KR100606165B1 - Multi hole Diaphragm For Microphone And Condenser Microphone Using the Same - Google Patents

Abstract

The present invention relates to a multiple diaphragm of a condenser microphone and a condenser microphone using the same.

The diaphragm of the present invention includes a pole ring made of a metal plate on which at least two vibration holes are formed; It is composed of a vibrating membrane attached to the pole ring. Here, the vibrating membrane is made of a polymer film, such as PET, PPS is coated with a metal film. In addition, the microphone of the present invention includes a case in which an acoustic hole for introducing the front sound on the bottom surface is formed and the other surface is opened and the opening surface is cured; A multiple diaphragm comprising a pole ring made of a metal plate on which at least two vibration holes are formed, and a vibration membrane attached to the pole ring; A spacer in contact with the diaphragm; An insulation ring inserted into the case to provide an insulation function; A back plate inserted into the insulating ring so as to face the diaphragm with the spacer interposed therebetween; A conductive ring located within the insulating ring and supporting the back plate, the conductive ring providing electrical connection to the back plate; And a PCB electrically connected to the back plate through a conductive ring, electrically connected to the vibrating membrane through a case, and provided with circuit elements.

Condenser microphone, diaphragm, diaphragm, multi-hole, metal plate, pole ring

Description

Multi diaphragm for condenser and condenser microphone using the same {Multi hole Diaphragm For Microphone And Condenser Microphone Using the Same}             

1 is a view showing the structure of a conventional diaphragm for a microphone,

2a to 2c are views showing the multiple diaphragm for the microphone according to the present invention,

3 is a first embodiment of a condenser microphone to which the present invention is applied;

4 is a second embodiment of a condenser microphone to which the present invention is applied;

5 is a third embodiment of a condenser microphone to which the present invention is applied.

* Explanation of symbols for main parts of the drawings

100: multiple diaphragm 110: pole plate

120: vibration membrane 112: vibration hole

202: case 204: diaphragm

206: spacer 208: insulating ring

210: back plate 212: conductive ring

214: PCB

The present invention relates to a condenser microphone, and more particularly, to a condenser microphone using multiple diaphragms of the microphone and the same.

In general, a condenser microphone widely used in a mobile communication terminal or an audio device includes a voltage bias element, a diaphragm / backplate pair forming a capacitor C that changes in response to sound pressure, and a buffer for output signal. It consists of a field effect transistor (JFET).

The condenser microphone is composed of an assembly in which a diaphragm, a spacer ring, an insulating ring, a back plate, an energizing ring, and a PCB are integrally assembled in one case. The conventional diaphragm 10 is made of metal, as shown in FIG. 1. And a vibrating membrane 14 made of a polymer film such as polyethylene terephthalate (PET) and polyphenylene sulfide (PPS) coated with a metal film on the cylindrical pole ring 12.

The conventional diaphragm 10 has a problem that the sound collection effect is insufficient because the vibration membrane 14 vibrates through one vibration hole 12a.

An object of the present invention is to provide a multi-vibration plate and a condenser microphone using the same to form a sound collecting effect by forming a plurality of vibration holes in the metal plate to solve the above problems.

In order to achieve the above object, the diaphragm of the present invention comprises: a condenser microphone comprising: a pole ring made of a metal plate having at least two vibration holes; It is characterized by consisting of a vibration membrane attached to the pole ring. Here, the vibrating membrane is made of a polymer film, such as PET, PPS is coated with a metal film.

In addition, the microphone of the present invention in order to achieve the above object, the sound hole for introducing the front sound in the bottom surface is formed and the other surface is opened in the tubular opening is cured; A multiple diaphragm comprising a pole ring made of a metal plate having at least two vibration holes and a vibration membrane attached to the pole ring; A spacer in contact with the diaphragm; An insulation ring inserted into the case to provide an insulation function; A back plate inserted into the insulating ring to face the diaphragm with the spacer interposed therebetween; A conductive ring located within the insulating ring and supporting the back plate, the conductive ring providing electrical connection to the back plate; And a PCB electrically connected to the back plate through the conductive ring, electrically connected to the vibrating membrane through the case, and provided with a circuit element.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2a is a perspective view showing a multiple diaphragm for a microphone according to the present invention, Figure 2b is a plan view, Figure 2c is a side cross-sectional view.

2A to 2C, the multiple diaphragm 100 of the present invention includes a pole ring 110 made of a metal plate having at least two vibration holes 112 and a vibration membrane 120 attached to the pole ring 110. It consists of. The vibration membrane 120 is made of a polymer film, such as polyethylene terephthalate (PET), polyphenylene sulfide (PPS) is coated with a metal film.

The diaphragm 100 forms a plurality of vibrating cells facing the back plate with the spacers interposed therebetween, and each vibrating cell vibrates independently by sound pressure introduced through the front sound hole, thereby achieving an overall sound collecting effect. .

3 is a first embodiment of the condenser microphone to which the present invention is applied, and is a case where the multiple diaphragm of the present invention is applied to a conventional circular microphone.

Referring to FIG. 3, the microphone 200 of the first exemplary embodiment of the present invention has a cylindrical case 202 having one surface opened and a sound hole 202a formed at a bottom thereof, and a multiple diaphragm inserted into the cylindrical case 202. 204, a ring-shaped thin spacer 206, a cylindrical insulating ring 208 having an upper and lower openings, a disk-shaped back plate 210 having a sound hole 210a, and a back plate 210, a circuit board (PCB: Conductive ring 212 for electrically connecting with 214, and a disk-shaped PCB 214 is mounted on one side (IC, MLCC) and the connection terminal is formed on the other side. Here, the multiple diaphragm 204 is composed of a pole ring 204b made of a metal plate on which a plurality of vibration holes 112 are formed, and a vibration membrane 204a attached to the pole ring 204b, and the vibration membrane 204a is formed of a metal film. It consists of a polymer film such as PET, PPS coated. In the back plate 210, an organic film is fused to a metal plate, and an electret is formed on the organic film.

The condenser microphone 200 according to the first embodiment has the multiple diaphragm 204, the spacer 206, the insulation ring 208, and the back plate 210 formed with the sound hole 210a in the cylindrical case 202. The ring 212 and the disk-shaped PCB 214 are sequentially arranged and then assembled into a structure in which the end of the case 202 is cured.

The operation of the condenser microphone of the first embodiment is as follows.

In the condenser microphone 200 according to the present invention, Vdd and GND power are applied from the outside through a connection terminal. Accordingly, the multiple diaphragm 204 of the condenser microphone according to the present invention is electrically connected to the PCB 214 via the case 202, and the back plate 210 is electrically connected to the PCB 214 through the conductive ring 212. Is connected.

In such a state, the sound from the external sound source is introduced into the microphone through the sound hole 202a of the case 202 and transmitted to each of the vibration holes 112 of the pole ring 204b to individually separate the vibration membrane 204a. As the vibrating membrane 204a of each vibrating hole 112 vibrates, the distance between the vibrating membrane 204a of each vibrating hole and the back plate 210 is changed, and as a result, the capacitance changes so that electric The signal (voltage) can be changed, and this signal is transferred to the IC mounted on the PCB 214 along the electrical connection line, amplified, and then output to the external circuit through the connection terminal.

4 is a second embodiment of the condenser microphone to which the present invention is applied, and is an example of applying the multiple diaphragm of the present invention to a condenser microphone having an integrated base.

Referring to FIG. 4, the condenser microphone 300 according to the present invention includes a diaphragm 304, a spacer 306, a back plate insulating ring 308, and a back plate 310 in a cylindrical case 302 having one surface open. After the integrated base 312 and the PCB 314 are sequentially disposed, the end of the case 302 is cured to complete the assembly. Here, the multiple diaphragm 304 is composed of a pole ring 304b made of a metal plate on which a plurality of holes 112 are formed, and a vibrating membrane 304a attached to the pole ring 304b, and the vibrating membrane 304a is coated with a metal film. It consists of polymer films, such as PET and PPS.

In this case, the back plate 310 is formed by bonding an organic film (polymer film) to a metal plate, and an electret is formed on the organic film (polymer film), and a separate back plate insulating ring 308 instead of the integrated base 312. Is insulated from the case 302. The back plate 310 is supported by the integrated base 312 and electrically connected to the PCB substrate 314 by a conductive pattern 312a formed of a metal plating layer formed on both sides of the integrated base 312. A circuit component such as a JFET is mounted on the PCB substrate 314. The end of the case 302 is cured to press the PCB 314 inward. In addition, the inner space formed by the back plate 310 and the integrated base 312 and the PCB 314 is called a back chamber. The back chamber of the microphone according to the present invention has no conventional second base. The volume can be made larger.

In the condenser microphone 300 of the present invention, the vibration membrane 304a is electrically connected to the PCB 314 circuit through the pole ring 304b and the case 302, and the back plate 310 is formed of the integrated base 312. The conductive pattern 312a is electrically connected to the PCB 314 to form an electrical circuit.

In the condenser microphone 300 of the present invention as described above, when air is introduced into the microphone through the sound hole 302a of the case 302 by external sound waves, the vibrating membrane 304a of each vibration hole vibrates by this sound pressure. In addition, it is introduced into the back chamber formed between the PCB 314 and the back plate 310 through the sound hole 310a formed in the back plate 310. At this time, when the vibration membrane 304a is vibrated by the sound pressure introduced through the sound hole 302a, the distance between the vibration membrane 304a and the back plate 310 is changed. When the interval is changed by the sound pressure, the capacitance formed by the vibrating membrane 304a and the back plate 310 is changed to obtain a change in the electrical signal (voltage) according to the sound wave. It is transferred to IC such as JFET mounted in the amplification and amplified and transmitted to the outside through connection terminal.

5 is a third embodiment of the condenser microphone to which the present invention is applied, and is an example in which the multiple diaphragm of the present invention is applied to a rectangular microphone. In the third embodiment of the present invention, the case in which the inner element is also a quadrangle has been described as an example.

Referring to FIG. 5, the condenser microphone 400 of the present invention includes a rectangular cylindrical case 402 having one surface opened and an acoustic hole 402a for introducing sound into the bottom surface, and a rectangular cylindrical case 402. A diaphragm 404 having a rectangular outer circumferential surface and a plurality of circular vibration holes formed therein, a spacer 406 having a rectangular outer circumferential surface and a rectangular inner circumferential surface, an insulating ring 408 having a rectangular cylindrical shape with a top and bottom opening, and a sound hole Square plate-shaped back plate 410 having a 410a formed therein, a conductive ring 412 having an outer circumferential surface for connecting the back plate 410 to the circuit board 414 and a rectangular inner circumferential surface, and a component IC, MLCC) is mounted, and is composed of a square plate-shaped PCB 414 having protruding terminals formed on the other surface thereof. Here, the diaphragm 404 is composed of a pole ring 404b made of a metal plate having a plurality of vibration holes 112 and a vibrating membrane 404a attached to the pole ring 404b, and the vibrating membrane 404a is coated with a metal film. It consists of polymer films, such as PET and PPS.

The operation of the condenser microphone of the third embodiment is as follows.

The condenser microphone 400 according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the condenser microphone 400 according to the present invention, the vibrating membrane 404a is electrically connected to the PCB 414 via the case 402 and the pole ring 404b, and the back plate 410 is electrically conductive. It is electrically connected to the PCB 414 through.

In this state, the sound from the external sound source is introduced into the microphone through the sound hole 402a of the case and transmitted to the vibrating membrane 404a, and the sound of the back chamber passes the sound hole 410a of the back plate 410. Passed to the vibrating membrane 404a.

Therefore, the vibrating membrane 404a vibrates by sound pressure, and thus the distance between the vibrating membrane 404a and the back plate 410 is changed, and as a result, the electrostatic formed by the vibrating membrane 404a and the back plate 410 is changed. The capacitance is changed to obtain a change in the electrical signal (voltage) according to the sound wave, which is transmitted to the IC mounted on the PCB 414 along the electrical connection line, amplified, and then amplified by an external terminal. Output to the circuit.

As described above, according to the present invention, a plurality of vibration holes may be formed in the pole ring to provide a sound collection effect such as using a plurality of microphones even with one microphone.

Claims (5)

delete delete A case in which an acoustic hole for introducing the front sound is formed on the bottom surface and the other surface is opened, and the opening surface is cured; A multiple diaphragm comprising a pole ring made of a metal plate having at least two vibration holes and a vibration membrane attached to the pole ring; A spacer in contact with the diaphragm; An insulation ring inserted into the case to provide an insulation function; A back plate inserted into the insulating ring to face the diaphragm with the spacer interposed therebetween; A conductive ring located within the insulating ring and supporting the back plate, the conductive ring providing electrical connection to the back plate; And And a PCB electrically connected to the back plate through the conductive ring, and electrically connected to the vibrating membrane through the case, and having a circuit element installed thereon. A case in which an acoustic hole for introducing the front sound is formed on the bottom surface and the other surface is opened, and the opening surface is cured; A multiple diaphragm comprising a pole ring made of a metal plate having at least two vibration holes and a vibration membrane attached to the pole ring; A spacer in contact with the diaphragm; An annular back plate insulating ring for insulating the back plate; A disk-shaped back plate in which sound holes are formed; An integrated base having a conductive pattern formed on the inner circumferential surface of the cylindrical insulating body having a top and bottom openings for providing an electrical connection between the back plate and the PCB; And Condenser microphone using a multiple diaphragm, characterized in that the electrical circuit is electrically connected to the back plate through the conductive pattern, through the case and electrically connected to the vibrating membrane, the circuit device is installed. A case having a rectangular cylindrical shape in which one surface is opened and an acoustic hole for introducing sound into the bottom surface is formed; A multiple diaphragm comprising a pole ring made of a metal plate having at least two vibration holes and a vibration membrane attached to the pole ring; Ring-shaped thin spacers; Insulation ring with upper and lower openings; A back plate on which sound holes are formed; A conductive ring for electrically connecting the back plate to a circuit board (PCB); And Condenser microphone using a multiple diaphragm, characterized in that the electrically connected to the back plate through the conductive ring, the case is electrically connected to the vibrating membrane through the case, a circuit board is installed in a rectangular plate-shaped PCB.

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