SE9604676D0 - Flip-Chip type connection with elastic contacts - Google Patents
Flip-Chip type connection with elastic contactsInfo
- Publication number
- SE9604676D0 SE9604676D0 SE9604676A SE9604676A SE9604676D0 SE 9604676 D0 SE9604676 D0 SE 9604676D0 SE 9604676 A SE9604676 A SE 9604676A SE 9604676 A SE9604676 A SE 9604676A SE 9604676 D0 SE9604676 D0 SE 9604676D0
- Authority
- SE
- Sweden
- Prior art keywords
- chip
- flip
- substrate
- type connection
- chip type
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 229920001971 elastomer Polymers 0.000 abstract 1
- 239000000806 elastomer Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/1319—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604676A SE516748C2 (sv) | 1996-12-19 | 1996-12-19 | Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat |
TW086100963A TW341726B (en) | 1996-12-19 | 1997-01-29 | Flip-chip type connection with elastic contacts |
US08/994,981 US5998875A (en) | 1996-12-19 | 1997-12-19 | Flip-chip type connection with elastic contacts |
AU55054/98A AU5505498A (en) | 1996-12-19 | 1997-12-19 | Flip-chip type connection with elastic contacts |
CNB971817766A CN1156003C (zh) | 1996-12-19 | 1997-12-19 | 一种组件结构 |
EP97951403A EP0953210A1 (en) | 1996-12-19 | 1997-12-19 | Flip-chip type connection with elastic contacts |
KR1019997005628A KR20000069626A (ko) | 1996-12-19 | 1997-12-19 | 탄성 접촉하는 플립칩형 접속 |
JP52762998A JP2001506413A (ja) | 1996-12-19 | 1997-12-19 | 弾性接点を備えたフリップチップタイプの接続装置 |
CA002275523A CA2275523A1 (en) | 1996-12-19 | 1997-12-19 | Flip-chip type connection with elastic contacts |
PCT/SE1997/002177 WO1998027589A1 (en) | 1996-12-19 | 1997-12-19 | Flip-chip type connection with elastic contacts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604676A SE516748C2 (sv) | 1996-12-19 | 1996-12-19 | Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9604676D0 true SE9604676D0 (sv) | 1996-12-19 |
SE9604676L SE9604676L (sv) | 1998-06-20 |
SE516748C2 SE516748C2 (sv) | 2002-02-26 |
Family
ID=20405042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9604676A SE516748C2 (sv) | 1996-12-19 | 1996-12-19 | Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2001506413A ( ) |
KR (1) | KR20000069626A ( ) |
CN (1) | CN1156003C ( ) |
CA (1) | CA2275523A1 ( ) |
SE (1) | SE516748C2 ( ) |
TW (1) | TW341726B ( ) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100975185B1 (ko) * | 2002-07-05 | 2010-08-10 | 니혼앗짜쿠단시세이소 가부시키가이샤 | 커넥터, 이 커넥터의 제조 방법 및 이 커넥터를 이용한배선판 구조 |
US7005751B2 (en) * | 2003-04-10 | 2006-02-28 | Formfactor, Inc. | Layered microelectronic contact and method for fabricating same |
CN100591181C (zh) * | 2007-08-24 | 2010-02-17 | 武汉华灿光电有限公司 | 倒装焊发光二极管芯片的制造方法 |
WO2012056661A1 (ja) | 2010-10-25 | 2012-05-03 | パナソニック株式会社 | 電子部品の接合形態 |
CN105185724B (zh) * | 2014-05-30 | 2019-03-01 | 无锡华润安盛科技有限公司 | 一种用于倒装芯片装片工艺的垫块、机器和倒装芯片的方法 |
WO2023163433A1 (ko) * | 2022-02-24 | 2023-08-31 | 삼성전자주식회사 | 디스플레이 모듈의 리페어 방법 |
-
1996
- 1996-12-19 SE SE9604676A patent/SE516748C2/sv not_active IP Right Cessation
-
1997
- 1997-01-29 TW TW086100963A patent/TW341726B/zh active
- 1997-12-19 JP JP52762998A patent/JP2001506413A/ja active Pending
- 1997-12-19 CA CA002275523A patent/CA2275523A1/en not_active Abandoned
- 1997-12-19 CN CNB971817766A patent/CN1156003C/zh not_active Expired - Fee Related
- 1997-12-19 KR KR1019997005628A patent/KR20000069626A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20000069626A (ko) | 2000-11-25 |
CA2275523A1 (en) | 1998-06-25 |
CN1156003C (zh) | 2004-06-30 |
SE516748C2 (sv) | 2002-02-26 |
CN1246202A (zh) | 2000-03-01 |
TW341726B (en) | 1998-10-01 |
JP2001506413A (ja) | 2001-05-15 |
SE9604676L (sv) | 1998-06-20 |
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Legal Events
Date | Code | Title | Description |
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NUG | Patent has lapsed |