ES552312A0 - Procedimiento para producir estratificados flexibles a base de poliamida y un material de soporte. - Google Patents

Procedimiento para producir estratificados flexibles a base de poliamida y un material de soporte.

Info

Publication number
ES552312A0
ES552312A0 ES552312A ES552312A ES552312A0 ES 552312 A0 ES552312 A0 ES 552312A0 ES 552312 A ES552312 A ES 552312A ES 552312 A ES552312 A ES 552312A ES 552312 A0 ES552312 A0 ES 552312A0
Authority
ES
Spain
Prior art keywords
layer
polyimide
substrate material
resins
longer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES552312A
Other languages
English (en)
Other versions
ES8708196A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo NV
Original Assignee
Akzo NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo NV filed Critical Akzo NV
Publication of ES552312A0 publication Critical patent/ES552312A0/es
Publication of ES8708196A1 publication Critical patent/ES8708196A1/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y10T428/2942—Plural coatings
    • Y10T428/2947—Synthetic resin or polymer in plural coatings, each of different type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Materials For Medical Uses (AREA)
ES552312A 1985-02-25 1986-02-24 Procedimiento para producir estratificados flexibles a base de poliamida y un material de soporte. Expired ES8708196A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853506524 DE3506524A1 (de) 1985-02-25 1985-02-25 Flexible polyimid-mehrschichtlaminate

Publications (2)

Publication Number Publication Date
ES552312A0 true ES552312A0 (es) 1987-10-01
ES8708196A1 ES8708196A1 (es) 1987-10-01

Family

ID=6263468

Family Applications (1)

Application Number Title Priority Date Filing Date
ES552312A Expired ES8708196A1 (es) 1985-02-25 1986-02-24 Procedimiento para producir estratificados flexibles a base de poliamida y un material de soporte.

Country Status (9)

Country Link
US (2) US4699841A (es)
EP (1) EP0192937B1 (es)
JP (1) JPS61195835A (es)
AT (1) ATE57652T1 (es)
CA (1) CA1284922C (es)
DE (2) DE3506524A1 (es)
DK (1) DK80686A (es)
ES (1) ES8708196A1 (es)
IE (1) IE860169L (es)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069222B2 (ja) * 1986-01-07 1994-02-02 日立化成工業株式会社 多層配線構造の製造法
JPS63290729A (ja) * 1987-05-22 1988-11-28 Ube Ind Ltd 金属表面を有する芳香族ポリイミドフィルムおよびその製造法
US4991045A (en) * 1987-12-21 1991-02-05 Hutchinson Technology, Inc. Suspension assembly
US4939317A (en) * 1988-08-10 1990-07-03 W. L. Gore & Associates, Inc. Polyimide insulated coaxial electric cable
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
US5371168A (en) * 1991-06-17 1994-12-06 Mitsui Toatsu Chemicals, Inc. Amorphous polyimide powder, preparation process of the powder, and heat-resistant adhesive and bonding method by use of the powder
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
US5578696A (en) * 1993-04-07 1996-11-26 Nitto Denko Corporation Heat resistant adhesive film, an adhesion structure, and method of adhesion
US6378199B1 (en) 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
US5670262A (en) * 1995-05-09 1997-09-23 The Dow Chemical Company Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
US5729424A (en) * 1995-09-27 1998-03-17 The United States Of America As Represented By The United States Department Of Energy Autogenous electrolyte, non-pyrolytically produced solid capacitor structure
JP3516035B2 (ja) 1997-05-13 2004-04-05 綜研化学株式会社 粘着剤組成物
US6355357B1 (en) * 1998-12-21 2002-03-12 Sony Chemicals Corp. Flexible printed board, polyamic acid and polyamic acid varnish containing same
US6245696B1 (en) * 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
US6270841B1 (en) * 1999-07-02 2001-08-07 Sigma Technologies International, Inc. Thin coating manufactured by vapor deposition of solid oligomers
US6692817B1 (en) 2000-04-04 2004-02-17 Northrop Grumman Corporation Apparatus and method for forming a composite structure
DE10026714A1 (de) * 2000-05-30 2001-12-13 Hueck Folien Gmbh Verbundfolie, Verfahren zu ihrer Herstellung und ihre Verwendung
JP3631105B2 (ja) * 2000-05-31 2005-03-23 キヤノン株式会社 定着フィルムおよびそれを用いた像加熱装置
US7384683B2 (en) * 2003-09-10 2008-06-10 Unitika Ltd. Substrate for flexible printed wiring board and method for manufacturing the same
EP1602477A1 (en) * 2004-06-01 2005-12-07 Ke-Burgmann A/S A heat resistant laminate for expansion joint and a method for manufacturing such laminate
JP4729880B2 (ja) * 2004-07-30 2011-07-20 トヨタ自動車株式会社 転造用平ダイスと転造方法
US20060102013A1 (en) * 2004-11-16 2006-05-18 Saint-Gobain Performance Plastics Corporation Method of cooking a food item
US20060134391A1 (en) * 2004-12-17 2006-06-22 Saint-Gobain Performance Plastics Corporation Methods for making arts and crafts articles and merchandised articles relating thereto
US20070116910A1 (en) * 2005-11-23 2007-05-24 Polykarpov Alexander Y Multilayer laminated structures
US20070154717A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US20070154716A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Composite material
US20070152195A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Electrostatic dissipative composite material
US20070155949A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
CA2953354A1 (en) * 2008-12-22 2010-07-01 Saint-Gobain Performance Plastics Corporation Modified perfluoropolymer sheet material and methods for making same
KR101282170B1 (ko) * 2010-10-19 2013-07-04 에스케이이노베이션 주식회사 후막 폴리이미드 금속박 적층체
US8932435B2 (en) 2011-08-12 2015-01-13 Harris Corporation Hydrocarbon resource processing device including radio frequency applicator and related methods
US8960285B2 (en) 2011-11-01 2015-02-24 Harris Corporation Method of processing a hydrocarbon resource including supplying RF energy using an extended well portion
KR101373833B1 (ko) * 2012-04-19 2014-03-14 도레이첨단소재 주식회사 전자종이 디스플레이 소자용 유전 점착필름
EP2692538B1 (de) * 2012-07-30 2017-03-15 Folex Coating GmbH Unterlagenfolie für ein Metalldrucktuch
JP6358378B1 (ja) * 2017-08-09 2018-07-18 日立金属株式会社 クラッド材の製造方法
US11445619B2 (en) * 2020-10-28 2022-09-13 Matrix Electronics Limited System and method for high-temperature lamination of printed circuit boards

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE494719A (es) * 1949-03-23 1900-01-01
US3032008A (en) * 1956-05-07 1962-05-01 Polaroid Corp Apparatus for manufacturing photographic films
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3179634A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
US3264250A (en) * 1963-12-18 1966-08-02 Du Pont Copolymeric polyamide-acids and polyimides
US3629037A (en) * 1967-01-31 1971-12-21 Mitsubishi Petrochemical Co Process for production of laminated film having reduced neck-in-forming property
FR1526330A (fr) * 1967-04-10 1968-05-24 G Convert Ets Procédé de collage de feuilles, films ou objets en polyoléfine sur différents supports
JPS4932772B1 (es) * 1968-06-10 1974-09-03
US3874833A (en) * 1969-07-07 1975-04-01 Union Carbide Corp Apparatus for the calendering of laminated polymeric materials
GB1317321A (en) * 1970-04-13 1973-05-16 Int Harvester Co Polyimides
US3697368A (en) * 1971-02-26 1972-10-10 Allied Chem Polyamide-polyethylene composite films
US3728150A (en) * 1971-07-12 1973-04-17 Du Pont Bondable adhesive coated polyimide film
US3900662A (en) * 1973-01-17 1975-08-19 Du Pont Bondable adhesive coated polyimide film and laminates
DE2357297C3 (de) * 1973-11-16 1978-09-21 Akzo Gmbh, 5600 Wuppertal Verfahren zur Herstellung von Polyamidcarbonsäuren
US3847870A (en) * 1973-11-23 1974-11-12 Gen Electric Method for making polyetherimides
JPS5178362U (es) * 1974-12-18 1976-06-21
US4075420A (en) * 1975-08-28 1978-02-21 Burroughs Corporation Cover layer for flexible circuits
JPS5163881A (ja) * 1975-10-24 1976-06-02 Toray Industries Sekisobutsu
JPS544374A (en) * 1977-06-10 1979-01-13 Sumitomo Bakelite Co Method of making base plate for flexible print wiring
US4238538A (en) * 1978-12-21 1980-12-09 E. I. Du Pont De Nemours And Company Method of and apparatus for ram-extrusion of aromatic polyimide and polyamide resins, and shaped articles formed using such method and apparatus
ATE23089T1 (de) * 1980-09-15 1986-11-15 Ciba Geigy Ag Verwendung von flexiblem basismaterial zur herstellung von gedruckten schaltungen.
CA1198662A (en) * 1980-09-22 1985-12-31 National Aeronautics And Space Administration Process for preparing high temperature polyimide film laminates
US4543295A (en) * 1980-09-22 1985-09-24 The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration High temperature polyimide film laminates and process for preparation thereof
JPS57181857A (en) * 1981-05-06 1982-11-09 Ube Industries Polyimide laminated material and its manufacture
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
EP0116297B1 (de) * 1983-01-15 1987-12-02 Akzo GmbH Polyimid-Laminate mit hoher Schälfestigkeit und Verfahren zu deren Herstellung
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit
US4576857A (en) * 1983-03-14 1986-03-18 E. I. Du Pont De Nemours And Company Melt-fusible polyimides
JPS6067539A (ja) * 1983-09-26 1985-04-17 Dainippon Ink & Chem Inc 耐熱性成形材料
US4590258A (en) * 1983-12-30 1986-05-20 International Business Machines Corporation Polyamic acid copolymer system for improved semiconductor manufacturing

Also Published As

Publication number Publication date
DK80686A (da) 1986-08-26
CA1284922C (en) 1991-06-18
DE3506524A1 (de) 1986-08-28
JPS61195835A (ja) 1986-08-30
EP0192937B1 (de) 1990-10-24
IE860169L (en) 1986-08-25
US4705720A (en) 1987-11-10
US4699841A (en) 1987-10-13
EP0192937A3 (en) 1988-02-10
ES8708196A1 (es) 1987-10-01
DE3675033D1 (de) 1990-11-29
DK80686D0 (da) 1986-02-21
EP0192937A2 (de) 1986-09-03
ATE57652T1 (de) 1990-11-15

Similar Documents

Publication Publication Date Title
ES552312A0 (es) Procedimiento para producir estratificados flexibles a base de poliamida y un material de soporte.
DE69031216D1 (de) Mehrschichtiger film und laminat zur verwendung bei der herstellung von gedru- ckten schaltungsplatten
ATE285623T1 (de) Klebeband für substrat zur verbindung von halbleiter, klebstoffbeschichtetes band für tab, klebstoffbeschichtetes band für drahtbandverbindungen, verbindungssubstrat für halbleiter und halbleitervorrichtung
DE69715471D1 (de) Retroreflektierender artikel mit einer bindeschicht, die ein epoxidharz und ein silikon vernetztes plymer enthält
DE69131900D1 (de) Delaminierungsbeständiges Metall-film laminat
ATE437932T1 (de) Hochtemperaturepoxidklebfilme
KR950007618A (ko) 구리부착적층판 및 프린트배선판
DK203186D0 (da) Praeformet struktur samt kombination af to saadanne strukturer
EP1152069A4 (en) ELECTROLYTIC COPPER SHEET WITH SUPPORT SHEET AND COPPER COATING LAMINATE
EP1306206A4 (en) EASILY REMOVABLE LAMINATE
DK0963290T3 (da) Højtemperatur slipfilm
DE50302467D1 (de) Mehrlagiges Etikett
UY24140A1 (es) Un metodo de sujecion de cinta adhesiva adaptado para su empleo en un articulo absorbente descartable
TW200505314A (en) Copper-clad laminate
KR850005327A (ko) 전도성 금속층의 트랜스퍼 적층물 및 그 제법
ES2127125B1 (es) Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.
ATE150568T1 (de) Mehrschichtiges etikett
DE502004003258D1 (de) Etikett mit Anfasslasche
EP1371701A3 (en) Heat-resistant label
ES2107060T3 (es) Lamina de transferencia para imprimir una base.
DE69703375D1 (de) Polymaleinimidharzzusammensetzung und diese verwendende Schichtstoffplatte für ein Halbleitersubstrat
ATE206354T1 (de) Spezieller klebstoffverbund geeignet für einfachen ausbau
DE69001663D1 (de) Abnehmbares, gewebeartiges, rissspreizverhinderndes verbindungsmaterial fuer das verbinden der tragenden oberflaeche einer struktur mit einer darauf angebrachten deckschicht, verfahren fuer seinen gebrauch und mit diesem material hergestellte abdeck-schichtenkonstruktion.
KR960000514A (ko) 전착화상의 전사방법
KR920703749A (ko) 양면 점착 테이프, 이의 적층 구조체, 점착 테이프 및 이들의 사용방법