JPH077299U - Electret microphone - Google Patents
Electret microphoneInfo
- Publication number
- JPH077299U JPH077299U JP3466593U JP3466593U JPH077299U JP H077299 U JPH077299 U JP H077299U JP 3466593 U JP3466593 U JP 3466593U JP 3466593 U JP3466593 U JP 3466593U JP H077299 U JPH077299 U JP H077299U
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- circuit board
- printed circuit
- half body
- back electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
(57)【要約】
【目的】 組立が容易に行なえる構造のエレクトレット
マイクを提供する。
【構成】 プリント基板9に背極板6となる導体パター
ンを形成すると共に、この背極板6の周縁に振動板と背
極板6との間の間隙を規定する絶縁スペーサ7を被着形
成し、この絶縁スペーサの上に導電リング5に張付られ
た振動板4を対接させる。背極板6は配線導体によって
プリント基板9に実装した能動素子11の入力端子に接
続する。プリント基板9の表側と裏側には導電性樹脂材
によって成形した前部筒状半体14と後部筒状半体15
を被せ、これら前部筒状半体14と後部筒状半体15の
開口端同士を溶着することによりプリント基板9と振動
板4を内部に固定し封止する。
(57) [Abstract] [Purpose] To provide an electret microphone having a structure that can be easily assembled. A conductor pattern serving as a back electrode plate 6 is formed on a printed circuit board 9, and an insulating spacer 7 that defines a gap between the diaphragm and the back electrode plate 6 is formed on the periphery of the back electrode plate 6 by deposition. Then, the diaphragm 4 attached to the conductive ring 5 is brought into contact with the insulating spacer. The back electrode plate 6 is connected to the input terminal of the active element 11 mounted on the printed board 9 by a wiring conductor. A front cylindrical half body 14 and a rear cylindrical half body 15 formed of a conductive resin material are formed on the front and back sides of the printed circuit board 9.
Then, the open ends of the front cylindrical half body 14 and the rear cylindrical half body 15 are welded to each other to fix and seal the printed circuit board 9 and the diaphragm 4 inside.
Description
【0001】[0001]
この考案は分極により帯電されて形成されたエレクトレットを利用したエレク トレットマイクロホンに関する。 The present invention relates to an electret microphone that uses an electret formed by being charged by polarization.
【0002】[0002]
図3に従来のエレクトレットマイクロホンの構造を示す。図中1は例えばアル ミ等の導電板で形成したマイクカプセルを示す。このマイクカプセル1はプレス 加工によりコップ状に形成されコップの底板に相当する部分に音孔2が形成され 、この底板に相当する部分がマイクロホンの前面板1Aとして利用される。前面 板1Aの前面に前面クロス3が貼付けられる。 FIG. 3 shows the structure of a conventional electret microphone. In the figure, 1 indicates a microphone capsule formed of a conductive plate such as aluminum. This microphone capsule 1 is formed into a cup shape by pressing, and a sound hole 2 is formed in a portion corresponding to the bottom plate of the cup, and the portion corresponding to this bottom plate is used as the front plate 1A of the microphone. The front cloth 3 is attached to the front surface of the front plate 1A.
【0003】 マイクカプセル1の内部には前端側にマイクユニットMUが配置される。マイ クユニットMUは振動板4と背極板6とによって構成される。振動板4は高分子 材料によって形成された膜と、この膜に被着形成した金属層とを具備し、高分子 膜が厚み方向に分極されてエレクトレットを構成し、このエレクトレットから成 る振動板4が背極板6とわずかな間隙(数10μm程度)を保持して配置され、 振動板4が振動することによりこれら振動板4と背極板6との間から電気信号を 取出す構造とされる。Inside the microphone capsule 1, a microphone unit MU is arranged on the front end side. The microphone unit MU is composed of the diaphragm 4 and the back electrode plate 6. The diaphragm 4 includes a film made of a polymer material and a metal layer deposited on the film. The polymer film is polarized in the thickness direction to form an electret. The diaphragm composed of this electret. 4 is arranged with a small gap (several tens of μm) held between the back electrode plate 6 and the diaphragm 4 so that an electric signal is taken out from between the diaphragm 4 and the back electrode plate 6 by vibrating. It
【0004】 振動板4は導電リング5に張付けられ、導電リング5を通じてマイクカプセル 1に電気的に接続される。振動板4と背極板6との間には振動板4と背極板6と の間の間隙を保持するための絶縁スペーサ7を介挿し背極板6とスペーサ7及び 振動板4、導電リングを前面板1Aに押し当て、マイクユニットMUをマイクカ プセル1の前端側に保持させる。The diaphragm 4 is attached to the conductive ring 5, and is electrically connected to the microphone capsule 1 through the conductive ring 5. An insulating spacer 7 for holding a gap between the diaphragm 4 and the back electrode plate 6 is interposed between the diaphragm 4 and the back electrode plate 6, and the back electrode plate 6, the spacer 7 and the diaphragm 4 The ring is pressed against the front plate 1A to hold the microphone unit MU on the front end side of the microphone capsule 1.
【0005】 マイクユニットMUをマイクカプセル1内において前端側に押し付けるために 従来は背極ホルダ8が設けられる。この例では背極ホルダ8をコップ状に形成し 、コップ状の開口端部に背極板6を支持しマイクユニットMUをマイクカプセル 1の前端側に押し当てる。 背極ホルダ8の底面部がマイクカプセル1の開口部に配置され、その外側にプ リント基板9が配置される。背極ホルダ8の内部にインピーダンス変換用の能動 素子11が収納される。この能動素子11は一般に入力インピーダンスが高い電 界効果トランジスタが用いられ、その入力端子となるゲート電極Gが背極板6に 接続され、ドレイン電極Dとソース電極が背極ホルダ8の底面板とプリント基板 9に形成した孔を通じてプリント基板9の表側に導出され、この表側の面に形成 された配線導体に半田付される。図4にエレクトレットマイクロホンの電気的な 接続構造を示す。A back electrode holder 8 is conventionally provided to press the microphone unit MU toward the front end side in the microphone capsule 1. In this example, the back pole holder 8 is formed in a cup shape, the back pole plate 6 is supported at the opening end of the cup shape, and the microphone unit MU is pressed against the front end side of the microphone capsule 1. The bottom surface portion of the back electrode holder 8 is arranged in the opening portion of the microphone capsule 1, and the print substrate 9 is arranged outside thereof. An active element 11 for impedance conversion is housed inside the back electrode holder 8. A field-effect transistor having a high input impedance is generally used as the active element 11, a gate electrode G serving as an input terminal thereof is connected to the back electrode plate 6, and a drain electrode D and a source electrode are the bottom plate of the back electrode holder 8. It is led out to the front side of the printed circuit board 9 through the hole formed in the printed circuit board 9 and is soldered to the wiring conductor formed on the front side surface. Fig. 4 shows the electrical connection structure of the electret microphone.
【0006】[0006]
従来のエレクトレットマイクロホンはマイクカプセル1の前端側にマイクユニ ットMUを配置し、後端側にプリント基板9及びこのプリント基板9に能動素子 11を実装する構造のため、能動素子11とマイクユニットMUとの接続が立体 的な接続構造となり、組立に手間が掛る欠点がある。 Since the conventional electret microphone has a structure in which the microphone unit MU is arranged on the front end side of the microphone capsule 1 and the printed circuit board 9 and the active element 11 are mounted on the rear end side, the active element 11 and the microphone unit MU are arranged. There is a drawback that the connection with and becomes a three-dimensional connection structure, which requires time and effort for assembly.
【0007】 この考案の目的は組立を容易に行なうことができる構造のエレクトレットマイ クロホンを提供しようとするものである。An object of the present invention is to provide an electret microphone having a structure that can be easily assembled.
【0008】[0008]
この考案では、マイクユニットと能動素子とを同一面上に配置する構造とし、 これによりマイクユニットと能動素子との間をプリント配線によって接続する構 造としたものである。 更に詳しく説明すれば、プリント基板に背極板となるべき導電パターンと、イ ンピーダンス変換用の能動素子を実装するためのプリント配線とを形成し、能動 素子をプリント基板に実装することにより、必然的に能動素子の入力端子と背極 板となるべき導電パターンとが接続される。背極板となるべき導電パターンの周 縁に絶縁インク等によってスペーサを形成し、このスペーサの上に導電リングに 張付けられて支持された振動板を乗せ、スペーサの厚み分の間隙を保持して背極 板と対向させる。 In this invention, the microphone unit and the active element are arranged on the same surface, and the structure is such that the microphone unit and the active element are connected by the printed wiring. More specifically, by forming a conductive pattern to be a back electrode plate on a printed circuit board and a printed wiring for mounting an active element for impedance conversion, and mounting the active element on the printed circuit board, it is inevitable. The input terminal of the active element is electrically connected to the conductive pattern to serve as the back plate. A spacer is formed on the periphery of the conductive pattern that should become the back electrode plate with insulating ink, etc., and a diaphragm supported by a conductive ring is placed on this spacer to maintain a gap corresponding to the thickness of the spacer. Face the back plate.
【0009】 振動板を支持した導電リングは導電性樹脂材によって形成された樹脂カプセル の閉塞板に形成された凹部に嵌着される。この結果、振動板は導電リングを介し て樹脂カプセルに電気的に接続される。 樹脂カプセルは一端が閉塞された一対の筒状半体によって構成される。つまり 前部筒状半体と後部筒状半体とによって構成され、これら一対の筒状半体を開口 端部を向い合せて開口端部同士を溶着することによりプリント基板と振動板とを 内部に封止する構造とされる。The conductive ring supporting the vibration plate is fitted into the recess formed in the closing plate of the resin capsule formed of the conductive resin material. As a result, the diaphragm is electrically connected to the resin capsule via the conductive ring. The resin capsule is composed of a pair of cylindrical halves whose one end is closed. That is, it is composed of a front tubular half and a rear tubular half, and the pair of tubular halves face each other with their open ends facing each other, and the open ends are welded to each other, so that the printed circuit board and the diaphragm are internally sealed. The structure is to be sealed.
【0010】 従ってこの考案の構造によれば振動板と背極板から成るマイクユニットと能動 素子とを同一のプリント基板上に実装するから、組立を簡単に行なうことができ る利点が得られる。Therefore, according to the structure of the present invention, the microphone unit composed of the diaphragm and the back electrode plate and the active element are mounted on the same printed circuit board, so that there is an advantage that the assembly can be easily performed.
【0011】[0011]
図1及び図2にこの考案の一実施例を示す。図3と対応する部分には同一符号 を付して示す。つまり、9はプリント基板、11はこのプリント基板9に実装し たFETのような能動素子、12はこの能動素子11を実装する配線パターンを 示す。この考案の特徴とする構造はプリント基板9に背極板6となる導電パター ンを形成すると共に、背極板6の周縁に絶縁インク等によって絶縁スペーサ7を 被着形成し、この絶縁スペーサ7を介して導電リング5に支持された振動板4を 対向させて配置する。これら背極板6と、絶縁スペーサ7及び導電リング5と振 動板4とによってマイクユニットMUを構成した点と、背極板6と能動素子11 の入力端子との間を配線パターン12で接続した点である。 1 and 2 show an embodiment of the present invention. Portions corresponding to those in FIG. 3 are designated by the same reference numerals. That is, 9 is a printed circuit board, 11 is an active element such as an FET mounted on the printed circuit board 9, and 12 is a wiring pattern for mounting the active element 11. The structure characteristic of this invention is that a conductive pattern to be the back electrode plate 6 is formed on the printed circuit board 9, and an insulating spacer 7 is adhered and formed on the periphery of the back electrode plate 6 with insulating ink or the like. The vibrating plates 4 supported by the conductive ring 5 are disposed so as to face each other. A wiring pattern 12 connects between the back electrode plate 6, the insulating spacer 7, the conductive ring 5, and the vibration plate 4 to form a microphone unit MU and the back electrode plate 6 and the input terminal of the active element 11. That is the point.
【0012】 14及び15は樹脂カプセル16を構成する前部筒状半体と、後部筒状半体を 示す。これら前部筒状半体14と後部筒状半体15は一端が閉塞板14A及び1 5Aによって閉塞された筒状半体によって構成される。材質は導電性樹脂材によ って形成され、開口端部同士を向い合せて溶着(例えば超音波溶着)し、この溶 着によって内部にプリント基板9と振動板4を封止する。Reference numerals 14 and 15 denote a front cylindrical half body and a rear cylindrical half body that form the resin capsule 16. The front tubular half body 14 and the rear tubular half body 15 are constituted by tubular half bodies whose one ends are closed by the closing plates 14A and 15A. The material is made of a conductive resin material, and the opening ends are opposed to each other and welded (for example, ultrasonic welding), and the printed board 9 and the diaphragm 4 are sealed inside by this welding.
【0013】 前部筒状半体14の閉塞板14Aには振動板4と対向する位置に音孔2を形成 する。更に前部筒状半体14の閉塞板14Aの背面には図2に示すように、音孔 2を取囲むように凹部14Bを形成する。この凹部14Bに導電リング5を嵌合 させることにより振動板4の位置を固定すると共に、振動板4を電気的に前部筒 状半体14、つまり樹脂カプセル16に電気的に接続する。振動板4を支持した 導電リング5を嵌合した前部筒状半体14とプリント基板9と後部筒状半体15 とを積ね合せ、前部筒状半体14と後端筒状半体15とをその開口端部同士を溶 着することにより組立が完了する。尚、図2に示す凹部14Cは能動素子11を 収納するための凹部を示す。A sound hole 2 is formed in the closing plate 14 A of the front cylindrical half body 14 at a position facing the diaphragm 4. Further, as shown in FIG. 2, a concave portion 14B is formed so as to surround the sound hole 2 on the back surface of the closing plate 14A of the front cylindrical half body 14. The position of the diaphragm 4 is fixed by fitting the conductive ring 5 into the recess 14B, and the diaphragm 4 is electrically connected to the front cylindrical half body 14, that is, the resin capsule 16. The front tubular half body 14 fitted with the conductive ring 5 supporting the diaphragm 4, the printed circuit board 9, and the rear tubular half body 15 are stacked to form a front tubular half body 14 and a rear end tubular half body. The assembly is completed by welding the body 15 and the open ends thereof. The recess 14C shown in FIG. 2 is a recess for accommodating the active element 11.
【0014】 後部筒状半体15の内周には段部15Bを設け、この段部15Bによってプリ ント基板9を受け止め、プリント基板9と後部筒状半体15との間に空室を形成 する。これと共に、プリント基板9の背極板6を形成した部分に複数の孔17を 形成し、この孔17を通じてプリント基板9と後部筒状半体15との間に形成し た空室を振動板4の面に連通させ後部音響室を形成する。A step portion 15 B is provided on the inner circumference of the rear tubular half body 15, and the print substrate 9 is received by the step portion 15 B to form an empty space between the printed board 9 and the rear tubular half body 15. To do. Along with this, a plurality of holes 17 are formed in the portion of the printed circuit board 9 where the back electrode plate 6 is formed, and the vacant space formed between the printed circuit board 9 and the rear cylindrical half body 15 through the holes 17 is used as the vibration plate. The rear acoustic chamber is formed by communicating with the surface of No. 4.
【0015】 前部音響室は振動板4と前部筒状半体14の閉塞板14Aとの間の空隙によっ て形成され、これら前部音響室と後部音響室の各容積によってマイクロホンの音 響特性が設定される。尚、マイクロホンの特性を双指向性、単一指向性とする場 合には閉塞板15Aの一部に音孔を形成することがある。The front acoustic chamber is formed by a gap between the diaphragm 4 and the closing plate 14A of the front cylindrical half body 14, and the volume of the front acoustic chamber and the volume of the rear acoustic chamber make the sound of the microphone sound. The resonance characteristics are set. When the characteristics of the microphone are bidirectional and unidirectional, a sound hole may be formed in a part of the closing plate 15A.
【0016】[0016]
以上説明したように、この考案によればマイクユニットMUと能動素子11と を同一のプリント基板9に実装する構造としたから、能動素子11の入力端子( ゲート電極)をマイクユニットMUを構成する背極板6に電気的に接続する導体 は背極板6を構成する銅箔を配線パターン12として延長して形成しておくだけ でよく、この配線パターン12に能動素子11を半田付して実装するだけでマイ クユニットMUと能動素子11との接続が完了する。従って組立を容易に行なう ことができ、量産が容易に行なえる利点が得られる。 As described above, according to the present invention, since the microphone unit MU and the active element 11 are mounted on the same printed circuit board 9, the input terminal (gate electrode) of the active element 11 constitutes the microphone unit MU. The conductor electrically connected to the back electrode plate 6 only needs to be formed by extending the copper foil forming the back electrode plate 6 as the wiring pattern 12, and the active element 11 is soldered to this wiring pattern 12. The connection between the microphone unit MU and the active element 11 is completed only by mounting. Therefore, there is an advantage that the assembling can be easily performed and the mass production can be easily performed.
【図1】この考案の一実施例を示す分解斜視図。FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
【図2】この考案の要部の構造を説明するための断面
図。FIG. 2 is a sectional view for explaining the structure of the main part of the present invention.
【図3】従来の技術を説明するための断面図。FIG. 3 is a cross-sectional view for explaining a conventional technique.
【図4】エレクトレットマイクロホンの電気的な構造を
説明するための接続図。FIG. 4 is a connection diagram for explaining an electrical structure of an electret microphone.
2 音孔 MU マイクユニット 4 振動板 5 導電リング 6 背極板 7 絶縁スペーサ 9 プリント基板 11 能動素子 12 配線パターン 14 前部筒状半体 15 後部筒状半体 14A,15A 閉塞板 16 樹脂カプセル 17 孔 2 sound hole MU microphone unit 4 diaphragm 5 conductive ring 6 back electrode plate 7 insulating spacer 9 printed circuit board 11 active element 12 wiring pattern 14 front cylindrical half body 15 rear cylindrical half body 14A, 15A closing plate 16 resin capsule 17 Hole
Claims (5)
インピーダンス変換用能動素子を実装するための導電パ
ターンが形成されたプリント基板と、 B.上記背極板となるべき導電パターンの周縁に形成さ
れ、振動板と背極板との間隙を保持するための絶縁スペ
ーサと、 C.導電性リングに張付られ高分子材料から成る膜に分
極を与えて帯電させた振動板と、 D.この振動板を支持した導電リングと電気的に接触
し、上記プリント基板の表裏両面を覆う導電性樹脂材に
よって成形した樹脂カプセルと、 によって構成したエレクトレットマイクロホン。1. A. A printed circuit board on which a conductive pattern to serve as a back electrode plate and a conductive pattern for mounting an active element for impedance conversion are formed; An insulating spacer formed on the periphery of the conductive pattern to be the back electrode plate, for holding a gap between the diaphragm and the back electrode plate; A diaphragm that is attached to a conductive ring and is charged by applying a polarization to a film made of a polymer material; An electret microphone composed of a resin capsule formed of a conductive resin material that electrically contacts the conductive ring supporting the diaphragm and covers both the front and back surfaces of the printed circuit board.
子の入力端子との間は上記プリント基板上において配線
パターンによって平面的に接続して構成した請求項1記
載のエレクトレットマイクロホン。2. The electret microphone according to claim 1, wherein a conductive pattern to serve as a back electrode plate and an input terminal of an active element are planarly connected by a wiring pattern on the printed circuit board.
状半体と後部筒状半体とによって構成され、これら筒状
半体の開口部を対向させて配置し、開口部の縁同士を溶
着し、内部に上記プリント基板及び導電リングに支持さ
れた振動板を封止する構造とした請求項1記載のエレク
トレットマイクロホン。3. A resin capsule is composed of a front tubular half body and a rear tubular half body whose one end is closed. The openings of these tubular half bodies are arranged to face each other, and the edges of the openings are opposed to each other. The electret microphone according to claim 1, wherein the electret microphone has a structure in which a diaphragm supported by the printed circuit board and the conductive ring is sealed inside by welding.
閉塞板に振動板と対向して音孔を形成すると共に、上記
プリント基板に形成された背極板となるべき導電パター
ンの形成位置に上記プリント基板を貫通する透孔を形成
し、上記振動板と前部筒状半体の閉塞板との間に形成さ
れた空間及び後部筒状半体とプリント基板との間の空間
によって前部音響室及び後部音響室とを構成した請求項
1記載のエレクトレットマイクロホン。4. A conductive pattern that forms a back electrode plate formed on the printed circuit board while forming a sound hole in the closing plate of the front cylindrical half body that constitutes the resin capsule so as to face the diaphragm. A through hole is formed at a position to penetrate the printed circuit board, and a space formed between the diaphragm and the closing plate of the front cylindrical half body and a space between the rear cylindrical half body and the printed circuit board are formed. The electret microphone according to claim 1, wherein the front acoustic chamber and the rear acoustic chamber are configured.
を取囲む凹部が形成され、この凹部に振動板を支持した
導電リングを嵌着し、導電リングを前部筒状半体に電気
的に接触させ、導電リングを通じて振動板を樹脂カプセ
ルに電気的に接続する構造とした請求項1記載のエレク
トレットマイクロホン。5. A concave portion surrounding the sound hole is formed on the back surface of the closing plate of the front cylindrical half body, and a conductive ring supporting the diaphragm is fitted in the concave portion to form the conductive ring in the front cylindrical shape. The electret microphone according to claim 1, wherein the diaphragm is electrically connected to the half body and the diaphragm is electrically connected to the resin capsule through a conductive ring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1993034665U JP2578773Y2 (en) | 1993-06-25 | 1993-06-25 | Electret microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1993034665U JP2578773Y2 (en) | 1993-06-25 | 1993-06-25 | Electret microphone |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH077299U true JPH077299U (en) | 1995-01-31 |
JP2578773Y2 JP2578773Y2 (en) | 1998-08-13 |
Family
ID=12420736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1993034665U Expired - Lifetime JP2578773Y2 (en) | 1993-06-25 | 1993-06-25 | Electret microphone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2578773Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003087898A (en) * | 2001-09-14 | 2003-03-20 | Nec Corp | Condenser microphone |
JP2006033091A (en) * | 2004-07-12 | 2006-02-02 | Jepico Corp | Sensor unit and sensor signal processing circuit |
WO2010067834A1 (en) * | 2008-12-12 | 2010-06-17 | 船井電機株式会社 | Microphone unit and voice input device using same |
JP2020509709A (en) * | 2017-03-07 | 2020-03-26 | ジー.アール.エー.エス. サウンド アンド バイブレーション アクチエゼルスカベット | Discreet surface mount microphone |
-
1993
- 1993-06-25 JP JP1993034665U patent/JP2578773Y2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003087898A (en) * | 2001-09-14 | 2003-03-20 | Nec Corp | Condenser microphone |
JP4639561B2 (en) * | 2001-09-14 | 2011-02-23 | 日本電気株式会社 | Condenser microphone |
JP2006033091A (en) * | 2004-07-12 | 2006-02-02 | Jepico Corp | Sensor unit and sensor signal processing circuit |
WO2010067834A1 (en) * | 2008-12-12 | 2010-06-17 | 船井電機株式会社 | Microphone unit and voice input device using same |
JP2010141720A (en) * | 2008-12-12 | 2010-06-24 | Funai Electric Co Ltd | Microphone unit and voice input device equipped with the same |
JP2020509709A (en) * | 2017-03-07 | 2020-03-26 | ジー.アール.エー.エス. サウンド アンド バイブレーション アクチエゼルスカベット | Discreet surface mount microphone |
Also Published As
Publication number | Publication date |
---|---|
JP2578773Y2 (en) | 1998-08-13 |
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