WO1997016866A3 - Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices - Google Patents

Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices Download PDF

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Publication number
WO1997016866A3
WO1997016866A3 PCT/US1996/008328 US9608328W WO9716866A3 WO 1997016866 A3 WO1997016866 A3 WO 1997016866A3 US 9608328 W US9608328 W US 9608328W WO 9716866 A3 WO9716866 A3 WO 9716866A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier substrate
semiconductor device
spring elements
semiconductor devices
methods
Prior art date
Application number
PCT/US1996/008328
Other languages
French (fr)
Other versions
WO1997016866A2 (en
Inventor
Igor Y Khandros
Sung Chul Chang
William D Smith
Original Assignee
Formfactor Inc
Igor Y Khandros
Sung Chul Chang
William D Smith
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/452,255 external-priority patent/US6336269B1/en
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Priority claimed from US08/554,902 external-priority patent/US5974662A/en
Priority claimed from PCT/US1995/014909 external-priority patent/WO1996017378A1/en
Priority claimed from US08/558,332 external-priority patent/US5829128A/en
Application filed by Formfactor Inc, Igor Y Khandros, Sung Chul Chang, William D Smith filed Critical Formfactor Inc
Priority to JP51454797A priority Critical patent/JP2968051B2/en
Priority to AU59657/96A priority patent/AU5965796A/en
Priority to KR1019970708468A priority patent/KR100299465B1/en
Publication of WO1997016866A2 publication Critical patent/WO1997016866A2/en
Publication of WO1997016866A3 publication Critical patent/WO1997016866A3/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
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    • C—CHEMISTRY; METALLURGY
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    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
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    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)

Abstract

A plurality of free-standing spring elements (512) are mounted to a surface (510a) of a carrier substrate (510). The carrier substrate (510) is mounted to a surface (502a) of a semiconductor device (502). Bond pads (504) of the semiconductor device are connected to the spring elements (512) by bond wires (520) extending between the bond pads (504) and terminals (516) associated with the spring elements. Alternatively, the carrier is flip-chip reflow soldered to the semiconductor device. The carrier substrate (510) is suitably mounted to one or more semiconductor devices (532, 534) prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device (502) are provided by the spring elements (512) extending from the carrier substrate (510), per se. Hence, the carrier substrate (510) suitably remains rigid with respect to the semiconductor device (502). The carrier substrate (510) is advantageously pre-fabricated, by mounting the spring elements (512) thereto prior to mounting the carrier substrate to the semiconductor device(s).
PCT/US1996/008328 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices WO1997016866A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP51454797A JP2968051B2 (en) 1995-05-26 1996-05-28 Chip interconnect carrier and method for mounting a spring contact on a semiconductor device
AU59657/96A AU5965796A (en) 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices
KR1019970708468A KR100299465B1 (en) 1995-05-26 1996-05-28 How to mount the chip interconnect carrier and the spring contactor to the semiconductor device

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US08/452,255 1995-05-26
US08/452,255 US6336269B1 (en) 1993-11-16 1995-05-26 Method of fabricating an interconnection element
US52624695A 1995-09-21 1995-09-21
US08/526,246 1995-09-21
US08/533,584 1995-10-18
US08/533,584 US5772451A (en) 1993-11-16 1995-10-18 Sockets for electronic components and methods of connecting to electronic components
US08/554,902 US5974662A (en) 1993-11-16 1995-11-09 Method of planarizing tips of probe elements of a probe card assembly
US08/554,902 1995-11-09
USPCT/US95/14909 1995-11-13
PCT/US1995/014909 WO1996017378A1 (en) 1994-11-15 1995-11-13 Electrical contact structures from flexible wire
US08/558,332 US5829128A (en) 1993-11-16 1995-11-15 Method of mounting resilient contact structures to semiconductor devices
US08/558,332 1995-11-15
US60217996A 1996-02-15 1996-02-15
US08/602,179 1996-02-15

Publications (2)

Publication Number Publication Date
WO1997016866A2 WO1997016866A2 (en) 1997-05-09
WO1997016866A3 true WO1997016866A3 (en) 1997-06-19

Family

ID=27560011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/008328 WO1997016866A2 (en) 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices

Country Status (4)

Country Link
JP (1) JP2968051B2 (en)
KR (1) KR100299465B1 (en)
AU (1) AU5965796A (en)
WO (1) WO1997016866A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP4050732B2 (en) 2004-08-30 2008-02-20 株式会社ルネサステクノロジ Semiconductor device and manufacturing method thereof
JP4711800B2 (en) * 2005-10-07 2011-06-29 日本電子材料株式会社 Probe card manufacturing method
JP2013024824A (en) * 2011-07-26 2013-02-04 Denso Corp Manufacturing method of sensor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5346861A (en) * 1990-09-24 1994-09-13 Tessera, Inc. Semiconductor chip assemblies and methods of making same
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US5346861A (en) * 1990-09-24 1994-09-13 Tessera, Inc. Semiconductor chip assemblies and methods of making same
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact

Also Published As

Publication number Publication date
JPH10510107A (en) 1998-09-29
KR19990021993A (en) 1999-03-25
WO1997016866A2 (en) 1997-05-09
KR100299465B1 (en) 2001-10-27
JP2968051B2 (en) 1999-10-25
AU5965796A (en) 1997-05-22

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