-30 다이니폰 인사츠 가부시키가이샤 진공증착용 다면부착 마스크장치
KR100382767B1 (ko) * 2001-08-25 2003-05-09 삼성에스디아이 주식회사 리튬 2차 전지용 음극 박막 및 그의 제조방법
CN1974472B (zh) 2001-08-28 2010-06-16 Tdk株式会社 薄膜电容元件用组合物、绝缘膜、薄膜电容元件和电容器
US7425223B2 (en) 2001-09-03 2008-09-16 Matsushita Electric Industrial Co., Ltd. Method for preparing electrochemical device with a layer structure
US7118825B2 (en) 2001-09-05 2006-10-10 Omnitek Partners Llc Conformal power supplies
US6637906B2 (en) 2001-09-11 2003-10-28 Recot, Inc. Electroluminescent flexible film for product packaging
WO2003022564A1 (en) 2001-09-12 2003-03-20 Itn Energy Systems, Inc. Apparatus and method for the design and manufacture of multifunctional composite materials with power integration
TW560102B (en) 2001-09-12 2003-11-01 Itn Energy Systems Inc Thin-film electrochemical devices on fibrous or ribbon-like substrates and methd for their manufacture and design
US6838209B2 (en) * 2001-09-21 2005-01-04 Eveready Battery Company, Inc. Flexible thin battery and method of manufacturing same
US7115516B2 (en) 2001-10-09 2006-10-03 Applied Materials, Inc. Method of depositing a material layer
JP2003124491A (ja) 2001-10-15 2003-04-25 Sharp Corp 薄膜太陽電池モジュール
JP4015835B2 (ja) 2001-10-17 2007-11-28 松下電器産業株式会社 半導体記憶装置
FR2831318B1 (fr) 2001-10-22 2006-06-09 Commissariat Energie Atomique Dispositif de stockage d'energie a recharge rapide, sous forme de films minces
US6666982B2 (en) 2001-10-22 2003-12-23 Tokyo Electron Limited Protection of dielectric window in inductively coupled plasma generation
US6750156B2 (en) 2001-10-24 2004-06-15 Applied Materials, Inc. Method and apparatus for forming an anti-reflective coating on a substrate
KR100424637B1 (ko) 2001-10-25 2004-03-24 삼성에스디아이 주식회사 리튬 이차 전지용 박막 전극 및 그 제조방법
US7404877B2 (en) 2001-11-09 2008-07-29 Springworks, Llc Low temperature zirconia based thermal barrier layer by PVD
US6805999B2 (en) 2001-11-13 2004-10-19 Midwest Research Institute Buried anode lithium thin film battery and process for forming the same
KR100425585B1 (ko) 2001-11-22 2004-04-06 한국전자통신연구원 가교 고분자 보호박막을 갖춘 리튬 고분자 이차 전지 및그 제조 방법
US20030097858A1 (en) 2001-11-26 2003-05-29 Christof Strohhofer Silver sensitized erbium ion doped planar waveguide amplifier
US6830846B2 (en) 2001-11-29 2004-12-14 3M Innovative Properties Company Discontinuous cathode sheet halfcell web
US20030109903A1 (en) 2001-12-12 2003-06-12 Epic Biosonics Inc. Low profile subcutaneous enclosure
US6683749B2 (en) * 2001-12-19 2004-01-27 Storage Technology Corporation Magnetic transducer having inverted write element with zero delta in pole tip width
US6737789B2 (en) 2002-01-18 2004-05-18 Leon J. Radziemski Force activated, piezoelectric, electricity generation, storage, conditioning and supply apparatus and methods
US20040081415A1 (en) 2002-01-22 2004-04-29 Demaray Richard E. Planar optical waveguide amplifier with mode size converter
US20030143853A1 (en) 2002-01-31 2003-07-31 Celii Francis G. FeRAM capacitor stack etch
US20030152829A1 (en) 2002-02-12 2003-08-14 Ji-Guang Zhang Thin lithium film battery
JP3565207B2 (ja) 2002-02-27 2004-09-15 日産自動車株式会社 電池パック
US6713987B2 (en) 2002-02-28 2004-03-30 Front Edge Technology, Inc. Rechargeable battery having permeable anode current collector
US7081693B2 (en) 2002-03-07 2006-07-25 Microstrain, Inc. Energy harvesting for wireless sensor operation and data transmission
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
US20030174391A1 (en) 2002-03-16 2003-09-18 Tao Pan Gain flattened optical amplifier
US7378356B2 (en) 2002-03-16 2008-05-27 Springworks, Llc Biased pulse DC reactive sputtering of oxide films
US20030175142A1 (en) 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
TWI283031B (en) 2002-03-25 2007-06-21 Epistar Corp Method for integrating compound semiconductor with substrate of high thermal conductivity
US6885028B2 (en) 2002-03-25 2005-04-26 Sharp Kabushiki Kaisha Transistor array and active-matrix substrate
US6792026B2 (en) 2002-03-26 2004-09-14 Joseph Reid Henrichs Folded cavity solid-state laser
JP2003282142A (ja) 2002-03-26 2003-10-03 Matsushita Electric Ind Co Ltd 薄膜積層体、薄膜電池、コンデンサ、及び薄膜積層体の製造方法と製造装置
KR100454092B1 (ko) 2002-04-29 2004-10-26 광주과학기술원 급속 열처리법을 이용한 박막전지용 양극박막의 제조방법
DE10318187B4 (de) 2002-05-02 2010-03-18 Osram Opto Semiconductors Gmbh Verkapselungsverfahren für organische Leuchtdiodenbauelemente
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
JP4043296B2 (ja) 2002-06-13 2008-02-06 松下電器産業株式会社 全固体電池
US6700491B2 (en) 2002-06-14 2004-03-02 Sensormatic Electronics Corporation Radio frequency identification tag with thin-film battery for antenna
US6780208B2 (en) 2002-06-28 2004-08-24 Hewlett-Packard Development Company, L.P. Method of making printed battery structures
US7410730B2 (en) 2002-07-09 2008-08-12 Oak Ridge Micro-Energy, Inc. Thin film battery and electrolyte therefor
US6818356B1 (en) 2002-07-09 2004-11-16 Oak Ridge Micro-Energy, Inc. Thin film battery and electrolyte therefor
US7362659B2 (en) * 2002-07-11 2008-04-22 Action Manufacturing Company Low current microcontroller circuit
US6835493B2 (en) 2002-07-26 2004-12-28 Excellatron Solid State, Llc Thin film battery
US6770176B2 (en) 2002-08-02 2004-08-03 Itn Energy Systems. Inc. Apparatus and method for fracture absorption layer
JP2004071305A (ja) 2002-08-05 2004-03-04 Hitachi Maxell Ltd 非水電解質二次電池
JP3729164B2 (ja) 2002-08-05 2005-12-21 日産自動車株式会社 自動車用電池
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US20080003496A1 (en) * 2002-08-09 2008-01-03 Neudecker Bernd J Electrochemical apparatus with barrier layer protected substrate
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US6916679B2 (en) 2002-08-09 2005-07-12 Infinite Power Solutions, Inc. Methods of and device for encapsulation and termination of electronic devices
KR20040017478A (ko) 2002-08-21 2004-02-27 한국과학기술원 인쇄회로기판의 제조방법 및 다층 인쇄회로기판
AU2003261463A1 (en) 2002-08-27 2004-03-19 Symmorphix, Inc. Optically coupling into highly uniform waveguides
US20040048157A1 (en) 2002-09-11 2004-03-11 Neudecker Bernd J. Lithium vanadium oxide thin-film battery
US6994933B1 (en) 2002-09-16 2006-02-07 Oak Ridge Micro-Energy, Inc. Long life thin film battery and method therefor
US20040081860A1 (en) 2002-10-29 2004-04-29 Stmicroelectronics, Inc. Thin-film battery equipment
JP2004149849A (ja) 2002-10-30 2004-05-27 Hitachi Chem Co Ltd 金属薄膜の形成方法及び電極付基板
US20040085002A1 (en) 2002-11-05 2004-05-06 Pearce Michael Baker Method and apparatus for an incidental use piezoelectric energy source with thin-film battery
JP2004158268A (ja) 2002-11-06 2004-06-03 Sony Corp 成膜装置
WO2004042868A1 (en) 2002-11-07 2004-05-21 Fractus, S.A. Integrated circuit package including miniature antenna
KR100682883B1 (ko) 2002-11-27 2007-02-15 삼성전자주식회사 고체 전해질, 그의 제조방법 및 이를 채용한 리튬전지 및 박막전지
JP4777593B2 (ja) 2002-11-29 2011-09-21 株式会社オハラ リチウムイオン二次電池の製造方法
DE50305946D1 (de) 2002-12-16 2007-01-25 Basf Ag Verfahren zur Gewinnung von Lithium
JP4072049B2 (ja) 2002-12-25 2008-04-02 京セラ株式会社 燃料電池セル及び燃料電池
TWI261045B (en) 2002-12-30 2006-09-01 Ind Tech Res Inst Composite nanofibers and their fabrications
US6906436B2 (en) 2003-01-02 2005-06-14 Cymbet Corporation Solid state activity-activated battery device and method
TWI341337B (en) 2003-01-07 2011-05-01 Cabot Corp Powder metallurgy sputtering targets and methods of producing same
US20040135160A1 (en) * 2003-01-10 2004-07-15 Eastman Kodak Company OLED device
IL153895A (en) 2003-01-12 2013-01-31 Orion Solar Systems Ltd Solar cell device
KR100513726B1 (ko) 2003-01-30 2005-09-08 삼성전자주식회사 고체 전해질, 이를 채용한 전지 및 그 고체 전해질의 제조방법
DE10304824A1 (de) 2003-01-31 2004-08-12 Varta Microbattery Gmbh Dünne elektronische Chipkarte
RU2241281C2 (ru) 2003-02-10 2004-11-27 Институт химии и химической технологии СО РАН Способ получения тонких пленок кобальтата лития
JP2004273436A (ja) 2003-02-18 2004-09-30 Matsushita Electric Ind Co Ltd 全固体薄膜積層電池
EP1597408B1 (en) 2003-02-27 2012-12-05 Symmorphix, Inc. Method for forming dielectric barrier layers
US6936407B2 (en) 2003-02-28 2005-08-30 Osram Opto Semiconductors Gmbh Thin-film electronic device module
KR100590376B1 (ko) 2003-03-20 2006-06-19 마쯔시다덴기산교 가부시키가이샤 집합전지
CN1274052C (zh) 2003-03-21 2006-09-06 比亚迪股份有限公司 锂离子二次电池的制造方法
US6955986B2 (en) 2003-03-27 2005-10-18 Asm International N.V. Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits
US20070141468A1 (en) 2003-04-03 2007-06-21 Jeremy Barker Electrodes Comprising Mixed Active Particles
US7253494B2 (en) 2003-04-04 2007-08-07 Matsushita Electric Industrial Co., Ltd. Battery mounted integrated circuit device having diffusion layers that prevent cations serving to charge and discharge battery from diffusing into the integrated circuit region
WO2004093223A2 (en) 2003-04-14 2004-10-28 Massachusetts Institute Of Technology Integrated thin film batteries on silicon integrated circuits
KR100508945B1 (ko) 2003-04-17 2005-08-17 삼성에스디아이 주식회사 리튬 전지용 음극, 그의 제조 방법 및 그를 포함하는 리튬전지
US7088031B2 (en) 2003-04-22 2006-08-08 Infinite Power Solutions, Inc. Method and apparatus for an ambient energy battery or capacitor recharge system
US7045246B2 (en) 2003-04-22 2006-05-16 The Aerospace Corporation Integrated thin film battery and circuit module
US6936377B2 (en) 2003-05-13 2005-08-30 C. Glen Wensley Card with embedded IC and electrochemical cell
US7238628B2 (en) 2003-05-23 2007-07-03 Symmorphix, Inc. Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
US8728285B2 (en) * 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US6852139B2 (en) 2003-07-11 2005-02-08 Excellatron Solid State, Llc System and method of producing thin-film electrolyte
US6886240B2 (en) 2003-07-11 2005-05-03 Excellatron Solid State, Llc Apparatus for producing thin-film electrolyte
US20050070097A1 (en) 2003-09-29 2005-03-31 International Business Machines Corporation Atomic laminates for diffusion barrier applications
US7230321B2 (en) 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
US20050079418A1 (en) 2003-10-14 2005-04-14 3M Innovative Properties Company In-line deposition processes for thin film battery fabrication
US7211351B2 (en) 2003-10-16 2007-05-01 Cymbet Corporation Lithium/air batteries with LiPON as separator and protective barrier and method
FR2861218B1 (fr) 2003-10-16 2007-04-20 Commissariat Energie Atomique Couche et procede de protection de microbatteries par une bicouche ceramique-metal
US7674360B2 (en) 2003-12-12 2010-03-09 Applied Materials, Inc. Mechanism for varying the spacing between sputter magnetron and target
EP1544917A1 (en) 2003-12-15 2005-06-22 Dialog Semiconductor GmbH Integrated battery pack with lead frame connection
JP2005196971A (ja) 2003-12-26 2005-07-21 Matsushita Electric Ind Co Ltd リチウム二次電池用負極とその製造方法ならびにリチウム二次電池
CN1957487A (zh) 2004-01-06 2007-05-02 Cymbet公司 具有一个或者更多个可限定层的层式阻挡物结构和方法
TWI302760B (en) 2004-01-15 2008-11-01 Lg Chemical Ltd Electrochemical device comprising aliphatic nitrile compound
JP3859645B2 (ja) * 2004-01-16 2006-12-20 Necラミリオンエナジー株式会社 フィルム外装電気デバイス
US7968233B2 (en) 2004-02-18 2011-06-28 Solicore, Inc. Lithium inks and electrodes and batteries made therefrom
US7624499B2 (en) 2004-02-26 2009-12-01 Hei, Inc. Flexible circuit having an integrally formed battery
DE102004010892B3 (de) 2004-03-06 2005-11-24 Christian-Albrechts-Universität Zu Kiel Chemisch stabiler fester Lithiumionenleiter
JP4418262B2 (ja) 2004-03-12 2010-02-17 三井造船株式会社 基板・マスク固定装置
US7052741B2 (en) 2004-05-18 2006-05-30 The United States Of America As Represented By The Secretary Of The Navy Method of fabricating a fibrous structure for use in electrochemical applications
US7195950B2 (en) * 2004-07-21 2007-03-27 Hewlett-Packard Development Company, L.P. Forming a plurality of thin-film devices
US7645246B2 (en) 2004-08-11 2010-01-12 Omnitek Partners Llc Method for generating power across a joint of the body during a locomotion cycle
JP4892180B2 (ja) 2004-08-20 2012-03-07 セイコーインスツル株式会社 電気化学セル、その製造方法およびその外観検査方法
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US7670724B1 (en) 2005-01-05 2010-03-02 The United States Of America As Represented By The Secretary Of The Army Alkali-hydroxide modified poly-vinylidene fluoride/polyethylene oxide lithium-air battery
US20060155545A1 (en) 2005-01-11 2006-07-13 Hosanna, Inc. Multi-source powered audio playback system
EP1842250B1 (en) 2005-01-19 2013-09-04 Arizona Board of Regents, acting for and on behalf of Arizona State University Electric current-producing device having a sulfone-based electrolyte
DE102005014427B4 (de) 2005-03-24 2008-05-15 Infineon Technologies Ag Verfahren zum Verkapseln eines Halbleiterbauelements
EP1713024A1 (en) 2005-04-14 2006-10-18 Ngk Spark Plug Co., Ltd. A card, a method of manufacturing the card, and a thin type battery for the card
US20060237543A1 (en) 2005-04-20 2006-10-26 Ngk Spark Plug Co., Ltd. Card, manufacturing method of card, and thin type battery for card
US8182661B2 (en) 2005-07-27 2012-05-22 Applied Materials, Inc. Controllable target cooling
US7400253B2 (en) 2005-08-04 2008-07-15 Mhcmos, Llc Harvesting ambient radio frequency electromagnetic energy for powering wireless electronic devices, sensors and sensor networks and applications thereof
AU2006280097A1 (en) 2005-08-09 2007-02-22 Polyplus Battery Company Compliant seal structures for protected active metal anodes
US7838133B2 (en) 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US7553582B2 (en) 2005-09-06 2009-06-30 Oak Ridge Micro-Energy, Inc. Getters for thin film battery hermetic package
US7202825B2 (en) 2005-09-15 2007-04-10 Motorola, Inc. Wireless communication device with integrated battery/antenna system
US7345647B1 (en) 2005-10-05 2008-03-18 Sandia Corporation Antenna structure with distributed strip
US20070187836A1 (en) 2006-02-15 2007-08-16 Texas Instruments Incorporated Package on package design a combination of laminate and tape substrate, with back-to-back die combination
DE102006009789B3 (de) 2006-03-01 2007-10-04 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse
US8155712B2 (en) 2006-03-23 2012-04-10 Sibeam, Inc. Low power very high-data rate device
DE102006025671B4 (de) 2006-06-01 2011-12-15 Infineon Technologies Ag Verfahren zur Herstellung von dünnen integrierten Halbleitereinrichtungen
JP4058456B2 (ja) 2006-10-23 2008-03-12 富士通株式会社 情報処理装置用機能拡張装置
DE102006054309A1 (de) 2006-11-17 2008-05-21 Dieter Teckhaus Batteriezelle mit Kontaktelementenanordnung
JP4466668B2 (ja) 2007-03-20 2010-05-26 セイコーエプソン株式会社 半導体装置の製造方法
US7915089B2 (en) 2007-04-10 2011-03-29 Infineon Technologies Ag Encapsulation method
DE102007030604A1 (de) 2007-07-02 2009-01-08 Weppner, Werner, Prof. Dr. Ionenleiter mit Granatstruktur
US8518581B2 (en) 2008-01-11 2013-08-27 Inifinite Power Solutions, Inc. Thin film encapsulation for thin film batteries and other devices
KR102155933B1 (ko) 2008-08-11 2020-09-14 사푸라스트 리써치 엘엘씨 전자기 에너지를 수확하기 위한 일체형 컬렉터 표면을 갖는 에너지 디바이스 및 전자기 에너지를 수확하는 방법
US8389160B2 (en) 2008-10-07 2013-03-05 Envia Systems, Inc. Positive electrode materials for lithium ion batteries having a high specific discharge capacity and processes for the synthesis of these materials

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US8062708B2 (en) 2011-11-22
JP2010505044A (ja) 2010-02-18
US20080078496A1 (en) 2008-04-03
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WO2008039471A3 (en) 2008-07-03
WO2008039471A2 (en) 2008-04-03

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