WO2005112526A8 - Printed wiring board, manufacturing method and electronic device - Google Patents

Printed wiring board, manufacturing method and electronic device

Info

Publication number
WO2005112526A8
WO2005112526A8 PCT/FI2005/050160 FI2005050160W WO2005112526A8 WO 2005112526 A8 WO2005112526 A8 WO 2005112526A8 FI 2005050160 W FI2005050160 W FI 2005050160W WO 2005112526 A8 WO2005112526 A8 WO 2005112526A8
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
manufacturing
electronic device
insulating layer
Prior art date
Application number
PCT/FI2005/050160
Other languages
French (fr)
Other versions
WO2005112526A1 (en
Inventor
Pauliina Mansikkamaeki
Tero Peltola
Juulia Loisa
Original Assignee
Aspocomp Technology Oy
Pauliina Mansikkamaeki
Tero Peltola
Juulia Loisa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aspocomp Technology Oy, Pauliina Mansikkamaeki, Tero Peltola, Juulia Loisa filed Critical Aspocomp Technology Oy
Priority to JP2007517318A priority Critical patent/JP2007538394A/en
Priority to EP05740730A priority patent/EP1747704A4/en
Publication of WO2005112526A1 publication Critical patent/WO2005112526A1/en
Publication of WO2005112526A8 publication Critical patent/WO2005112526A8/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A printed wiring board, an electronic device and a method for manufacturing a printed wiring board. A printed wiring board (1) comprises an insulating layer (2, 2a, 2b) and a circuit pattern (3, 3a, 3b) arranged on at least one surface of the insulating layer (2, 2a, 2b) and made of a conductive material. At least one surface of the insulating layer (2, 2a, 2b) is provided with a support pattern (6, 6a, 6b), which comprises material lines (7, 7a, 7b) arranged at a distance from each other.
PCT/FI2005/050160 2004-05-17 2005-05-16 Printed wiring board, manufacturing method and electronic device WO2005112526A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007517318A JP2007538394A (en) 2004-05-17 2005-05-16 Printed circuit board, manufacturing method, and electronic device
EP05740730A EP1747704A4 (en) 2004-05-17 2005-05-16 Printed wiring board, manufacturing method and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20045179 2004-05-17
FI20045179A FI117234B (en) 2004-05-17 2004-05-17 Printed circuit board, manufacturing method and electronic device

Publications (2)

Publication Number Publication Date
WO2005112526A1 WO2005112526A1 (en) 2005-11-24
WO2005112526A8 true WO2005112526A8 (en) 2006-02-16

Family

ID=32338458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2005/050160 WO2005112526A1 (en) 2004-05-17 2005-05-16 Printed wiring board, manufacturing method and electronic device

Country Status (4)

Country Link
EP (1) EP1747704A4 (en)
JP (1) JP2007538394A (en)
FI (1) FI117234B (en)
WO (1) WO2005112526A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10195852B2 (en) 2014-08-28 2019-02-05 Hewlett-Packard Development Company, L.P. Printhead assembly

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5539800B2 (en) * 2010-07-07 2014-07-02 日本特殊陶業株式会社 Intermediate product of wiring board and method of manufacturing wiring board
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
US10136512B2 (en) * 2014-12-09 2018-11-20 Microsoft Technology Licensing, Llc Avoiding reflections in PCB signal trace
CN115702490A (en) * 2020-06-03 2023-02-14 住友电木株式会社 Circuit board

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270887A (en) * 1985-05-24 1986-12-01 松下電器産業株式会社 Flexible printed wiring board
JPS63211692A (en) * 1987-02-27 1988-09-02 株式会社日立製作所 Double-sided interconnection board
US5278727A (en) * 1990-05-29 1994-01-11 Digital Equipment Corporation High density electrical interconnection device and method therefor
JPH05299786A (en) * 1992-04-20 1993-11-12 Ibiden Co Ltd Printed wiring board
US5300899A (en) * 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5715140A (en) * 1996-05-03 1998-02-03 Ford Motor Company Overlay substrate for securing electronic devices in a vehicle
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
US6407345B1 (en) * 1998-05-19 2002-06-18 Ibiden Co., Ltd. Printed circuit board and method of production thereof
JP2001326429A (en) * 2000-05-17 2001-11-22 Sony Corp Printed wiring board
JP2002076263A (en) * 2000-08-31 2002-03-15 Hitachi Ltd Semiconductor device
JP2002111142A (en) * 2000-09-29 2002-04-12 Hitachi Kokusai Electric Inc Structure of printed circuit board
JP4646386B2 (en) * 2000-11-30 2011-03-09 京セラ株式会社 Wiring board manufacturing method
JP2002190657A (en) * 2000-12-21 2002-07-05 Sony Chem Corp Flexible wiring board and its manufacturing method
JP2003124637A (en) * 2001-10-11 2003-04-25 Toppan Printing Co Ltd Multilayer wiring board
TW564533B (en) * 2002-10-08 2003-12-01 Siliconware Precision Industries Co Ltd Warpage-preventing substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10195852B2 (en) 2014-08-28 2019-02-05 Hewlett-Packard Development Company, L.P. Printhead assembly

Also Published As

Publication number Publication date
EP1747704A1 (en) 2007-01-31
EP1747704A4 (en) 2011-10-12
FI20045179A0 (en) 2004-05-17
WO2005112526A1 (en) 2005-11-24
FI20045179A (en) 2005-11-18
FI117234B (en) 2006-07-31
JP2007538394A (en) 2007-12-27

Similar Documents

Publication Publication Date Title
TW342579B (en) Manufacturing method of printed circuit board and printed circuit board
EP1484952A4 (en) Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method
TW200731908A (en) Multilayer printed wiring board and method for manufacturing same
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
WO2006134216A3 (en) Circuit board structure and method for manufacturing a circuit board structure
WO2008008552A3 (en) Build-up printed wiring board substrate having a core layer that is part of a circuit
TW200610017A (en) Wiring board, method of manufacturing the same, and semiconductor device
EP1418798A3 (en) Printed circuit board and method for installing printed circuit board onto electro-conductive housing
EP1250033A3 (en) Printed circuit board and electronic component
FI20020190A0 (en) A method for immersing a component in a substrate and forming a contact
EP1391923A4 (en) Semiconductor device and its manufacturing method, circuit board and electronic apparatus
TW200730061A (en) Multilayer circuit board and electronic apparatus
TW200731898A (en) Circuit board structure and method for fabricating the same
EP1937041A3 (en) Printed circuit board, light emitting apparatus having the same and manufacturing method thereof
EP1347674A3 (en) Technique for reducing the number of layers in a multilayer circuit board
EP1976060A4 (en) Antenna built-in module, card type information device and methods for manufacturing them
TW200520638A (en) Hybrid integrated circuit device and method for manufacture thereof
WO2000047025A3 (en) Method for forming printed circuit board electrical interconnects
TWI257273B (en) Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board
TW200704330A (en) Electronic board, method of manufacturing the same, and electronic device
EP1394856A3 (en) Surface-mounted electronic component module and method for manufacturing the same
WO2005092043A3 (en) Process for fabrication of printed circuit boards
TW200629998A (en) Printed circuit board and forming method thereof
TWI256094B (en) Film carrier tape for mounting electronic devices thereon and method of manufacturing the same
WO2005112526A8 (en) Printed wiring board, manufacturing method and electronic device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i

Free format text: IN PCT GAZETTE 47/2005 UNDER (71) REPLACE "ASPOCOMP TECHNOLOY OY [FI/FI]; YRITIE 12 A, FI-01510 VANTAA (FI)." BY "ASPOCOMP TECHNOLOGY OY [FI/FI]; YRITIE 12 A, FI-01510 VANTAA (FI)."

WWE Wipo information: entry into national phase

Ref document number: 2005740730

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007517318

Country of ref document: JP

NENP Non-entry into the national phase in:

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

WWP Wipo information: published in national office

Ref document number: 2005740730

Country of ref document: EP