JPH0138610Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a multi-sided hologram duplication type used for mass production of relief holograms.

A hologram is generally a record of a pattern of light interference, and can be used to record three-dimensional images, etc.
Taking advantage of its ability to record high-density information, it is expected to be applied to many fields such as optical memory.

High-resolution silver salt photosensitive materials are generally used as recording materials for holograms, but this material is expensive and difficult to photograph or reproduce, making hologram products expensive and requiring processing such as development. It has the disadvantage that it is not suitable for mass production because it requires

On the other hand, in the case of a relief hologram, hologram information is recorded in a pattern of concave and convex parts on a photoresist, etc., then this concave and convex pattern is molded by plating, etc., and this mold is stamped into a thermoplastic resin, etc. It is known that copies can be easily made in large quantities.

In addition, a resin liquid that cures with ultraviolet rays or electron beams is applied to the relief hologram mold, and then the resin liquid is cured by irradiating ultraviolet rays or electron beams, and at the same time it is shaped and peeled off, and the above operation is repeated. This makes it possible to reproduce in large quantities.

When performing mass replication as described above, it is recommended to arrange and adhere the hologram molds onto a substrate that supports the molds, and perform the replication in a so-called multi-sided manner, both in terms of increasing production speed and shortening preparation time. desirable. However, if a mass-produced replication mold is used in which a large number of hologram molds are simply arranged and bonded on a supporting substrate, the pressure of the press will be applied to the gaps between each hologram mold when duplication is performed, for example by embossing. If the resin is not applied sufficiently, cracks and burrs may occur on the reproduced product, and even when electron beam or ultraviolet curing resin liquid is used, the resin liquid may not be completely filled in the gaps, causing bubbles or separation. It has disadvantages such as being difficult to mold and easily causing burrs on copies.

The present invention solves the above-mentioned drawbacks of the conventional technology. That is, the hologram duplication mold of the present invention has a reverse mold shape of the fine unevenness of the hologram obtained by using a desired punching die at the time of cutting on a substrate. A plurality of hologram molds are glued together with a gap between them,
In the gap, there is a filler having approximately the same thickness as the hologram mold and obtained by using the punching mold during cutting.
It is characterized in that it is filled by adhering to the substrate immediately with the hologram mold.

FIG. 1 is a schematic cross-sectional view showing an embodiment of the hologram duplication mold 1 of the present invention, in which the hologram mold 4 has a reverse hologram shape 3 on the surface of the substrate 2.
is adhered, and a filler 5 having approximately the same thickness as the hologram mold 4 is adhered to the substrate 2 in the gap between the hologram molds 4, and the filler 5 fills the unadhered portions of the hologram 4, thereby forming the hologram. The side surface having the inverted mold shape 3, ie, the mold surface, is a substantially uniform plane.

To explain the hologram type 4 mentioned above, first, the hologram duplication type of the present invention includes holograms such as Fresnel holograms, Fourier transform holograms, and Fraunhofer holograms, as well as image holograms, rainbow holograms, and holograms that utilize these hologram formats. It can also be applied to the mass production of optical stereograms, etc., and general diffraction gratings.

To obtain the above hologram as a relief hologram, for example, in the case of a Fresnel hologram, a photoresist (for example, manufactured by Shipley, AZ-1350J) is coated on a glass substrate as a photoreceptor.
The argon laser beam is split with a beam splitter (half mirror) using a coating with a thickness of about 2.5 μm, one beam is applied to the object to be photographed, and the reflected or transmitted light (referred to as object beam) is placed on the photoresist. The other light obtained by splitting the light is guided directly onto the photoresist, causing both lights to interfere with each other.
This is done by exposing the resulting interference pattern and developing it with a prescribed developer (for example, AZ Velotspur manufactured by the same company for the photoresist mentioned above), and then applying silver to a thickness of 400 mm on the master pattern obtained in the above manner.
A hologram replica mold having an inverse shape of a relief hologram can be obtained by depositing a layer of approximately 1 mm thick, and performing nickel plating using the resulting deposited film as an electrode to form a plated layer with a thickness of approximately 1 mm and peeling it off.

Alternatively, a resin that is cured by electron beams or ultraviolet rays is applied onto a relief hologram prototype prepared by the method using the photoresist described above, and the resin is cured and shaped by irradiation with electron beams or ultraviolet rays, and then peeled off. May be used. In this case, after applying the resin liquid, a suitable substrate may be brought into close contact with the resin liquid, and the resin may be bonded and reinforced during curing.

The hologram mold obtained above has a predetermined shape,
For example, cut into circles, squares, and other shapes.

On the other hand, another material having approximately the same thickness as the hologram mold is cut into a shape that can fill the gaps between the cut holograms without any gaps. For example, if a hologram type is cut using a predetermined punching die that punches out a circular shape, and on the other hand, if the filler material is punched out at predetermined intervals using the same die, the hologram will be cut out on the substrate. When bonding the mold and the filler, the two can be bonded without any gaps. The cutting may be performed by shearing or other methods other than punching.

The material for the filler may be any material as long as it does not cause any problems when used as a replication mold, and when electron beam or ultraviolet curing resin liquids are used as the replication resin, materials that are not corroded by these resin liquids, such as polyethylene terephthalate, etc. Plastic films, sheets or plates with high solvent resistance such as polyethylene, polypropylene, polyvinylidene chloride, polyvinyl alcohol, nylon, cellulose acetate, polysulfone, polyimide, metals, etc., or thermoplastic resins for duplication are used. , when using the press molding method, a heat-resistant resin with a higher softening point than thermoplastic duplication resin,
For example, the resin may be selected from the plastic films mentioned above as resins with high solvent resistance except polyethylene, polycarbonate, metals, and the like. These materials can also be used as substrates.

In the above, the substrate and the hologram type and the substrate and the filler may be bonded together using an adhesive or a pressure-sensitive adhesive, double-sided tape, welding, or solvent bonding.

The above-mentioned hologram duplication mold of the present invention does not cause cracks or burrs when duplicating using the press method, or bubbles or mold release problems when using an electron beam or ultraviolet curing resin liquid. It does not have the drawbacks of being hard or prone to burrs, and can be used in mass production without any problems.

Example A relief hologram was produced on a dry plate provided with a photoresist layer by a conventional method, and a resin liquid (manufactured by Asahi Kasei Industries, Ltd., APR) cured by ultraviolet rays was screen printed on the mold surface of the obtained relief hologram. After coating the resin to a thickness of 50 μm, a polyester sheet (manufactured by Asahi Kasei Industries, Ltd., base sheet for APR) is laminated on the coated surface, and ultraviolet rays are irradiated from the polyester sheet side using an ultra-high pressure mercury lamp to coat the resin. After the liquid was cured, a resin mold having an inverse shape of the uneven relief hologram was obtained.

The surface of the resulting resin mold was coated with the same resin liquid and polyester sheet as described above, and the resin liquid was cured by irradiating ultraviolet rays from the polyester sheet side. When the resin mold was peeled off, the relief hologram version was revealed. A copy was made.

The obtained relief hologram plate was punched into a rectangular shape of 90 × 150 mm, and then the same punching die used to punch out the relief hologram plate into a 125 μm thick polyethylene terephthalate film was used to punch out the relief hologram plate at intervals of 20 mm in length and width. A hole was opened and six rectangles were punched out, and the relief hologram plate punched out above was fitted into the punched part, and the whole was stuck on a 2 mm thick acrylic board with double-sided adhesive tape to form an original plate for a multi-sided relief hologram.

Using this original plate, a mold for reproduction was created using a resin liquid that is cured by ultraviolet light in the same manner as described above. The mold surface of this reproduction mold was smooth and planar.

Further, when a replication mold was used and a resin liquid cured by ultraviolet rays and a polyester sheet were used for replication, a multifaceted relief hologram was replicated, and the polyester sheet could be peeled off smoothly.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of the hologram duplication type of the present invention. 2... Substrate, 3... Reverse shape of hologram, 4
...Hologram type, 5...Filling material.

Claims (1)

[Scope of utility model registration request] A plurality of hologram molds each having a shape that is the inverse of the hologram's minute unevenness obtained by using a desired punching die during cutting are bonded onto the substrate with a space between them, and the space between the hologram molds is approximately the same as the hologram shape. Same thickness,
A hologram duplication mold, characterized in that the filler obtained by using the punching mold during cutting is filled by adhering to the substrate immediately after the hologram mold.