JPH0221754U - - Google Patents
Info
- Publication number
- JPH0221754U JPH0221754U JP10141288U JP10141288U JPH0221754U JP H0221754 U JPH0221754 U JP H0221754U JP 10141288 U JP10141288 U JP 10141288U JP 10141288 U JP10141288 U JP 10141288U JP H0221754 U JPH0221754 U JP H0221754U
- Authority
- JP
- Japan
- Prior art keywords
- circuit module
- contact surface
- contact
- circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案をフラツトパツク形ＩＣに適用
した場合の一実施例を示す斜視図、第２図は第１
図の要部を拡大して示す側面図、第３図は従来の
フラツトパツク形ＩＣの接続構造を示す斜視図、
第４図は第３図の要部を拡大して示す側面図であ
る。
６……印刷配線基板、７……回路パターン、８
……フラツトパツク形ＩＣ、９……リード線、９
ａ……接触部、１０……湾曲部、１１……半田。
FIG. 1 is a perspective view showing an embodiment of the present invention applied to a flat pack type IC, and FIG.
FIG. 3 is a perspective view showing the connection structure of a conventional flat pack IC;
FIG. 4 is a side view showing an enlarged main part of FIG. 3. 6...Printed wiring board, 7...Circuit pattern, 8
... Flat pack type IC, 9 ... Lead wire, 9
a... Contact portion, 10... Curved portion, 11... Solder.
Claims (1)
ターン面にこのパターン面と接触する電子部品の
リード線の接触面を半田を介し電気的に接続して
なる回路モジユールにおいて、前記電子部品のリ
ード線の接触面の少なくとも一部が湾曲している
ことを特徴とする回路モジユール。 In a circuit module in which a contact surface of a lead wire of an electronic component that is in contact with the pattern surface of a circuit pattern formed on a printed wiring board is electrically connected via solder, A circuit module characterized in that at least a portion of a contact surface is curved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10141288U JPH0221754U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10141288U JPH0221754U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221754U true JPH0221754U (en) | 1990-02-14 |
Family
ID=31330380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10141288U Pending JPH0221754U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221754U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465158A (en) * | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
-
1988
- 1988-07-28 JP JP10141288U patent/JPH0221754U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465158A (en) * | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | Manufacture of semiconductor device |