JPH02111990A - Duplicating pattern for hologram and production of hologram - Google Patents

Abstract

PURPOSE:To duplicate an initial relief pattern faithfully by allowing a resin layer which can be cured with electron beams or ultraviolet rays to contact closely with a surface of an original plate for hologram, curing the resin layer and removing a photoresist layer by dissolution after stripping off a base material for the original plate for hologram. CONSTITUTION:After curing a resin layer 2, which can be cured with electron beams or ultraviolet rays and has been allowed to contact closely with an original plate A for hologram provided with a photoresist layer 3 by irradiating the resin layer 2 with electron beams or ultraviolet rays, a base material 4 of the original plate A is stripped from an interface, then the photoresist layer 3 is removed. As described above, a photopolymer 3 constituting the original plate A for hologram is adhered firmly to a resin 2 for constituting a resin pattern in a stage of producing the resin pattern, and the photopolymer 3 is removed from a base material 4 for the photopolymer by stripping from an interface between the photopolymer 3 and the base material 4 after curing, and the photopolymer 3 is removed thereafter. Thus, a relief pattern of a matrix can be reproduced faithfully without causing damage to the initial relief pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to the manufacture of holograms, and more particularly to a method of manufacturing a replica mold for a relief type hologram and an effective method of manufacturing a hologram.

Since holograms reproduce three-dimensional images, they are loved for their excellent design and are used for books, magazine covers, POP displays, gifts, and the like. Furthermore, since holograms are equivalent to recording information on the submicron order, they are also used to prevent counterfeiting of securities, credit cards, and the like.

(Prior art) Conventionally, when mass-producing relief-type holograms, a mold is made from a photoresist on which an uneven relief pattern is formed as a base plate by metal plating, etc., and this mold is used to form a pattern on the base material. A known method is to mass-reproduce holograms by thermo-pressing the coated thermoplastic resin, but this method requires a lot of steps to make molds, making quality control difficult. However, since it requires a large amount of time and labor, there is a problem in that it leads to high product prices.

Therefore, as a method to solve the above problem, a method of using electron beams, ultraviolet curing resin, thermoplastic resin, or thermosetting resin instead of a mold was proposed in Japanese Patent Application Laid-Open No. 58-184986.
proposed in No. In this method, when making a resin mold, a curable resin such as an electron beam or an ultraviolet curable resin is directly adhered to the surface of the photopolymer matrix, and the relief pattern is replicated, but it faithfully reproduces the relief pattern of the hologram original. In order to do this, the photopolymer and curable resin must have good wettability, but as this increases the adhesive strength between the two, it is realistic to peel it off while keeping the initial relief pattern in good condition. It is very difficult to Even if it can be peeled off, it is difficult to avoid damage to the relief pattern due to cohesive failure inside the photopolymer or inside the curable resin, and there are problems such as the type of curable resin to be selected is extremely limited.

Furthermore, in the publication, when producing a replicated hologram using a resin mold, an electron beam or ultraviolet curing resin is brought into close contact with the resin mold, and the resin mold is cured and shaped by electron beam or ultraviolet irradiation. The material itself may deteriorate due to irradiation with high-energy rays during electrical transformation, which may cause problems in ensuring stable quality.

(Problems to be Solved by the Invention) The problems to be solved by the present invention are as described above. By doing so,
This shortens the process and stabilizes manufacturing quality.

Furthermore, during the production of the resin mold, the photopolymer serving as the hologram original plate and the resin mold production resin are adhered well, and after curing, the photopolymer and the photopolymer base material are peeled off from the interface,
By subsequently removing the photopolymer, a resin mold for reproducing a hologram is obtained which faithfully reproduces the relief pattern of the mother mold without causing any damage to the initial relief pattern.

Another object of the present invention is to provide a method for mass-reproducing holograms with stable quality using the hologram reproduction mold and using a replication device for embossing molding using heat and pressure, which is simple in principle.

(Means for Solving the Problems) That is, the present invention provides a resin layer containing at least an electron beam or ultraviolet curable resin or monomer on a film or sheet support that is transparent to electron beams or ultraviolet rays. The photoresist layer having a fine relief pattern on the surface is then brought into close contact with the hologram original plate provided with the photoresist layer, and the resin layer is cured by irradiation with an electron beam or ultraviolet rays. This is a method for manufacturing a hologram duplication mold, in which a hologram duplication mold is obtained by peeling from the photoresist layer and then removing the photoresist layer. Moreover, the method for manufacturing a hologram is characterized in that the duplication mold is removed after being bonded under heat and pressure onto a thermoplastic resin layer.

The present invention further provides for manufacturing a hologram replica mold by irradiating the support with electron beams or ultraviolet rays.

(Detailed description of the invention) Hereinafter, the present invention will be explained in detail using the drawings.

Figures 1 to 3 show a method for manufacturing a hologram duplication type according to the present invention, and Figures 4 to 5'ff are related to a method for mass-producing holograms, and each shows a cross-sectional view. .

First, the constituent materials will be explained, and then the manufacturing process will be explained.

In FIG. 1, ( ]) is a film or sheet-like support, (2) is a resin layer containing at least an electron beam or ultraviolet curable resin or monomer, and (3) is a relief pattern that is a hologram original. The photoresist layer (4) is a base material of the photoresist, and a glass plate is usually used.

The film or sheet-like support (1) that is transparent to electron beams or ultraviolet rays according to the present invention has appropriate heat resistance and mechanical strength that can withstand the heating of the thermoplastic resin in the subsequent process and the heating during pressure embossing molding. , surface smoothness, etc. are required, and specifically, polyester, polycarbonate, glass, etc. can be used, and the thickness is preferably about 20 to 200 μm. Furthermore, heat-resistant films such as polyetherimide, polyphenylene sulfide, and polyimide can also be used.

Examples of the electron beam or ultraviolet curable resin or monomer contained in the resin layer include -S ester acrylate,
Epoxy acrylates, urethane acrylates, and the like can be used, but those that have excellent adhesion to the photoresist layer of the hologram original plate and provide a cured film with a high crosslinking density with 2 or more bone fats are particularly preferred. Further, the resin layer may use only the electron beam or ultraviolet curable resin or monomer, but a mixture with other thermosetting resins or thermoplastic resins may also be used.

As the photoresist layer on which the relief pattern is formed, generally widely used semiconductor resists can be used, but positive resists with particularly excellent resolution are preferable, such as AZ-1350 and AZ-2400 (all of which are manufactured by Shipley Co., Ltd.). (manufactured by Tokyo Ohka Co., Ltd.), 0FPR800 (manufactured by Tokyo Ohka Co., Ltd.) Wa
As the photoresist base material (4) of which Y coat HPR (manufactured by Hunt Co., Ltd.) is commercially available, a glass plate is usually used because smoothness is required.

In FIG. 4, (5) is a thermoplastic resin layer, and (6) is a thermoplastic resin base material.

The thermoplastic resin layer (5) is made of polyester resin, polystyrene, styrene-acrylic copolymer, polyvinyl chloride,
Polyvinyl acetate, vinyl chloride-vinyl acetate copolymer, polyvinyl acecool, alkyd resin, acrylic resin, polyacrylonitrile, polycarbonate polyketone, etc. can be used.

As the thermoplastic resin base material (6), polyester, polypropylene, polycarbonate, cellophane, etc. can be used, and the above-mentioned electron beam or ultraviolet transparent film can also be used. Thickness is 10~1100
A film or sheet of about tI is preferred.

Next, the manufacturing process will be explained.

First, in FIG. 1, a resin layer (2) consisting of a resin liquid containing at least an electron beam or ultraviolet ray curable resin or a monomer is placed on the film or sheet-like support (1).
) without applying a primer by a known method such as knife coating or spin cord roll coating, and then brought into close contact with the surface of the hologram master A, that is, the photoresist layer (3) having an uneven surface. The photoresist layer is coated on glass with a thickness of 2 to 3 mm using a spin code to a film thickness of about 1 to 3 μm, exposed to an argon laser, and then developed with a specified developer to create a relief image. This is what was created.

Next, the resin layer is cured by irradiating electron beams or ultraviolet rays from the support side (1). In this case, in order to perform a sufficient curing reaction, the electron beam irradiation amount is 1.
It is preferable that it is OMrad or more, and in the case of ultraviolet rays, it is 100 mj/c- or more.

After curing by the above method, Xi is released from the interface between the photoresist layer (3) and its base material (4) as shown in FIG. In order to improve the releasability, it is more preferable not to use a primer in the photoresist coating process.Next, the photoresist layer (3) is removed. In this case, use a solvent that dissolves the photoresist layer (3) and does not attack the cured resin layer. Alternatively, the photoresist layer can be exposed again and removed using a prescribed developer.

Next, as shown in FIG. 4, the round hologram reproduction mold B obtained by the above-mentioned method is brought into close contact with the thermoplastic resin layer (5), and simultaneously subjected to heating and pressure embossing molding, and then peeled off. As a result, a final hologram replica C is obtained as shown in FIG.

Hereinafter, the present invention will be explained in more detail using Examples.

(Example-1) Using AZ-1350 (manufactured by Shipley) as a photoresist without using a primer, a photoresist layer with a film thickness of approximately 1.5 μm was prepared on a base material consisting of a glass plate with a thickness of 3 mm. Then, the interference fringes of the three-dimensional object are removed by approximately 1
After exposure for 0 minutes, a relief hologram was produced by alkali development, and this was used as a hologram original.

Next, about 10 μm of an electron beam curable resin having the following composition was placed on a support made of a 70 μm thick polyester film.
A resin layer was formed by wire bar coating to a film thickness of m, and after this was brought into close contact with the relief surface of the hologram master, an electron beam of 200 Xev was irradiated from the support side at an absorbed dose of 5 Mrad. , then peeled off from the interface between the photoresist layer of the hologram master and its base glass plate, and then the photoresist layer was exposed to ultraviolet light and then removed by ultrasonic waves in an alkaline developer to create a polyester film and cured resin. A hologram replica mold was created. A good resin mold was obtained in which the relief pattern was not damaged and the pattern of the hologram master was faithfully reproduced.

"Electron beam curable three-bone fat acrylate' (B,t(EX-?J:1!: KAYARA
D TMPTA ) -7o'Mt+lJ thickness 50μ
A thermoplastic resin having the following composition was coated with a wire bar to a thickness of about 15 μm on a base material made of a polyester film of 1.0 m to prepare a film for a replicated hologram.

60 parts by weight of isopropanol Next, about 25 kg/cm of the relief surface of the hologram reproduction mold was applied to the thermoplastic resin layer surface of the film for reproduction holograms.
d, and heated at 120°C for 15 seconds from the support side of the hologram reproduction mold, and then,
A hologram reproduction mold product was obtained by peeling off the thermoplastic resin layer surface and the hologram reproduction mold. i) A hologram that gives a good, sharp and clear image.

(Example-2) A resin liquid having the following composition was spread onto a support made of a polyester film with a thickness of 100 μm using a wire bar for about 10 μm.
It was coated to have a thickness of m, and after being brought into close contact with the relief surface of the hologram original plate in the same manner as in Example-1, the strength was 400 mj/crA from the polyester film side.
The resin layer was cured by irradiation with ultraviolet rays, and then the photoresist layer was removed in the same manner as in Example-1, thereby producing a hologram replica mold. The obtained replication mold was good as in Example-1.

"Ultraviolet curable acrylate (manufactured by Nippon Kayaku Co., Ltd.: kAYAI?AD TMPTA)"
-70 parts by weight L benzoin isobutyl ether-0,4
Part by Weight Next, a relief pattern was produced on the thermoplastic resin layer using the same method and conditions as in Example 1 to obtain a hologram reproduction product. A clear hologram similar to that in Example-1 was obtained.

(Effect of the invention) Hologram according to the invention! ! ! According to this method, as described above, it is possible to significantly shorten the steps in producing a hologram reproduction mold and save time accordingly.

Furthermore, a decagram? When making a JI mold, the hologram master and at least an electronic cotton or ultraviolet curable resin or a resin layer containing a monomer are brought into close contact and cured to achieve good adhesion, and then the photoresist layer of the hologram master and the base By peeling from the material interface and then removing the photoresist layer, it is possible to obtain a good hologram reproduction mold that faithfully reproduces the initial relief pattern.

In addition, by using the hologram replica mold obtained by the above method, it is possible to create a hologram with a clear image and stable quality on the thermoplastic resin layer using a method using heating and pressure embossing that is simple in principle. This has the great effect of making large-scale reproduction possible in a short period of time.

[Brief explanation of the drawing]

1, 2 and 3 are cross-sectional views showing a method for manufacturing a resin mold for hologram reproduction, and FIGS. 4 and 5 are sectional views showing a method for mass-reproducing holograms. 1...Support 2...Resin layer 3...Photoresist N 4.6...Base material 5...
Thermoplastic resin layer A...Original hologram B...Reproduction version C...Application for permission to maintain hologram reproduction
Representative Kazuo Suzuki, Jintoppan Printing Co., Ltd. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Procedural amendment (voluntary) 1. Indication of the case 1988 Patent Application No. 266588 2. Name of the invention Hologram reproduction Mold and hologram manufacturing method 3, relationship with the case of the person making the amendment Patent applicant address: 5-1-4 Taito-chome, Taito-ku, Tokyo, subject of amendment a) Detailed description of the invention in the specification ((Δ5 , Contents of the amendment B) The Detailed Description of the Invention column of the specification shall be amended as follows.
", insert barcode J. B. Specification, page 11, lines 19 to 20
ARAD TMPTA) - 10 parts by weight J [electron beam curable double-gability acrylate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.: NK
Ester A-BPH-4)-70 parts by weight J. C3 Specification, page 12, lines 1 to 2, ``Electron beam curing urethane ac! ], Specification page 13, lines 10 to 11 Fat acrylate (manufactured by Nippon Kayaku Co., Ltd.: KA\'AR
AD TMPTA) - 70 parts by weight" to "ultraviolet curable Ninomiya i acrylate (manufactured by Nippon Kayaku Co., Ltd.: KAYAIi
AD MAND, N ) 70 overlapping section". Ko゛CE. On page 13, line 13 of the specification, "(2KA ARAD

Claims (3)

[Claims] (1) A resin layer consisting of at least an electron beam or ultraviolet ray curable resin or a resin containing a monomer is provided on an electron beam or ultraviolet ray transparent film or notebook-like support, and then the surface is A hologram master plate consisting of a photoresist layer having a fine relief pattern and a base material that can be peeled from the photoresist layer is closely adhered to the hologram original plate, and an electron beam,
Alternatively, after curing the resin layer by irradiating with ultraviolet rays,
A hologram duplication type manufacturing method in which a base material of a hologram original plate is peeled off and a photoresist layer is dissolved and removed. (2) A method for manufacturing a hologram duplication type according to claim (1), wherein electron beams or ultraviolet rays are irradiated from the support side. (3) A method for producing a hologram, which comprises the step of heat-pressing the replica mold obtained in claim (1) onto a thermoplastic resin layer of a base material having a thermoplastic resin layer, and then removing the replica mold.