JPH0466780U - - Google Patents
Info
- Publication number
- JPH0466780U JPH0466780U JP1990110255U JP11025590U JPH0466780U JP H0466780 U JPH0466780 U JP H0466780U JP 1990110255 U JP1990110255 U JP 1990110255U JP 11025590 U JP11025590 U JP 11025590U JP H0466780 U JPH0466780 U JP H0466780U
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- land electrode
- terminal part
- connection terminal
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図イおよびロは本考案におけるリードチツ
プ説明図、第２図は本考案における外部接続端子
説明図、第３図は本考案における他のリードチツ
プ説明図、第４図は本考案における外部接続端子
を回路基板に接続した状態説明図、第５図は従来
例における混成集積回路装置を母回路基板に取り
付けた状態説明図である。
１……リードチツプ、２……端子部、３……ス
ペーサ部、４……連結凹部、５……連結凸部、６
……厚膜導体層、７……外部接続端子、８……回
路基板、９……ランド電極、１０……電子部品、
１１……リードチツプ、１２……端子チツプ、１
３……端子凹部、１４……端子凸部、１５……厚
膜導体層、１６……スペーサチツプ、１７……ス
ペーサ凹部、１８……スペーサ凸部。
Figure 1 A and B are explanatory diagrams of the lead chip in the present invention, Figure 2 is an explanatory diagram of the external connection terminal in the present invention, Figure 3 is an explanatory diagram of another lead chip in the present invention, and Figure 4 is an explanatory diagram of the external connection terminal in the present invention. FIG. 5 is a diagram illustrating a state in which a conventional hybrid integrated circuit device is attached to a mother circuit board. DESCRIPTION OF SYMBOLS 1... Lead chip, 2... Terminal part, 3... Spacer part, 4... Connection recessed part, 5... Connection convex part, 6
... Thick film conductor layer, 7 ... External connection terminal, 8 ... Circuit board, 9 ... Land electrode, 10 ... Electronic component,
11...Lead chip, 12...Terminal chip, 1
3...Terminal recess, 14...Terminal protrusion, 15...Thick film conductor layer, 16...Spacer chip, 17...Spacer recess, 18...Spacer protrusion.
Claims (1)
外部接続端子において、 一つのランド電極９と対応するように厚膜導体
層６を形成した耐熱性絶縁部材からなる端子部２
と、 当該端子部２と隣合う他の端子部２′に接続す
る連結部４，５と、 各端子部間を絶縁するスペーサ部３と、 から構成されるリードチツプ１，１１が所望の長
さに連結されていることを特徴とするリードチツ
プからなる外部接続端子。 (2) 配線パターンおよび当該配線パターンに接
続されているランド電極９が表面に形成されてい
る回路基板８と、 前記配線パターンの所定の位置に搭載されてい
る電子部品１０と、 前記ランド電極９に対応した位置に配置された
リードチツプ１，１１からなる請求項(1)記載の
外部接続端子７と、 を備えていることを特徴とする混成集積回路装置
。[Scope of Claim for Utility Model Registration] (1) An external connection terminal electrically connected to a land electrode of a circuit board, made of a heat-resistant insulating material on which a thick film conductor layer 6 is formed to correspond to one land electrode 9. Terminal part 2
, connecting parts 4 and 5 that connect the terminal part 2 to another terminal part 2' adjacent to the terminal part 2, and a spacer part 3 that insulates between each terminal part. An external connection terminal consisting of a lead chip, characterized in that it is connected to a lead chip. (2) a circuit board 8 having a wiring pattern and a land electrode 9 connected to the wiring pattern formed on its surface; an electronic component 10 mounted at a predetermined position on the wiring pattern; and the land electrode 9. A hybrid integrated circuit device comprising: an external connection terminal (7) according to claim (1), comprising lead chips (1, 11) arranged at positions corresponding to the external connection terminal (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110255U JPH0612622Y2 (en) | 1990-10-23 | 1990-10-23 | External connection terminal composed of lead chip and hybrid integrated circuit device having the external connection terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110255U JPH0612622Y2 (en) | 1990-10-23 | 1990-10-23 | External connection terminal composed of lead chip and hybrid integrated circuit device having the external connection terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0466780U true JPH0466780U (en) | 1992-06-12 |
| JPH0612622Y2 JPH0612622Y2 (en) | 1994-03-30 |
Family
ID=31857563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990110255U Expired - Lifetime JPH0612622Y2 (en) | 1990-10-23 | 1990-10-23 | External connection terminal composed of lead chip and hybrid integrated circuit device having the external connection terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612622Y2 (en) |
-
1990
- 1990-10-23 JP JP1990110255U patent/JPH0612622Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0612622Y2 (en) | 1994-03-30 |
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