201140089 六、發明說明： 【發明所屬之技術領域】 傭ίΓ歸及半ΐ㈣件檢職置’更料地說涉及加熱_試溫产夕 測方法。 €職料物轉檢纖置以及半導體器件檢 【先前技術】 電特關於 用於裝==2::件置::個例子’其結構包括：裝载部， 時間直至溫度=:試:半導體器件而加熱預定 器件安裝於測試插座之後執行半;體器件:電半導體 據測試部的測試結果對半導體器件進行分類電雜專的測试’卸载部’根 其成Γ方面，隨著市場競爭力越來越激烈，半導體ϋ件也著實需要降低 處理來ίϊίΐί構的半導體器件檢測裝置也需要增加單位元時間的 並且，半導體器件檢測裝置將設置 需要通過料《所切㈣轉低铸内，料 【發明内容】 本發明是赛於上述必要性而作出，其 過提高針解導體n件的檢 、=的在於’提供-種能夠通 及半導體器件檢測方法。 又來^生產率的半導體器件檢測裝置以 本發明的另一個目的在於，提供 置的設置空間來降低半導體器件的整體生產小半導體器件檢别裝 及半導體器件檢測方法。 成本的半導體器件檢測裝置以 201140089 祕ίΐΓΐ為了朗上述的本發明目的峨出，本發明提供-種半導體 截件^裝置’包括：裝載部，用於裝載—個以上的托盤，在上 ‘收件；加熱板部’通過第—移送工具從上述裝载部的托 ίϊ :ϊ 進行加熱;反轉裝載部，從上述加熱板部拾取半導體 件的電特性，m 測關於被上述加熱板部加熱的半導體器 述-對取多個半導體器件，上職轉移動部使上 動邱借置與器件測試位置之間進行旋轉，上述線性移 ^上私取部進行線性移動，使得被上述拾取部拾取辭導體 ^述座或從上述测試插座分離；第三移送工具，將半導體^ 移送工且^裝載㈣遞錄赴述料更触置的上述拾取部；第四 :-轉======mm部拾取結束測試的半導體 狀離下進行祕^接收半導織倾將其拾取的 _下部=;:=進::=^ 通過ίίΓϊΓί對載入在上述卸載板部的半導體器件進行分類並载。入果， 用於將半導體n件域龍定_試溫^置於上34板部件_部或底面， 應：=:===插座的間隔進行_ 具的各載人槽關隔為構成上敍難飾的战各拾取工 上述加熱板部包括能夠相互交替移動的一對板部件。 替地移動。 ㈣牛㈣請的傳_置之間相互交 上述一對板部件設置成沿上下隔開間隔，以免妨礙相互移動，該板部 201140089 述板部件=^==^_蝴⑼物概驅動上 線性移動㈣™過χ_γ 進行旋 n:r===:=—_ 器件的底面朝向上側。 轉體讀並使其旋轉而反轉成半導體 多個ΐ==二多個拾取工具，用於拾取半導體器件，以移送 牛導體盗件，以及支樓部，設置成支撐上述各拾取工且 線性沿χ_γ方向移動，以將半導體器件載人到上_板。· 進行旋ΪΓ載部還包括旋轉移動裝置，該旋轉移動裝置使上述支樓部 下側。 科導體11件並使其旋轉而反轉辭導體器件的底面朝向 上述第三 進行移動。 移送工具及上述第四移送卫具通過-個移動裝置相互連動地 驟，提供-種半導體11件檢财法，包括以下步驟：11件裝載步 彈，上的托盤，在上述托盤中載人有多個半導體器件；加孰步 具將半導體器件從上述器件裝載步驟的托盤接收h口 伯、甘進'，，、，# 一反轉步驟，拾取在上述加熱步驟加熱的半導體器件， -對it ^體^件的底面朝向上側；測試步驟，在器件更換位置通過 种的任思一個來接收通過上述第一反轉步驟反轉的半導體器 I 拾取部拾取到的狀態從器件更換位置旋轉到器件測試位置之 =ΐίί拾取部拾取的半導體器件安裝於測試元件_試插座而進行 n同時藉上述拾取部的旋轉將半導體器件拾 =上述拾取部之後，接收通過上述第一反轉步驟反轉==之 之後將半導體器件從上述測試插座分離而從器件測試位置旋轉 位置；第"反轉步驟，從上述拾取部接收在上述測試步驟結2 /、’式的半導體純，使其反轉成在被拾取的狀態下麵下側而進行移送； 201140089 上述第二反轉步驟拾取到的半導體11件載入到却載 且對费入在卜n ^驟’娜上侧試元件酬試結果，通過苐二移送工 八子载、在上述卸載板部的半導體器件進行分類而載入。 多個載個拾取工具，用於拾取半導體器件，以移送 移動裝置沿χ-γ方向移拾取工具’並通過χ-γ線性 移動裝置，使上述支撐部進行^從;^取^導體器件；以及旋轉 使其旋轉而反轉成半各導體器件t底：1上上7熱板部拾取半導體器件而 上述反轉卸載部包括：多個拾取工具，用 成半導體器件的底面朝向下側。疋以°取'’導體益件並使其旋轉而反轉 點·=明導體器件檢測農置以及半導體器件檢測方法具有以下優 並從測試插座分離，從而不僅能 測试，而且還能夠減少裝置的大小。 t子+導體讀的 下優ί且由器件檢測裝置以及半導體_^ 熱半導體器件的停留時間。卿增加裝置的大小，而充分維持用於加 從㈣-對板部件， 體器件的移送。 崎留酬’趟_親行針對半導 【實施方式】 方法^詳=；：輯本卿的铸㈣件檢職置-轉黯件檢測 如第1圖至第6 _示’本_半输件檢繼的結構包括： 201140089 裝載部100 ’用於裝载半導體器件l0;加孰板部 導體器件ω而進行加熱；測試部通，對由加⑽接收半 200傳遞至測試部刻之前，使其反轉成半導體加熱板部 反轉卸載部520，從測試部·接牛0的底面朝向上側，· ::r： 分類出半導體器件根據測試部的_果從卸載板部彻 上述褒載部100為用於裝載—個 20 ：：-!：10' 地配置有娜下称適當 圖示）移送到㈣部_，並能H的20能夠通過托盤移送部（未 (未_進行旋轉，以==多2==00之前通過托盤反轉部 並且，還能豹m、詩盤仍未取出的半導體器件ι〇。 ^ 2〇 m 600 上述托盤20能夠構成根據8 等各種結構，使·八多解雜的舰形成麵容槽2丨的結構 非W，、如—的 接觸端子的半導體器件作為檢測對象。'統LSI A其疋在底面形成有各球狀 上述加熱板部200是用於货 2〇接收半導體器件10而進行力送工具530從裝載部觸的托盤 成為通過預定的加熱相，例如=、、°彳u姆成為各種結構，能夠構 加熱到規定的溫度。 約90秒以上的加熱_將半賴器件10 201140089 如第1圖、第2圖以及第3圖所千，μ、七 - 9in j. , * ’、上述加熱板部200能夠包括：板 狀祕。P件210,在上表面形成有多個載入槽211，使得載 以及加録置，設置於板部件21〇 _部或底面 ^㈣ 溫度。在這裡，將上述铸體器件1Q加熱加$ 應力姻定的咖，即加_仏上_的^: 並:能夠與加熱裝成為一體或作為獨立的部件構成， 並月匕夠形成夕個載入槽211，使得载入半導體器件1〇。 韵邱训上述板#件210的各載入槽211為了有效地取出後述的反轉裝 載。Ρ 1〇而能夠根據測試插座311的間隔進行配置，但考慮到裝 大小，優選為根據對應於托盤2G的各收容槽21的間隔進行^置。 A取2 210的载入槽211的間隔優選為構成反轉裝載部510的 。取二511的間_ 1/2，使得能夠更有效地取出上述反魏載部训。 載部上述板部件210的各載入槽2U形成的間隔成為由反轉裝 、才δ取工具511形成的間隔的1/2時，由於能夠跳過一個地取出 裝奶的各載入槽211的半導體器件1〇，因而不需要調整反轉 裝載。Ρ 510的各拾取工具511的橫向以及縱向間隔（節距> 却^時’上述板部件210的載入槽的橫向以及縱向數量優選為反轉裝載 。 的拾取工具數量的倍數（兩倍、四倍等）。 另一方面，上述加熱板部2〇〇需要從裝載部100接收半導體器件1〇之 加熱時間以上的時間’使得穩定地達到測試溫度’由於傳遞到測試 ° ^的時間受到加熱板部200結構的影響，因而加熱板部200優選為載 入儘里多數量的半導體器件10。 芒故ί疋，隨著載入數量更多的半導體器件1〇，加熱板部200的大小變大， 、Ά成由於裝置的大小變大而導致裝置的設置空暖大的問題。 1〇因此，上述加熱板部200需要構成為能夠載入數量更多的半導體器件 置大小的同時充分確保半導體器件1〇的停留時間D。 ^ .. 弟2圖以及第3圖所示，上述加熱板部200包括能夠相互 父替移動的—對板部件21〇。 > 如第2圖所示’上述一對板部件210設置為交替移動能夠從裝載部100 201140089 $托盤20接收半件1()的 體器件10的傳遞位置。 ㈣戟1 此夠取出半導 理’裝載位置是指以連接裝载部⑽以及反轉裝載部510 661 ，（Y轴）為基準而與裝載部廳相鄰的位置 作 載部510相鄰的位置。 罝疋扣與反轉裝 ’上述加熱板部200能夠由一對板部件210相互平行地西？罢 共由==件2成，使得半_件而 隔，以免妨礙相互移動圖&不括部件210設置為沿上下隔開間 上引以及胁鶴上述板部件的線性移動^動的以 構成如上所述的加熱板部2m置222。 分維持半導體器件10的停留時間。3兄下心不增加裝置的大小而充 写件^而裝載部510能夠更容易地從加熱板部200取出半導體 益件10，因而具有顯著提高裝置的處理速度的優點。 ㈣+導體 詈的^Ϊ如第1圖及第2圖所示的結構的加熱板部200令，位於货哉7 =板# 21〇通過第—移送工具53〇從裝載部 遞位置的板部件21G通過反轉 ’ 在廷裡，板部件210通 ㈣牛導體态件10。 1〇裝載後被取出為止先〜的熱讀續加熱，直到半導體器件 &&另方面，在位於裝載位置的板部件21〇裝滿半導俨5|杜1Λ ^遞位置的板部件加清空半導體器件，一2= ^並從位 替換位來執行半導體器件ω的裝載及取出過^。對板縣加將相互交 構成四個板部件训 L轉裝载#510是用於從加熱板部2〇 至測試部300的έ士槿，沪釣A 出丰導體态件10而傳遞 種結構。i構此夠根據加熱板部咖及測試部删的結搆形成各 上述反轉裝載部5物：多個拾取工具祀，用於拾取半導雜器件 201140089 ι〇，使得能夠移送多個半導體考 取工具5U，並通過X_Y線性移= 及支撐^ ^，設置成支樓各拾 取出半導體器件10 ό I置，。χ-γ方向移動’以從加熱板部200 相互==::3。°的測試插座-的橫向及縱向間隔 橫向及縱向間隔，但能夠如“=的各拾取工具511構成為能夠調整 移送更多的半導體II件1G。圖及弟4圖所示狀橫向及縱向間隔，以 特別是，在第一移送工且53 多的半導體ϋ件H)的情況下、置為2x8而能夠移送更 為4x8。 録部510的各拾取工具511能夠配置 試：二^速進行後述的測試部-的測 件K)的底面朝向上側 體讀1G而使其進行旋轉而反轉成半導體器 支樓轉移動裝置513，該旋轉移動裝㈣使 轉而反轉成半導體器件10的底面朝= 合取+導體器件10而使其進行旋 特由半輸㈣進行電 10的多個測試插座311;—對於取^:: ’具有用於安裝半導體器件 旋轉移動部330,使-對拾取部多個半導體器件10 ; 拾取到的半導體器件1〇安裝於丁f性移動’以將被拾取部320 在這裡，器主11或從測試插座311分離。 換半導體器件10的位置，器載部510及反轉卸載部520更 拾取到的半 性測試的結構，麟^^^^溫^導體科1G進行電特 10的多個測試插座311。 13冓並匕3迠夠安裝半導體器件 上述—對拾取部320包含與反轉裝载部训對應的各拾取工具321，以 10 201140089 從反轉裝載部训接收半導體器件1〇。 =地第一移送工具53〇配置成2χ8的情況下能夠配置成柯。 合，從反轉裝載ίΐίί部、32°經過以下過程：通過旋轉及上下移動的組 導體哭件10择。f級半導體器件10，並通過旋轉及上下移動來將半 至反i卸載部520座311而進行測試之後，將半導體器件10傳遞 機制上述—對拾取部创能夠由體現旋轉及上下移動的組合的各種 包括及第4圖所示’上述測試部包括：旋轉移動部330， 動的旋轉._裝置以及使旋轉轴331進行旋轉驅 位於測試插座311的=# ，在拾取部32g #的任意一個 311 . 方夺，使拾取部32〇向下側移動而安裝於測試插座 錢拾取部320向上側移動而從測試插座311分離。 等動部撕能夠根據線性移動方式形成職起重器（咖w -部第1 _不’上述測試部300還包括只開放上側部分的 削刀二A S 50 ’使得測試讀310穩定地執行對於半導體器件10的 測试，並避免妨礙半導體器件10的移送。 筋圍內350 '、要構成為能夠在不影響測試組件310的測試環境的 觀圍内最大限度地阻止溫度變化，就㈣呈任意的結構。 的丰===部52G是用於從拾取部320接收在測試部3GG結束測試 盘;5触壯Γ ❿使其反轉之後將其傳遞至卸載板部4〇〇的結構，實質上 與反轉裝載部的結構相同，故省略詳細說明。 杜ι/上述反轉卸載部520包括：多個拾取工具521，用於拾取半導體器 t =移送多解導體雜1G;支#部，設置成支撑各拾取卫具⑵， · Y線14移動裳置沿X_Y彳向移動，以從加熱板部200取出半導體 态、:U及旋轉裝置，使多個拾取工具521 it行旋轉而反轉。 述卸載板。M00疋用於根據測試部300的測試結果在將半導體器件 11 201140089 i〇傳遞至卸载部_之前臨賴人半 板部件410與半導體器件J〇需要^ 的結構，卸載板部400的 7的板料加係獨的，不受停料1=上==時_加熱板部 ::送速度等能夠包含形成有適當數量的各載：== 另一方面，上述板部件41〇為了對經加埶 還能夠設置冷卻裝置，板部件210 A卻穿1體器件ω進行冷卻而 的部件構成。 /、7卩褒置構成為一體或作為獨立 另一方面，如第1圖及苐2圖所示，上 之間、測試部300與反轉卸载部52〇 m襄載部與測試部300 第三及第四移送卫具55G、560進行。.導體益件1〇的移送能夠通過 上过第—移送工具550拾取由反轉裝盤a 件Η)，將其移送到位於器件 =0 =側反轉的半導體器 送工具55〇從結束測試並位於器 :的拾取部31〇，第四移 ^310" 561 ^ 551 ' 561，並使各拾取工具551、561進行H置。又置成娜拾取工具州、 考慮到加熱板部200及測試部300的測試插座311>5縱 向間隔相互不同的情況，構成上述第三移送工且 ^輪向及縱 第1圖及m 構成為此夠調整橫向及縱向間隔的結構，但是如 器件10。斤不’固定橫向及縱向間隔，以能移送數量更多的半導體 移逆2慮到由上述第二移送工具550拾取的半導體器件10通過第四 ^ 55'0 Γ第:取部320取出半導體器件10之後被載入，上述第三移送 移达工具能夠相互連動地進行移動，特別是，支樓各 拾取工具55卜561的移動裝置能夠形成為一個。 州疋支樓各 上述知載部600根據測試部則的測試元件⑽的測試結果 -移送工具540對載入在卸載板部彻的半導體器件ι〇進行分類。 12 201140089 所干部_的結構與裝載部⑽類似，作為—個例子，如第i圖 t為裝辭魏餅1G 盤2G論处域2㈣自喊手動方式交 能夠:：===在裝載部觸清空的空托盤2。， 规4=1====== ^送工具 部320的各拾取工具511、52具•^移送工具以及拾取 有通f空勤來吸附半導_ 1㈣吸_=Γ。能夠構成為具 部5:=:：^^載部~載 獅叫半輸件1〇之後使 狀態Ϊ且如=娜Γ°拾取半導體器件10而成為如第6圖所示的 而移動到反=。:==送工㈣相互連動 別拾3導=移送工具550及第四移送工具娜分 ^ 320 , , 56〇 f2；：J^ ㈡、:===== 導體时1G的拾取及載人而進行移動。 4 了進订+ 為朝二==態;部32。成 移動部安裝於測試插座311 =被^料別財導體轉10藉線性 此時，朝向上側的拾取部32〇如上所述地進行半導體器件⑺的移送。 13 201140089 备加方面’如第6圖所示，接收到結束測試的半導體器件ig的反轉卸 載。P 〇在反轉之後’向卸餘部傳遞結束測試的半導體器件1〇。 具有如上結構的本發明的半導體器件檢測裝置能夠通過包括如下步驟 的檢測方法進行針對半導體器件的檢測。 即’本發明的半導體器件檢測方法包括以下步驟：器件裝載步驟，裝 固以上的托盤，在上述托盤中載入有多個半導體器件；加熱步驟，通 =-^工具料導龍件從糾裝驟的托雜收至地板而進行 轉步驟，拾取在加熱步驟加熱的半導體器件，使其反轉成半 ^體:件的底面朝向上側；測試步驟，在器件更換位置通過—對拾取部中 個來接收通過第—反轉步驟反轉的半導體器件，以藉拾取部拾取 主道從11件更換位置旋制11制試位置之後，將由拾取部拾取到的 眩坐描別裝於測試元件的測試插座而進行測試，畴藉拾取部的旋轉 “絲體讀拾取到位於11件更換位置之剩餘的拾㈣之後，接收通過第 八μ f驟反轉的半導體器件，並結束職之後將半導舰件從測試插座 :而Τ件測試位置旋轉靡件更換位置；第二反轉步驟，從拾取部接 在測=驟結束職的半導黯件，使其反轉成在被拾取雜態下朝向 ③而進彳τ移送；第-卸載步驟，將在第二反轉步驟拾取剩半導體器件 銘亡到卸触，錢第二卸齡驟’根據測試元件制試結果，通過第二 运工具對載入在卸載板部的半導體器件進行分類而載入。 =上所述的内容只不過是本發明的優選實施例的—部分而已應該指 右莖门^明的範圍不限於上述實施例，如上所述的本發_技術原理及具 寺同意義的技術思想都應視為本發明的保護範圍。 【圖式簡單說明】 第1圖是表示本發明的半導體器件檢測裝置的俯視圖； =圖疋表示第1圖的半導體器件檢測裝置的加熱板的一例的俯視圖; 第3圖是第2圖的加熱板的剖視圖；以及 第4圖至第6圖是表示第j 到反轉卸載部的動作過程的側視 圖的半導體器件檢測裝置中從反轉裝载部 圖。 14 201140089 【主要元件符號說明】 10 半導體器件 21 收容槽 200 加熱板部 211 > 411載入槽 222 線性驅動裝置 310 測試元件 320 拾取部 330 旋轉移動部 332 旋轉驅動裝置 350 測試室 510 反轉裝載部 513 旋轉移動裝置 530 第一移送工具 550 第三移送工具 600 卸載部 托盤 裝載部 、410板部件 引導部件 測試部 測試插座 、511、521、551、561 拾取工具 旋轉軸 線性移動部 卸載板部 支撐部 反轉卸載部 第二移送工具 第四移送工具201140089 VI. Description of the invention: [Technical field to which the invention belongs] The commissioner and the semi-finished (four) pieces of the prosecution are more concerned with the heating_testing temperature measurement method. The inspection of the material and the inspection of the semiconductor device [previous technique] The electrical device is used for loading ==2::piece::example] The structure includes: loading section, time up to temperature =: test: semiconductor The device is heated and the predetermined device is mounted on the test socket to execute the half; the body device: the test result of the electric semiconductor according to the test part, the semiconductor device is classified, the electric miscellaneous test is carried out, the 'unloading department' is in terms of its success, and the market competitiveness More and more fierce, semiconductor components also need to reduce the processing of the semiconductor device detection device also needs to increase the unit time and the semiconductor device detection device will set the need to pass the material "cut (four) turn low casting, material [ SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned necessity, and the detection of the negligible conductor n is improved by the 'providing' and the semiconductor device detecting method. Further, a semiconductor device detecting device of productivity is another object of the present invention to provide a mounting space for reducing the overall production of a small semiconductor device and a semiconductor device detecting method for a semiconductor device. The cost of the semiconductor device detecting device is disclosed in the Japanese Patent Application No. 201140089. The present invention provides a semiconductor cutting device device comprising: a loading portion for loading more than one tray, and a receiving piece on the top The heating plate portion 'heats from the loading portion by the first transfer tool; the reverse loading portion picks up the electrical characteristics of the semiconductor member from the heating plate portion, and measures the heating by the heating plate portion. The semiconductor device describes a plurality of semiconductor devices, and the upper-moving moving portion rotates between the upper movable portion and the device testing position, and the linear shifting and the private taking portion linearly move, so that the pick-up portion picks up the words. The conductor is separated from the test socket; the third transfer tool transfers the semiconductor and loads (4) the above-mentioned pickup portion which is more touched by the description; fourth: - turn ====== The semiconductor shape of the mm-end pick-up test is performed, and the semiconductor device that picks up the semi-guided weave is picked up. _ lower=;:=in::=^ The semiconductor device loaded in the unloading plate portion is classified and loaded by ίίΓϊΓί . Into the fruit, used to place the semiconductor n-piece domain _ test temperature ^ on the upper 34 plate parts _ part or the bottom surface, should: =: === socket spacing _ with each manned slot separation for the composition Each of the heating plate portions of the warfare device includes a pair of plate members that are alternately movable. Move for the ground. (4) Cattle (4) Please pass the _ set between the above-mentioned pair of plate members are arranged to be spaced apart from each other so as not to hinder mutual movement, the plate portion 201140089 plate member = ^ = = ^ _ butterfly (9) object drive linear Move (4) TM over χ γ to perform rotation n: r ===:=__ The bottom surface of the device faces the upper side. The swivel reads and rotates and reversals into a plurality of semiconductors == two pick-up tools for picking up the semiconductor device to transfer the cattle conductors, and the branch portion, which is arranged to support the above pickers and is linear Moving in the χ_γ direction to carry the semiconductor device to the upper _ plate. • The rotation of the carrier portion further includes a rotary moving device that causes the lower side of the branch portion. The conductors 11 are rotated and rotated to reverse the bottom surface of the conductor device toward the third. The transfer tool and the fourth transfer aid are connected to each other by a mobile device, and provide a semiconductor inspection method for the 11 pieces, including the following steps: 11 loading step bombs, the upper tray, carrying the tray in the tray a plurality of semiconductor devices; the stepping device receives the semiconductor device from the tray of the loading step of the device, and the step of inverting, and, in the step of inverting, picking up the semiconductor device heated in the heating step, - on it The bottom surface of the body member faces the upper side; the test step, at the device replacement position, receives the state picked up by the semiconductor device I pickup portion reversed by the first inversion step, and rotates from the device replacement position to the device Test position=ΐίί The semiconductor device picked up by the pick-up unit is mounted on the test element_test socket to perform n while the semiconductor device is picked up by the rotation of the pick-up portion, and the reception is reversed by the first inversion step == Thereafter, the semiconductor device is separated from the test socket and rotated from the device test position; the "reverse step is received from the pick-up portion The test step 2 /, 'the semiconductor pure, reversed to the lower side of the picked up state and transferred; 201140089 The second reverse step of the semiconductor 11 picked up loaded and loaded and The fee is charged in the test result of the upper side test component, and is loaded by the semiconductor device of the unloading plate portion by the second transfer carrier. a plurality of pick-up tools for picking up the semiconductor device to transfer the moving device to move the pick-up tool along the χ-γ direction and to pass the support portion to the conductor device through the χ-γ linear moving device; The rotation is rotated to be reversed into half of each conductor device t bottom: 1 upper upper 7 hot plate portion picks up the semiconductor device and the reverse reverse unloading portion includes a plurality of pick-up tools, and the bottom surface of the semiconductor device faces downward.疋 Taking ''conductor benefits' and rotating it to reverse the point ·= Ming conductor device detection and semiconductor device detection method have the following advantages and are separated from the test socket, so that not only can test, but also reduce the device the size of. The t-sub-conductor reads the lower retention time of the device detection device and the semiconductor _^ thermal semiconductor device. Qing increased the size of the device and fully maintained the transfer from the (four)-to-board components and body devices.崎留留'趟 亲 亲 亲 亲 亲 亲 亲 亲 亲 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The structure of the device inspection includes: 201140089 The loading portion 100' is used to load the semiconductor device 10; the heating device ω is applied to heat the heating device; the test portion is turned on, and the test portion is passed to the test portion before being fed by the (10) receiving half 200. This is reversed to the semiconductor heating plate portion reverse unloading portion 520, and is directed from the bottom surface of the test portion to the ox 0, and ::r: the semiconductor device is classified according to the test portion, and the load portion is removed from the unloading plate portion. 100 is used for loading - 20: ::-!: 10' is arranged with a suitable icon) and transferred to (4) _, and H can be passed through the tray transfer unit (not (not _ rotated, ==Multiple 2==00 before passing through the tray reversing section and also the semiconductor device ι〇, which is still not taken out of the poem. ^ 2〇m 600 The above tray 20 can be constructed according to various structures such as 8 The structure of the multi-disintegrated ship forming the surface groove 2丨 is not W, and the semiconductor device of the contact terminal such as the The LSI A is formed with a spherical shape on the bottom surface. The heating plate portion 200 is for receiving the semiconductor device 10, and the tray for the force feeding tool 530 to be touched from the loading portion passes through a predetermined heating phase, for example. =,, °彳u m is a variety of structures, can be heated to a predetermined temperature. Heating for about 90 seconds or more _ will be half of the device 10 201140089 as shown in Figure 1, Figure 2 and Figure 3, μ, seven - 9in j. , * ', the above-described heating plate portion 200 can include: a plate-shaped secret. The P-piece 210 has a plurality of loading grooves 211 formed on the upper surface thereof so as to be loaded and placed, and disposed on the plate member 21〇_ The temperature of the part or the bottom surface (4). Here, the above-mentioned casting device 1Q is heated and added to the stress of the coffee, that is, it is added to the heating device or as a separate component, and The moon 匕 形成 形成 载入 载入 211 211 211 211 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 载入 半导体 半导体 半导体 半导体 半导体 半导体 半导体The interval of the socket 311 is configured, but in consideration of the size of the package, it is preferably according to the corresponding The interval between the storage grooves 21 of the tray 2G is set. The interval between the loading grooves 211 of the A 2 210 is preferably such that the reverse loading portion 510 is formed. The interval _ 1/2 of the two 511 is taken, so that the interval can be taken more efficiently. When the interval formed by each of the loading grooves 2U of the plate member 210 of the carrier portion is 1/2 of the interval formed by the reverse mounting and the tool 511, the device can be taken out one by one. The semiconductor device 1 of each of the loading grooves 211 of the milk does not need to adjust the reverse loading. The lateral and longitudinal intervals of the respective pick-up tools 511 of the 510 are (pitch > The lateral and longitudinal numbers are preferably reverse loaded. Multiples of the number of pick tools (twice, quadruple, etc.). On the other hand, the above-described heating plate portion 2 needs to receive the time "from the loading portion 100 for more than the heating time of the semiconductor device 1 so that the test temperature is stably reached" due to the structure of the heating plate portion 200 due to the time of transmission to the test portion ^. The effect, and thus the heating plate portion 200, is preferably a loading of a large number of semiconductor devices 10. As the semiconductor device is loaded in a larger number, the size of the heating plate portion 200 becomes larger, and the size of the device becomes larger, which causes a problem that the installation of the device is large. 1. Therefore, the above-described heating plate portion 200 needs to be configured to be able to load a larger number of semiconductor devices while sufficiently securing the residence time D of the semiconductor device 1?. As shown in Fig. 2 and Fig. 3, the above-described heating plate portion 200 includes a pair of plate members 21 that are movable with each other. > As shown in Fig. 2, the pair of plate members 210 are arranged to alternately move the transfer position of the body member 10 capable of receiving the half piece 1() from the loading unit 100 201140089 $tray 20. (4) 戟1 This is enough to take out the semi-guided 'loading position', which is adjacent to the loading portion 510 by the connection loading portion (10) and the reverse loading portion 510 661 (Y-axis). position. Snap and reverse mounting The above-described heating plate portion 200 can be parallel to each other by a pair of plate members 210. The total number of parts is 2, so that the pieces are separated by half, so as not to hinder the mutual movement of the figure & the non-arranged part 210 is arranged to be arranged along the upper and lower partitions and the linear movement of the above-mentioned plate parts of the crane. The heating plate portion 2m as described above is placed 222. The residence time of the semiconductor device 10 is maintained. The 3 brothers can add the components without increasing the size of the device, and the loading portion 510 can more easily take out the semiconductor package 10 from the heating plate portion 200, thereby having an advantage of significantly increasing the processing speed of the device. (4) The +-conductor Ϊ Ϊ Ϊ Ϊ Ϊ 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热21G through the reversal 'in the Tingri, the plate member 210 passes (four) the cattle conductor state piece 10. 1〇 After the loading is taken out, the hot reading is continued until the semiconductor device &&>, in the plate member 21 at the loading position, the plate member 21 is filled with a semi-conducting 俨5| The semiconductor device is emptied, and a 2=^ and bit replacement bit is used to perform loading and unloading of the semiconductor device ω. The board and the county will be intertwined to form four board parts. The L-loading #510 is used for the gentleman's 从 from the heating plate part 2〇 to the test part 300, and the Shanghai fishing A is a conductor element 10 and transmits the seed structure. . According to the structure of the heating plate portion and the test portion, each of the reverse loading portions 5 is formed: a plurality of picking tools 拾 for picking up the semiconductor device 201140089 〇, so that a plurality of semiconductor testing tools can be transferred. 5U, and through X_Y linear shift = and support ^ ^, set up the branch to pick up the semiconductor device 10 ό I set. The χ-γ direction shifts 'from the heating plate portion 200 to each other ==::3. The test socket of the ° is laterally and longitudinally spaced apart from the lateral and longitudinal intervals, but each of the pick-up tools 511 such as "= can be configured to be able to adjust the transfer of more semiconductors 1G 1G. The horizontal and vertical intervals are shown in the figure and the figure 4 In particular, in the case of the first transfer tool and more than 53 semiconductor elements H), it is possible to transfer 4x8 to 2x8. Each pickup tool 511 of the recording unit 510 can be configured to test: The bottom surface of the test piece K of the test portion is read 1G toward the upper body and rotated to be inverted into the semiconductor branch rotating device 513, which is reversed to the bottom surface of the semiconductor device 10 A plurality of test sockets 311 that are electrically connected to the conductor device 10 by a half-transmission (four); for the mounting of the semiconductor device rotation-moving portion 330, the --pair pickup a plurality of semiconductor devices 10; the picked-up semiconductor device 1 is mounted on the "moving" to separate the picked-up portion 320, the main body 11 or the test socket 311. The position of the semiconductor device 10, the carrier portion 510 and reverse unloading unit 520 pick up The structure of the semi-tested test, Lin ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Each of the pick-up tools 321 corresponding to the ministry receives the semiconductor device 1 from the reverse loading section at 10 201140089. = When the first transfer tool 53 is configured to be 2 χ 8 , it can be configured to be com. The portion 32° passes through the following process: the group conductors 10 are rotated and moved up and down. The f-level semiconductor device 10 is tested by rotating and moving up and down to the half-to-reverse unloading portion 520. Transmission Mechanism of Semiconductor Device 10 As described above, various combinations including the combination of rotation and up and down movement are included in the pickup portion, and the above-described test portion includes the rotary movement portion 330, the rotary motion device, and the rotation shaft. 331 is rotated to drive the =# located in the test socket 311, and any one of the pick-up portions 32g# is moved to the lower side of the pick-up portion 32, and is attached to the test socket. The money picking portion 320 is moved upward from the test. The socket 311 is separated. The equal-moving part tearing can form a job lifter according to the linear movement mode (the coffee w-part 1st_not] the above test part 300 further includes the upper knife-only cutter 50 AS 50 to make the test read 310 stable Performing tests on the semiconductor device 10 and avoiding impeding the transfer of the semiconductor device 10. Within the ribs 350', it is configured to minimize temperature variations within the scope of the test environment that does not affect the test component 310, (4) an arbitrary structure. The abundance === portion 52G is for receiving from the pickup unit 320 at the end of the test portion 3GG to test the disc; after the 5 touches the ❿ ❿ to reverse it, it is transmitted to the unloading plate portion 4 The structure is substantially the same as the structure of the reverse loading unit, and detailed description thereof will be omitted. The Duo/the above-described reverse unloading section 520 includes: a plurality of pick-up tools 521 for picking up the semiconductor device t=transferring the multi-decomposing conductor miscellaneous 1G; the branching section is arranged to support each of the pick-up guards (2), · the Y-line 14 is moving Moving in the X_Y direction, the semiconductor state, U, and the rotating device are taken out from the heating plate portion 200, and the plurality of picking tools 521 are rotated and inverted. Unload the board. M00疋 is used to transfer the semiconductor device 11 201140089 i〇 to the unloading unit _ according to the test result of the test portion 300, and the structure of the unloading plate portion 410 and the semiconductor device J 〇 If the material is added separately, it is not subject to the stoppage 1 = upper == _ heating plate section:: the delivery speed, etc. can include the formation of an appropriate number of loads: == On the other hand, the above-mentioned plate member 41〇 is added The crucible can also be provided with a cooling device, and the plate member 210A is configured by a member that is cooled by the one-body device ω. The /, 7 is configured as a single body or as an independent side. As shown in Figs. 1 and 2, the upper portion, the test portion 300, the reverse unloading portion 52〇m, the load portion and the test portion 300 The third and fourth transfer guards were carried out at 55G and 560. The transfer of the conductor piece 1 能够 can be picked up by the over-feeding tool 550 by the reverse loading plate a), and transferred to the semiconductor device feeding tool 55 located at the device=0=side inversion. The pick-up portion 31 is located at the pick-up portion of the device: the fourth shift is ^310 & 561 551 '561, and the pick-up tools 551, 561 are placed H. Further, in the case of the pickup tool state, the test socket 311 > 5 of the heating plate unit 200 and the test unit 300 is different from each other, and the third transfer worker is configured, and the wheel direction and the vertical pattern 1 and m are configured as This is sufficient to adjust the lateral and longitudinal spacing of the structure, but as in device 10. Do not 'fix the lateral and longitudinal spacing to be able to transfer a larger number of semiconductors. 2 Consider that the semiconductor device 10 picked up by the second transfer tool 550 removes the semiconductor device through the fourth portion: the portion 320. After 10 is loaded, the third transfer transfer tool can be moved in conjunction with each other. In particular, the mobile device of each of the pick-up tools 55 561 of the branch building can be formed into one. Each of the above-described knowledge carrying units 600 sorts the semiconductor devices ι loaded in the unloading plate portion according to the test result of the test element (10) of the test portion. 12 201140089 The structure of the cadre _ is similar to that of the loading department (10). As an example, as the i-th picture t is the slogan Wei cake 1G disk 2G on the field 2 (four) self-calling manual mode can be::=== at the loading part Empty empty tray 2. , 4=1====== ^ Each of the picking tools 511, 52 of the tooling unit 320 has a transfer tool and a pick-up air to absorb the semiconductor _ 1 (four) suction _ = Γ. It can be configured as a pedestal 5:=::^^ carrier-loaded lion called a half-transfer 1 使 and then the state Ϊ and as the Γ Γ ° picks up the semiconductor device 10 and moves to the opposite as shown in Fig. 6 =. :== delivery (four) interlocking with each other, do not pick up 3 guides = transfer tool 550 and fourth transfer tool Na points ^ 320 , , 56〇f2;: J^ (2), :===== 1G pick and carry people And move. 4 has entered the order + for the second == state; the department 32. The moving portion is attached to the test socket 311 = the wire is turned by the wire. At this time, the pickup portion 32 of the upper side performs the transfer of the semiconductor device (7) as described above. 13 201140089 Additional aspect As shown in Fig. 6, the reverse loading of the semiconductor device ig that has finished the test is received. P 〇 After the inversion, the semiconductor device 1 结束 ending the test is delivered to the unloading portion. The semiconductor device detecting apparatus of the present invention having the above structure can perform detection for a semiconductor device by a detecting method including the following steps. That is, the semiconductor device detecting method of the present invention includes the following steps: a device loading step of mounting the above tray, loading a plurality of semiconductor devices in the tray; heating step, heating =-^ tool material guide member from the fitting The step of transferring the substrate to the floor and performing the transferring step, picking up the semiconductor device heated in the heating step, and inverting it into a half body: the bottom surface of the member faces the upper side; the test step passes at the device replacement position - the middle of the picking portion To receive the semiconductor device reversed by the first-reversal step, and to test the glare of the test component by the pick-up portion after the pick-up portion picks up the main track and spins the test position from the 11-piece replacement position. The socket is tested, and the domain borrows the rotation of the pickup portion. After the silk body is read and picked up to the remaining pickup (four) at the 11-piece replacement position, the semiconductor device that is inverted by the eighth μ f is received, and the semi-guide ship is terminated after the end of the work. The piece is from the test socket: and the piece test position is rotated to rotate the piece replacement position; the second reverse step is to connect the semi-conductive piece from the picking part to the end of the test, and reverse it to be picked up. The lower direction is 3 and the 彳τ is transferred; the first-unloading step is to pick up the remaining semiconductor device in the second inversion step and sneak into the unloading, and the second second squeezing step is based on the test component test result and the second transport tool. The semiconductor device loaded in the unloading plate portion is sorted and loaded. The above description is only a part of the preferred embodiment of the present invention, and the range of the right stem door is not limited to the above embodiment. The technical principle of the present invention and the technical idea of the same meaning as described above should be regarded as the protection scope of the present invention. [Simplified description of the drawings] Fig. 1 is a plan view showing the semiconductor device detecting device of the present invention;疋 is a plan view showing an example of a heating plate of the semiconductor device detecting device of Fig. 1; Fig. 3 is a cross-sectional view of the heating plate of Fig. 2; and Figs. 4 to 6 are views showing the operation of the jth to reverse unloading portion In the semiconductor device detecting device of the side view of the process, the reverse loading portion is shown in Fig. 14 201140089 [Description of main components] 10 semiconductor device 21 housing groove 200 heating plate portion 211 > 411 loading slot 222 Driving device 310 Test element 320 Picking portion 330 Rotating moving portion 332 Rotating driving device 350 Test chamber 510 Reverse loading portion 513 Rotating moving device 530 First transfer tool 550 Third transfer tool 600 Unloading portion Pallet loading portion, 410 plate member guiding Component test part test socket, 511, 521, 551, 561 picking tool rotation axis linear movement part unloading plate part support part reverse unloading part second transfer tool fourth transfer tool