JPS60254174A - Duplicating method of hologram - Google Patents
Duplicating method of hologramInfo
- Publication number
- JPS60254174A JPS60254174A JP11166384A JP11166384A JPS60254174A JP S60254174 A JPS60254174 A JP S60254174A JP 11166384 A JP11166384 A JP 11166384A JP 11166384 A JP11166384 A JP 11166384A JP S60254174 A JPS60254174 A JP S60254174A
- Authority
- JP
- Japan
- Prior art keywords
- hologram
- film
- resin
- original plate
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims abstract description 55
- 239000011347 resin Substances 0.000 claims abstract description 55
- 238000001723 curing Methods 0.000 claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims abstract description 8
- 238000001227 electron beam curing Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims abstract 5
- 238000010894 electron beam technology Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 description 19
- 239000002904 solvent Substances 0.000 description 11
- -1 polyethylene Polymers 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 125000004386 diacrylate group Chemical group 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 125000004069 aziridinyl group Chemical group 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000010076 replication Effects 0.000 description 2
- 230000003362 replicative effect Effects 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VTRHYFDNOLMPHD-UHFFFAOYSA-N (1-prop-2-enoyloxycyclohexyl) prop-2-enoate Chemical compound C=CC(=O)OC1(OC(=O)C=C)CCCCC1 VTRHYFDNOLMPHD-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- DZSVIVLGBJKQAP-UHFFFAOYSA-N 1-(2-methyl-5-propan-2-ylcyclohex-2-en-1-yl)propan-1-one Chemical compound CCC(=O)C1CC(C(C)C)CC=C1C DZSVIVLGBJKQAP-UHFFFAOYSA-N 0.000 description 1
- OGBWMWKMTUSNKE-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C OGBWMWKMTUSNKE-UHFFFAOYSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XEZCCHVCBAZAQD-UHFFFAOYSA-N 2-(aziridin-1-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCN1CC1 XEZCCHVCBAZAQD-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- UZDMJPAQQFSMMV-UHFFFAOYSA-N 4-oxo-4-(2-prop-2-enoyloxyethoxy)butanoic acid Chemical compound OC(=O)CCC(=O)OCCOC(=O)C=C UZDMJPAQQFSMMV-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- XTNAQYPNHOEHCW-UHFFFAOYSA-N [1-(2-methylprop-2-enoyloxy)cyclohexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(OC(=O)C(C)=C)CCCCC1 XTNAQYPNHOEHCW-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000001093 holography Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
- B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H1/028—Replicating a master hologram without interference recording by embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/722—Decorative or ornamental articles
- B29L2031/7224—Holograms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/04—Processes or apparatus for producing holograms
- G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
- G03H2001/185—Applying a curing step
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Holo Graphy (AREA)
Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明は、ホログラムの複製方法に関し、さらに詳しく
は、複製工程を著しく簡素化でき、したかって大量生産
が可能なホログラムの複製方法に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for replicating holograms, and more particularly to a method for replicating holograms that can significantly simplify the replication process and thus enable mass production.
ホログラフィ−とは、物体からの光の波面を記録する新
しい技術であって、この技術によって作られたホログラ
ムによれば、立体像を再生することができしかも多重記
録も可能となる。またホログラムの記録の一方法として
、物体からの光の波面に相当する干渉縞を材料表面の凹
凸模様で記録することができ、このホログラムは大量複
製が容易である。Holography is a new technology that records the wavefront of light from an object, and holograms made using this technology can reproduce three-dimensional images and also allow multiple recording. In addition, as a method for recording holograms, interference fringes corresponding to the wavefront of light from an object can be recorded as an uneven pattern on the surface of a material, and this hologram can be easily reproduced in large quantities.
このようなホログラムを、たとえばクレジットカード、
バンクカードなどのカード類に設ければ、美しさおよび
目新らしさを備え、しかもカード自体の偽造ならびに変
造が困難なカード類が得られる。また、本の表紙、レコ
ードジャケット、あるいは衣類などに設ければ、美しさ
および目新らしさを備えた製品が得られる。A hologram like this can be placed on a credit card, for example.
When provided in cards such as bank cards, it is possible to obtain cards that have beauty and novelty, and are difficult to counterfeit or alter. Moreover, if it is provided on the cover of a book, record jacket, clothing, etc., a product with beauty and novelty can be obtained.
ホログラムをカード類あるいは本の表紙、レコードジャ
ケットなどに設けるためには、物体からする必要がある
。In order to place a hologram on cards, book covers, record jackets, etc., it is necessary to start with an object.
従来、ホログラムの複製は、熱可塑性樹脂と、物体から
の光の波面に相当する干渉縞を凹凸模様で表面に形成さ
nたホログラム原版とを、加熱条件下で圧接させて熱可
塑性樹脂の表面に凹凸を形成することによって行なわれ
ていた。ところがこの方法によれば、熱可塑性樹脂とホ
ログラム原版とを圧接させながら、冷却する必要があっ
た。なぜなら、加熱条件下で熱可塑性樹脂とホログラム
原版とを圧接させて熱可塑性樹脂の表面に凹凸を形成し
た後直ちに圧接状態全解除すると、一旦熱可塑性樹脂表
面に形成された凹凸が消滅してしまうからである。この
ため、ホログラムの複製工程に長時間を必要とし、また
、多数回の加熱・冷却を繰シ返すためホログラム原版が
劣化するという問題点があった。さらに、ホログラムは
、熱可塑性樹脂で作るため耐熱性がなく、また一般的に
耐−溶剤性にも劣る問題もあった。Conventionally, holograms have been reproduced by pressing a thermoplastic resin and a hologram master plate, on which interference fringes corresponding to the wavefront of light from an object are formed in an uneven pattern, under heated conditions. This was done by forming unevenness on the surface. However, according to this method, it was necessary to cool the thermoplastic resin and the hologram master while bringing them into pressure contact. This is because if a thermoplastic resin and a hologram master are pressed together under heating conditions to form unevenness on the surface of the thermoplastic resin, and then the pressure is completely released immediately, the unevenness that was once formed on the thermoplastic resin surface will disappear. It is from. Therefore, the hologram copying process requires a long time, and the hologram original plate deteriorates because heating and cooling are repeated many times. Furthermore, since holograms are made of thermoplastic resin, they lack heat resistance and generally have poor solvent resistance.
一方、このようなホログラム複製に際しての加熱や耐熱
性、耐溶剤性に伴なう問題点を解消するため、基材フィ
ルム上に紫外線硬化樹脂が設けられてなるホログラム形
成用フィルムとホログラム原版とを圧接させ、次いで紫
外線をこのフィルム上に照射して前記樹脂を硬化させる
ことによって、ホログラムの複製をしようとする試みも
提案されている。ところが、従来用いられてきた種類の
紫外線硬化樹脂は、一般に液体状態にあるため、基材フ
ィルム上に塗布した場合に著しくべたつキ、シたがって
基材フィルム上に従来の紫外線硬化樹脂を塗布してなる
ホログラム形成用フィルムは巻取って保管することがで
きず、したがってホログラム原版と接触する直前に基材
フィルム上にいちいち紫外線硬化樹脂を塗布してホログ
ラム形成用フィルムを作成しなければならないという問
題点があった。On the other hand, in order to solve the problems associated with heating, heat resistance, and solvent resistance during hologram duplication, a hologram forming film in which an ultraviolet curing resin is provided on a base film and a hologram original plate have been developed. Attempts have also been made to reproduce holograms by applying pressure and then irradiating ultraviolet light onto the film to cure the resin. However, since the types of UV curable resins that have been used in the past are generally in a liquid state, they become extremely sticky when applied to the base film, and therefore it is difficult to apply conventional UV curable resins onto the base film. The hologram-forming film made by this process cannot be rolled up and stored, so it is necessary to create a hologram-forming film by applying an ultraviolet curing resin onto the base film immediately before it comes into contact with the hologram master. There was a problem.
発明の目的
本発明は、これら従来技術に伴なう問題点を解決しよう
とするものでアシ、以下のような目的を有する。OBJECTS OF THE INVENTION The present invention is intended to solve the problems associated with these conventional techniques, and has the following objects.
(、) ホログラム原版とホログラム形成用フィル宏鉦
加熱冷却を繰り返す必要がなく、したがってホログラム
原版を劣化させることのないホログラムの複製方法を提
供すること。(,) To provide a hologram duplication method that does not require repeated heating and cooling of a hologram original plate and a hologram forming fill plate and does not cause deterioration of the hologram original plate.
(b) ホログラム原版とホログラム形成用フィルムと
を加熱状態に保って圧接させることによりホログラム形
成用フィルムの表面に物体からの光の波面に相当する干
渉縞を凹凸の形で形成した後、直ちに圧接状態を解除し
て冷却することができ、したがってホログラムの複製工
程を者しく簡素化できるとともに大量生産が可能なホロ
グラムの複製方法を提供すること。(b) Immediately after forming interference fringes corresponding to the wavefront of light from an object in the form of irregularities on the surface of the hologram forming film by keeping the hologram master and the hologram forming film in a heated state and pressing them together, the hologram master plate and the hologram forming film are pressed together. To provide a method for duplicating a hologram by which the state can be released and cooled, thereby clearly simplifying the process of duplicating the hologram, and enabling mass production.
(C) 巻取って保存することが可能なホログラム形成
用フィルムを用いることによって、ホログラムの複製工
程を簡素化でき、しかも大量生産が可能なホログラムの
複製方法を提供すること。(C) To provide a hologram duplication method that can simplify the hologram duplication process and enable mass production by using a hologram forming film that can be rolled up and stored.
(d) 耐熱性、耐溶剤性に優れたホログラムを提供す
ること。(d) To provide a hologram with excellent heat resistance and solvent resistance.
発明の概要
本発明に係るホログラムの複製方法は、基材フィルム上
に熱成形性を有する紫外線硬化樹脂または電子線硬化樹
脂が設けられてなるホログラム形成用フィルムと表面に
物体からの光の波面に相当する干渉縞を凹凸の模様とし
て形成されているホログラム原版とを、加熱条件下で圧
接させて前記樹脂に凹凸を形成し、次いで直ちに紫外線
または電子線を前記ホログラム形成用フィルムに照射さ
せることを特徴としている。Summary of the Invention A hologram duplication method according to the present invention comprises a hologram forming film comprising a base film and a thermoformable ultraviolet curable resin or an electron beam curable resin, and a hologram forming film formed by applying a wavefront of light from an object to the surface of the hologram forming film. A hologram original plate having corresponding interference fringes formed as an uneven pattern is brought into pressure contact with the resin under heating conditions to form unevenness in the resin, and then immediately the hologram forming film is irradiated with ultraviolet rays or electron beams. It is a feature.
以下本発明を図面に示す具体例について説明する。The present invention will be described below with reference to specific examples shown in the drawings.
図は、本発明に係るホログラムの複製工程を示すもので
ある。ホログラム形成用フィルム1は、基材フィルム2
上に、熱成形性を有する紫外線硬化樹脂または電子線硬
化樹脂3が設けられて構成されている。必要に応じて、
基材フィルム2と前記樹脂3との間には、剥離層(図示
せず)が設けられていてもよい。The figure shows a hologram replication process according to the present invention. The hologram forming film 1 is a base film 2
A thermoformable ultraviolet curable resin or electron beam curable resin 3 is provided thereon. as needed,
A release layer (not shown) may be provided between the base film 2 and the resin 3.
基材フィルム2としては、フィルム状のあらゆる材料が
用いられうる。具体的には、ポリエチレン、ポリプロピ
レン、ポリエチレンテレフタレート、ポリ塩化ビニル、
塩化ビニル/酢酸ビニル共重合体、ポリ塩化ビニリデン
、ポリメタクリル酸メチル、ポリスチレン、?リビニル
プチラール、ポリカーボネートなどの重合体フィルム、
紙、合成紙、鉄などの金属フィルムなどが用いられつる
。As the base film 2, any film-like material can be used. Specifically, polyethylene, polypropylene, polyethylene terephthalate, polyvinyl chloride,
Vinyl chloride/vinyl acetate copolymer, polyvinylidene chloride, polymethyl methacrylate, polystyrene, ? Polymer films such as ribinyl petyral and polycarbonate,
Paper, synthetic paper, and metal films such as iron are used for vines.
また、これらの積1体も用いられうる。Moreover, a single product of these can also be used.
本発明に用いられうる熱成形;生を有する紫外線硬化樹
脂または電子線硬化樹脂3は、常温では固体状であって
、基材フィルム2上に設けられた場合に、表面がべたつ
くことがなく巻取り可能である。したがって、基材フィ
ルム2上に前記樹脂を設けてなるホログラム形成用フィ
ルム1は、巻取って保存することができるため、ホログ
ラム原版と接触する直前に、基材フィルム上にいちいち
前記樹脂を設ける必要がない。Thermoforming that can be used in the present invention; the raw ultraviolet curable resin or electron beam curable resin 3 is solid at room temperature, and when provided on the base film 2, the surface does not become sticky and can be rolled. It is possible to take. Therefore, since the hologram forming film 1 in which the resin is provided on the base film 2 can be rolled up and stored, it is necessary to provide the resin on the base film one by one immediately before contacting the hologram master. There is no.
本発明のホログラム層に使用可能な材料としてはう・ク
カル重合性不飽和基金有する熱成形性物質であり、次の
2種類のものがある。Materials that can be used for the hologram layer of the present invention are thermoformable substances having a creeping/curing polymerizable unsaturated foundation, and there are two types of materials as follows.
(1)ガラス転移温度が0〜250℃のポリマー中にう
・ジカル重合性不飽和基を有するもの。さらに具体的に
は、ホリマーとしては以下の化合物■〜■を重合、もし
くは共重合させたものに対し後述する方法(イ)〜に)
によりラジカル重合性不飽和基を導入したものを用いる
ことができる。(1) A polymer having a glass transition temperature of 0 to 250°C and having a u-/dical-polymerizable unsaturated group. More specifically, as a polymer, the following compounds ■ to ■ are polymerized or copolymerized using the method (a) to) described below.
It is possible to use those into which radically polymerizable unsaturated groups have been introduced.
■ 水酸基を有する単量体二N−メチロールアクリルア
ミド、2−ヒドロキシエチルアクリレート、2−ヒドロ
キシエチルメタクリレート、2−ヒドロキシプロピルア
クリレート、2−ヒドロキシプロピルメタクリレート、
2−ヒドロキシブチルアクリレート、2−ヒドロキシエ
チルアクリレート、2−ヒドロキシ、3−フェノキシゾ
ロビルメタクリレート、2−ヒドロキシ、3−フェノキ
シプロピルアクリレート7など。■ Monomers having hydroxyl groups 2N-methylolacrylamide, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate,
2-hydroxybutyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxy, 3-phenoxyzorobyl methacrylate, 2-hydroxy, 3-phenoxypropyl acrylate 7, etc.
■ カルボキシル基を有する単量体ニアクリル酸、メタ
クリル酸、アクリロイルオキシエチルモノサクシネート
など。■ Monomers with carboxyl groups such as nialic acid, methacrylic acid, acryloyloxyethyl monosuccinate, etc.
■ エポキシ基を有する単量体ニゲリシジルメタクリレ
ートなど。■ Monomers such as nigericidyl methacrylate having epoxy groups.
■ アジリジニル基を有する単量体=2−アジリジニル
エチルメタクリレート、2−アジリジニルゾロピオン酸
アリルなど。(2) Monomers having an aziridinyl group = 2-aziridinylethyl methacrylate, allyl 2-aziridinylzolopionate, etc.
■ アミン基を有する単量体ニアクリルアミド、メタク
リルアミド、ダイア七トンアクリルアミド、ジメチルア
ミノエチルメタクリレート、ジエチルアミノエチルメタ
クリレートなど。■ Monomers having amine groups such as niacrylamide, methacrylamide, diaseptone acrylamide, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, etc.
■ スルフォン基含有する単量体=2−アクリルアミド
ー2−メチルプロパンスルフォン酸など。■ Monomer containing sulfone group = 2-acrylamide 2-methylpropanesulfonic acid, etc.
■ インシアネート基を有する単量体:2,4−トルエ
ン、ジイソシアネートと2−ヒドロキシエチルアクリレ
ートの1モル対1モル付加物などのジイソシアネートと
活性水素を有するラジアル重合性単量体の付加物など。(2) Monomers having an incyanate group: adducts of diisocyanates and radially polymerizable monomers having active hydrogen, such as 2,4-toluene, 1 mol to 1 mol adducts of diisocyanate and 2-hydroxyethyl acrylate, and the like.
■ さらに、上記の共重合体のガラス転移点を調節した
り、硬化膜の物性を調節したりするために、上記の化合
物と、この化合物と共重合可能な以下のような単量体と
共重合させることもできる。■Furthermore, in order to adjust the glass transition point of the above copolymer and the physical properties of the cured film, the above compound can be copolymerized with the following monomers that can be copolymerized with this compound. It can also be polymerized.
このような共重合可能な単量体としては、たとえばメチ
ルメタクリレート、メチルアクリレート、エチルアクリ
レート、エチルメタクリレート、プロピルアクリレート
、プロピルメタクリレート、ブチルアクリレート、ブチ
ルメタクリレート、インブチルアクリレート、イソブチ
ルメタクリレート、t−ブチルアクリレート、t−ブチ
ルメタクリレート、インアミルアクリレート、インアミ
ルメタクリレート、フクロヘキシルアクリレート、シク
ロヘキシルメタクリレート、2−エチルへキシルアクリ
レート、2−エチルへキシルメタクリレート、などが挙
けられる。Examples of such copolymerizable monomers include methyl methacrylate, methyl acrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, inbutyl acrylate, isobutyl methacrylate, t-butyl acrylate, Examples include t-butyl methacrylate, inamyl acrylate, inamyl methacrylate, fluorohexyl acrylate, cyclohexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, and the like.
次に上述のようにして得られた重合体を以下に述べる方
法(イ)〜に)により反応させ、ラジカル重合性不飽和
基を導入することによって、本発明に係はアクリル酸、
メタクリル酸などのカルボキシル基を有する単量体など
を組合反応させる。Next, the polymer obtained as described above is reacted with the method (a) to (a) to (b) described below to introduce a radically polymerizable unsaturated group.
Monomers having carboxyl groups such as methacrylic acid are subjected to a combination reaction.
単量体を縮合反応させる。Monomers undergo a condensation reaction.
は前述の水酸基を有する単量体もしくはカルボキシル基
を有する単量体を付加反応させる。The above-mentioned hydroxyl group-containing monomer or carboxyl group-containing monomer is subjected to an addition reaction.
量体あるいはアジリジニル基を有する単量体あるいはジ
イソシアネート化合物と水酸基含有アクリル酸エステル
単量体の1対1モルの付加物を付加反応させる。A 1:1 mole adduct of a monomer having an aziridinyl group or a diisocyanate compound and a hydroxyl group-containing acrylic acid ester monomer is subjected to an addition reaction.
上記反応を行うには、微量のハイドロキノンなどの重合
禁止剤を加え乾燥空気を送りながら行うことが好ましい
。In order to carry out the above reaction, it is preferable to add a small amount of a polymerization inhibitor such as hydroquinone and carry out the reaction while blowing dry air.
(2)融点が0〜250℃であυう・ジカル重合性不飽
和基を有する化合物。具・体的にはステアリルアクリレ
ート、ステアリルメタクリレート、トリアクリルイソ7
アヌレート、シクロヘキサンジオールジアクリレート、
シクロヘキサンジオールジメタクリレート、スピログリ
コ・−ルジアクリレート、スピログリコールジメタクリ
レートなどが挙げられる。(2) A compound having a dicarpolymerizable unsaturated group with a melting point of 0 to 250°C. Specifically, stearyl acrylate, stearyl methacrylate, triacryl iso 7
annulate, cyclohexanediol diacrylate,
Examples include cyclohexanediol dimethacrylate, spiroglycol diacrylate, and spiroglycol dimethacrylate.
また、本発明においては、前記(1) 、 (z)を混
合して用いることもでき、さらに、それらに対してラジ
カル重合性不飽和単量体を加えることもできる。Furthermore, in the present invention, the above (1) and (z) can be used as a mixture, and a radically polymerizable unsaturated monomer can also be added to them.
このラジカル重合性不飽和単量体は、電離放射線照射の
際、架橋密度を向上させ耐熱性を向上させるものであっ
て、前述の単量体の他にエチレングリコールジアクリレ
ート、エチレングリコールジメタクリレート、ポリエチ
レングリコールジアクリレート、ポリエチレングリコー
ルジアクリレート、ヘキサンジオールジアクリレート、
ヘキサンジオールジメタクリレート、トリメチロールゾ
ロバンドリアクリレート、トリメチロールプロノセント
リメタクリレート、トリメチロールプロノぞンジアクリ
レート、トリメチロールプロノぐンジメタクリレート、
ペンタエリスリトールテトラアクリレート、ペンタエリ
スリトールテトラアクリレ−ト、ペンタエリスリトール
トリアク1ル−ト、ペンタエリスリトールトリメタクリ
レート、ジペンタエリスリトールへキサアクリレート、
ジペンタエリスリトールへキサメタクリレート、エチレ
ングリコールジグリシジルエーテルジアクリレート、エ
チレンクリコールシ/’)シクロエーテルジメタクリレ
ート、ポリエチレングリコールジグリシジルエーテルジ
アクリレート、ポリエチレングリレート、プロピレング
リコールジグリシジルエーテルジメタクリレート、ポリ
プロピレングリコールジグリジルエーテルジアクリレー
ト、ポリゾロピレングリコールジグリジルエーテルジメ
タクリレート、ソルビトールテトラグリジルエーテルテ
トラアクリレート、ソルビトールテトラグリシジルエー
テルテトラメタクリレート、などを用いることができ、
前記した共重合体混合物の固型分100重量部に対して
、0.1〜100重量部で用いることが好ましい。また
、上記のものは電子線により十分に硬化可能であるが、
紫外線照射で硬化させる場合には、増感剤として4ンゾ
キノン、ベンゾイン、ベンゾインメチルエーテル、など
のベンゾインエーテル類、ハロゲン化アセトフェノン類
、ビアチル類などの紫外線照射によりラジカルを発生す
るものも用いることができる。This radically polymerizable unsaturated monomer improves crosslinking density and heat resistance when irradiated with ionizing radiation, and in addition to the above-mentioned monomers, ethylene glycol diacrylate, ethylene glycol dimethacrylate, Polyethylene glycol diacrylate, polyethylene glycol diacrylate, hexanediol diacrylate,
hexanediol dimethacrylate, trimethylolzolobandriacrylate, trimethylolpronocentrimethacrylate, trimethylolpronozone diacrylate, trimethylolpronocentrimethacrylate,
Pentaerythritol tetraacrylate, pentaerythritol tetraacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate,
Dipentaerythritol hexamethacrylate, ethylene glycol diglycidyl ether diacrylate, ethylene glycol dimethacrylate, polyethylene glycol diglycidyl ether diacrylate, polyethylene glycol, propylene glycol diglycidyl ether dimethacrylate, polypropylene glycol digly Zyl ether diacrylate, polyzolopyrene glycol diglydyl ether dimethacrylate, sorbitol tetraglycidyl ether tetraacrylate, sorbitol tetraglycidyl ether tetramethacrylate, etc. can be used,
It is preferably used in an amount of 0.1 to 100 parts by weight based on 100 parts by weight of the solid content of the copolymer mixture described above. In addition, although the above-mentioned materials can be sufficiently cured by electron beams,
When curing by ultraviolet irradiation, sensitizers that generate radicals by ultraviolet irradiation, such as benzoin ethers such as 4-zoquinone, benzoin, and benzoin methyl ether, halogenated acetophenones, and biacyl, can also be used. .
ホログラム原版4は、その表面に物体からの光の波面に
相当する干渉縞である凹凸が形成されている。このホロ
グラム原版4は、従来既知の方法によって作成すること
ができ、また、ホログラム原版4に形成されるホログラ
ムは材料表面の凹凸によりホログラムの情報を記録でき
るタイプのもので、具体的には、リップマンホログラム
ラ除く、フレネルホログラム、フーリエ変換ホログラム
、クラウンホーファーホログラムなどの原理のものに及
び、それらの原理を利用したイメージホログラム、レイ
ンボーホログラム、ホログラフィックステレオダラム、
ホログラフィック回折格子などが用いられる。The hologram original plate 4 has irregularities formed on its surface, which are interference fringes corresponding to the wavefront of light from an object. This hologram master plate 4 can be created by a conventionally known method, and the hologram formed on the hologram master plate 4 is of a type in which hologram information can be recorded by the unevenness of the material surface. Excluding holograms, the principles include Fresnel holograms, Fourier transform holograms, and Crownhofer holograms, as well as image holograms, rainbow holograms, holographic stereo durams, etc. that utilize these principles.
A holographic diffraction grating or the like is used.
上記のようなホログラム形成用フィルム1とホラム形成
用フィルム1の紫外線硬化樹脂または電子線硬化樹脂3
の表面に、ホログラム原版4の凹凸模様全複製する。The hologram forming film 1 and the ultraviolet curing resin or electron beam curing resin 3 of the hologram forming film 1 as described above.
The entire uneven pattern of the hologram original plate 4 is replicated on the surface of the hologram original plate 4.
この際、加熱ロールの温度は、用いられている前記樹脂
30種類によって大きく変化するが、品〜300℃望ま
しくは100〜200℃であることが好ましい。さらに
ホログラム形成用フィルム1とホログラム原版4とは、
0.1kg/em以上、望ましくは1kg/cm以上の
圧力下に圧接されることが好−ましい。At this time, the temperature of the heating roll varies greatly depending on the 30 types of resins used, but it is preferably from 300°C to 300°C, preferably from 100 to 200°C. Furthermore, the hologram forming film 1 and the hologram original plate 4 are
It is preferable that the welding is carried out under a pressure of 0.1 kg/em or more, preferably 1 kg/cm or more.
体からの光の波面に相当する干渉縞全凹凸の模様として
ホログラムに形成し、ホログラム原版との圧接状態で紫
外線硬化樹脂ならば紫外線を、また電子線硬化樹脂なら
ば電子線を、ホログラム彫成用フィルムl上に照射して
前記樹脂3を硬化させる。Interference fringes corresponding to the wavefront of light from the body are formed on a hologram as a fully uneven pattern, and the hologram is carved using ultraviolet rays if it is an ultraviolet curable resin or an electron beam if it is an electron beam curable resin while in pressure contact with the hologram original. The resin 3 is cured by irradiating it onto the film l.
紫外線または電子線のホログラム形成用フィルム上への
照射は、照射光源6により行なえばよい。The irradiation of ultraviolet rays or electron beams onto the hologram forming film may be performed using the irradiation light source 6.
この際に、紫外線または電子線の照射は、ホログラム原
版のホログラムの凹凸を成形したフィルムを版より剥離
した後に再度照射してもよく、樹脂を十分に硬化させる
ことが好ましい。紫外線または電子線の照射量は使用す
る樹脂により適宜状めることが必要である。At this time, the irradiation with ultraviolet rays or electron beams may be carried out again after the film formed with the hologram irregularities of the hologram original plate is peeled from the plate, and it is preferable that the resin is sufficiently cured. It is necessary to adjust the amount of ultraviolet ray or electron beam irradiation appropriately depending on the resin used.
このようにしてホログラム形成用フィルム1の紫外線硬
化樹脂または電子線硬化樹脂の表面に凹凸を形成した状
態で紫外線または電子線を照射して前記樹脂を硬化させ
ることによって、直ちにホログラム原版とホログラム形
成用フィルムとの間にかけていた圧力全解除して冷却す
ることが可能となる。なぜなら前記樹脂は、路外線また
は電子線の照射によって直ちに硬化し、したがってホロ
グラム原版とホログラム形成用フィルムとの間にかけて
いた圧力を解除しても形成された凹凸は消滅しないため
である。また、紫外線あるいは電子線の照射により樹脂
が三次元架橋硬化するため、耐熱性、耐溶剤性が付与さ
れる。By thus forming irregularities on the surface of the ultraviolet curable resin or electron beam curable resin of the hologram forming film 1, the resin is cured by irradiating ultraviolet rays or electron beams. It becomes possible to completely release the pressure applied between the film and the film and cool it. This is because the resin is immediately cured by irradiation with off-line radiation or electron beam, and therefore, the formed irregularities do not disappear even if the pressure applied between the hologram original plate and the hologram forming film is released. Furthermore, since the resin is three-dimensionally crosslinked and cured by irradiation with ultraviolet rays or electron beams, heat resistance and solvent resistance are imparted.
なお、ホログラム原版およびホログラム形成用フィルム
を、紫外線または電子線の照射前あるいは照射後に、強
制的に冷却してもよいが、通常は自然に冷却すれば充分
である。Although the hologram master and the hologram forming film may be forcibly cooled before or after irradiation with ultraviolet rays or electron beams, it is usually sufficient to cool them naturally.
次に、ホログラム原版と、表面に凹凸模様が形成された
ホログラム形成用フィルムとを剥離すれば、複製ホログ
ラムが得られる。また、必要であれば剥離後にさらに紫
外線あるいは電子線を照射することにより、十分に樹脂
を硬化させることができ、硬度、耐熱性、耐溶剤性等を
向上させることもできる。Next, a duplicate hologram is obtained by peeling off the hologram original plate and the hologram-forming film having the uneven pattern formed on its surface. Further, if necessary, by further irradiating the resin with ultraviolet rays or electron beams after peeling, the resin can be sufficiently cured, and the hardness, heat resistance, solvent resistance, etc. can be improved.
なお、本発明のホログラム成形用フィルムを用いて従来
の熱0T塑性樹脂を用いた場合と同様に、加熱加圧して
凸凹を成形した状態で冷却しその後、ホログラム原版と
、ホログラム成形用フィルムとを剥離する方法を用いて
も、複製ホログラムが得られるのはもちろんのことであ
り、その後さらに紫外線あるいは電子線を照射すれば、
ホログラムに耐熱性、耐溶剤性上付与することができる
。In addition, in the same way as when using the conventional thermal 0T plastic resin using the hologram molding film of the present invention, the hologram original plate and the hologram molding film are cooled after being heated and pressed to form irregularities. Of course, even if you use the peeling method, you can obtain a duplicate hologram, and if you further irradiate it with ultraviolet rays or electron beams,
It can provide heat resistance and solvent resistance to holograms.
発明の効果
本発明に係るホログラムの複製方法は、基材フィルム上
に、熱成形性含有する紫外線硬化樹脂または電子線硬化
樹脂が設けられてなる、ホログラム形成用フィルムと、
表面に物体からの光の波面に相当する凹凸が形成されて
いるホログラム原版と會、加熱条件下で圧接させて前記
樹脂に凹凸を形成し、次いで寺令遡紫外線または電子線
全前記ホログラム形成用フィルムに照射させることによ
って行なっているため、以下のような効果が得られる。Effects of the Invention The method for duplicating a hologram according to the present invention comprises: a hologram-forming film comprising a thermoformable ultraviolet curable resin or an electron beam curable resin provided on a base film;
A hologram original plate having irregularities corresponding to the wavefront of light from an object is formed on the surface, and the resin is pressed under heating conditions to form irregularities, and then ultraviolet rays or electron beams are used to form the hologram. Since this is done by irradiating the film, the following effects can be obtained.
(&) ホログラム原版とホログラム形成用フィルムと
を長時間にわたって加熱状態に圧接する必要がなく、シ
たがってホログラム原版の凹凸が熱により消滅すること
がない。(&) There is no need to press the hologram master and the hologram forming film into a heated state for a long time, and therefore the unevenness of the hologram master does not disappear due to heat.
(b) ホログラム形成用フィルムとホログラム原版と
を加熱状態に保って圧接して該フィルム上に凹凸を形成
した後、直ちに圧接状態を解除することができ、したが
って冷却工程を短時間で行なうことができ、ホログラム
の複製工程を著しく簡素化できるとともに大量生産が可
能となる。(b) After the hologram forming film and the hologram master are kept in a heated state and pressed together to form irregularities on the film, the pressed state can be immediately released, and therefore the cooling process can be carried out in a short time. This greatly simplifies the hologram duplication process and enables mass production.
(c)ホログラム形成用フィルムを巻取って保存するこ
とがでキ、シたがってホログラムの複製工程を簡素化で
きるとともに大量生産が可能となる。(c) The hologram forming film can be rolled up and stored, thus simplifying the hologram duplication process and making mass production possible.
(d) 耐熱性、耐溶剤性に優れたホログラムを提供す
ること。(d) To provide a hologram with excellent heat resistance and solvent resistance.
以下、本発明を実施例により説明するが、本発明はこれ
ら実施例に限定されるものではない。EXAMPLES The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples.
実施例1 下記組成物を6時間還流させ共重合を行った。Example 1 The following composition was refluxed for 6 hours to perform copolymerization.
メチルメタアクリレート 300部
2−ヒドロキシエチルメタクリレート 130部酢酸エ
チル 1000部
αゲーアゾビスイソブチロニトリル 2部次いで0.1
重通部のiRシラトキシフェノールを加え反応を停止さ
せた後、得られた反応物に100重量部の2−ヒドロキ
シエチルアクリレートと2.4−トルエンジイソシアネ
ートの1モル対1モル付加物を加え、さらにジブチルチ
ンシラウリレートを5重愉部加えて乾燥空気を送りなが
ら80℃で5時間反応させた。Methyl methacrylate 300 parts 2-hydroxyethyl methacrylate 130 parts Ethyl acetate 1000 parts αGe azobisisobutyronitrile 2 parts then 0.1
After adding iR silatoxyphenol from Shizutsube to stop the reaction, 100 parts by weight of a 1 mole to 1 mole adduct of 2-hydroxyethyl acrylate and 2.4-toluene diisocyanate was added to the resulting reaction product, Furthermore, 5 parts of dibutyltin silaurylate were added, and the mixture was reacted at 80° C. for 5 hours while blowing dry air.
反応液を室温まで冷却した後、15重量部の紫外線増感
材(イルガテユア184チバガイギー社製)を加えて、
均一に溶解させてホログラム層用の樹脂液を得た。次に
、この樹脂液をポリエチレンテレフタレートフィルムδ
μm(東し製ルミラー)に固型分が3 g / mにな
る様に塗布し、溶剤を乾燥させ、ホログラム形成用フィ
ルムを得た。次にこのホログラム形成用フィルムの上記
の樹脂の塗布面とホログラム原版としてホログラムが凹
凸形状で記録されている金型の凹凸面とt重ね合せ、1
60℃20 kg / cmのニップロール間を通し、
密着させ、この状態でフィルム面より80W/am水銀
灯下10cmの位置で10 m 7m l ’nの速度
で紫外線を照射し、樹脂を硬化させた後、ホログラム形
成用フィルムをホログラム原版より剥離したところ上記
樹脂表面に凹凸形状が形成されホログラムが複製できた
。この複製ホログラムは、耐熱性、耐溶剤性にも優れた
ものであった。After cooling the reaction solution to room temperature, 15 parts by weight of an ultraviolet sensitizer (Irgateur 184 manufactured by Ciba Geigy) was added.
A resin liquid for a hologram layer was obtained by uniformly dissolving the resin. Next, this resin liquid was applied to polyethylene terephthalate film δ.
The solution was coated on a μm (Lumirror manufactured by Toshi) so that the solid content was 3 g/m, and the solvent was dried to obtain a hologram-forming film. Next, the resin coated surface of this hologram forming film is superimposed on the uneven surface of a mold in which a hologram is recorded in an uneven shape as a hologram master, 1
Pass through 20 kg/cm nip rolls at 60℃,
In this state, the hologram forming film was peeled off from the hologram master plate after curing the resin by irradiating it with ultraviolet rays at a speed of 10 m 7 ml 'n at a position 10 cm below the film surface under an 80 W/am mercury lamp. An uneven shape was formed on the resin surface, and a hologram could be replicated. This replicated hologram also had excellent heat resistance and solvent resistance.
実施例2 下記組成物を6時間還流させ共重合を行った。Example 2 The following composition was refluxed for 6 hours to perform copolymerization.
メチルメタクリレート 320重量部
ブチルメタクリレート 130重量部
グリシジルメタクリレート 284重量部トルエン 1
290重量部
メチルエチルケトン 1290重量部
α、α′−アゾビスイソブチロニトリル 25重量部次
いで得られた反応物に0.2重量部のハイドロキノンを
加え反応を停止させた後、アクリル酸158重量部、ピ
リジン10重量部を加え、乾燥空気を送り込みながら9
0°〜100℃で8時間反応させた。Methyl methacrylate 320 parts by weight Butyl methacrylate 130 parts by weight Glycidyl methacrylate 284 parts by weight Toluene 1
290 parts by weight Methyl ethyl ketone 1290 parts by weight α,α'-azobisisobutyronitrile 25 parts by weight Next, 0.2 parts by weight of hydroquinone was added to the obtained reaction product to stop the reaction, and 158 parts by weight of acrylic acid, Add 10 parts by weight of pyridine and add 9 parts by weight while blowing dry air.
The reaction was carried out at 0° to 100°C for 8 hours.
得られた材料を5μmの厚みのポリエチレンテレフタレ
ートフィルムに乾燥後に2..5g/m2になる様に均
一に塗布し、溶剤を乾燥させてホログラム成形用フィル
ムとした。得られたフィルムは常温ではペタつかず、巻
取状態で保管できる。The obtained material was dried into a polyethylene terephthalate film with a thickness of 5 μm. .. It was applied uniformly to a concentration of 5 g/m2, and the solvent was dried to obtain a hologram forming film. The obtained film does not stick at room temperature and can be stored in a rolled state.
次にこの塗工フィルムの樹脂面と、ホログラムが凹凸の
形状で記録されているホログラム原版である金型の凹凸
面とを重ね合せ、実施例1と同様に上下より加熱加圧し
、金型と塗工フィルムとを密着させた。さらにその状態
でフィルム側より175KVに加速された電子線を5M
rad照射し、塗布した樹脂を架橋硬化して金型と、塗
工フィルムとを剥離すると、塗布フィルムの樹脂面に金
型の凹凸形状が形成されたホログラムが複製された。Next, the resin surface of this coated film and the uneven surface of a mold, which is a hologram original plate in which a hologram is recorded in an uneven shape, are overlapped and heated and pressed from above and below in the same manner as in Example 1. The coated film was brought into close contact with the film. Furthermore, in this state, an electron beam accelerated to 175KV is applied from the film side to 5M.
When the coated resin was cross-linked and cured by rad irradiation and the mold and coated film were separated, a hologram in which the uneven shape of the mold was formed was replicated on the resin surface of the coated film.
この複製ホログラムは耐熱性、耐溶剤性に優れていた。This replicated hologram had excellent heat resistance and solvent resistance.
図は、本発明に係るホログラムの複製方法の製造工程を
示す断面図である。
1・・・ホログラム形成用フィルム
2・・・基材フィルム
3・・・紫外線硬化樹脂または電子線硬化樹脂4・・・
ホログラム原版
5・・・加熱圧接ロール
6・・・照射光源The figure is a cross-sectional view showing the manufacturing process of the hologram duplication method according to the present invention. 1... Hologram forming film 2... Base film 3... Ultraviolet curing resin or electron beam curing resin 4...
Hologram original plate 5...Heating pressure welding roll 6...Irradiation light source
Claims (1)
は電子線硬化樹脂が設けられてなるホログラム形成用フ
ィルムと、表面に物体からの光の波面に相当する干渉縞
が凹凸の形でホログラムに形成されているホログラム原
版とを、前記フィルムの紫外線硬化樹脂または電子線硬
化樹脂がホログラム原版に接するようにして加熱条件下
で圧接させて前記樹脂に凹凸を形成した後紫外線または
電子線をホログラム形成用フィルムに照射することを特
徴とするホログラムの複製方法。A hologram forming film consisting of a thermoformable ultraviolet curable resin or electron beam curable resin on a base film, and a hologram with uneven interference fringes corresponding to the wavefront of light from an object on the surface. The hologram original plate is pressed against the hologram original plate under heating conditions so that the ultraviolet ray curing resin or electron beam curing resin of the film is in contact with the hologram original plate to form irregularities on the resin, and then ultraviolet rays or electron beams are applied for hologram formation. A hologram reproduction method characterized by irradiating a film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59111663A JPH0685103B2 (en) | 1984-05-31 | 1984-05-31 | Hologram duplication method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59111663A JPH0685103B2 (en) | 1984-05-31 | 1984-05-31 | Hologram duplication method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60254174A true JPS60254174A (en) | 1985-12-14 |
JPH0685103B2 JPH0685103B2 (en) | 1994-10-26 |
Family
ID=14567030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59111663A Expired - Lifetime JPH0685103B2 (en) | 1984-05-31 | 1984-05-31 | Hologram duplication method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0685103B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63168397A (en) * | 1986-12-29 | 1988-07-12 | 大日本印刷株式会社 | Article to which forgery is prevented and manufacture thereof |
EP0328298A2 (en) * | 1988-02-12 | 1989-08-16 | Markem Systems Limited | Manufacture of relief holograms |
JPH01214498A (en) * | 1988-02-22 | 1989-08-28 | Dainippon Printing Co Ltd | Rugged pattern formed body, method of forming said body and rugged pattern forming sheet for use in said method |
JPH05232853A (en) * | 1992-02-25 | 1993-09-10 | Tootsuya:Kk | Production of hologram |
JPH05323856A (en) * | 1992-05-20 | 1993-12-07 | Tootsuya:Kk | Transparent hologram display and display device |
US5755919A (en) * | 1995-02-09 | 1998-05-26 | Dai Nippon Printing Co., Ltd. | Continuous film laminating and delaminating system |
US5798850A (en) * | 1993-08-27 | 1998-08-25 | Dai Nippon Printing Co., Ltd. | Method of and apparatus for duplicating hologram and duplicate hologram |
EP1519249A3 (en) * | 2003-09-17 | 2006-06-28 | Dai Nippon Printing Co., Ltd. | Method for forming fine relief patterns and methods for producing and copying optical diffraction structures |
US7420005B2 (en) | 2001-06-28 | 2008-09-02 | Dai Nippon Printing Co., Ltd. | Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed transfer sheet, optical article, stamper and method of forming finely embossed pattern |
CN102375162A (en) * | 2010-08-18 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | Film production device |
Citations (6)
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---|---|---|---|---|
JPS5835578A (en) * | 1981-08-28 | 1983-03-02 | Toppan Printing Co Ltd | Method for duplicating hologram |
JPS58132271A (en) * | 1982-02-01 | 1983-08-06 | Dainippon Printing Co Ltd | Manufacture of hologram |
JPS58144877A (en) * | 1982-02-23 | 1983-08-29 | Dainippon Printing Co Ltd | Duplicating method of hologram |
JPS58144879A (en) * | 1982-02-23 | 1983-08-29 | Dainippon Printing Co Ltd | Duplicating method of hologram |
JPS58144878A (en) * | 1982-02-23 | 1983-08-29 | Dainippon Printing Co Ltd | Duplicating method of hologram |
JPS58184986A (en) * | 1982-04-23 | 1983-10-28 | Dainippon Printing Co Ltd | Duplicating method of hologram |
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1984
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5835578A (en) * | 1981-08-28 | 1983-03-02 | Toppan Printing Co Ltd | Method for duplicating hologram |
JPS58132271A (en) * | 1982-02-01 | 1983-08-06 | Dainippon Printing Co Ltd | Manufacture of hologram |
JPS58144877A (en) * | 1982-02-23 | 1983-08-29 | Dainippon Printing Co Ltd | Duplicating method of hologram |
JPS58144879A (en) * | 1982-02-23 | 1983-08-29 | Dainippon Printing Co Ltd | Duplicating method of hologram |
JPS58144878A (en) * | 1982-02-23 | 1983-08-29 | Dainippon Printing Co Ltd | Duplicating method of hologram |
JPS58184986A (en) * | 1982-04-23 | 1983-10-28 | Dainippon Printing Co Ltd | Duplicating method of hologram |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63168397A (en) * | 1986-12-29 | 1988-07-12 | 大日本印刷株式会社 | Article to which forgery is prevented and manufacture thereof |
EP0328298A2 (en) * | 1988-02-12 | 1989-08-16 | Markem Systems Limited | Manufacture of relief holograms |
EP0328298A3 (en) * | 1988-02-12 | 1990-11-22 | Markem Systems Limited | Manufacture of relief holograms |
JPH01214498A (en) * | 1988-02-22 | 1989-08-28 | Dainippon Printing Co Ltd | Rugged pattern formed body, method of forming said body and rugged pattern forming sheet for use in said method |
JPH05232853A (en) * | 1992-02-25 | 1993-09-10 | Tootsuya:Kk | Production of hologram |
JPH05323856A (en) * | 1992-05-20 | 1993-12-07 | Tootsuya:Kk | Transparent hologram display and display device |
US5798850A (en) * | 1993-08-27 | 1998-08-25 | Dai Nippon Printing Co., Ltd. | Method of and apparatus for duplicating hologram and duplicate hologram |
US5993600A (en) * | 1995-02-09 | 1999-11-30 | Dai Nippon Printing Co., Ltd. | Continuous film laminating and delaminating system |
US5755919A (en) * | 1995-02-09 | 1998-05-26 | Dai Nippon Printing Co., Ltd. | Continuous film laminating and delaminating system |
US7420005B2 (en) | 2001-06-28 | 2008-09-02 | Dai Nippon Printing Co., Ltd. | Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed transfer sheet, optical article, stamper and method of forming finely embossed pattern |
EP1519249A3 (en) * | 2003-09-17 | 2006-06-28 | Dai Nippon Printing Co., Ltd. | Method for forming fine relief patterns and methods for producing and copying optical diffraction structures |
EP1806635A2 (en) * | 2003-09-17 | 2007-07-11 | Dai Nippon Printing Co., Ltd. | Method for forming fine relief patterns and methods for producing and copying optical diffraction structures |
US7245406B2 (en) | 2003-09-17 | 2007-07-17 | Dai Nippon Printing Co., Ltd. | Method for forming fine concavo-convex patterns, method for producing optical diffraction structure, and method for copying optical diffraction structure |
EP1806635A3 (en) * | 2003-09-17 | 2011-03-09 | Dai Nippon Printing Co., Ltd. | Method for forming fine relief patterns and methods for producing and copying optical diffraction structures |
US7955785B2 (en) * | 2003-09-17 | 2011-06-07 | Dai Nippon Printing Co., Ltd. | Method for forming fine concavo-convex patterns, method for producing optical diffraction structure, and method for copying optical diffraction structure |
CN102375162A (en) * | 2010-08-18 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | Film production device |
Also Published As
Publication number | Publication date |
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JPH0685103B2 (en) | 1994-10-26 |
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