KR101169406B1 - Test Handler for semiconductor device, and inpection method for semiconductor device - Google Patents

Abstract

In accordance with another aspect of the present invention, an apparatus for inspecting a semiconductor device includes: a loading unit configured to load semiconductor devices; A heating plate unit for receiving and heating the semiconductor elements from the loading unit; A test unit for testing electrical characteristics of the semiconductor elements heated in the heating plate unit; An inverting loading unit for inverting the bottom of the semiconductor devices to face upwards before transferring the semiconductor devices from the heating plate unit to the test unit; An inversion unloading unit which receives the semiconductor elements from the test unit and inverts the bottom surfaces of the semiconductor elements to face downwards; An unloading plate part which receives the semiconductor elements from the inverse unloading part and is loaded; And an unloading unit configured to classify and load semiconductor devices according to test results of the test unit from the unloading plate unit.

Description

Test device for semiconductor device and method for testing semiconductor device {Test Handler for semiconductor device, and inpection method for semiconductor device}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection device, and more particularly, to a semiconductor device inspection device and a semiconductor device inspection method for inspecting electrical characteristics of a semiconductor device after heating to a test temperature.

After the semiconductor device has been packaged, the semiconductor device is subjected to various inspections such as electrical property, reliability of heat or pressure by a semiconductor device inspection device.

As an example of a conventional semiconductor device inspection apparatus, a loading unit in which a plurality of semiconductor devices are loaded; A heating plate which receives the semiconductor elements from the loading unit and heats them to a temperature for a test for a predetermined time; A test unit configured to test the semiconductor devices such as electrical characteristics after mounting the semiconductor devices heated in the heating plate to the test socket; And an unloading unit for classifying the semiconductor devices according to the test result of the test unit.

On the other hand, as semiconductor devices are fiercely competitive in the market, cost reduction is urgently required.

Therefore, the semiconductor device inspection apparatus having the above configuration also needs to increase productivity by increasing the processing speed per unit time.

In addition, since the semiconductor device inspection apparatus is installed in a clean room that maintains a clean environment, it is necessary to reduce the overall production cost of the semiconductor device by reducing the space occupied by the device.

Disclosure of Invention An object of the present invention is to provide a semiconductor device inspection apparatus and a semiconductor device inspection method capable of improving productivity by improving an inspection speed of a semiconductor device in consideration of the necessity as described above.

Another object of the present invention is to provide a semiconductor device inspection apparatus and a semiconductor device inspection method that can reduce the overall production cost of the semiconductor device by reducing the installation space of the semiconductor device inspection device.

The present invention has been made to achieve the object of the present invention as described above, the present invention includes a loading unit is loaded with one or more trays are loaded with a plurality of semiconductor devices; A heating plate unit configured to heat the semiconductor element from the tray of the loading unit by receiving the semiconductor element through a first transfer tool; An inverting loading unit which picks up the semiconductor elements from the heating plate unit and inverts the bottom surfaces of the semiconductor elements to face upwards; A test module having test sockets each semiconductor device is mounted to inspect electrical characteristics of the semiconductor devices heated in the heating plate part, a pair of pickup parts for picking up a plurality of semiconductor devices, and a pair of A rotational movement portion for rotating the pickup portions between the element exchange position and the element test position, and a linear movement portion for linearly moving the pickup portion to mount or detach the semiconductor elements picked up in the pickup portion to the test socket; A test unit to perform; A third transfer tool for transferring semiconductor elements from the inverted loading portion to the pickup portion located at the element exchange position, and a fourth transfer tool for picking up tested semiconductor elements from the pickup portion positioned at the element exchange position; ; A reverse unloading unit configured to receive the semiconductor elements from the fourth transfer tool and invert them to face downwards in a picked up state; An unloading plate part on which semiconductor elements picked up by the inverted unloading part are loaded; Disclosed is a semiconductor device inspection apparatus comprising: an unloading unit configured to classify and load semiconductor devices loaded on the unloading plate unit according to a result of the test module through a second transfer tool.

The heating plate part includes a plate-shaped plate member having a plurality of loading grooves formed on an upper surface thereof so that the semiconductor elements can be loaded, and a heating device installed on the inner or bottom surface of the plate member to heat the semiconductor elements to a predetermined test temperature. Can be configured.

Loading grooves of the plate member may be arranged in accordance with the interval of the test sockets, or may be arranged in accordance with the interval corresponding to the interval of the receiving grooves of the tray.

The loading grooves of the plate member may form one half of the interval of the pickup tools forming the reverse loading portion.

The heating plate portion may include a pair of plate members that can be moved alternately with each other.

The pair of plate members may be installed to alternately move a loading position capable of receiving semiconductor elements from the tray of the loading part and a transfer position capable of drawing the semiconductor element from the reverse loading part.

The pair of plate members are installed at intervals up and down so as not to interfere with each other, one or more guide members for guiding the linear movement of the plate member and a linear driving device for driving the linear movement of the plate member. can do.

The reverse loading unit is provided with a plurality of pickup tools for picking up each semiconductor element so as to transfer a plurality of semiconductor elements, and the pickup tools are supported and installed by an XY linear transfer device to draw out the semiconductor elements from the heating plate unit. It may include a support that is moved in the XY direction.

The reverse loading unit may further include a rotation moving device for rotating the support unit to pick up the semiconductor elements from the heating plate unit and rotate the inverted side so that the bottoms of the semiconductor elements face upward.

The reverse unloading unit is provided with a plurality of pickup tools for picking up each semiconductor element so as to transfer a plurality of semiconductor elements, and the pickup tools are supported and installed in an XY linear transfer device to load the semiconductor elements into the unloading plate unit. It may include a support that is moved in the XY direction.

The reverse unloading unit may further include a rotational movement device for rotating the support unit to pick up the semiconductor devices and rotate the bottom surfaces of the semiconductor devices to rotate downward.

The third transfer tool and the fourth transfer tool may be configured to move in association with each other through one moving device.

The present invention also provides a device loading step of loading one or more trays loaded with a plurality of semiconductor devices; A heating step of receiving and heating the semiconductor elements from the tray to the heating plate part through a first transfer tool in the loading step; A first inversion step of picking up the semiconductor devices heated in the heating step and inverting the bottom surfaces of the semiconductor devices to face upwards; The semiconductor devices inverted by the first inversion step are received by any one of the pair of pickups at the element exchange position, and rotated from the element exchange position to the element test position in the state of being picked up by the pickup portion. The semiconductor devices picked up by the pickup unit are mounted on the test sockets of the test module, and the semiconductor device is picked up by the first inversion step after picking up the semiconductor devices in the pickup unit which are located at the element replacement position by the rotation of the pickup unit. A test step of receiving the inverted semiconductor devices, after completing the test, separating the semiconductor devices into the test sockets and rotating them from the device test position to the device exchange position; A second inverting step of receiving the tested semiconductor devices from the pickup unit in the test step and inverting the picked-up semiconductor device to face downward; An unloading step of loading the semiconductor elements picked up in the second inversion step into an unloading plate; According to a test result of the test module is disclosed a semiconductor device inspection method comprising the step of classifying and loading the semiconductor devices loaded on the unloading plate portion through a second transfer tool.

The reverse loading unit includes a plurality of pick-up tools for picking up each semiconductor element to transfer a plurality of semiconductor elements, and an XY linear transfer device to support the pick-up tools and to draw the semiconductor elements from the heating plate unit. And a support for moving in the XY direction, and a rotating device for rotating the support to pick up the semiconductor devices from the heating plate and to rotate the bottom surface of the semiconductor devices upward.

The inverse unloading unit includes a plurality of pick-up tools for picking up each semiconductor element to transfer a plurality of semiconductor elements, and the pick-up tools are supported and installed in the XY linear transfer device to load the semiconductor elements into the unloading plate unit. And a support for moving in the XY direction, and a rotation moving device for rotating the support to pick up the semiconductor devices and rotate the inverted side so that the bottom of the semiconductor devices faces downward.

In the semiconductor device inspection apparatus and the semiconductor device inspection method according to the present invention, the semiconductor device inspection method and the semiconductor device inspection method are picked up by a pair of pick-up units, and the pick-up units are alternately rotated so as to be mounted on and detached from the test socket, so that testing of the semiconductor devices is performed more quickly. Not only can this be done, but the size of the device can be reduced.

In addition, the semiconductor device inspection apparatus and the semiconductor device inspection method according to the present invention comprises a pair of plate members which alternately move the heating plate portion for heating the semiconductor elements before the test, without increasing the size of the device There is an advantage that can sufficiently maintain the residence time for heating of the.

In particular, by arranging two or more of the pair of plate members in parallel with each other, it is possible to sufficiently achieve a residence time sufficient for heating the semiconductor devices, and there is an advantage that the transfer to the semiconductor devices can be performed quickly.

1 is a plan view showing a semiconductor device inspection apparatus according to the present invention.
FIG. 2 is a plan view illustrating an example of a heating plate unit of the semiconductor device inspecting apparatus of FIG. 1.
3 is a cross-sectional view of the heating plate of FIG. 2.
4 to 6 are side views illustrating an operation process from the inversion loading unit to the inversion unloading unit in the semiconductor device inspection apparatus of FIG. 1.

Hereinafter, a semiconductor device inspection apparatus and a semiconductor device inspection method according to the present invention will be described in detail with reference to the accompanying drawings.

1 to 6, the semiconductor device inspection apparatus according to the present invention includes a loading unit 100 for loading the semiconductor devices 10; A heating plate unit 200 receiving and heating the semiconductor elements 10 from the loading unit 100; A test unit 300 for testing electrical characteristics of the semiconductor devices 10 heated by the heating plate unit 200; An inversion loading unit 510 for inverting the bottom surfaces of the semiconductor devices 10 to the upper side before transferring the semiconductor devices 10 from the heating plate unit 200 to the test unit 300; An inversion unloading unit 520 which receives the semiconductor devices 10 from the test unit 300 and inverts the bottom surfaces of the semiconductor devices 10 to face downwards; An unloading plate part 400 which receives the semiconductor elements 10 from the inversion unloading part 520 and is loaded; The unloading plate unit 400 includes an unloading unit 600 that classifies and stacks the semiconductor devices 10 according to the test result of the test unit 300.

The loading unit 100 is a configuration in which one or more trays 20 in which a plurality of semiconductor devices 10 are loaded are loaded, and various configurations are possible according to design and design.

For example, as shown in FIG. 1, the loading unit 100 includes a plurality of trays 20 properly disposed so that the first transfer tool 530 may pick up and transfer the semiconductor device 10 without interruption. The tray 20 in which the semiconductor devices 10 are empty may be configured to be replaced with the tray 20 in which the semiconductor devices 10 are filled. Here, the tray 20 may be automatically transferred to a position where the first transfer tool 530 may withdraw the semiconductor device 10 after a predetermined bundle of trays 20 are manually or automatically loaded.

In this case, the empty tray 20 from which the semiconductor devices 10 are drawn out may be transferred to the unloading unit 600 by a tray transfer unit (not shown), and before the tray 20 is transferred to the unloading unit 600. It may be rotated in the tray inverting portion (not shown) to remove the semiconductor device 10 that is not drawn out therein.

In addition, a tray buffer unit (not shown) may be additionally installed between the loading unit 100 and the unloading unit 600 in which the empty tray 20 may be temporarily loaded.

The tray 20 may be configured in various ways such that the receiving grooves 21 are formed according to a predetermined standard such as 8 × 16 so that a plurality of semiconductor devices 10 may be loaded.

The semiconductor device 10 to be inspected may be a memory semiconductor or a non-memory semiconductor such as a system LSI. In particular, the inspection object is preferably a system LSI, particularly a semiconductor device in which ball-type contact terminals are formed on the bottom thereof.

The heating plate 200 is configured to receive and heat the semiconductor devices 10 from the tray 20 of the loading unit 100 through the first transfer tool 530, and may be configured in various ways. 10) can be configured to heat to a constant temperature through a predetermined heating time, for example a heating time of about 90 seconds or more.

As shown in FIGS. 1, 2, and 3, the heating plate part 200 has a plate-like plate member 210 having a plurality of loading grooves 211 formed on an upper surface thereof so that the semiconductor devices 10 may be loaded. And a heating device installed inside or at the bottom of the plate member 210 to heat the semiconductor devices 10 to a predetermined test temperature. In this case, the semiconductor device 10 is heated through a predetermined time, that is, a time for heating time or more, when heating to a test temperature in consideration of thermal shock due to heating.

The plate member 210 may be configured integrally with the heating device or as a separate member, and a plurality of loading grooves 211 may be formed for loading the semiconductor device 10.

And the loading grooves 211 of the plate member 210 may be arranged in accordance with the interval of the test socket 311 for efficient withdrawal of the reverse loading unit 510 which will be described later, in consideration of the size of the entire apparatus tray ( It is preferable to be disposed in accordance with the interval corresponding to the interval of the receiving grooves 21 of 20).

Furthermore, in order for the reverse loading unit 510 to be withdrawn more efficiently, the interval of the loading groove 211 of the plate member 210 is 1 / time of the interval of the pickup tools 511 constituting the reverse loading unit 510. 2 is preferred.

Here, when the spacing between the loading grooves 211 of the plate member 210 is 1/2 of the spacing between the pick-up tools 511 of the reverse loading unit 510, the loading grooves 211 of the plate member 210 are formed. Since the semiconductor devices 10 loaded in the filter device may be taken out one by one, the horizontal and vertical intervals (pitch) of the pick-up tools 511 of the inverted loading part 510 may be eliminated.

At this time, the number of transverse and longitudinal directions of the loading groove of the plate member 210 is preferably made of multiples (2 times, 4 times, etc.) of the number of the pickup tool of the reverse loading unit 510.

On the other hand, the heating plate 200 receives the semiconductor elements 10 from the loading unit 100 and needs to stay for a heating time or more to reach the test temperature stably, according to the configuration of the test unit 300 Since it affects the time to be delivered to), it is preferable that the heating plate 200 is loaded with as many semiconductor elements 10 as possible.

However, as a larger number of semiconductor devices 10 are loaded, the size of the heating plate 200 increases, resulting in an increase in the size of the device, thereby increasing the installation space of the device.

Therefore, the heating plate 200 needs to be configured to be able to load a larger number of semiconductor devices 10 so as to secure a sufficient residence time of the semiconductor device 10 without increasing the size of the device. .

As shown in FIGS. 1, 2, and 3, the heating plate part 200 may include a pair of plate members 210 that may be moved alternately with each other.

As shown in FIG. 2, the pair of plate members 210 may have a loading position and a reverse loading unit 510 for receiving the semiconductor elements 10 from the tray 20 of the loading unit 100. It is installed to alternately move the transfer position that can take out the element 10.

Here, the loading position means a position adjacent to the loading unit 100 on the basis of the copper wire (Y axis) connecting the loading unit 100 and the reverse loading unit 510, and the transfer position is the reverse loading unit 510. It means the position adjacent to.

In particular, the heating plate 200 may be composed of a total of four plate members 210 are arranged in parallel with the pair of plate members 210 so that the semiconductor elements 10 can stay for a sufficient heating time. .

Meanwhile, as shown in FIG. 3, the pair of plate members 210 may be installed at intervals up and down so as not to interfere with each other, and at least one guide member for guiding linear movement of the plate member 210. 221 and the linear driving device 222 for driving the linear movement of the plate member 210 can be configured.

When the heating plate 200 is configured as described above, the residence time of the semiconductor elements 10 may be sufficiently maintained without increasing the size of the device.

Furthermore, since the inversion loading unit 510 draws out the semiconductor elements 10 from the heating plate unit 200 more easily, there is an advantage in that the processing speed of the device can be significantly increased.

In the heating plate portion 200 having the configuration as shown in FIGS. 1 and 2, the plate members 210 located at the loading positions of the semiconductor elements 10 may be formed by the semiconductor elements 10 from the loading portion 100. 1, the semiconductor device 10 is drawn out by the reverse loading unit 510 is loaded by the transfer tool 530, and at the same time the plate member 210 located in the transfer position. Here, the plate member 210 is heated continuously by applying a predetermined heat until the semiconductor elements 10 are withdrawn after loading.

On the other hand, when the semiconductor elements 10 are filled in the plate member 210 positioned in the loading position, and the semiconductor elements 10 are emptied from the plate member 210 positioned in the transfer position, the pair of plate members 210 Alternating positions are alternately performed to load and withdraw the semiconductor device 10.

In particular, when the pair of plate members 210 are arranged in parallel to each other and constitute a total of four plate members 210, the loading and withdrawal of the semiconductor elements 10 can be seamlessly performed without increasing the size of the device. The speed of inspection on (10) can be significantly increased.

The inverted loading unit 510 is a configuration for drawing the semiconductor elements 10 from the heating plate unit 200 and transferring the semiconductor elements 10 to the test unit 300 according to the configuration of the heating plate unit 200 and the test unit 300. Various configurations are possible.

The reverse loading unit 510 is installed to support a plurality of pickup tools 511 and pickup tools 511 for picking up each semiconductor element 10 so as to transfer the plurality of semiconductor elements 10. It may be configured to include a support portion 512 to be moved in the XY direction by the XY linear transfer device to withdraw the semiconductor elements 10 from the (200).

The pick-up tools 511 of the inverted loading unit 510 adjust horizontal and vertical spacing in consideration of the case where the horizontal and vertical spacing of the heating plate 200 and the test socket 311 of the test unit 300 are different from each other. This may be configured to be possible, but as shown in FIGS. 1 and 4, horizontal and vertical spacings may be fixed to allow the transfer of a larger number of semiconductor devices 10.

In particular, when the pick-up tools of the first transfer tool 530 are arranged at 2 × 8, the pick-up tools 511 of the inverted loading unit 510 may be 4 × 8 so as to enable the transfer of a larger number of semiconductor devices 10. It can be arranged as.

Meanwhile, the reverse loading unit 510 picks up the semiconductor devices 10 from the heating plate unit 200 and then rotates the bottom surfaces of the semiconductor devices 10 upward to quickly test the test unit 300 to be described later. Can be configured to invert.

The inversion loading part 510 rotates the support part 512 to pick up the semiconductor devices 10 from the heating plate part 200 and to rotate the bottom surface of the semiconductor devices 10 upward to invert them. The device 513 may further include.

The test unit 300 is a component for inspecting electrical characteristics of the semiconductor devices 10 heated by the heating plate unit 200. The test unit 300 includes a plurality of test sockets 311 in which the semiconductor devices 10 are mounted. The branch has a test module 310, a pair of pickups 320 for picking up a plurality of semiconductor elements 10, and a rotation to rotate the pair of pickups 320 between the element replacement position and the device test position The linear moving part 340 which linearly moves the pickup part 320 to mount or detach the moving part 330 and the semiconductor device 10 picked up by the pickup part 320 in the test socket 311 is provided. It can be configured to include.

Here, the device exchange position refers to a position where the reverse loading unit 510 and the reverse unloading unit 520 and the semiconductor device 10 can be exchanged, and the device test position is the semiconductor device 10 picked up by the pickup unit 320. ) Refers to a position where the test socket 311 can be mounted or removed.

The test module 310 is configured to test electrical characteristics of the semiconductor device 10 heated to a test temperature, and various configurations are possible according to a test, and a plurality of tests on which the semiconductor devices 10 may be mounted. It comprises a socket 311.

The pair of pickup units 320 may include pickup tools 321 corresponding to the reverse loading unit 510 to receive the semiconductor elements 10 from the reverse loading unit 510.

The pickup tools 321 of the pair of pickup units 320 may be arranged in various forms, and in the case where the first transfer tool 530 is 2 × 8 corresponding to the test socket 311, 4 × 8 It can be arranged as.

Meanwhile, the pickup unit 320 receives the semiconductor devices 10 from the inversion loading unit 510 by a combination of rotation and shanghai, and transfers the semiconductor devices 10 to the test socket 311 by rotation and shanghai. After insertion and testing, the semiconductor devices 10 are transferred to the inverse unloading unit 520.

Therefore, the pair of pickup units 320 may be driven by various mechanisms for implementing a combination of rotation and shankdong.

For example, as illustrated in FIGS. 1 and 4, the test unit 300 rotates the rotary shaft 331 and the rotary shaft 331 to which the pair of pickup units 320 are coupled to face each other. When any one of the rotary mover 330 including the driving device 332 and the pickup 320 is located above the test socket 311, the pickup 320 is moved downward to test the test socket 311. It may be configured to include a linear moving unit 340 to be mounted on the) and moved upward after the test to separate from the test socket 311.

The linear moving part 340 may be configured in various ways, such as a screw jack according to the linear moving method.

Meanwhile, as illustrated in FIG. 1, the test unit 300 is configured such that the test module 310 does not interfere with the transfer of the semiconductor device 10 so that the test module 310 can stably test the semiconductor devices 10. It may further include a test chamber 350 in which only a part of the portion is opened.

The test chamber 350 may have any structure as long as it can prevent a temperature change as much as possible without affecting the test environment of the test module 310.

The inversion unloading unit 520 is a configuration for inverting and receiving the semiconductor elements 10 that have been tested in the test unit 300 from the pickup unit 320 and then transferring them to the unloading plate unit 400. Since the loading unit 510 may be configured in substantially the same manner, a detailed description thereof will be omitted.

That is, the inversion unloading unit 520 is installed to support a plurality of pickup tools 521 and pickup tools 521 for picking up each semiconductor element 10 so as to transfer the plurality of semiconductor elements 10. It may include a support that is moved in the XY direction by the XY linear moving device and a rotating device for rotating and inverting the plurality of pickup tools 521 so as to withdraw the semiconductor elements 10 from the heating plate 200 have.

The unloading plate unit 400 is a configuration for temporarily loading the semiconductor elements 10 before the unloading unit 600 is transferred to the unloading unit 600 according to the test result of the test unit 300. The plate member 410 of the heating element is different from the plate member 210 of the heating plate part 200 in which the semiconductor elements 10 should stay for a predetermined time or more, so that the transfer time of the semiconductor elements 10 is not limited. It may be configured to include one or more plate member 410 in which an appropriate number of loading grooves 411 are formed in consideration of speed and the like.

Meanwhile, the plate member 410 may further include a cooling device for cooling the heated semiconductor device 10, and the plate member 210 may be configured integrally with the cooling device or as a separate member.

Meanwhile, as illustrated in FIGS. 1 and 2, the transfer of the semiconductor devices 10 between the inversion loading unit 510 and the test unit 300, and between the test unit 300 and the inversion unloading unit 520 may be performed. It may be transferred by the third and fourth transfer tools (550, 560).

The third transfer tool 550 is configured to pick up the semiconductor elements 10 inverted by the inversion loading unit 510 and to transfer them to the pickup unit 310 of the test unit 300 located at the element exchange position. The fourth transfer tool 550 finishes the test and picks up the semiconductor elements 10 from the pick-up unit 310 of the test unit 300 positioned at the element exchange position, thereby inverting them upward. Configured to transfer).

The third transfer tool 550 and the fourth transfer tool 560 are supported by a plurality of pickup tools 551 and 561 and pickup tools 551 and 561 capable of picking up the semiconductor devices 10. It may be configured to include a moving device for moving the pick-up tools (551, 561).

The plurality of pickup tools 551 and 561 constituting the third transfer tool 550 and the fourth transfer tool 560 are horizontally formed by the heating plate 200 and the test socket 311 of the test unit 300. And horizontal and vertical spacing may be adjusted in consideration of the case where the vertical spacing is different from each other. As shown in FIGS. 1 and 4, the horizontal and vertical spacing may be adjusted. And the vertical spacing can be fixed.

In addition, since the third transfer tool 550 picks up the semiconductor elements 10, the third transfer tool 560 is picked up by the fourth transfer tool 560 after the semiconductor elements 10 are extracted from the pick-up unit 320. The transfer tool 550 and the fourth transfer tool 560 may be configured to move in conjunction with each other, and in particular, the moving device supporting the pickup tools 551 and 561 may be configured as one.

The unloading unit 600 classifies the semiconductor devices 10 loaded on the unloading plate unit 400 through the second transfer tool 540 according to the test result of the test module 310 of the test unit 300. It is configured to.

The unloading unit 600 is configured similarly to the loading unit 100, and as an example, as shown in FIG. 1, an appropriate number of trays 20 are disposed according to a classification standard according to a test result, and a semiconductor The tray 20 filled with the elements 10 may be configured to be automatically or manually replaced with the empty tray 20.

On the other hand, the empty tray 20, as described above, the empty tray 20 emptied from the loading unit 100 may be transferred by a tray transfer unit (not shown).

Meanwhile, the reverse loading tool 510, the reverse unloading tool 520, the first transfer tool 530, the second transfer tool 540, the third transfer tool 550, the fourth transfer tool 560 and the pickup The pick-up tools 511, 521, 531, 541, 551, 561, and 321 constituting the part 320 may be configured as a picker having an adsorption head for adsorbing the semiconductor device 10 by vacuum pressure.

The transfer process of the semiconductor devices 10 from the inversion loading tool 510 to the inversion unloading tool 520 having the above configuration will be described with reference to FIGS. 4 to 6.

First, the inversion loading tool 510 picks up the semiconductor elements 10 from the heating plate 200 and inverts the same to that of FIG. 6.

In addition, when the inversion loading tool 510 picks up the semiconductor devices 10 and is in a state as shown in FIG. 6, the third transfer tool 550 and the fourth transfer tool 560 are shown in FIG. 4. Likewise, the upper part of the reverse loading tool 510 and the pick-up part 320 are moved in cooperation with each other.

As shown in FIG. 5, the third transfer tool 550 and the fourth transfer tool 560 pick up the semiconductor elements 10, respectively, and the third transfer tool 550 may be formed in the pickup unit 320. The 4 transfer tools 560 are loaded into the reverse unloading tool 520.

On the other hand, when the semiconductor device 10 that has been tested by the fourth transfer tool 560 is picked up and the semiconductor device 10 to be tested is loaded by the third transfer tool 550, as shown in FIG. 6, pickup The part 320 is replaced with the pickup part 320 facing the test socket 311 by rotation by the rotation moving part 330. In this case, the third transfer tool 550 and the fourth transfer tool 560 are moved to pick up and load the semiconductor device 10.

When the pickup 320 on which the semiconductor devices 10 to be tested are loaded is in a state facing the test socket 311, as illustrated in FIG. 4, the semiconductor devices 10 loaded on the pickup 320 are linear. It is mounted on the test socket 311 by the moving unit 340 and tested.

At this time, the pickup portion 320 facing upward is made to transfer the semiconductor elements 10 as described above.

Meanwhile, the inversion unloading tool 520 that receives the tested semiconductor devices 10 delivers the tested semiconductor devices 10 to the unloading plate unit 400 after inversion as illustrated in FIG. 6.

In the semiconductor device inspection apparatus according to the present invention having the above configuration, the semiconductor device inspection may be performed by an inspection method having the following configuration.

That is, the semiconductor device inspection method according to the present invention includes a device loading step of loading at least one tray loaded with a plurality of semiconductor devices; A heating step of receiving and heating the semiconductor elements from the tray to the heating plate part through the first transfer tool in the loading step; A first inversion step of picking up the heated semiconductor elements in the heating step and inverting the bottoms of the semiconductor elements to face upwards; The semiconductor devices inverted by the first inversion step are received by any one of the pair of pickups at the element replacement position, rotated from the element replacement position to the element test position in the picked-up state, and then picked up by the pickup portion. The picked-up semiconductor devices are mounted on the test sockets of the test module for testing, and the semiconductor devices are picked up at the remaining pick-up parts positioned at the device replacement positions by the rotation of the pickup unit, and then the semiconductor devices inverted by the first inversion step are transferred. A test step of removing the semiconductor devices from the test sockets after the test is completed and rotating them from the device test position to the device exchange position; A second inversion step of inverting and transferring the semiconductor devices that have been tested in the test step toward the lower side in the picked-up state; An unloading step of loading the semiconductor elements picked up in the second inversion step into the unloading plate; And an unloading step of classifying and loading the semiconductor devices loaded on the unloading plate part through the second transfer tool according to the test result of the test module.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: loading portion 200: heating plate portion
300: test unit 400: unloading plate
510: reverse loading unit 520: reverse unloading unit
600: unloading unit

Claims (19)

A loading unit in which one or more trays in which a plurality of semiconductor devices are loaded are loaded;
A heating plate unit configured to heat the semiconductor element from the tray of the loading unit by receiving the semiconductor element through a first transfer tool;
An inverting loading unit which picks up the semiconductor elements from the heating plate unit and inverts the bottom surfaces of the semiconductor elements to face upwards;
A test module having test sockets each semiconductor device is mounted to inspect electrical characteristics of the semiconductor devices heated in the heating plate part, a pair of pickup parts for picking up a plurality of semiconductor devices, and a pair of A rotational movement portion for rotating the pickup portions between the element exchange position and the element test position, and a linear movement portion for linearly moving the pickup portion to mount or detach the semiconductor elements picked up in the pickup portion to the test socket; A test unit to perform;
A third transfer tool for transferring semiconductor elements from the inverted loading portion to the pickup portion located at the element exchange position, and a fourth transfer tool for picking up tested semiconductor elements from the pickup portion positioned at the element exchange position; ;
A reverse unloading unit configured to receive the semiconductor elements from the fourth transfer tool and invert them to face downward in a picked up state;
An unloading plate part on which semiconductor elements picked up by the inverted unloading part are loaded;
And an unloading unit configured to classify and load the semiconductor devices loaded on the unloading plate unit according to the result of the test module through a second transfer tool. The method according to claim 1,
The heating plate part includes a plate-shaped plate member having a plurality of loading grooves formed on an upper surface thereof so that the semiconductor elements can be loaded, and a heating device installed on the inner or bottom surface of the plate member to heat the semiconductor elements to a predetermined test temperature. Semiconductor device inspection apparatus, characterized in that. The method according to claim 2,
The stacking grooves of the plate member are disposed in accordance with the interval of the test sockets, or the semiconductor device inspection apparatus, characterized in that arranged in the interval corresponding to the interval of the receiving grooves of the tray. The method according to claim 2,
And the loading grooves of the plate member are one-half of the interval between the pick-up tools forming the reverse loading portion. The method according to claim 2,
And the heating plate unit includes a pair of plate members that can be moved alternately with each other. The method according to claim 5,
The pair of plate members are installed so as to alternately move the loading position to receive the semiconductor elements from the tray of the loading unit and the transfer position from which the reverse loading unit can take out the semiconductor element. . The method according to claim 5,
The pair of plate members are installed at intervals up and down so as not to interfere with each other, one or more guide members for guiding the linear movement of the plate member and a linear driving device for driving the linear movement of the plate member. Semiconductor device inspection apparatus, characterized in that. The method according to claim 1,
The reverse loading unit is provided with a plurality of pickup tools for picking up each semiconductor element so as to transfer a plurality of semiconductor elements, and the pickup tools are supported and installed by an XY linear transfer device to draw out the semiconductor elements from the heating plate unit. A semiconductor device inspection device comprising a support portion moved in the XY direction. The method according to claim 8,
The inverting loading unit further includes a rotation device for rotating the support unit to pick up the semiconductor elements from the heating plate unit and rotate by inverting the bottom surface of the semiconductor elements upward. . The method according to claim 1,
The reverse unloading unit is provided with a plurality of pickup tools for picking up each semiconductor element so as to transfer a plurality of semiconductor elements, and the pickup tools are supported and installed in an XY linear transfer device to load the semiconductor elements into the unloading plate unit. And a support part moved in the XY direction by the semiconductor device inspection apparatus. The method of claim 10,
And the reverse unloading unit further includes a rotation moving device which rotates the support unit to pick up the semiconductor elements and rotate the bottom surfaces of the semiconductor elements so that the bottom faces downward. The method according to claim 1,
And the third transfer tool and the fourth transfer tool move in cooperation with each other through one moving device. A device loading step of loading one or more trays on which a plurality of semiconductor devices are loaded;
A heating step of receiving and heating the semiconductor elements from the tray to the heating plate part through a first transfer tool in the loading step;
A first inversion step of picking up the semiconductor elements heated in the heating step by the inversion loading unit and inverting the bottom surfaces of the semiconductor elements to face upwards;
The semiconductor devices inverted by the first inversion step are received by any one of the pair of pickups at the element exchange position, and rotated from the element exchange position to the element test position in the state of being picked up by the pickup portion. The semiconductor devices picked up by the pickup unit are mounted on the test sockets of the test module, and the semiconductor device is picked up by the first inversion step after picking up the semiconductor devices in the pickup unit which are located at the element replacement position by the rotation of the pickup unit. A test step of receiving the inverted semiconductor devices, after completing the test, separating the semiconductor devices into the test sockets and rotating them from the device test position to the device exchange position;
A second inversion step of inverting and transporting the semiconductor devices, which have been tested in the test step, by the inversion unloading unit to the lower side in the picked-up state;
An unloading step of loading the semiconductor elements picked up in the second inversion step into an unloading plate;
And an unloading step of classifying and stacking the semiconductor devices loaded on the unloading plate unit through a second transfer tool according to a test result of the test module. The method according to claim 13,
The heating plate part includes a plate-shaped plate member having a plurality of loading grooves formed on an upper surface thereof so that the semiconductor elements can be loaded, and a heating device installed on the inner or bottom surface of the plate member to heat the semiconductor elements to a predetermined test temperature. Semiconductor device inspection method characterized in that. The method according to claim 14,
And the loading grooves of the plate member are one-half of the interval between the pick-up tools forming the inverted loading part. The method according to claim 14,
The heating plate unit comprises a pair of plate members that can be moved alternately with each other. 18. The method of claim 16,
And the pair of plate members are installed to alternately move a loading position capable of receiving the semiconductor elements from the tray and a transfer position of the reverse loading portion capable of withdrawing the semiconductor element. The method according to claim 13,
The reverse loading unit includes a plurality of pick-up tools for picking up each semiconductor element to transfer a plurality of semiconductor elements, and an XY linear transfer device to support the pick-up tools and to draw the semiconductor elements from the heating plate unit. And a support for moving in the XY direction, and a rotating device for rotating the support to pick up the semiconductor devices from the heating plate and to rotate the bottom surface of the semiconductor devices upward. method of inspection. The method according to claim 13,
The inverse unloading unit includes a plurality of pick-up tools for picking up each semiconductor element to transfer a plurality of semiconductor elements, and the pick-up tools are supported and installed in the XY linear transfer device to load the semiconductor elements into the unloading plate unit. And a support for moving in the XY direction, and a rotation moving device for rotating the support to pick up the semiconductor devices and rotate the inverted surfaces so that the bottoms of the semiconductor devices face downward. .

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