GB1317321A - Polyimides - Google Patents
PolyimidesInfo
- Publication number
- GB1317321A GB1317321A GB1736070A GB1317321DA GB1317321A GB 1317321 A GB1317321 A GB 1317321A GB 1736070 A GB1736070 A GB 1736070A GB 1317321D A GB1317321D A GB 1317321DA GB 1317321 A GB1317321 A GB 1317321A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solid solution
- solution
- solid
- impregnated
- melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
1317321 Laminates INTERNATIONAL HARVESTER CO 13 April 1970 17360/70 Heading B5N [Also in Division C3] A polymerizable material consists essentially of a solid solution of substantially stoichiometric proportions of an aromatic diprimary amine having a primary amine basicity constant not exceeding 10<SP>-11</SP> in a benzophenone tetracarboxylic acid diester where R is alkyl or substituted alkyl. On heating in the absence of a solvent or water the solid solution may be converted to the corresponding polyamide-acid or directly to the polyimide but one stated to have a practically unlimited shelf-life. The solid solutions may be made by mixing the diamine with the molten diester until homogeneous or by reacting the corresponding dianhydride with excess esterifying agent and then adding and homogenizing the amine and removing excess esterifying agent. Specified diamines are 4,4<SP>1</SP>-diaminodiphenyl sulphone and 2,6-diaminopyridine. Solid solutions derived from specific combinations of at least two diamines which are the subject of Specification 1,317,322 are disclaimed. The solid solutions are stated to be low melting (e.g. 60‹ to 100‹C.), capable of being spray dried, and soluble in common low-boiling solvents, e.g. alcohols or ketones, and suitable for direct use by injection moulding, melt coating, film-coating or impregnation techniques. Uses.-Specified uses are: (a) Metal to metal adhesives using a mixture of the solid solution and aluminium powder knife-coated on to glass fabric as an adhesive layer; (b) Laminates of layers pre-impregnated with the solid solution; (c) Honeycomb structures from open-weave glass fabric pre-impregnated with the solid solution. The pre-impregnated fabric for all these applications may be prepared by solution-, melt- or knife-coating the fabric with the solid solution with or without additives or fillers; (d) As vehicles for ground or suspended pigments to prepare high-temperature resistant insulating coatings; and (e) Casting unpigmented films from solution or melt.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1736070 | 1970-04-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1317321A true GB1317321A (en) | 1973-05-16 |
Family
ID=10093835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1736070A Expired GB1317321A (en) | 1970-04-13 | 1970-04-13 | Polyimides |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1317321A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0012269A1 (en) * | 1978-12-11 | 1980-06-25 | Bayer Ag | Water hardenable compositions and their use as coating, sealing and adhesive materials |
US4533574A (en) * | 1984-09-14 | 1985-08-06 | E. I. Du Pont De Nemours And Company | Polyimide coating compositions of esterified anhydride and aromatic amine mixture |
US4612210A (en) * | 1985-07-25 | 1986-09-16 | International Business Machines Corporation | Process for planarizing a substrate |
US4675246A (en) * | 1984-06-30 | 1987-06-23 | Akzo Nv | Flexible multilayer polyimide laminates |
EP0233069A2 (en) * | 1985-09-03 | 1987-08-19 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and its use as a high-temperature adhesive. |
US4699841A (en) * | 1985-02-25 | 1987-10-13 | Akzo Nv | Flexible multilayer polymide laminates |
US4746561A (en) * | 1985-02-25 | 1988-05-24 | Akzo N.V. | Polyimide-containing cover layer for a printed circuit element |
US5514444A (en) * | 1994-06-17 | 1996-05-07 | Hexcel Corporation | Fiber reinforced polyimide honeycomb for high temperature applications |
JP2016037538A (en) * | 2014-08-06 | 2016-03-22 | Jnc株式会社 | Resin composition, and heat radiation coating material and electronic component using the same |
-
1970
- 1970-04-13 GB GB1736070A patent/GB1317321A/en not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0012269A1 (en) * | 1978-12-11 | 1980-06-25 | Bayer Ag | Water hardenable compositions and their use as coating, sealing and adhesive materials |
US4675246A (en) * | 1984-06-30 | 1987-06-23 | Akzo Nv | Flexible multilayer polyimide laminates |
US4533574A (en) * | 1984-09-14 | 1985-08-06 | E. I. Du Pont De Nemours And Company | Polyimide coating compositions of esterified anhydride and aromatic amine mixture |
US4699841A (en) * | 1985-02-25 | 1987-10-13 | Akzo Nv | Flexible multilayer polymide laminates |
US4705720A (en) * | 1985-02-25 | 1987-11-10 | Akzo Nv | Flexible multi-layer polyimide laminates |
US4746561A (en) * | 1985-02-25 | 1988-05-24 | Akzo N.V. | Polyimide-containing cover layer for a printed circuit element |
US4612210A (en) * | 1985-07-25 | 1986-09-16 | International Business Machines Corporation | Process for planarizing a substrate |
EP0233069A2 (en) * | 1985-09-03 | 1987-08-19 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and its use as a high-temperature adhesive. |
EP0233069A3 (en) * | 1985-09-03 | 1988-09-07 | Mitsui Toatsu Chemicals Inc. | Polyimide and high-temperature adhesive of polyimide |
US5514444A (en) * | 1994-06-17 | 1996-05-07 | Hexcel Corporation | Fiber reinforced polyimide honeycomb for high temperature applications |
JP2016037538A (en) * | 2014-08-06 | 2016-03-22 | Jnc株式会社 | Resin composition, and heat radiation coating material and electronic component using the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |