TW341726B - Flip-chip type connection with elastic contacts - Google Patents

Flip-chip type connection with elastic contacts

Info

Publication number
TW341726B
TW341726B TW086100963A TW86100963A TW341726B TW 341726 B TW341726 B TW 341726B TW 086100963 A TW086100963 A TW 086100963A TW 86100963 A TW86100963 A TW 86100963A TW 341726 B TW341726 B TW 341726B
Authority
TW
Taiwan
Prior art keywords
flip
type connection
chip type
elastic contacts
chip
Prior art date
Application number
TW086100963A
Other languages
Chinese (zh)
Inventor
Hesselbom Hjalmar
Bodo Peter
Hentzell Hans
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of TW341726B publication Critical patent/TW341726B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
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    • H01L2224/8112—Aligning
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    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

An assembly structure comprising at least a flip-chip and a substrate, where the substrate has at least one bump and the chip has at least one pad, so that the pattern of the bump will correspond to the pad pattern on the chip, characterized in that the substrate (202) has a frame (212), in that the chip (214) has an edge and in that the frame has the shape as the edge of the chip.
TW086100963A 1996-12-19 1997-01-29 Flip-chip type connection with elastic contacts TW341726B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604676A SE516748C2 (en) 1996-12-19 1996-12-19 Flip-chip type assembly connection with elastic contacts for mounting integrated circuits

Publications (1)

Publication Number Publication Date
TW341726B true TW341726B (en) 1998-10-01

Family

ID=20405042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100963A TW341726B (en) 1996-12-19 1997-01-29 Flip-chip type connection with elastic contacts

Country Status (6)

Country Link
JP (1) JP2001506413A (en)
KR (1) KR20000069626A (en)
CN (1) CN1156003C (en)
CA (1) CA2275523A1 (en)
SE (1) SE516748C2 (en)
TW (1) TW341726B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100975185B1 (en) * 2002-07-05 2010-08-10 니혼앗짜쿠단시세이소 가부시키가이샤 Connector, method for manufacturing the same, and wiring board strusture employing it
US7005751B2 (en) * 2003-04-10 2006-02-28 Formfactor, Inc. Layered microelectronic contact and method for fabricating same
CN100591181C (en) * 2007-08-24 2010-02-17 武汉华灿光电有限公司 Method of manufacturing flip welding LED chip
WO2012056661A1 (en) 2010-10-25 2012-05-03 パナソニック株式会社 Electronic components assembly
CN105185724B (en) * 2014-05-30 2019-03-01 无锡华润安盛科技有限公司 A method of cushion block, machine and flip-chip for flip-chip load technique
WO2023163433A1 (en) * 2022-02-24 2023-08-31 삼성전자주식회사 Method for repairing display module

Also Published As

Publication number Publication date
KR20000069626A (en) 2000-11-25
SE9604676D0 (en) 1996-12-19
CA2275523A1 (en) 1998-06-25
CN1156003C (en) 2004-06-30
SE516748C2 (en) 2002-02-26
CN1246202A (en) 2000-03-01
JP2001506413A (en) 2001-05-15
SE9604676L (en) 1998-06-20

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