TW342579B - Manufacturing method of printed circuit board and printed circuit board - Google Patents
Manufacturing method of printed circuit board and printed circuit boardInfo
- Publication number
- TW342579B TW342579B TW086112582A TW86112582A TW342579B TW 342579 B TW342579 B TW 342579B TW 086112582 A TW086112582 A TW 086112582A TW 86112582 A TW86112582 A TW 86112582A TW 342579 B TW342579 B TW 342579B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- manufacturing
- holes
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23614296A JP3241605B2 (ja) | 1996-09-06 | 1996-09-06 | 配線基板の製造方法並びに配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW342579B true TW342579B (en) | 1998-10-11 |
Family
ID=16996390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086112582A TW342579B (en) | 1996-09-06 | 1997-09-02 | Manufacturing method of printed circuit board and printed circuit board |
Country Status (5)
Country | Link |
---|---|
US (1) | US6195882B1 (zh) |
JP (1) | JP3241605B2 (zh) |
KR (1) | KR100272314B1 (zh) |
CN (1) | CN1115083C (zh) |
TW (1) | TW342579B (zh) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6703565B1 (en) | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
US6565954B2 (en) | 1998-05-14 | 2003-05-20 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
SG86345A1 (en) * | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
US6451441B1 (en) * | 1999-03-30 | 2002-09-17 | Kyocera Corporation | Film with metal foil |
US6631980B2 (en) * | 2000-01-19 | 2003-10-14 | Seiko Epson Corporation | Liquid jetting head |
US6871396B2 (en) | 2000-02-09 | 2005-03-29 | Matsushita Electric Industrial Co., Ltd. | Transfer material for wiring substrate |
US6753483B2 (en) | 2000-06-14 | 2004-06-22 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
US6518514B2 (en) | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
JP2002176237A (ja) * | 2000-12-06 | 2002-06-21 | Ibiden Co Ltd | プリント配線板 |
JP3473601B2 (ja) * | 2000-12-26 | 2003-12-08 | 株式会社デンソー | プリント基板およびその製造方法 |
JP4774606B2 (ja) * | 2001-02-19 | 2011-09-14 | パナソニック株式会社 | 回路形成基板の製造方法 |
GB0106417D0 (en) * | 2001-03-15 | 2001-05-02 | Oxford Biosensors Ltd | Transfer screen-printing |
KR100671541B1 (ko) * | 2001-06-21 | 2007-01-18 | (주)글로벌써키트 | 함침 인쇄회로기판 제조방법 |
US20040231141A1 (en) * | 2001-07-06 | 2004-11-25 | Masaru Nishinaka | Laminate and its producing method |
JP2007081423A (ja) * | 2001-10-26 | 2007-03-29 | Matsushita Electric Works Ltd | 配線板用シート材及びその製造方法、並びに多層板及びその製造方法 |
JP4392157B2 (ja) * | 2001-10-26 | 2009-12-24 | パナソニック電工株式会社 | 配線板用シート材及びその製造方法、並びに多層板及びその製造方法 |
US6946205B2 (en) * | 2002-04-25 | 2005-09-20 | Matsushita Electric Industrial Co., Ltd. | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
JP3969192B2 (ja) * | 2002-05-30 | 2007-09-05 | 株式会社デンソー | 多層配線基板の製造方法 |
JP2004146634A (ja) * | 2002-10-25 | 2004-05-20 | Murata Mfg Co Ltd | 樹脂基板の製造方法、および樹脂多層基板の製造方法 |
JP2004158651A (ja) * | 2002-11-06 | 2004-06-03 | Murata Mfg Co Ltd | 樹脂基板の製造方法、樹脂多層基板の製造方法、および樹脂基板 |
US7417315B2 (en) * | 2002-12-05 | 2008-08-26 | International Business Machines Corporation | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
JP3991358B2 (ja) * | 2003-01-07 | 2007-10-17 | ソニー株式会社 | バックライト装置および液晶表示装置 |
JP4142954B2 (ja) * | 2003-01-10 | 2008-09-03 | 京セラ株式会社 | プリント配線板の製造装置 |
US7001662B2 (en) * | 2003-03-28 | 2006-02-21 | Matsushita Electric Industrial Co., Ltd. | Transfer sheet and wiring board using the same, and method of manufacturing the same |
JP4203435B2 (ja) * | 2003-05-16 | 2009-01-07 | 日本特殊陶業株式会社 | 多層樹脂配線基板 |
US7377277B2 (en) * | 2003-10-27 | 2008-05-27 | Oriel Therapeutics, Inc. | Blister packages with frames and associated methods of fabricating dry powder drug containment systems |
US20050124197A1 (en) * | 2003-12-04 | 2005-06-09 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment |
JP2005251780A (ja) * | 2004-03-01 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 半導体回路部品およびその製造方法 |
JP2006066627A (ja) * | 2004-08-26 | 2006-03-09 | Kyocera Corp | 電子部品の製造方法 |
US20060068576A1 (en) * | 2004-09-30 | 2006-03-30 | Burdick William E Jr | Lithography transfer for high density interconnect circuits |
JP4577715B2 (ja) * | 2005-01-05 | 2010-11-10 | 株式会社神戸製鋼所 | パターン電極を備えた多孔質誘電体基板の製造方法 |
US20080136041A1 (en) | 2006-01-24 | 2008-06-12 | Tessera Interconnect Materials, Inc. | Structure and method of making interconnect element having metal traces embedded in surface of dielectric |
JP2008529283A (ja) * | 2005-01-24 | 2008-07-31 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | 誘電体の表面に埋め込まれた金属トレースを有する相互接続要素を作る構成および方法 |
JP2006278906A (ja) * | 2005-03-30 | 2006-10-12 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US7650694B2 (en) | 2005-06-30 | 2010-01-26 | Intel Corporation | Method for forming multilayer substrate |
US20070037432A1 (en) * | 2005-08-11 | 2007-02-15 | Mershon Jayne L | Built up printed circuit boards |
US7893359B2 (en) * | 2005-09-19 | 2011-02-22 | Industrial Technology Research Institute | Embedded capacitor core having a multiple-layer structure |
TWI333580B (en) * | 2006-02-08 | 2010-11-21 | Chimei Innolux Corp | Backlight module and liquid crystal display using the same |
KR100661295B1 (ko) * | 2006-02-15 | 2006-12-26 | 삼성전기주식회사 | 패키지용 인쇄회로기판 및 그 제조 방법 |
KR100771674B1 (ko) | 2006-04-04 | 2007-11-01 | 엘지전자 주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2008028376A (ja) * | 2006-06-20 | 2008-02-07 | Sanyo Electric Co Ltd | 回路基板、半導体モジュールおよび回路基板の製造方法 |
US7459202B2 (en) * | 2006-07-03 | 2008-12-02 | Motorola, Inc. | Printed circuit board |
KR100782402B1 (ko) * | 2006-10-24 | 2007-12-07 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US7451540B2 (en) * | 2006-10-24 | 2008-11-18 | Motorola, Inc. | Method for fabricating a printed circuit board |
KR100771467B1 (ko) | 2006-10-30 | 2007-10-30 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
KR100887382B1 (ko) | 2007-03-28 | 2009-03-06 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
CN101351092B (zh) * | 2007-07-17 | 2010-06-02 | 欣兴电子股份有限公司 | 具有导电孔的内埋式线路板工艺 |
CN101472399B (zh) * | 2007-12-26 | 2011-09-21 | 欣兴电子股份有限公司 | 内埋式线路板的制作方法 |
CN101528009B (zh) * | 2008-03-06 | 2012-05-23 | 欣兴电子股份有限公司 | 线路结构的制造方法 |
CN101636044B (zh) * | 2008-07-25 | 2011-07-13 | 欣兴电子股份有限公司 | 内埋式线路结构及其制作方法 |
KR101057674B1 (ko) | 2009-05-08 | 2011-08-18 | 주식회사 코리아써키트 | 인쇄회로기판 제조 방법 |
KR101116725B1 (ko) * | 2009-11-30 | 2012-02-22 | 삼포정보통신 (주) | 인쇄회로기판 조립체 |
WO2012108381A1 (ja) * | 2011-02-08 | 2012-08-16 | 株式会社村田製作所 | 樹脂多層基板およびその製造方法 |
KR101221664B1 (ko) * | 2011-08-08 | 2013-01-14 | 삼성전기주식회사 | 인쇄회로기판 제조 방법 |
TWI557855B (zh) | 2011-12-30 | 2016-11-11 | 旭德科技股份有限公司 | 封裝載板及其製作方法 |
JP5881173B2 (ja) * | 2012-10-31 | 2016-03-09 | 京セラサーキットソリューションズ株式会社 | 配線基板の製造方法 |
KR102198541B1 (ko) * | 2014-03-17 | 2021-01-06 | 삼성전기주식회사 | 캐리어 부재 |
JP2016219452A (ja) * | 2015-05-14 | 2016-12-22 | 富士通株式会社 | 多層基板及び多層基板の製造方法 |
TWI658767B (zh) * | 2017-09-28 | 2019-05-01 | 欣興電子股份有限公司 | 電路板的製造方法以及應用於製造其之堆疊結構 |
JP7381323B2 (ja) * | 2019-12-17 | 2023-11-15 | 日東電工株式会社 | 両面配線回路基板の製造方法および両面配線回路基板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6484186A (en) | 1987-09-28 | 1989-03-29 | Hitachi Ltd | Nuclear reactor |
JP2601128B2 (ja) * | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | 回路形成用基板の製造方法および回路形成用基板 |
JPH06318783A (ja) | 1993-05-10 | 1994-11-15 | Meikoo:Kk | 多層回路基板の製造方法 |
DE69412952T2 (de) | 1993-09-21 | 1999-05-12 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Verbindungsteil eines Schaltungssubstrats und Verfahren zur Herstellung mehrschichtiger Schaltungssubstrate unter Verwendung dieses Teils |
US5480503A (en) * | 1993-12-30 | 1996-01-02 | International Business Machines Corporation | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
US5456004A (en) | 1994-01-04 | 1995-10-10 | Dell Usa, L.P. | Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
JP3207663B2 (ja) | 1994-03-22 | 2001-09-10 | 松下電器産業株式会社 | プリント配線基板及びその製造方法 |
US5498467A (en) | 1994-07-26 | 1996-03-12 | W. L. Gore & Associates, Inc. | Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
JPH09116273A (ja) | 1995-08-11 | 1997-05-02 | Shinko Electric Ind Co Ltd | 多層回路基板及びその製造方法 |
JP3492467B2 (ja) | 1996-06-20 | 2004-02-03 | イビデン株式会社 | 多層プリント配線板用片面回路基板、および多層プリント配線板とその製造方法 |
-
1996
- 1996-09-06 JP JP23614296A patent/JP3241605B2/ja not_active Expired - Lifetime
-
1997
- 1997-09-02 TW TW086112582A patent/TW342579B/zh active
- 1997-09-04 KR KR1019970045845A patent/KR100272314B1/ko not_active IP Right Cessation
- 1997-09-05 US US08/924,619 patent/US6195882B1/en not_active Expired - Lifetime
- 1997-09-06 CN CN97119329A patent/CN1115083C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1177901A (zh) | 1998-04-01 |
US6195882B1 (en) | 2001-03-06 |
KR100272314B1 (ko) | 2001-01-15 |
CN1115083C (zh) | 2003-07-16 |
JP3241605B2 (ja) | 2001-12-25 |
KR19980024348A (ko) | 1998-07-06 |
JPH1084186A (ja) | 1998-03-31 |
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