SE9604676D0 - Flip-Chip type connection with elastic contacts - Google Patents

Flip-Chip type connection with elastic contacts

Info

Publication number
SE9604676D0
SE9604676D0 SE9604676A SE9604676A SE9604676D0 SE 9604676 D0 SE9604676 D0 SE 9604676D0 SE 9604676 A SE9604676 A SE 9604676A SE 9604676 A SE9604676 A SE 9604676A SE 9604676 D0 SE9604676 D0 SE 9604676D0
Authority
SE
Sweden
Prior art keywords
chip
flip
substrate
type connection
chip type
Prior art date
Application number
SE9604676A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE516748C2 (en
SE9604676L (en
Inventor
Lillebror Hjalmar Hesselbom
Jan Peter Bodoe
Hans Hentzell
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604676A priority Critical patent/SE516748C2/en
Publication of SE9604676D0 publication Critical patent/SE9604676D0/en
Priority to TW086100963A priority patent/TW341726B/en
Priority to EP97951403A priority patent/EP0953210A1/en
Priority to CNB971817766A priority patent/CN1156003C/en
Priority to AU55054/98A priority patent/AU5505498A/en
Priority to KR1019997005628A priority patent/KR20000069626A/en
Priority to JP52762998A priority patent/JP2001506413A/en
Priority to CA002275523A priority patent/CA2275523A1/en
Priority to PCT/SE1997/002177 priority patent/WO1998027589A1/en
Priority to US08/994,981 priority patent/US5998875A/en
Publication of SE9604676L publication Critical patent/SE9604676L/en
Publication of SE516748C2 publication Critical patent/SE516748C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/1319—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/81801—Soldering or alloying
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    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The assembly connection comprises at least a flip-chip (214) and a substrate (202). The substrate has an elastomer bump structure (204) moulded by using anisotropically etched silicon as a mould. The chip has pads, the pattern of the bumps corresponding to the pad pattern on the chip. The substrate has a guiding frame (212) and the chip an edge, the frame having the same shape as the edge of the chip. The bumps may be coated with gold and act as both electrical contacts (206) and as guides for vertical positioning.
SE9604676A 1996-12-19 1996-12-19 Flip-chip type assembly connection with elastic contacts for mounting integrated circuits SE516748C2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9604676A SE516748C2 (en) 1996-12-19 1996-12-19 Flip-chip type assembly connection with elastic contacts for mounting integrated circuits
TW086100963A TW341726B (en) 1996-12-19 1997-01-29 Flip-chip type connection with elastic contacts
US08/994,981 US5998875A (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts
AU55054/98A AU5505498A (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts
CNB971817766A CN1156003C (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts
EP97951403A EP0953210A1 (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts
KR1019997005628A KR20000069626A (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts
JP52762998A JP2001506413A (en) 1996-12-19 1997-12-19 Flip-chip type connection device with elastic contacts
CA002275523A CA2275523A1 (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts
PCT/SE1997/002177 WO1998027589A1 (en) 1996-12-19 1997-12-19 Flip-chip type connection with elastic contacts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604676A SE516748C2 (en) 1996-12-19 1996-12-19 Flip-chip type assembly connection with elastic contacts for mounting integrated circuits

Publications (3)

Publication Number Publication Date
SE9604676D0 true SE9604676D0 (en) 1996-12-19
SE9604676L SE9604676L (en) 1998-06-20
SE516748C2 SE516748C2 (en) 2002-02-26

Family

ID=20405042

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604676A SE516748C2 (en) 1996-12-19 1996-12-19 Flip-chip type assembly connection with elastic contacts for mounting integrated circuits

Country Status (6)

Country Link
JP (1) JP2001506413A (en)
KR (1) KR20000069626A (en)
CN (1) CN1156003C (en)
CA (1) CA2275523A1 (en)
SE (1) SE516748C2 (en)
TW (1) TW341726B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100975185B1 (en) * 2002-07-05 2010-08-10 니혼앗짜쿠단시세이소 가부시키가이샤 Connector, method for manufacturing the same, and wiring board strusture employing it
US7005751B2 (en) * 2003-04-10 2006-02-28 Formfactor, Inc. Layered microelectronic contact and method for fabricating same
CN100591181C (en) * 2007-08-24 2010-02-17 武汉华灿光电有限公司 Method of manufacturing flip welding LED chip
WO2012056661A1 (en) 2010-10-25 2012-05-03 パナソニック株式会社 Electronic components assembly
CN105185724B (en) * 2014-05-30 2019-03-01 无锡华润安盛科技有限公司 A method of cushion block, machine and flip-chip for flip-chip load technique
WO2023163433A1 (en) * 2022-02-24 2023-08-31 삼성전자주식회사 Method for repairing display module

Also Published As

Publication number Publication date
KR20000069626A (en) 2000-11-25
CA2275523A1 (en) 1998-06-25
CN1156003C (en) 2004-06-30
SE516748C2 (en) 2002-02-26
CN1246202A (en) 2000-03-01
TW341726B (en) 1998-10-01
JP2001506413A (en) 2001-05-15
SE9604676L (en) 1998-06-20

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