KR102656451B1 - Handler for testing electronic components - Google Patents

Abstract

The present invention relates to a handler for testing electronic components.
The handler according to the present invention includes a loading device for loading electronic components to be tested from a supply tray onto a test tray; A connecting device that electrically connects the electronic components loaded on the test tray to the tester; An unloading device that unloads electronic components for which testing has been completed from a test tray and moves them to a recovery tray; and a buffer device having a buffer table that can move between the operating area of the loading device and the operating area of the unloading device. Includes. Additionally, the buffer device moves the buffer table between the operating area of the loading device and the operating area of the unloading device as needed, so that the buffer table is utilized for loading by the loading device and unloading by the unloading device.
According to the present invention, by using a buffer table for appropriate movement of electronic components according to loading, unloading, or retesting, the speed of appropriate movement and retesting of electronic components is ensured, thereby increasing the operation rate of the handler. There is a possible effect.

Description

Handler for testing electronic components {HANDLER FOR TESTING ELECTRONIC COMPONENTS}

The present invention relates to a handler used to test the electrical characteristics of produced electronic components. In particular, the present invention relates to technology for moving electronic components in a handler.

Electronic components such as semiconductor devices and module RAMs are produced and shipped after undergoing electrical characteristic testing. At this time, a handler is used to electrically connect the electronic component to be tested to the tester.

Typically, the handler includes a test tray, a first stacker, a loading device, a connecting device, an unloading device, and a second stacker.

The test tray circulates along a circular path that leads back to the loading position through the loading position, testing position, and unloading position.

The first stacker stores supply trays loaded with electronic components to be tested. The supply trays stored in the first stacker are sequentially supplied to the supply location, so that the loading operation by the loading device is performed smoothly.

The loading device loads electronic components to be tested from a supply tray at the supply position to a test tray at the loading position.

The connection device electrically connects the electronic components loaded on the test tray to the tester when the test tray whose electronic components have been completely loaded by the loading device is brought to the test position.

After the test of the electronic components loaded at the test location is completed, the unloading device unloads the electronic components from the test tray that came to the unloading location, sorts them according to the test results, and moves them to the recovery tray at the recovery location.

The second stacker stores recovery trays for recovering electronic components for which testing has been completed. These recovery trays are also sequentially supplied to the recovery location, so that the unloading operation by the unloading device is performed smoothly.

However, as in Korean Patent Publication No. 10-2009-0063542, etc., after the first test is completed, the electronic components classified as retest are supplied to the handler again and undergo a second retest process. At this time, electronic components classified as retest loaded on the recovery tray are manually supplied to the handler by the operator.

Therefore, the operation of the handler is stopped between the first test and the second retest, which reduces the operation rate of the handler.

Meanwhile, as in Korean Patent Publication No. 10-2009-0008062, a buffer table is provided in the handler to assist proper loading by the loading device.

In general, the buffer table functions to temporarily load electronic components that need to be temporarily removed during loading due to socket-off of the test socket in the tester, etc. This makes the loading process smoother and improves the loading speed. Here, socket-off refers to turning the test socket out, and whether a specific test socket is the target of socket-off may vary depending on the designer's intention. For example, if an abnormal judgment is made in a specific test socket more than a set number of times, the specific test socket can be set to be socket-off. Also, if there is a test socket that is socket-off, do not load the electronic components in the position facing the test socket on the test tray, but collect the electronic components that need to be loaded in that location in the buffer table, and then test them later when a certain amount has been collected. It is transferred to a tray. The present invention relates to the use of such a buffer table.

The first purpose of the present invention is to provide a technology that can smoothly perform loading, unloading, and retest operations by utilizing a buffer table.

The second purpose of the present invention is to provide a technology that can individually identify electronic components and accurately determine the flow of electronic components using a buffer table.

A handler for testing electronic components according to a first aspect of the present invention includes a test tray that circulates along a circular path leading back to the loading position through a loading position, a test position, and an unloading position; a loading device that loads electronic components to be tested from a supply tray onto the test tray at the loading position; a connection device that electrically connects the electronic components loaded on the test tray to the tester when the test tray on which the loading of electronic components has been completed by the loading device is brought to the test position; an unloading device that unloads the electronic components from the test tray that came to the unloading location after the test of the electronic components loaded at the test location is completed, sorts them according to test results, and moves them to a recovery tray; and a buffer device having a buffer table that can move between the operating area of the loading device and the operating area of the unloading device. It includes, wherein the buffer device moves the buffer table between the operating area of the loading device and the operating area of the unloading device as needed, thereby performing a loading operation by the loading device and an unloading operation by the unloading device. The buffer table is used.

The unloading device loads specific electronic components classified as retest as a result of the test into the buffer table in the operating area of the unloading device, and the loading device loads the specific electronic components classified as retested into the operating area of the loading device in the operating area of the unloading device. A specific electronic component is moved from the buffer table moved to the test tray at the loading position.

The electronic component test handler includes a first stacker in which supply trays loaded with electronic components to be tested are stored; and a second stacker in which recovery trays for recovering tested electronic components are stored; It further includes, wherein the second stacker includes: a lifting frame on which recovery trays can be stacked in an upward and downward direction at regular intervals from each other; An elevator that elevates the elevator frame; and advancers and retractors that position the recovery trays in the recovery position or return them to the storage position by selectively advancing and retracting the recovery trays loaded on the lifting frame. Includes.

A handler for testing electronic components according to a second aspect of the present invention includes a test tray that circulates along a circular path leading back to the loading position through a loading position, a test position, and an unloading position; a loading device that loads electronic components to be tested from a supply tray onto the test tray at the loading position; a connection device that electrically connects the electronic components loaded on the test tray to the tester when the test tray on which the loading of electronic components has been completed by the loading device is brought to the test position; an unloading device that unloads the electronic components from the test tray that came to the unloading location after the test of the electronic components loaded at the test location is completed, sorts them according to test results, and moves them to a recovery tray; and an identification device for identifying electronic components loaded into the test tray at the loading position by the loading device. Includes, wherein the loading device moves the gripped electronic components to the test tray at the loading position through the identification device, so that the electronic components held by the identification device can be identified, and the identification device , a camera for photographing barcodes printed on electronic components; and a reader that reads the barcode on the image captured by the camera. Includes.

The identification device includes a reflector corresponding to the camera and reflecting a barcode printed on an electronic component to the camera; It further includes.

Barcode identification is performed while the loading device holds the electronic component.

The identification device includes foreign matter removal means for removing foreign matter from electronic components; It further includes.

The electronic component testing handler identifies barcodes while the loading device holds the electronic component.

The first loading device can hold a plurality of electronic components, and the identification device performs barcode identification for the plurality of electronic components held by the loading device.

The reader also reads the loading direction of the electronic component through the image captured by the camera.

Identification of the barcode performed by the identification device and the loading direction of the electronic components are performed simultaneously.

According to the present invention as described above, the following effects are achieved.

First, by utilizing the buffer table for all loading, unloading, and retest operations, the movement flow of electronic components can be optimized with minimal additional configuration, which ultimately has the effect of greatly improving the handler's operation rate.

Second, it supports the movement flow of electronic components using a buffer table by individually identifying electronic components using an identification device.

Third, in addition to the function of identifying electronic components, the identification device has the function of reading the loading direction of electronic components and removing foreign substances from electronic components, enabling efficient use and design of the identification device.

1 is a conceptual plan view of a handler for testing electronic components according to an embodiment of the present invention.
Figures 2 and 3 are reference diagrams for explaining the identification device applied to the handler of Figure 1.
Figure 4 is an example of electronic components to be tested.
FIG. 5 is a schematic plan view of a buffer device applied to the handler of FIG. 1.
FIG. 6 is a reference diagram for explaining the height difference between the buffer plate for loading/unloading applied to the handler of FIG. 1 and the buffer table.
FIGS. 7 and 8 are reference diagrams for explaining a technique for positioning a recovery tray in a recovery position in the second stacker applied to the handler of FIG. 1.
9 to 11 show examples for photographing barcodes of electronic components.

Preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings, but for brevity of explanation, overlapping descriptions will be omitted or compressed as much as possible.

Figure 1 is a conceptual plan view of a handler 100 (hereinafter abbreviated as 'handler') for testing electronic components according to an embodiment of the present invention.

The handler in FIG. 1 includes a test tray (TT), a first stacker 110, a loading device 120, a loading buffer plate 130, an identification device 140, a connection device 150, and an unloading device 160. ), a buffer plate 170 for unloading, a second stacker (181, 182, 183), and a buffer device 190.

The test tray (TT) circulates along a circular path (C) that leads back to the loading position (LP) through the loading position (LP), the test position (TP), and the unloading position (UP). This test tray (TT) is provided to move electronic components to the loading position (LP), test position (TP), and unloading position (UP). That is, the electronic components are loaded on the test tray (TT) from the loading position (LP) and moved to the unloading position (UP) via the test position (TP).

The first stacker 110 accommodates supply trays (ST) on which electronic components to be tested are loaded. The supply trays (ST) stored in the first stacker 110 are sequentially supplied to the supply position (SP), so that the loading operation by the loading device 120 is performed smoothly. This first stacker 110 may be provided in a structure where the operator directly loads the supply trays (ST), or may be provided in a structure to accommodate a supply cart on which the supply trays (ST) are loaded. .

For reference, a camera (CM) may be provided above the supply position (SP) or above the waiting position (WP) where the supply tray (ST) waits before going to the supply position (SP). In this case, appropriate control of the loading device 120 may be possible because the loading status (loading position or number) of the electronic components D loaded on the supply tray ST can be confirmed in advance through the camera CM. Of course, since the supply position SP belongs to the operating area of the loading device 120, it would be desirable for the camera CM to be provided above the standby position WP as in this embodiment.

The loading device 120 loads electronic components to be tested from the supply tray (ST) at the supply position (SP) to the test tray (TT) at the loading position (LP).

The loading buffer plate 130 is used to temporarily load electronic components to be tested as needed. This loading buffer plate 130 is provided to be fixed. Therefore, the above loading device 120 is controlled to load the gripped electronic components into the loading buffer plate 130 or to load the electronic components loaded on the loading buffer plate 130 at the loading position LP. It also performs the task of moving it to the test tray (TT).

The identification device 140 is provided to individually identify electronic components that are in the process of being moved from the supply position (ST) to the loading position (LP) while being held by the loading device 120. It is sufficient for this identification device 140 to be able to individually identify electronic components. Therefore, for example, it may be equipped with a barcode reader or camera, and in this case, the electronic component must have an identification code printed on it that can be identified by a barcode or camera. And so that the electronic components can be identified by the identification device 140, the loading device 120 moves the electronic components held in plan view to the loading position (LP) via the identification position (RP) where the identification device 140 is located. It is controlled to move to the test tray (TT) in . In addition, if necessary for this purpose, the electronic components held by the loading device 120 may be temporarily stopped at the identification position (RP), and furthermore, the electronic components may be somewhat advanced or retreated from the identification position (RP) to allow them to be placed in the identification device (RP). This can enable accurate identification of electronic components.

Figure 2 shows an example of the identification device 140. The identification device 140 consists of four barcode readers (BR), and the four barcode readers (BR) are spaced apart at regular intervals. This barcode reader (BR) may be equipped with a camera and has a structure to photograph the barcode (B) through a reflector (M). Of course, the loading device 120 can hold four electronic components D at a time while being spaced apart from each other, and a barcode is printed on the side of the electronic components D. In the example shown in FIG. 2, the loading device 120 temporarily lowers the four electronic components D held and positions the electronic components D between the reflectors M as shown in FIG. 3 for accurate identification. For this purpose, the electronic components (D) are advanced and retreated somewhat in the forward and backward directions to help the barcode readers (BR) recognize the barcodes of the electronic components (D). Of course, when recognition of the barcode by the barcode readers (BR) is completed, the reader (DA) reads the barcode on the image captured by the barcode reader (BR). In the case where the barcode reader (BR) is equipped with a camera as in this embodiment, the reader (DA) can check the loading direction of the electronic component (D) by checking whether the barcode is reflected in the image and utilize the entire image. Therefore, the loading direction of the electronic component D can be confirmed by reading the shape of the area other than the barcode (such as the shape of the directional groove in FIG. 4).

In addition, the identification device 140 is formed with a flow path (L) for blowing wind to the electronic component (D). Therefore, wind can be blown to the electronic component (D) through the flow path (L), thereby removing foreign substances from the electronic component (D). In other words, the flow path L functions as a foreign matter removal means to remove foreign substances from the electronic component D. Of course, it is also possible to configure it to shake off foreign substances using suction or a brush. And in case of inhalation, a separate space must be provided to collect foreign substances.

In this embodiment, the identification device 140 can identify four electronic components (D) at once, and the loading device 120 is configured to move four electronic components (D) at once, but in practice, Therefore, the number of identifications or movements can be increased or decreased as much as desired.

For reference, in this embodiment, the barcode reader (BR) and reflector (M) provided as a camera are used to read the barcode of the electronic component and check the loading direction of the electronic component, but depending on the implementation, the two functions may be used differently. It can also be carried out by dividing it into configurations. For example, the electronic component D shown in FIG. 4 has a plurality of directional grooves DS formed therein. These multiple direction grooves DS can be used to read the loading direction of the electronic component D. In other words, it may be implemented to read the loading direction of the electronic component (D) using a light-emitting element and a light-receiving element, based on whether the light emitted by the light-emitting element toward the direction groove DS is recognized by the light-receiving element. And the barcode of the electronic component (D) can be recognized with a camera or reader.

The connection device 150 electrically connects the electronic components loaded on the test tray (TT) to the tester when the test tray (TT), whose electronic components have been completely loaded by the loading device 120, comes to the test position (TP). .

After the test of the electronic components loaded at the test position (TP) is completed, the unloading device 160 unloads the electronic components from the test tray (TT) that has been brought to the unloading position (UP), sorts them according to the test results, and moves them to the recovery position. Move it to the recovery tray (DT ₁ to DT ₃ ) in (DP ₁ to DP ₃ ).

The unloading buffer plate 170 is used to temporarily load electronic components for which testing has been completed, as needed. This unloading buffer plate 170 is provided to be fixed. Therefore, the above unloading device 160 is controlled to load electronic components held at the unloading position (UP) or the recovery position (DP ₁ to DP ₃ ) on the unloading buffer plate 170 or to unload them. It is also possible to move the electronic components loaded on the loading buffer plate 170 to the recovery trays (DT ₁ to DT ₃ ) at the recovery positions (DP ₁ to DP ₃ ).

The second stacker (181, 182, 183) accommodates recovery trays (DT ₁ to DT ₃ ) for recovering electronic components for which testing has been completed. These recovery trays (DT ₁ to DT ₃ ) are sequentially supplied to the recovery positions (DP ₁ to DP ₃ ), so that the unloading operation by the unloading device 160 is performed smoothly. Here, the second stacker of symbol 181 accommodates a recovery tray (DTb) on which electronic components determined to be defective are loaded, as shown in FIG. 6, or a recovery tray (DTa) on which electronic components that are determined to be listless are loaded. . And recovery trays (DT ₂ and DT ₃ ) on which electronic components judged to be good are loaded are stored in the second stackers of symbols 182 and 183.

The buffer device 190 is provided to help the appropriate movement of electronic components by the loading device 120 and the unloading device 160, and as shown in FIG. 5, it includes a buffer table 191, a mover 192, and a guide rail ( 193).

The buffer table 191 can move between the operating area (A) of the loading device 120 and the operating area (B) of the unloading device 160. In this buffer table 191, electronic components to be tested may be temporarily loaded as needed, or electronic components classified as retested among electronic components for which testing has been completed may be temporarily loaded. That is, because the buffer table 191 can be selectively located in the operating area (A) of the loading device 120 and the operating area (B) of the unloading device 160, the loading device 120 and the unloading device 160 While preventing interference with 160, it can be used for loading by the loading device 120 and unloading by the unloading device 160, as needed. Of course, when the buffer table 191 is used in the loading process, it moves toward the loading device 120, and when the buffer table 191 is used in the unloading process, it moves toward the unloading device 160. For reference, instead of designing a shared space shared by the loading device 120 and the unloading device 160 and fixing the buffer table 191 in the shared space or stopping it in the shared space, loading It may also be considered to precisely control the operation of the device 120 and the unloading device 160 to prevent mutual collision interference in the shared space.

The mover 192 selectively positions the buffer table 191 in the operating area (A) of the loading device 120 and the operating area (B) of the unloading device 160. That is, the mover 192 has an operating area (A) of the loading device 120 and an operating area (B) of the unloading device 160 to avoid operational interference between the loading device 120 and the unloading device 160. makes it possible to separate. Of course, the basic design policy is to prevent interference between the loading device 120 and the unloading device 160 due to operational errors, but as described above, in some cases, the loading device 120 and the unloading device 160 may operate. The area can be mutually shared, and a fixed buffer table 191 can be provided in the shared area. In this case, collision interference between the loading device 120 and the unloading device 160 can be prevented through control.

Meanwhile, the buffer table 191 is located above the loading buffer plate 130 and the unloading buffer plate 170, as shown in FIG. 6 when viewed from the side. Therefore, the position of the buffer table 191 may overlap with the loading buffer plate 130 or the unloading buffer plate 170 when viewed from a plan view. The reason for this is to minimize the operating distance between the loading device 120 and the unloading device 160 to ensure driving efficiency and stability. That is, since the buffer plate 130 can be located above the buffer plate 130 for loading and the buffer plate 170 for unloading, the operating areas of the loading device 120 and the unloading device 160 are prevented from overlapping. can be easily designed, and the moving distance of electronic components by the loading device 120 and the unloading device 160 can be minimized.

The guide rail 193 guides the left and right movement of the buffer table 191.

Continuing to refer to FIG. 1, it can be seen that the first stacker 110 is located on the left front, and the second stackers 181, 182, and 183 are located on the right and front of the first stacker 110. there is. And a buffer zone (BZ) is disposed between the first stacker 110 and the second stacker (181, 182, 183) and the loading position (LP) and the unloading position (UP). This buffer zone (BZ) is provided with a buffer plate 130 for loading, a buffer plate 170 for unloading, and a buffer table 191. And an identification device 140 is provided on the left side of the loading buffer plate 130.

Hereinafter, the operation of the handler 100 as described above will be described.

<Basic operation>

The supply trays (ST) in the first stacker 110 are sequentially supplied to the supply location (SP).

The loading device 120 grasps four electronic components at a time and then moves the grasped electronic components to the test tray (TT) at the loading position (LP) through the identification position (RP). In this process, when the electronic component is at the identification position (RP), air is blown on both sides of the electronic component through the flow path (L) to shake off foreign substances, and then the loading device 120 is grasped by the barcode reader (BR). Individual identification is made for each electronic component. Of course, along with identification, the loading direction of electronic components is also determined. Here, the order in which tasks are performed, including the task of shaking off foreign substances, identification, and judgment about the loading direction, can be changed as needed, and the identification and judgment tasks can be performed simultaneously. Meanwhile, in this process, the loading device 120 identifies the barcode and determines the loading direction of the electronic components while holding the four electronic components. If electronic components are placed on a separate tray or shuttle and then configured to identify the barcode, the barcode can be read, but it is difficult to check the loading direction because the part that can confirm the loading direction is inserted into the tray or shuttle. In addition, even if the loading direction can be confirmed to some extent when loaded on a tray or shuttle, it must be assumed that the electronic component is properly inserted into the tray or shuttle. In other words, when electronic components are installed tilted, tilted to one side, or inserted into a tray or shuttle, the barcode identification position or loading direction determination position changes each time, reducing accuracy. Additionally, problems arise such as having to check for abnormal loading conditions and take action to correct the error. Therefore, in this embodiment, the work of identifying the barcode and determining the loading direction of the electronic component is performed while the loading device 120 is holding the electronic component.

Furthermore, in this embodiment, there is no method of identifying the barcodes of the electronic components held by the loading device 120 one by one, and four (at least two or more) electronic components are identified simultaneously. In other words, in a situation where two or more remaining electronic components can be held, the identification of the barcode and the loading direction of the electronic components are determined simultaneously through the identification device 140.

Meanwhile, data from analyzing the identified barcode is used to confirm the identifier for each electronic component and information about the electronic component. Therefore, it is possible to check under what production conditions the relevant electronic component was produced based on the previously entered information.

For reference, the identifier for each electronic component and information about the electronic component are transmitted to the tester, and the tester stores the test results of a specific electronic component by linking them to the identifier of the specific electronic component. Then, the tester sends information about the test results of a specific semiconductor device to the handler 100. Accordingly, the handler records and stores information about test results from the tester by linking it to the identifier of a specific electronic component. Accordingly, the handler can manage electronic components individually. Of course, the recorded and stored information can also be used in future retests of electronic components, and when retesting is performed, even the retest results can be managed as history. .

For reference, through individual identification of the electronic components, the test results of the electronic components can be recorded together in the history provided in advance for the electronic components. Therefore, individual history management for each electronic component can be possible.

When the loading of electronic components is completed on the test tray (TT) at the loading location (LP), the loading status of the electronic components is checked using the laser and camera on the loading location (LP) side. Then, the test tray (TT) is transferred from the loading position (LP) to the testing position (TP) by a transfer device (not shown).

At the test position TP, the electronic components loaded on the test tray TT are electrically connected to the tester by the connection device 150, and then the electrical characteristics of the electronic components are tested by the tester.

When the test of the loaded electronic components is completed, the test tray (TT) is transferred from the test position (TP) to the unloading position (UP) by a transfer device (not shown).

The unloading device 160 unloads the electronic components from the test tray (TT) at the unloading position (UP) to the recovery tray (DT) at the recovery positions (DP ₁ to DP ₃ ) according to the test results. Sort and move. Of course, the recovery trays DT in the second stackers 181, 182, and 183 are also sequentially supplied to the recovery positions DP ₁ to DP ₃ .

When the first basic operation as described above is completed, a second operation, which is a retest operation using the buffer table 191, which will be described later, is performed.

Next, the functions of the loading buffer plate 130, the unloading buffer plate 170, and the buffer table 191 that contribute to the loading process, unloading process, and retest process will be described.

<Loading process>

The loading buffer plate 130 and buffer table 191 can be used in the loading process.

For example, if 50 electronic components are loaded on the supply tray (ST) and the loading device 120 can hold 4 electronic components at once, 48 electronic components on the supply tray (ST) Once moved to this test tray (TT), only two electronic components remain in the supply tray (ST). In this case, the loading device 120 may hold the remaining two electronic components and move them to the test tray (TT) through an identification process. However, in this embodiment, to increase work efficiency, the remaining two electronic components are used for loading. After loading on the buffer plate 130, the electronic components of the supply tray (ST) newly supplied to the supply position (SP) are first moved to the test tray (TT) in the loading position (LP). Through this, two electronic components remain at regular intervals, and the process of loading them on the loading buffer plate 130 is performed. If there are more than four electronic components loaded on the buffer plate 130, the four are placed as one set. This identifies the barcode and moves it to the test tray (TT). In addition, even when a situation such as a test socket in the tester is socket-off occurs, the loading buffer plate 130 can be used to load electronic components whose loading is to be withheld. Of course, the loading device 120 holds the electronic components loaded on the loading buffer plate 130 four at a time and moves them to the test tray TT at the loading position LP when necessary. The order of the electronic components may change during this process, but since the electronic components are individually managed by the identification device 140, there is no need to consider changing the order of the electronic components.

Meanwhile, when more electronic components are withheld from the loading operation than the loading buffer plate 130 can accommodate, the buffer table 191 is utilized. Therefore, when the loading buffer plate 130 is filled with electronic components, the buffer table 191 moves to the operating area A of the loading device 120 to assist the loading operation by the loading device 120.

For reference, when the loading of electronic components into the test tray (TT) at the loading position (LP) is completed, a process can be performed to check whether the electronic components are properly loaded on the test tray (TT) using a laser and camera. there is.

<Unloading process>

The unloading buffer plate 170 and buffer table 191 can be used in the unloading process.

For example, when the unloading device 160 grasps all electronic components that have been judged good from the test tray (TT) in the unloading position (UP), they are moved to the second recovery position (DP ₂ ) or the third recovery position ( Move the electronic components to the recovery tray (DT) in the DP ₃ ). However, for example, if one of the electronic components held is judged defective, one is judged retested, and two are judged good, one electronic part judged defective is placed on the buffer plate 170 for unloading. , one electronic component determined to be retested is loaded on the buff table 191, and the two electronic components determined to be good are placed in the second recovery position (DP ₂ ) or the third recovery position (DP ₃ ). Move it to the recovery tray (DT).

The following explains how to process retest quantities performed during the unloading process.

<In case the retest judgment volume is small>

When the retest judgment quantity is small and all of the retest quantity can be loaded into the buffer table 191, after the first test for all electronic components is completed, they are currently placed in the operating area A of the unloading device 160. The buffer table 191 is moved to the operating area (B) of the loading device 120. Then, the loading device 120 operates to move the retest quantity from the buffer table 191 to the test tray (TT) at the loading position (LP). Of course, electronic components that have been moved back to the test tray (TT) in the loading position (LP) go through a retest process while moving with the test tray (TT). Therefore, the buffer zone (BZ) may be named a return zone where electronic components determined to be retested can be moved back to the loading position (LP) by the buffer table 191.

<In case there is a large number of retest judgments>

During the first test process, the buffer table 191 is filled because the retest judgment volume is greater than the loading capacity of the buffer table 191, or the buffer table 191 is filled in consideration of the interdependence between the buffer table 191 and the loading device 120. When a certain percentage (%) of the load is filled, the unloading device 160 transfers the electronic components determined to be retested from the buffer table 191 to the recovery tray (DT) currently supplied to the first recovery location (DP ₁ ). ). Then, the retest quantity loaded on the recovery tray (DT) is transferred to the unloading buffer plate 170 by the unloading device 160, then moved to the buffer table 191, and then transferred to the loading device 120. By sequentially passing through the loading buffer plate 130 and the buffer table 191, it is moved back to the test tray (TT) at the loading position (LP) and undergoes a retest process. Of course, in this flow of retest quantity, the use of the loading buffer plate 130 or the unloading buffer plate 170 may be selectively omitted depending on the extent of the retest quantity.

Meanwhile, for proper flow of retest quantity, a recovery tray (DT) for loading retest quantity and a recovery tray (DT) for loading defective quantity are selectively located at the first recovery location (DP ₁ ). It is desirable to implement it as much as possible. For example, as shown in the side views of FIGS. 7 and 8, the second stacker 181 includes an elevator 181a, an elevator frame 181b, and an advance/retractor 181c.

The elevator 181a elevates the lifting frame 181b.

In the lifting frame 181, recovery trays (DTa, DTb) can be loaded in the vertical direction at regular intervals from each other.

The advance/retractors 181c selectively advance/retract the recovery trays DT in the forward/backward direction to place the recovery trays DTa, DTb in the recovery position DP ₁ or return them to the storage position RP.

Accordingly, since the recovery trays (DTa, DTb) of the second stacker 181 can be raised and lowered (see arrow a) and selectively moved to the first recovery position (DP ₁ ), a circuit for loading the retest quantity A receiving tray (DTa) and a recovery tray (DTb) for loading defective items may be selectively located at the recovery position (DP ₁ ).

Above, we have looked at the roles of the loading buffer plate 130, the unloading buffer plate 170, and the buffer table 191 in the loading process, unloading process, and retest process, but the above examples are just some examples. It's just that. That is, the movement flow of electronic components can vary depending on how the loading device 120, the unloading device 160, and the buffer device 190 are controlled, and the loading buffer plate 130, The contribution of the unloading buffer plate 170 and buffer table 191 may vary.

<Various examples of barcode identification structures>

In the above example, the barcode is printed on one side (front or back) of the electronic component, but as shown in Figure 9, the barcode (B) may be printed on both the front and back of the electronic component (D). there is. In this case, there is a need to read both barcodes (B) on both sides of the electronic component (D). Accordingly, two barcode readers (BR, which may be cameras) were configured between both electronic components (D).

Meanwhile, Figure 10 shows a configuration in which two reflectors (M) are placed between both electronic components (D) to capture the barcodes (B) printed on the electronic components (D) on both sides at the same time with one camera (CM). Yes. In this structure of FIG. 10, two neighboring reflectors (CM) that reflect the barcode (B) toward the camera (CM) correspond to one camera (CM), and as a result, the camera (CM) has two reflectors ( The two barcodes (B) printed on the neighboring electronic components (D) coming from M) are photographed together.

The various barcode identification structures described above were created in order to perform barcode identification on a plurality of electronic components held by the loading device 120 at the same time. For example, when electronic components are lying down and barcodes are exposed in a plane direction, multiple barcodes can be identified at once with a single camera, but as in the present invention, when the loading device 120 is erected with a plurality of electronic components It is impossible to identify multiple barcodes at once with a single camera when held with a . However, identifying each barcode individually makes processing complicated and takes longer, so various barcode identification structures like the ones above are needed.

Of course, as shown in FIG. 11, the barcodes for a plurality of electronic components held by the loading device 120 can be identified at once by arranging the cameras (CM) to photograph the barcodes (B) of the electronic components (D) at a certain angle. The structure can also be fully considered.

As described above, the specific description of the present invention has been made by way of examples with reference to the accompanying drawings. However, since the above-described embodiments are only explained by referring to preferred examples of the present invention, the present invention is limited to the above-mentioned examples. It should not be understood as being possible, and the scope of rights of the present invention should be understood in terms of the claims described later and their equivalent concepts.

100: Handler for electronic component testing
TT: Test tray
120: loading device
130: Buffer plate for loading
140: identification device
150: Connector
160: Unloading device
170: Buffer plate for unloading
190: buffer device
191: buffer table 192: mover

Claims (10)

A test tray that circulates along a circular path that leads back to the loading position through the loading position, test position, and unloading position;
a loading device that loads electronic components to be tested from a supply tray onto the test tray at the loading position;
a connection device that electrically connects the electronic components loaded on the test tray to the tester when the test tray, on which the loading of electronic components has been completed by the loading device, is brought from the loading position to the test position;
an unloading device that unloads the electronic components from the test tray that has been brought to the unloading location after the test of the electronic components loaded at the test location is completed, sorts them according to the test results, and moves them to a recovery tray; and
a buffer device having a buffer table capable of moving between an operating area of the loading device and an operating area of the unloading device; Including,
Electronic components may be temporarily loaded on the buffer table,
The buffer device is
a mover capable of separating the operating area of the loading device and the operating area of the unloading device by selectively positioning the buffer table in the operating area of the loading device and the operating area of the unloading device; and
a guide rail that guides movement of the buffer table; It further includes,
The buffer device moves the buffer table between the operating area of the loading device and the operating area of the unloading device, as needed, so that the buffer table is used for the loading operation by the loading device and the unloading operation by the unloading device. This is utilized,
The unloading device loads specific electronic components classified as retest as a result of the test into the buffer table in the operating area of the unloading device,
The loading device moves a specific electronic component from the buffer table moved from the operating area of the unloading device to the operating area of the loading device to the test tray at the loading position.
Handler for testing electronic components. According to claim 1,
A loading buffer plate used to temporarily load electronic components to be tested; and
An unloading buffer plate used to temporarily load tested electronic components; It further includes,
The buffer table is located above the loading buffer plate and the unloading buffer plate when viewed from the side.
Handler for testing electronic components. According to claim 1,
A first stacker where supply trays loaded with electronic components to be tested are stored; and
a second stacker where recovery trays for recovering tested electronic components are stored; It further includes,
The unloading device unloads the electronic components that have come to the unloading position after the test is completed, sorts them according to the test results, and moves them to the recovery tray,
The second stacker is,
A lifting frame on which recovery trays can be stacked in the vertical direction at regular intervals from each other;
An elevator that elevates the elevator frame; and
Advancers and retractors that position the recovery trays in a recovery position or return them to a storage position by selectively advancing and retracting the recovery trays loaded on the lifting frame; containing
Handler for testing electronic components. delete delete delete delete delete delete delete

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