JPS562649A - Manufacturing device of semiconductor - Google Patents

Manufacturing device of semiconductor

Info

Publication number
JPS562649A
JPS562649A JP7848279A JP7848279A JPS562649A JP S562649 A JPS562649 A JP S562649A JP 7848279 A JP7848279 A JP 7848279A JP 7848279 A JP7848279 A JP 7848279A JP S562649 A JPS562649 A JP S562649A
Authority
JP
Japan
Prior art keywords
room
valve
stopper
prepared
gravitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7848279A
Other languages
Japanese (ja)
Inventor
Taiji Hiraga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7848279A priority Critical patent/JPS562649A/en
Publication of JPS562649A publication Critical patent/JPS562649A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To save the motion power source for a semiconductor manufacturing device and simplify the device by a method wherein an inclined transporting means is prepared in a vacuum vessel, and materials or material holders are transferred by gravitation. CONSTITUTION:A material or a material holder 8 is put on a transporting means in a front-room 2 through a partitioning valve 1, the room 2 is exhausted through a pipe 9 and the material is introduced in a room 4. A thin film is formed during the transfer of material through the position corresponding to a thin film forming source 13 to the diagonally downward direction by gravitation, and the material is taken- out by opening a partitioning valve 5 prepared between a rear-room 6 having the same pressure with the room 4. The material is taken out to the outside by closing the valve 5 and opening a valve 7. The material is transferred one after another from the room 4 to 6 driving intermittently a stopper 16 by a motive power source prepared at the outside of vacuum vessel, and a stopper 18 supplies materials synchronizing with the motion of the stopper 16. In this constitution, the introduction of the motive power into the vessel is limited to the stoppers only to make an expensive vacuum sealing to be needless and to reduce the cost of device.
JP7848279A 1979-06-21 1979-06-21 Manufacturing device of semiconductor Pending JPS562649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7848279A JPS562649A (en) 1979-06-21 1979-06-21 Manufacturing device of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7848279A JPS562649A (en) 1979-06-21 1979-06-21 Manufacturing device of semiconductor

Publications (1)

Publication Number Publication Date
JPS562649A true JPS562649A (en) 1981-01-12

Family

ID=13663207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7848279A Pending JPS562649A (en) 1979-06-21 1979-06-21 Manufacturing device of semiconductor

Country Status (1)

Country Link
JP (1) JPS562649A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183666U (en) * 1981-05-18 1982-11-20
JPS59200433A (en) * 1983-04-28 1984-11-13 Hitachi Electronics Eng Co Ltd Loading method of chemical vapor deposition device
CN102386272A (en) * 2010-09-03 2012-03-21 上海凯世通半导体有限公司 Vacuum transmission processing equipment and method
CN102403249A (en) * 2010-09-07 2012-04-04 上海凯世通半导体有限公司 Vacuum transmission process equipment and method
CN102403392A (en) * 2010-09-07 2012-04-04 上海凯世通半导体有限公司 Vacuum process equipment, vacuum transmission process equipment and methods

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183666U (en) * 1981-05-18 1982-11-20
JPS59200433A (en) * 1983-04-28 1984-11-13 Hitachi Electronics Eng Co Ltd Loading method of chemical vapor deposition device
CN102386272A (en) * 2010-09-03 2012-03-21 上海凯世通半导体有限公司 Vacuum transmission processing equipment and method
CN102403249A (en) * 2010-09-07 2012-04-04 上海凯世通半导体有限公司 Vacuum transmission process equipment and method
CN102403392A (en) * 2010-09-07 2012-04-04 上海凯世通半导体有限公司 Vacuum process equipment, vacuum transmission process equipment and methods

Similar Documents

Publication Publication Date Title
IT1152032B (en) PACKAGING WITH GAS SEALED ENVELOPE
US4870800A (en) Inert gas-filling and sealing device, heat sealing device and packaging apparatus using these devices
KR940006209A (en) Surface treatment method and device
GB1128800A (en) Method and apparatus for packaging material in a protective atmosphere
AU9446098A (en) Device for packaging products under controlled atmosphere in packages sealed with a film
ES8501304A1 (en) Method of making a seal.
JPS562649A (en) Manufacturing device of semiconductor
SE7901039L (en) CLOSING DEVICE
GB1184481A (en) Packaging Apparatus
EP0260487A3 (en) An arrangement on packing containers
FR2506264A1 (en) FLEXIBLE POUCH CONTAINER FOR LYOPHILIZING LIQUID AND METHOD OF USE
JPS56113464A (en) Ink feeder
US6430901B1 (en) Method and device for opening and filling pre-manufactured bag packages
ZA836783B (en) Process for sealing a glass container with a thin closure
GB1431116A (en) Method of and arrangement for storing handled bags
GB931563A (en) Improvements in and relating to a method and apparatus for manufacturing food containers
DK0663884T3 (en) Container which is sealed by sealing and resealable after the first opening as well as the method and foil for its manufacture
JPS5549136A (en) Continuous working apparatus during pressure reduction
JPS5519842A (en) Thin film growing device under vacuum
GB2023105A (en) Dispensing apparatus
JPS6470370A (en) Packaging material for semiconductor device
GB1230550A (en)
JPS5693345A (en) Packing method of ceramic sealed-type semiconductor device
JPS53124077A (en) Chucking for wafer
JPS56148877A (en) Atomic beam device