JP2578773Y2 - Electret microphone - Google Patents

Electret microphone

Info

Publication number
JP2578773Y2
JP2578773Y2 JP1993034665U JP3466593U JP2578773Y2 JP 2578773 Y2 JP2578773 Y2 JP 2578773Y2 JP 1993034665 U JP1993034665 U JP 1993034665U JP 3466593 U JP3466593 U JP 3466593U JP 2578773 Y2 JP2578773 Y2 JP 2578773Y2
Authority
JP
Japan
Prior art keywords
diaphragm
circuit board
printed circuit
back electrode
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1993034665U
Other languages
Japanese (ja)
Other versions
JPH077299U (en
Inventor
俊朗 井土
和夫 小野
誠 畑田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hosiden Corp
Original Assignee
Hosiden Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hosiden Corp filed Critical Hosiden Corp
Priority to JP1993034665U priority Critical patent/JP2578773Y2/en
Publication of JPH077299U publication Critical patent/JPH077299U/en
Application granted granted Critical
Publication of JP2578773Y2 publication Critical patent/JP2578773Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】この考案は分極により帯電されて
形成されたエレクトレットを利用したエレクトレットマ
イクロホンに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electret microphone using an electret formed by being charged by polarization.

【0002】[0002]

【従来の技術】図3に従来のエレクトレットマイクロホ
ンの構造を示す。図中1は例えばアルミ等の導電板で形
成したマイクカプセルを示す。このマイクカプセル1は
プレス加工によりコップ状に形成されコップの底板に相
当する部分に音孔2が形成され、この底板に相当する部
分がマイクロホンの前面板1Aとして利用される。前面
板1Aの前面に前面クロス3が貼付けられる。
2. Description of the Related Art FIG. 3 shows the structure of a conventional electret microphone. In the figure, reference numeral 1 denotes a microphone capsule formed of a conductive plate such as aluminum. The microphone capsule 1 is formed in a cup shape by pressing, and a sound hole 2 is formed in a portion corresponding to a bottom plate of the cup, and a portion corresponding to the bottom plate is used as a front plate 1A of the microphone. The front cloth 3 is attached to the front surface of the front plate 1A.

【0003】マイクカプセル1の内部には前端側にマイ
クユニットMUが配置される。マイクユニットMUは振
動板4と背極板6とによって構成される。振動板4は高
分子材料によって形成された膜と、この膜に被着形成し
た金属層とを具備し、高分子膜が厚み方向に分極されて
エレクトレットを構成し、このエレクトレットから成る
振動板4が背極板6とわずかな間隙(数10μm程度)
を保持して配置され、振動板4が振動することによりこ
れら振動板4と背極板6との間から電気信号を取出す構
造とされる。
[0003] Inside the microphone capsule 1, a microphone unit MU is arranged at the front end side. The microphone unit MU includes a diaphragm 4 and a back plate 6. The diaphragm 4 includes a film formed of a polymer material and a metal layer adhered to the film, and the polymer film is polarized in the thickness direction to form an electret. Is a small gap with back electrode plate 6 (several tens of μm)
, And the vibration plate 4 vibrates to take out an electric signal from between the vibration plate 4 and the back electrode plate 6.

【0004】振動板4は導電リング5に張付けられ、導
電リング5を通じてマイクカプセル1に電気的に接続さ
れる。振動板4と背極板6との間には振動板4と背極板
6との間の間隙を保持するための絶縁スペーサ7を介挿
し背極板6とスペーサ7及び振動板4、導電リングを前
面板1Aに押し当て、マイクユニットMUをマイクカプ
セル1の前端側に保持させる。
[0004] The diaphragm 4 is attached to a conductive ring 5 and is electrically connected to the microphone capsule 1 through the conductive ring 5. An insulating spacer 7 for maintaining a gap between the diaphragm 4 and the back plate 6 is interposed between the diaphragm 4 and the back plate 6, and the back plate 6 and the spacer 7, the diaphragm 4, and the conductive The ring is pressed against the front plate 1A to hold the microphone unit MU on the front end side of the microphone capsule 1.

【0005】マイクユニットMUをマイクカプセル1内
において前端側に押し付けるために従来は背極ホルダ8
が設けられる。この例では背極ホルダ8をコップ状に形
成し、コップ状の開口端部に背極板6を支持しマイクユ
ニットMUをマイクカプセル1の前端側に押し当てる。
背極ホルダ8の底面部がマイクカプセル1の開口部に配
置され、その外側にプリント基板9が配置される。背極
ホルダ8の内部にインピーダンス変換用の能動素子11
が収納される。この能動素子11は一般に入力インピー
ダンスが高い電界効果トランジスタが用いられ、その入
力端子となるゲート電極Gが背極板6に接続され、ドレ
イン電極Dとソース電極が背極ホルダ8の底面板とプリ
ント基板9に形成した孔を通じてプリント基板9の表側
に導出され、この表側の面に形成された配線導体に半田
付される。図4にエレクトレットマイクロホンの電気的
な接続構造を示す。
Conventionally, in order to press the microphone unit MU to the front end side in the microphone capsule 1, conventionally, the back electrode holder 8 is used.
Is provided. In this example, the back electrode holder 8 is formed in a cup shape, the back electrode plate 6 is supported at the opening end of the cup shape, and the microphone unit MU is pressed against the front end side of the microphone capsule 1.
The bottom surface of the back electrode holder 8 is arranged at the opening of the microphone capsule 1, and the printed circuit board 9 is arranged outside the opening. Active element 11 for impedance conversion is provided inside back electrode holder 8.
Is stored. The active element 11 is generally a field effect transistor having a high input impedance, the gate electrode G serving as the input terminal thereof is connected to the back electrode plate 6, and the drain electrode D and the source electrode are printed on the bottom plate of the back electrode holder 8. It is led out to the front side of the printed board 9 through a hole formed in the board 9 and soldered to a wiring conductor formed on the front side surface. FIG. 4 shows an electrical connection structure of the electret microphone.

【0006】[0006]

【考案が解決しようとする課題】従来のエレクトレット
マイクロホンはマイクカプセル1の前端側にマイクユニ
ットMUを配置し、後端側にプリント基板9及びこのプ
リント基板9に能動素子11を実装する構造のため、能
動素子11とマイクユニットMUとの接続が立体的な接
続構造となり、組立に手間が掛る欠点がある。
The conventional electret microphone has a structure in which a microphone unit MU is arranged at the front end of a microphone capsule 1 and a printed board 9 and an active element 11 are mounted on the printed board 9 at a rear end. In addition, the connection between the active element 11 and the microphone unit MU has a three-dimensional connection structure, and there is a disadvantage that the assembly is troublesome.

【0007】この考案の目的は組立を容易に行なうこと
ができる構造のエレクトレットマイクロホンを提供しよ
うとするものである。
An object of the present invention is to provide an electret microphone having a structure that can be easily assembled.

【0008】[0008]

【課題を解決するための手段】この考案では、マイクユ
ニットと能動素子とを同一面上に配置する構造とし、こ
れによりマイクユニットと能動素子との間をプリント配
線によって接続する構造としたものである。更に詳しく
説明すれば、プリント基板に背極板となるべき導電パタ
ーンと、インピーダンス変換用の能動素子を実装するた
めのプリント配線とを形成し、能動素子をプリント基板
に実装することにより、必然的に能動素子の入力端子と
背極板となるべき導電パターンとが接続される。背極板
となるべき導電パターンの周縁に絶縁インク等によって
スペーサを形成し、このスペーサの上に導電リングに張
付けられて支持された振動板を乗せ、スペーサの厚み分
の間隙を保持して背極板と対向させる。
According to the present invention, a microphone unit and an active element are arranged on the same surface, whereby the microphone unit and the active element are connected by a printed wiring. is there. More specifically, by forming a conductive pattern to be a back electrode plate on a printed circuit board and a printed wiring for mounting an active element for impedance conversion, and mounting the active element on the printed circuit board, it is inevitable. Is connected to the input terminal of the active element and a conductive pattern to be a back electrode plate. A spacer is formed around the periphery of the conductive pattern to be the back electrode plate with insulating ink or the like, and a diaphragm supported by being attached to a conductive ring is placed on the spacer, and a gap corresponding to the thickness of the spacer is held to hold the back plate. Face the electrode plate.

【0009】振動板を支持した導電リングは導電性樹脂
材によって形成された樹脂カプセルの閉塞板に形成され
た凹部に嵌着される。この結果、振動板は導電リングを
介して樹脂カプセルに電気的に接続される。樹脂カプセ
ルは一端が閉塞された一対の筒状半体によって構成され
る。つまり前部筒状半体と後部筒状半体とによって構成
され、これら一対の筒状半体を開口端部を向い合せて開
口端部同士を溶着することによりプリント基板と振動板
とを内部に封止する構造とされる。
The conductive ring supporting the diaphragm is fitted into a recess formed in a closing plate of a resin capsule formed of a conductive resin material. As a result, the diaphragm is electrically connected to the resin capsule via the conductive ring. The resin capsule is constituted by a pair of cylindrical halves having one end closed. In other words, the printed circuit board and the diaphragm are internally formed by a front cylindrical half and a rear cylindrical half, and the pair of cylindrical halves are welded to each other with their open ends facing each other. To be sealed.

【0010】従ってこの考案の構造によれば振動板と背
極板から成るマイクユニットと能動素子とを同一のプリ
ント基板上に実装するから、組立を簡単に行なうことが
できる利点が得られる。
Therefore, according to the structure of the present invention, the microphone unit composed of the diaphragm and the back electrode plate and the active element are mounted on the same printed circuit board, so that an advantage that assembly can be easily performed is obtained.

【0011】[0011]

【実施例】図1及び図2にこの考案の一実施例を示す。
図3と対応する部分には同一符号を付して示す。つま
り、9はプリント基板、11はこのプリント基板9に実
装したFETのような能動素子、12はこの能動素子1
1を実装する配線パターンを示す。この考案の特徴とす
る構造はプリント基板9に背極板6となる導電パターン
を形成すると共に、背極板6の周縁に絶縁インク等によ
って絶縁スペーサ7を被着形成し、この絶縁スペーサ7
を介して導電リング5に支持された振動板4を対向させ
て配置する。これら背極板6と、絶縁スペーサ7及び導
電リング5と振動板4とによってマイクユニットMUを
構成した点と、背極板6と能動素子11の入力端子との
間を配線パターン12で接続した点である。
1 and 2 show an embodiment of the present invention.
Parts corresponding to those in FIG. 3 are denoted by the same reference numerals. That is, 9 is a printed board, 11 is an active element such as an FET mounted on the printed board 9, and 12 is the active element 1
1 shows a wiring pattern for mounting No. 1. The structure of the present invention is characterized in that a conductive pattern serving as a back electrode plate 6 is formed on a printed circuit board 9 and an insulating spacer 7 is formed on the periphery of the back electrode plate 6 with insulating ink or the like.
The vibration plate 4 supported by the conductive ring 5 via is disposed to face. A point where the microphone unit MU is constituted by the back electrode plate 6, the insulating spacer 7, the conductive ring 5 and the vibration plate 4, and the back electrode plate 6 and the input terminal of the active element 11 are connected by the wiring pattern 12. Is a point.

【0012】14及び15は樹脂カプセル16を構成す
る前部筒状半体と、後部筒状半体を示す。これら前部筒
状半体14と後部筒状半体15は一端が閉塞板14A及
び15Aによって閉塞された筒状半体によって構成され
る。材質は導電性樹脂材によって形成され、開口端部同
士を向い合せて溶着(例えば超音波溶着)し、この溶着
によって内部にプリント基板9と振動板4を封止する。
Reference numerals 14 and 15 denote a front cylindrical half and a rear cylindrical half forming the resin capsule 16. Each of the front cylindrical half 14 and the rear cylindrical half 15 is formed of a cylindrical half whose one end is closed by closing plates 14A and 15A. The material is formed of a conductive resin material, and welding is performed (for example, ultrasonic welding) with the opening ends facing each other, and the printed circuit board 9 and the diaphragm 4 are sealed inside by this welding.

【0013】前部筒状半体14の閉塞板14Aには振動
板4と対向する位置に音孔2を形成する。更に前部筒状
半体14の閉塞板14Aの背面には図2に示すように、
音孔2を取囲むように凹部14Bを形成する。この凹部
14Bに導電リング5を嵌合させることにより振動板4
の位置を固定すると共に、振動板4を電気的に前部筒状
半体14、つまり樹脂カプセル16に電気的に接続す
る。振動板4を支持した導電リング5を嵌合した前部筒
状半体14とプリント基板9と後部筒状半体15とを積
ね合せ、前部筒状半体14と後端筒状半体15とをその
開口端部同士を溶着することにより組立が完了する。
尚、図2に示す凹部14Cは能動素子11を収納するた
めの凹部を示す。
A sound hole 2 is formed in the closing plate 14A of the front cylindrical half 14 at a position facing the diaphragm 4. Further, as shown in FIG. 2, on the back surface of the closing plate 14A of the front cylindrical half 14,
A concave portion 14B is formed so as to surround the sound hole 2. By fitting the conductive ring 5 into the recess 14B, the diaphragm 4
Is fixed, and the diaphragm 4 is electrically connected to the front cylindrical half 14, that is, the resin capsule 16. The front tubular half 14 fitted with the conductive ring 5 supporting the diaphragm 4, the printed circuit board 9, and the rear tubular half 15 are stacked together, and the front tubular half 14 and the rear tubular half are stacked. The assembly is completed by fusing the body 15 with its open ends.
The recess 14C shown in FIG. 2 is a recess for accommodating the active element 11.

【0014】後部筒状半体15の内周には段部15Bを
設け、この段部15Bによってプリント基板9を受け止
め、プリント基板9と後部筒状半体15との間に空室を
形成する。これと共に、プリント基板9の背極板6を形
成した部分に複数の孔17を形成し、この孔17を通じ
てプリント基板9と後部筒状半体15との間に形成した
空室を振動板4の面に連通させ後部音響室を形成する。
A step 15B is provided on the inner periphery of the rear tubular half 15, and the printed board 9 is received by the step 15B, and an empty space is formed between the printed board 9 and the rear tubular half 15. . At the same time, a plurality of holes 17 are formed in the portion of the printed circuit board 9 where the back electrode plate 6 is formed, and the vacant space formed between the printed circuit board 9 and the rear cylindrical half 15 is formed through the holes 17. And a rear acoustic chamber is formed.

【0015】前部音響室は振動板4と前部筒状半体14
の閉塞板14Aとの間の空隙によって形成され、これら
前部音響室と後部音響室の各容積によってマイクロホン
の音響特性が設定される。尚、マイクロホンの特性を双
指向性、単一指向性とする場合には閉塞板15Aの一部
に音孔を形成することがある。
The front acoustic chamber comprises a diaphragm 4 and a front cylindrical half 14.
The acoustic characteristics of the microphone are set by the volumes of the front acoustic chamber and the rear acoustic chamber. When the microphone has bidirectional or unidirectional characteristics, a sound hole may be formed in a part of the closing plate 15A.

【0016】[0016]

【考案の効果】以上説明したように、この考案によれば
マイクユニットMUと能動素子11とを同一のプリント
基板9に実装する構造としたから、能動素子11の入力
端子(ゲート電極)をマイクユニットMUを構成する背
極板6に電気的に接続する導体は背極板6を構成する銅
箔を配線パターン12として延長して形成しておくだけ
でよく、この配線パターン12に能動素子11を半田付
して実装するだけでマイクユニットMUと能動素子11
との接続が完了する。従って組立を容易に行なうことが
でき、量産が容易に行なえる利点が得られる。
As described above, according to the present invention, since the microphone unit MU and the active element 11 are mounted on the same printed circuit board 9, the input terminal (gate electrode) of the active element 11 is connected to the microphone. The conductor electrically connected to the back electrode plate 6 constituting the unit MU only needs to be formed by extending the copper foil constituting the back electrode plate 6 as the wiring pattern 12. The microphone unit MU and the active element 11 are simply mounted by soldering.
The connection with is completed. Therefore, there is an advantage that assembly can be easily performed and mass production can be easily performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この考案の一実施例を示す分解斜視図。FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

【図2】この考案の要部の構造を説明するための断面
図。
FIG. 2 is a sectional view for explaining a structure of a main part of the present invention.

【図3】従来の技術を説明するための断面図。FIG. 3 is a cross-sectional view for explaining a conventional technique.

【図4】エレクトレットマイクロホンの電気的な構造を
説明するための接続図。
FIG. 4 is a connection diagram for explaining the electrical structure of the electret microphone.

【符号の説明】[Explanation of symbols]

2 音孔 MU マイクユニット 4 振動板 5 導電リング 6 背極板 7 絶縁スペーサ 9 プリント基板 11 能動素子 12 配線パターン 14 前部筒状半体 15 後部筒状半体 14A,15A 閉塞板 16 樹脂カプセル 17 孔 Reference Signs List 2 sound hole MU microphone unit 4 diaphragm 5 conductive ring 6 back electrode plate 7 insulating spacer 9 printed circuit board 11 active element 12 wiring pattern 14 front cylindrical half 15 rear cylindrical half 14A, 15A closing plate 16 resin capsule 17 Hole

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭58−207798(JP,A) 特開 平3−6500(JP,A) 特開 昭57−112199(JP,A) 特開 昭52−2425(JP,A) 実公 昭52−23967(JP,Y2) (58)調査した分野(Int.Cl.6,DB名) H04R 19/04──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-207798 (JP, A) JP-A-3-6500 (JP, A) JP-A-57-112199 (JP, A) JP-A 52-207 2425 (JP, A) J. 52-23967 (JP, Y2) (58) Fields investigated (Int. Cl. 6 , DB name) H04R 19/04

Claims (5)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 A.背極板となるべき導電パターン及び
インピーダンス変換用能動素子を実装するための導電パ
ターンが形成されたプリント基板と、 B.上記背極板となるべき導電パターンの周縁に形成さ
れ、振動板と背極板との間隙を保持するための絶縁スペ
ーサと、 C.導電性リングに張付られ高分子材料から成る膜に分
極を与えて帯電させた振動板と、 D.この振動板を支持した導電リングと電気的に接触
し、上記プリント基板の表裏両面を覆う導電性樹脂材に
よって成形した樹脂カプセルと、 によって構成したエレクトレットマイクロホン。
1. A. First Embodiment B. a printed board on which a conductive pattern to be a back electrode plate and a conductive pattern for mounting an active element for impedance conversion are formed; B. an insulating spacer formed on the periphery of the conductive pattern to be the back electrode plate for maintaining a gap between the diaphragm and the back electrode plate; A diaphragm attached to the conductive ring and charged by imparting polarization to a film made of a polymer material; A resin capsule formed of a conductive resin material that is in electrical contact with the conductive ring supporting the diaphragm and covers both the front and back surfaces of the printed circuit board.
【請求項2】 背極板となるべき導電パターンと能動素
子の入力端子との間は上記プリント基板上において配線
パターンによって平面的に接続して構成した請求項1記
載のエレクトレットマイクロホン。
2. The electret microphone according to claim 1, wherein a conductive pattern to be a back electrode plate and an input terminal of the active element are planarly connected by a wiring pattern on the printed circuit board.
【請求項3】 樹脂カプセルは一端が閉塞された前部筒
状半体と後部筒状半体とによって構成され、これら筒状
半体の開口部を対向させて配置し、開口部の縁同士を溶
着し、内部に上記プリント基板及び導電リングに支持さ
れた振動板を封止する構造とした請求項1記載のエレク
トレットマイクロホン。
3. The resin capsule is composed of a front cylindrical half and a rear cylindrical half whose one end is closed, and the openings of these cylindrical halves are arranged to face each other, and the edges of the openings are connected to each other. 3. The electret microphone according to claim 1, wherein the diaphragm is welded to seal the diaphragm supported by the printed circuit board and the conductive ring.
【請求項4】 樹脂カプセルを構成する前部筒状半体の
閉塞板に振動板と対向して音孔を形成すると共に、上記
プリント基板に形成された背極板となるべき導電パター
ンの形成位置に上記プリント基板を貫通する透孔を形成
し、上記振動板と前部筒状半体の閉塞板との間に形成さ
れた空間及び後部筒状半体とプリント基板との間の空間
によって前部音響室及び後部音響室とを構成した請求項
1記載のエレクトレットマイクロホン。
4. A sound hole is formed on a closing plate of the front cylindrical half that constitutes the resin capsule in opposition to the vibration plate, and a conductive pattern to be a back electrode plate formed on the printed circuit board is formed. A through hole is formed through the printed circuit board at a position, and a space formed between the diaphragm and the closing plate of the front tubular half and a space between the rear tubular half and the printed circuit board are provided. The electret microphone according to claim 1, wherein a front acoustic room and a rear acoustic room are configured.
【請求項5】 前部筒状半体の閉塞板の背面に上記音孔
を取囲む凹部が形成され、この凹部に振動板を支持した
導電リングを嵌着し、導電リングを前部筒状半体に電気
的に接触させ、導電リングを通じて振動板を樹脂カプセ
ルに電気的に接続する構造とした請求項1記載のエレク
トレットマイクロホン。
5. A recess surrounding the sound hole is formed on the back surface of the closing plate of the front cylindrical half, and a conductive ring supporting the diaphragm is fitted into the recess, and the conductive ring is connected to the front cylindrical member. 2. The electret microphone according to claim 1, wherein the diaphragm is electrically connected to the half body, and the diaphragm is electrically connected to the resin capsule through a conductive ring.
JP1993034665U 1993-06-25 1993-06-25 Electret microphone Expired - Lifetime JP2578773Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1993034665U JP2578773Y2 (en) 1993-06-25 1993-06-25 Electret microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1993034665U JP2578773Y2 (en) 1993-06-25 1993-06-25 Electret microphone

Publications (2)

Publication Number Publication Date
JPH077299U JPH077299U (en) 1995-01-31
JP2578773Y2 true JP2578773Y2 (en) 1998-08-13

Family

ID=12420736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1993034665U Expired - Lifetime JP2578773Y2 (en) 1993-06-25 1993-06-25 Electret microphone

Country Status (1)

Country Link
JP (1) JP2578773Y2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639561B2 (en) * 2001-09-14 2011-02-23 日本電気株式会社 Condenser microphone
JP2006033091A (en) * 2004-07-12 2006-02-02 Jepico Corp Sensor unit and sensor signal processing circuit
JP5481852B2 (en) * 2008-12-12 2014-04-23 船井電機株式会社 Microphone unit and voice input device including the same
EP3373597B1 (en) * 2017-03-07 2019-08-14 G.R.A.S. Sound & Vibration A/S Low profile surface mount microphone

Also Published As

Publication number Publication date
JPH077299U (en) 1995-01-31

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