TW201000380A - Electronic component handling apparatus, electronic component test apparatus and electronic component holding tray - Google Patents

Electronic component handling apparatus, electronic component test apparatus and electronic component holding tray Download PDF

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Publication number
TW201000380A
TW201000380A TW098114005A TW98114005A TW201000380A TW 201000380 A TW201000380 A TW 201000380A TW 098114005 A TW098114005 A TW 098114005A TW 98114005 A TW98114005 A TW 98114005A TW 201000380 A TW201000380 A TW 201000380A
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Taiwan
Prior art keywords
electronic component
holding
tray
interval
test
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TW098114005A
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Chinese (zh)
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TWI359777B (en
Inventor
Akihiko Ito
Mitsunori Aizawa
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Advantest Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An electronic component handling apparatus comprises a pitch change mechanism (260A) for changing a pitch between plates (81-84) in a contact plate (8), wherein each of the plates has a retaining hole (89) provided thereto.

Description

201000380 5 0 0〜搬出部; 51 〇〜搬出裝置; 520〜第2托盤移載裝置。 最能顯 示發明特徵的化學式: 五、本案若有化學式時,請揭示 益 〇 〇*、 六、發明說明: 【發明所屬之技術領域】 本發明係關於將能夠處理 元株笙沾士 7 口持例如半導體積體電路 兀*件荨的電子元件(以下統稱之 W yr M ^ iin. ^ 二^元件)的固持托盤之 電子凡件運搬裝置、用以執行 ..^ ¥ ^子凡件測試的電子元件測 裝置、以及能夠固持電子元件的固持托盤。 【先前技術】201000380 5 0 0~Removal unit; 51 〇~ carry-out device; 520~2nd tray transfer device. The chemical formula that best shows the characteristics of the invention: 5. If there is a chemical formula in this case, please disclose the benefits*, VI, and the description of the invention: [Technical field of the invention] The present invention relates to the ability to process the For example, an electronic component of a semiconductor integrated circuit (hereinafter referred to as "W yr M ^ iin. ^ two components") is used to carry out the electronic component transporting device for performing the test. An electronic component measuring device and a holding tray capable of holding the electronic component. [Prior Art]

元件的製造過程中,使用電子㈣測試裝置,以 測试已封裝狀態之IC元件的性能或機能。 ―構成該電子元件測試裝置之處理機(hamner),係將 1C、二件從客端托盤轉置於測試托盤上,將該測試托盤搬運 H式頭上’纟iC兀件承載於測試托盤的狀態下,將1C 元件按壓到設於測試頭之插座。在此狀態下,構成電子元 件測試裝置的測試器(tester),透過測試頭執行IC元件= 測試。當測試結束之後,處理機將ic元件依據測試結果予 以分類,同時再次將其從測試托盤移到客端托盤上。 2247-l〇44i-PF;Alicewu 201000380 再者,各端托盤係為定細、日丨4 a ★、1 、 勹各納測试刖或測試後的ic元件的 托盤。測試前的I (3元件, 山 、In the manufacturing process of the component, an electronic (four) test device is used to test the performance or function of the IC component in the packaged state. ―The hamner constituting the electronic component testing device transfers the 1C and the two pieces from the client tray to the test tray, and carries the test tray to the state where the '纟iC兀' on the H-type head is carried on the test tray. Next, press the 1C component to the socket provided in the test head. In this state, a tester constituting the electronic component test device performs IC component = test through the test head. When the test is over, the processor classifies the ic components based on the test results and moves them from the test tray to the guest tray again. 2247-l〇44i-PF; Alicewu 201000380 Furthermore, each end tray is a tray that is fixed, 丨 4 a ★, 1, 勹 纳 刖 test or ic component after testing. I before the test (3 components, mountain,

, 在承載於客%托盤的情況下 A 前一個程序送到處理哭, 攸 ^ -而測試後的1C元件,則在承載於 客端托盤的情況下,從泠 ; 贯兄下仗處理器送到後一個程序。另一方面 測試托盤則為在處理哭肉Μ 处理态内循環運送的專用之托盤。 【發明内容】 發明欲解決的課題 用=裝置將ic Α件在測試托盤和測試把盤之間移 置猶疋需要時間的。藉由將該取放操作變更為直接將 «移置的方法’能夠縮短移置操作所 間。 或者,在測試托盤和測試托盤之間移置Ic元件時 由不變換I C TL件之間的間隔,而能夠簡化取放裝置。 仁疋’客端牦盤中收納部間的間隔比較狹窄。因此, 例如在處理使用其斗g 4 % 破伴… 測試的情況下’有時無法充分 確保在測喊頭上插座周圍的配線所必須的空間。 本毛月所欲解決的課題為,提供能夠確保測試頭上的 配線空間夠大的電子 、 70件運搬衣置、電子S件測試裝置以 及電子7L件固持托盤。 解決課題之手段 理可明,提供電子元件運搬裝置,其能夠操縱處 π 、電子兀*件的固持托盤的電子元件運搬裝置,立勺 括間隔變更Ρ罢 β ^ ^ 衣置,其變更該固持托盤具有的複數個固持部 2247-10441-PF;Alicewu 201000380 ,中至少一部份的該固持 第1項)。 之間的間隔(參見申請專利範圍 .在上述發明中雖然並未特別加以限^ 該複數個固持部係相互 t疋,但以此為佳: 圍第2項)。 而可以微動(參見申請專利範 在上述發明中並不待别限定, 更裝置變更該複數個固持部中至小二4此為佳:該間隔變 的間隔,使得該固持部 卩伤的該固持部之間 件運搬裝置的客端托盤中的 己置於出入該電子元 倍,或者’和測試頭中接觸部:間:件之間的間隔之整數 利範圍第3項)。 ,隔相同(參見申請專 在上述發明中並不特別限定 更裝置,係變更由特…、此為侄··該間隔變 U由特疋數目的該固持 固持群中至少-部份的該固持群刀別構成之複數個 利範圍第4項)。 、間隔(參見申請專 在上述發明中並不特別限定’然以 群係相互獨立而可以微動 ^.該複數個固持 各, 兄T D月專利範圍第5項)。 上述發明中並不特別限定,然以此 更裝置變更該複數個固持群 ….以間隔變 ^ 群中至少—部份的該固持群之間 的間隔,使得該固持部 曰’的間為配置於出入該電子亓 件運搬裝置的客端托盤中的 于7" 几件之間的間隔之整數 ν 或者’和測試頭中接觸邱+网& π — 接觸邛之間的間隔相同(參見申請專 利範圍第6項)。 丁 3寻 在上述發明中並不輯別 小将別限疋,然以此為佳:該固持托 2247-l〇441-PF;Alicewu 5 201000380 盤直接從該客端托盤接收該電子 第7項)。 〃見申凊專利範圍 依據本發明,提供電子元 試被測試電子元件的電子元件測試^置置其^係為用以測 運搬裝置;具有和該被測試電子元件電性接: = 的 測試頭;及和該測試頭電性連接 部之 在測試時,將該被測試電子元❹搬裝置, ^ ^ J 〇茨接觸部(參f中古軎 專利範圍第8項)。 匕見甲《月 在上述發明中並不特別限定,鈇 ^ p w . ? ^ …' 以此為佳:該間隔變 π ^ 邓忒,加寬該固持部之 間的間隔,使得該固持部 j Τ该接觸部的配列相對 應在該固持托盤中已加寬間隔 對庫的L士、 ⑽该固持部之間的空間所 對應的該測試頭上的空間中,設 用以將該接觸部周圍的 配線、安裝於該接觸部周圍的電子 件或者該固持部對 1觸部決定位置之位置決定裝置中的至少一個(參見申 請專利範圍第9項)。 依據本發明’提供電子元件運搬楚置,其能夠操縱處 料有可固持電子元件的複數個固持部之固持托盤,其包 括和置I置,從具有收納該電子元件的收納裝置之收納 部’將該電子元件疏散並移置到該固持托盤之該固持部(參 見申睛專利範圍第10項)。 在上述發明中並不特別限定,然以此為佳:該複數個 固持部或由特定數的該固持部分別構成之複數個固持群, 係相互獨立而可以微動(參見申請專利範圍第u項)。 2247-l〇441-PF;Alicewu 6 201000380 • 纟上述發明中並不特別限定,然以此為佳:更包括複 數 運裝置,其將固持該電子元件的該固持托盤搬運到 對向測試頭的位置;該移置裝置,將該收納裝置中收納著 的該被測試雷$ + # ^ ^ 牛刀別疏散並移置到分別供應至該各搬 ' "的^各固持托盤中(參見申請專利範圍第12項)。 〃述矣明中亚不特別限定,然以此為佳:該收納裝 系為出入"亥電子70件運搬裝置的客端托盤,該複數個 f 固持部之間的間隔,俜為 糸马°亥客知托盤中該收納部之間的間 =之整數倍,㈣持托盤,在維持該電子元件之配列的狀 =攸該客知托盤接收該電子元件(參見申請專利範圍第 丄d項)。 ^述發Μ並不特別限定’然以此為佳··該固持托 =接二該收納裝置接收該電子元件(參見申請專 弟i 4項)。 在上述發明中並不转 缺罢# X不特別限疋,然以此為佳•·包括閉塞 叢置’ ▲將該電子元株 時,於“一 裳置移置到該固持托盤 見申請專利範圍第15項)。〃電子疋件的收納部(參 依據本發明’提供電子元件測試裝置 試被測試電子元件的電子元件 二係為用以測 搬裝置;具有和該被測試電子元=接f包括:上述運 ^ jg . „. _ ^ 電丨生接觸的接觸部之測 1、’及和該測咸頭電性連接之測試器;該運搬裝置 測試時,將該被測試電子元 " 利範圍第16項)。 m亥接觸部(參見申請專 2247^l〇441-PF;Alicewu 7 201000380 在上述發明中並不特別限定,然以此為佳:在該固持 托盤中由該移置t 夕直表置4散移置的該被測試電子元件之間的 工間所對應的該測讀通μ + D 、上的二間中’設置用以將該接觸部 周圍的配線、女裳於該接觸部周圍的電子元 持部對該接觸部決定位置之位……/者該口 〜此夏之位置決疋裝置中的至少一個 (參見申請專利範圍第1 7項)。 依據本發明,提供電子元件固持托盤,其包括分別可 以固持被測试電子元件的複數個第工固持部,該複數個第 1固持部至少沿菩笛·! +丄 者第1方向配列;沿著該第丨方向之該第i 固持部之間的間隔包合.势,βθ _ .第1間隔,以及與該第1間隔相 異之第2間隔(參見申請專利範圍第18項)。 在上述發明中並不胜 I不特別限夂,然以此為佳:以該第2 間隔配列之該第1固持 寻邛之間的間距,為以該第1間隔配 列之該第1固持部之間 _ 1q… 間的間距之5倍以上(參見申請專利範 圍弟1 9項)。 卜 _ 4寸別限定,然以此為佳:包括使該 第2間隔可改變的可_ μ # · 4 人 k機構,该可變機構可以改變該第 間隔,使得該第2間隔和該第1門 个成弟i間隔貫質上為同一(來見 請專利範圍第20項)。 匕見申 在上述發明中並不特別限定,鈇 …、以此為佳:該複數彻 第1固持部或由特定數目的該 彳/複數個 ^ is ^ m fr ^-V 1 口持。Μ冓成之固持群, 係相互獨立而可以微動(參見 θ寻利乾圍第21項)。 再者’依據本發明,提供雷 - 子7L件運搬裝置,豆俜 能夠操縱處理如上述之固持托 /、系為 巧逼子凡件運搬裝置,其 2247-l〇441-PF;Alicewu 8 201000380 .f括第1移置袭置’在維持出入該電子元件運搬裝置之客 端托盤中的該雷早;# 几件的配列的狀態下’在該客 該固持托盤之間務署料 ^各端托盤及 置該電子凡件(參見申請專利範圍 2 項)。 在上述發明中並不特別限定,然以此為佳:該客端托 盤具有可以收纳該雷尽_批 巧该電子凡件的複數個收納部, 中的該第1間隔,盥兮☆ 口幵托盤 /、3亥客知托盤中沿著該第丨方向之 ί 納部之間的間隔實際上為 q u 政固待托盤中沿著第?古 向之該第ί固持部夕pq认sb _ 万 之間的間隔,和該客端托盤中沿著 2方向之該收納部之間 耆該弟 範圍第23項)。 U上為同-(參見申請專利 在上述發明中並不特別限定,^此為佳;M W 置裝置具有吸附固持該電子元件的複數個吸附口, 沿著該第1方向之兮κ ,上為π方…吸附口之間的間隔和該第i間隔 ^際為同一,亚且,沿著該第2方向之該吸附口之間的 間隔’和該固持托盤中 一 者該第2方向之該第1固持部之 間的間隔貫際上為同—(參見申請專利範圍第24項)。 “么月中並不特別限定,然以此為佳:包括按壓 二:,、:該電子元件收納在該固持托盤的狀態下,將該 電子70件按壓到該接觸部(參見申請專利範圍第2 。 在上述發明中並不特別限定,然以此為佳包 第2移置裝置,其將哕 、匕栝. 肝该電子兀件在該固持托盤及 個可固持該電子元件的笛 句複數 件的第2固持部之第2固持托盤之間 置;按壓裝置,在該雷工& ί <間移 電子儿件被固持在該第2固持托 2247-l〇441-PF;Alicewu 9 201000380 狀〜、下將該電子元件按魔到、、則4 夕植Α '下《Γ 判碉试頭之接觸部 利範圍第26項)。 嗎邛(參見申凊專 再者’依據本發明,提供 以測試被 、電子件“式裝置,其係用 W被測试電子元件,其 古4 —返之運搬裝置:且 有和该被測試電子元件電 装置/、 卞电/·生接觸的接觸部之 該測試頭電性連接之測1 、#碩,及和 該被測試電子元杜垃厥丨 、八守將 电于凡件按覆到該接觸部(參 27項)。 1、^兄甲明專利範圍第 依據本發明,提供電子元件 子亓杜八m衣置其在被測試電 刀別口持在具有複數個 下,趑4 ^ U符之固持托盤的狀態In the case of carrying the %% pallet, the previous program is sent to handle the crying, 攸^- and the 1C component after the test is carried in the passenger tray, from the 泠; Go to the next program. On the other hand, the test tray is a dedicated tray that is circulated and transported in the processing state of the chop. SUMMARY OF THE INVENTION Problem to be Solved by the Invention It takes time to move the ic member between the test tray and the test tray with the = device. By changing the pick and place operation to directly shift the "displacement method", it is possible to shorten the shift operation. Alternatively, when the Ic element is displaced between the test tray and the test tray, the spacing between the I C TL members is not changed, and the pick-and-place device can be simplified. The interval between the storage sections of Ren's guest tray is relatively narrow. Therefore, for example, in the case of processing using its bucket g 4 % breakage test... Sometimes it is not possible to sufficiently ensure the space necessary for wiring around the socket on the head. The problem to be solved by this month is to provide electronic, 70-piece storage, electronic S-testing devices, and electronic 7-liter holding trays that ensure sufficient wiring space on the test head. The means for solving the problem is clear, and an electronic component transporting device is provided, which is capable of manipulating the electronic component transporting device of the holding tray of the π and the electronic 兀*, and changing the interval, and changing the holding. The tray has a plurality of holding portions 2247-10441-PF; Alicewu 201000380, at least a part of which holds the first item). The interval between them (see the scope of the patent application. Although the above-mentioned invention is not particularly limited to the plurality of holding portions, it is preferable to do so: it is the second item). In the above invention, the device is not limited, and it is preferable to change the plurality of holding portions to the second two in the device: the interval is changed, and the holding portion is wounded by the holding portion. In the guest tray of the piece transporting device, the electronic component is placed in or out of the electronic unit, or 'the contact portion in the test head: the integer range of the interval between the pieces is the third item). The same is true (see the application in the above-mentioned invention, and the device is not particularly limited, and the change is made by the special feature, and the interval is changed by at least a part of the number of the fixed holding groups. Group knife does not constitute a multiple of the range of interest 4). , and the interval (see the application is not specifically limited in the above invention), but the group is independent of each other and can be fine-acting ^. The plural holds each, the brother TD patent scope item 5). In the above invention, the present invention is not particularly limited, and the apparatus is further configured to change the plurality of holding groups. The interval between the holding groups of at least a part of the group is changed such that the holding portion 曰' is disposed. The interval between the integers ν or ' between the 7" pieces in the passenger tray that enters and exits the electronic component transport device is the same as the interval between the contacts and the contact head in the test head (see the application of Qiu + net & π - contact 邛) (see application) Article 6 of the patent scope). Ding 3 search in the above invention does not identify the other is not limited, but this is better: the holding bracket 2247-l 〇 441-PF; Alicewu 5 201000380 disk directly receives the electronic item 7 from the passenger tray) . 〃 凊 凊 凊 凊 凊 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 凊 依据 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊 凊And when testing the electrical connection portion of the test head, the tested electronic element is moved to the device, and the ^ ^ J 接触 接触 contact portion (refer to the third item of the 中 軎 軎 patent scope).匕见A "Month is not particularly limited in the above invention, 鈇^ pw . ? ^ ...' is preferable: the interval becomes π ^ Deng, widening the interval between the holding portions, so that the holding portion j配 The arrangement of the contact portion is corresponding to the space on the test head corresponding to the space between the holder of the library and the space between the holders in the holding tray, and is disposed in the space around the contact portion corresponding to the space between the holders The wiring, the electronic component mounted around the contact portion, or at least one of the position determining means for determining the position of the contact portion of the holding portion (see the ninth application of the patent application). According to the present invention, there is provided an electronic component transporting device capable of steering a holding tray having a plurality of holding portions capable of holding electronic components, comprising: a housing portion having a receiving portion for accommodating the electronic component The electronic component is evacuated and displaced to the holding portion of the holding tray (see item 10 of the patent application scope). In the above invention, it is not particularly limited, but it is preferable that the plurality of holding portions or the plurality of holding groups respectively constituted by the specific number of the holding portions are independent of each other and can be finely moved (see the patent application scope item u) ). 2247-l〇441-PF; Alicewu 6 201000380 • The above invention is not particularly limited, but it is preferable to further include a plurality of transport devices that carry the holding tray holding the electronic component to the opposite test head. a displacement device that evacuates and displaces the tested thunder $ + # ^ ^ 刀 knife stored in the storage device to each of the holding trays (see patent application) Scope 12). It is said that Central Asia is not particularly limited, but it is better: the storage device is a passenger tray that enters and exits the "Hai Electronics 70" transport device, and the interval between the plurality of f-holding portions is a Hummer. The number of times between the accommodating parts in the tray is (integral), (4) holding the tray, maintaining the arrangement of the electronic components = 攸 the customer tray receives the electronic component (see the patent application scope 丄d item) ). The description of the hairpin is not particularly limited. However, it is preferable that the holding device is connected to the electronic component (see application for the professional i). In the above invention, the invention is not particularly limited. X is not particularly limited, but it is preferable to include the occlusion cluster ▲ ▲ when the electronic element is planted, the "one skirt is placed on the holding tray. See patent application. Scope 15). 收纳 〃 〃 ( ( ( ( ( ( ( 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供f includes: the above-mentioned operation ^ jg . „. _ ^ the contact of the contact part of the electric contact, and the tester electrically connected with the salty head; when the transport device is tested, the tested electronic element &quot ; Article 16 of the scope of interest). The m Hai contact portion (see application 2247^l〇441-PF; Alicewu 7 201000380 is not particularly limited in the above invention, but it is preferable that the displacement tray is placed in the holding tray by the displacement t The reading pass μ + D corresponding to the work space between the tested electronic components, and the two of the upper ones are disposed to connect the wiring around the contact portion and the electronic device around the contact portion. The holding unit determines the position of the contact portion.../the at least one of the position of the mouth-to-summer position (see the patent application item No. 17). According to the present invention, an electronic component holding tray is provided, The method includes a plurality of first working holding portions that can respectively hold the electronic component to be tested, and the plurality of first holding portions are arranged at least along the first direction of the phlegm and the ;; the ith holding along the second 丨 direction The interval between the parts includes the potential, βθ _. the first interval, and the second interval different from the first interval (see the 18th item of the patent application scope). In the above invention, it is not particularly limited. And this is better: the first holding of the search at the second interval The spacing between the first holding portions arranged at the first interval is more than five times the distance between the first holding portions _ 1q... (see the patent application for the ninth item). Preferably, the mechanism includes a _μ # · 4 person k mechanism that can change the second interval, and the variable mechanism can change the second interval such that the second interval and the first door are separated. For the same (see item 20 of the patent scope) 匕见申 is not particularly limited in the above invention, 鈇..., preferably: the plural first retaining portion or a specific number of the 彳/plural number ^ is ^ m fr ^-V 1 Oral. The group of holdings is independent of each other and can be jogged (see θ 寻利干围第21). Furthermore, according to the present invention, Ray-Sub 7L pieces are provided. The transporting device, the soybean meal can handle the handling of the holding device as described above, and it is a self-contained moving device, which is 2247-l〇441-PF; Alicewu 8 201000380 .f includes the first displacement attack. The lightning in the passenger tray of the electronic component transporting device; # a few pieces of the state of the arrangement The trays are disposed between the trays and the electronic trays (see Patent Application No. 2). The invention is not particularly limited, but it is preferable that the passenger tray has the thunder. _The number of the first compartments in the plurality of storage sections of the electronic parts, the interval between the 盥兮 幵 幵 幵 /, and the 3 客 知The interval between the sb _ 10000 and the accommodating portion along the second direction of the occupant in the tray Item 23). U is the same - (see the patent application is not particularly limited in the above invention, which is preferred; the MW device has a plurality of adsorption ports for adsorbing and holding the electronic component, along the first direction 兮 κ , π square... the interval between the adsorption ports is the same as the i-th interval, and the interval between the adsorption ports along the second direction and the second direction of the one of the holding trays The interval between the first holding portions is the same as the above--(see Patent Application No. 24). "It is not particularly limited in the month of the month, but it is preferable to include: press 2:,:: the electronic component storage In the state in which the tray is held, the electronic member 70 is pressed to the contact portion (see Patent Application No. 2). The invention is not particularly limited, and the second displacement device is a good package.匕栝. The liver is placed between the holding tray and the second holding tray of the second holding portion of the plurality of strips that can hold the electronic component; the pressing device is in the Leigong & ί < The interdigitated electronic device is held in the second holding bracket 2247-l〇441-PF; Alicewu 9 201000380 状~, the next electronic component is deviled, and then 4 夕 Α ' ' 下 下 Γ 碉 碉 碉 碉 碉 碉 碉 碉 第 第 。 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛The present invention provides a test device, an electronic device "type device, which is used to test the electronic component, and the transfer device: and the electronic component of the electronic component to be tested /, the electric device / The contact portion of the contact portion of the contact portion is electrically connected to the contact portion (see item 27) and the electronic component Du Layu and Ba Shou will be electrically connected to the contact portion (see item 27). According to the invention, the electronic component is provided in the state in which the electronic component is held in the state of the holding tray having a plurality of 趑4^U characters.

下 將π亥被測試電子元# i* Μ XI n…、 壓到測試頭的接觸部,用以執 订k被測试電子元件的測 及冽試頭的該接觸邱右 被固持在該固持部的該被測試電子 具有和 制叫雪工- 直接接觸,將該被 測忒電子7L件對該接觸部決定发 見申珠鼻剎& FI… ,、位置的位置決定裝置(參 見甲°月專利摩巳圍弟28項)〇 在上述發明中並不特別限定,鈇 盤,直接從搬入出該電子元件’,、、·“ .該固持托 被測試電子元件(夾目由▲主击 盤接收該 件(參見申请專利範圍第29項)。 發明之效果 在本發明中,藉由間 4dr ^ 欠更裝置變更固持托盤的固持 4或固持群之間的間隔,或藉 ,._ ^ 移置裴置將被測試電子元 件疏政並從收納裝置移置到固 、托盤。因此,被固接在m 持托盤中的被測試電子元件之間 、 接觸部之間的間隔也隨之加寬, 的 口此’能夠確保用於測試 2247-1044I-PF;Alicewu _ ^ 10 201000380 頭上的配線的空間寬廣。 再者,本發明中’設定有2種固持托盤中第丄固 之間的間隔。因此,能夠將一部 ' 的破固持在固持托盤中 的被測試電子元件之間賴隔加寬,目此使得測試頭 接觸部之間的間隔也隨之部分地加寬,能約確保用 頭上的配線的空間寬廣。 、 再者’本發明中,位置決定裝置和被固持在固持托盤 中的被K電子7G件直接接觸,使被測試電子元件對於接 觸部決定位置’ m夠精確地決定被測試電子元件的 位置。 【實施方式】 下文配合圖式,說明本發明之實施型態。 [第1實施型態] 第1圖顯示依據本發明第1實施型態之電子元件測試 裝置的全體構成之概略平面圖。 本實施型態之電子元件測試裝置,係為在對IC元件施 加高溫或低溫的溫度應力的狀態下,由處理器〗A將IC元 件按壓到測試頭6的插座61,測試器(未圖示)透過測試頭 6將測試信號輸出給1C元件,藉此測試(檢查)IC元件是否 適當地動作之裝置。 本實施型態的處理機1A,如第1圖所示,包括:载入 部100、施加部200A、測試部300A、除熱部40〇a及搬出 部 500。 11 2247-l〇441-PF;Alicewu 201000380 載入部100 ’將客端托盤7 _妗 „ 1A ^ % 枚一枚地從供應給處理 器1A的疊放體70A搬入施加部2〇〇a。The next step is to test the electronic component # i* Μ XI n..., which is pressed to the contact portion of the test head for binding the test of the electronic component to be tested and the contact of the test head. The tested electronic part has direct contact with the snowman, and the 7L piece of the tested electronic device is determined to be sent to the contact part of the Shenzhu nasal brake & FI..., position determining device (see A°) In the above invention, there is no particular limitation, and the electronic disk is directly loaded from the electronic component ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The disk receives the piece (see claim 29). Effect of the Invention In the present invention, the holding 4 of the holding tray or the interval between the holding groups is changed by the 4dr ^ under-device, or by, ._ ^ The displacement device dissipates the tested electronic components and displaces them from the storage device to the solid and the tray. Therefore, the interval between the tested electronic components that are fixed in the m holding tray and the contact portions is also increased. Wide, the mouth of this 'can be used to test 2247-1044I-PF; Ali Cewu _ ^ 10 201000380 The wiring on the head has a wide space. In addition, in the present invention, the interval between the first tamping in the two holding trays is set. Therefore, it is possible to hold a portion of the shackle held in the holding tray. The width of the test electronic components is widened, so that the interval between the contact portions of the test heads is also partially widened, and the space for wiring on the head can be broadened. Further, in the present invention, the position is determined. The device is in direct contact with the K-electron 7G member held in the holding tray, so that the electronic component to be tested determines the position of the contact portion to accurately determine the position of the electronic component to be tested. [Embodiment] [First Embodiment] Fig. 1 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to a first embodiment of the present invention. In a state where a high-temperature or low-temperature temperature stress is applied to the IC element, the IC element is pressed by the processor A to the socket 61 of the test head 6, and the tester (not shown) passes the test. (6) A device for outputting a test signal to a 1C device, thereby testing (checking) whether or not the IC device is properly operated. The processor 1A of the present embodiment, as shown in Fig. 1, includes a loading unit 100 and an application unit 200A. The test unit 300A, the heat removal unit 40〇a, and the carry-out unit 500. 11 2247-l〇441-PF; Alicewu 201000380 Loading unit 100 'send the passenger tray 7 _妗 1 1 ^ ^ % from one supply to the other The stacking body 70A of the processor 1A is carried into the applying portion 2A.

係由收納了測試前的1C元件之客端 兄放體70A <各知托盤層積而構成。 施加部2 0 0 A ’讓IC元件% μ—办 什、.隹持收納在客端托盤7中 狀態’將高溫或低溫的熱應力施加於該lc元件 觸板δ重疊在客端托盤7上並將其 , 兀件從客端托盤7移置到接觸板(固持板)8上。繼之 施加部200Α中’將客端托盤7從接觸板8上取下,將該接 觸板8搬入測試部3_中。繼之,從接觸板8取下的= 托盤7被送回除熱部4〇〇Α。 測試部300Α,將接觸板8移到測試頭6的下方,在π 元件固持(收納)在接觸板8的狀態下,冑IC元件按壓到測 試頭6的插座6卜在此狀態下,測試器透過測試頭6,執 行和ic元件之間的測試信號之收發,執行lc元件之測試。 在1C兀件的測試結束之後,將接觸板8從測試部搬 出到除熱部400A。 除熱部400A,將從施加部2〇〇A送回的客端托盤7覆 蓋在接觸板8上之後’將其反轉,以-次將測試完畢的IC 元件從接觸板8移置到客端托盤7,將接觸板8從客端托 盤7上取下。將熱應力從κ元件除去之後,將客端托盤7 從除熱部4_搬運到搬出部_。繼之,從客端托盤7取 下的接觸板8 ’被送回施加部2 〇 〇 a。 繼之,在搬出部5〇〇,將從除熱部4〇〇A搬出的客端托 盤7,疊放在疊放體7〇β之上。再者,疊放體7〇β係由已 2247-1044l-PF;Alicewu 201000380 .、經搬出的客端托盤7疊放而構成,這些客端托盤中收納了 測試完畢的IC元件。 客端托盤7的疊放體70B,藉由操作者或ADV等的自 動搬運裝置,搬運到獨立於處理機1A的分類專用裝置(未 圖示)。藉由該分類專用裳置,將IC元件分類到對應於測 試結果分類。 繼之,先說明本實施型態的客端托盤7及接觸板8。 r 第2圖顯示用於第1圖的電子元件測試裝置的客端托 1盤之斜視圖,第3圖顯示顯示用於第1圖的電子元件測試 裝置的接觸板的斜視圖,第4圖顯示第3圖的接觸板展開 狀態的斜視圖,第5圖顯示第3圖的接觸板的背面圖,第 6圖顯示沿著第3圖的VI-VI線的斷面圖。 如第2圖所tf,本實施型態中的客端托盤7係為平板 狀的托盤本体71的上面,形成複數個用以收納ic元件的 凹狀的收納穴72,在本實施型態中,共有64個收納穴72 Lj在托盤本体71上配列為8行8列。在此客端托盤7中,沿 著Y軸方向的收納穴72之間的間隔為p],沿著χ軸方向: 收納穴72之間的間隔為ρ2。 另一方面,如第3及4圖所示,本實施型態中的接觸 板8包括第卜第4板81〜84以及將其連接的軸85。軸85 分別插入形成於各板8卜84的插入孔中,各板沿著 軸85在γ軸方向滑動,藉此,如第4圖所示,可以使第 1〜第4板81〜84之間的間隔變寬。 再者,在接觸板8中,將板8丨〜84之間以可移動的方 2247-1044i-PF;Alicewu 13 201000380 式連結的機構,並不限定㈣,例如,也可 (pantagraph)或線性滑執等。 用集電弓 如第5圖所不,各板81〜84的背面略中央處,八* 出設置針狀的凸輪從動件81a〜84a。這些第J 4刀別突 動件81a〜84a在後述的間 一 4凸輪從 ^ ^變更機構26〇A、42〇A的凸輪i 内移動,藉此,能夠使第彳 ]凸輪溝 …真… 板81,之間的間隔變寬 或變乍。再者,在接 文見 中,用以使板81〜8 4之間的 隔變寬或變窄的機構, 之間的間 $、查蛀黾,* μ 限疋於凸輪機構,利用如汽缸、 或連接馬相滾麵㈣構等亦可。 如第3及4圖所示,各板 持單元87。在各固梏置_ 〇7 4上刀別裝-2組的固 、 兀8 7上分別形成用以固持IC元件 的凹狀之⑸h 89。各 IC7G# 89配置為2行4列。 的上面,8個固持穴 如第3圖所开·,+丄由 之門…! 型態中,第1〜第4板8H4 之間的間隔最窄的狀態下 的間隔為P3,沿著X抽方Λ 向的固持穴89之間 。者X軸方向之固持穴89 這些間隔p3、4 4 心丨』α门加马。 r , θ 〇述之客端托盤7中的間隔Ρ,、p2f 際上疋一致的(Ρπρ 員 門的鬥μ咖 Ρ5~Ρ〇因此,第卜第4板8卜84之 間的間攻窄的狀態 際上和客端托盤7由 板8中固持穴89的配列’實 一七盤7中的收納穴72的配列一致。 另 方面’如第4圖所示,者笙, 的間隔放# 田弟卜第4板81〜84之間 J敢大限度時,透禍g β 元87的 透、軸85形成於鄰接的固持單 ^付八89之間的沿菩ν * Ρ4(Ρ3<Ρ4)〇,χ., , ^ # Y軸方向的間隔從P3加寬為 乂此加見的間隔P4配列之固持穴89之間的間隔 膽―10441卞此咖u 14 201000380 S2,為以間隔&配列之固持穴89之間的間隔Si的5倍以 上為佳(S2$Six5),為10倍以上更佳(SdSixlO)。 在測試時’在各固持單元87的一邊的側邊的附近,形 成用以將IC元件對插座6丨決定其位置的第i位置決定孔 87a。另外’在第4圖中’形成第2位置決定孔87b的突出 片87c ’從各固持單元87的上下的側面突出。該第2位置 決定孔87b和第1位置決定孔87a 一樣,在測試時,用以It is composed of a guest body 70A < a tray in which the 1C component before the test is accommodated; The application part 2 0 0 A 'allows the IC element % μ - to be held in the guest tray 7 in a state of 'applying high or low temperature thermal stress to the lc element contact plate δ overlapping on the client tray 7 The jaws are displaced from the client tray 7 to the contact plate (holding plate) 8. Next, the client tray 7 is removed from the contact plate 8 and the contact panel 8 is carried into the test portion 3_. Then, the tray 7 taken out from the contact plate 8 is sent back to the heat removing portion 4''. The test unit 300A moves the contact plate 8 below the test head 6, and in a state where the π element is held (accommodated) in the contact plate 8, the 胄IC element is pressed to the socket 6 of the test head 6 in this state, the tester Through the test head 6, the test signal transmission between the ic component and the ic component is performed, and the test of the lc component is performed. After the end of the test of the 1C member, the contact plate 8 is carried out from the test portion to the heat removing portion 400A. In addition to the heat portion 400A, after the client tray 7 returned from the application portion 2A is overlaid on the contact plate 8, 'reverses it, and the tested IC component is displaced from the contact panel 8 to the guest. The end tray 7 removes the contact plate 8 from the passenger tray 7. After the thermal stress is removed from the κ element, the guest tray 7 is transported from the heat removing unit 4_ to the carry-out unit _. Then, the contact plate 8' removed from the passenger tray 7 is returned to the applying portion 2 〇 〇 a. Then, at the carry-out portion 5, the guest tray 7 carried out from the heat removing portion 4A is superposed on the stacked body 7??. Further, the stacked body 7 〇β is composed of 2247-1044l-PF; Alicewu 201000380. The carried-out passenger trays 7 are stacked, and the tested IC components are housed in these guest trays. The stacking body 70B of the client tray 7 is transported to a sorting-dedicated device (not shown) independent of the processor 1A by an operator or an automatic transfer device such as an ADV. The IC components are classified into corresponding test result classifications by the dedicated placement of the classification. Next, the guest tray 7 and the contact plate 8 of this embodiment will be described first. r Fig. 2 is a perspective view showing a guest tray for the electronic component testing device of Fig. 1, and Fig. 3 is a perspective view showing a contact panel for the electronic component testing device of Fig. 1, Fig. 4 Fig. 5 is a perspective view showing the unfolded state of the contact plate of Fig. 3, Fig. 5 is a rear view showing the contact plate of Fig. 3, and Fig. 6 is a cross-sectional view taken along line VI-VI of Fig. 3. As shown in Fig. 2, the client tray 7 in the present embodiment is a flat upper tray main body 71, and a plurality of concave storage pockets 72 for accommodating the ic elements are formed. In this embodiment, A total of 64 storage holes 72 Lj are arranged on the tray body 71 in 8 rows and 8 columns. In this client tray 7, the interval between the accommodation holes 72 in the Y-axis direction is p], and the interval between the accommodation holes 72 is ρ2 along the z-axis direction. On the other hand, as shown in Figs. 3 and 4, the contact plate 8 in this embodiment includes the fourth plate 81 to 84 and the shaft 85 to which the contact plate 8 is connected. The shafts 85 are respectively inserted into the insertion holes formed in the respective plates 8 and 84, and the respective plates are slid in the γ-axis direction along the axis 85. Thereby, as shown in Fig. 4, the first to fourth plates 81 to 84 can be made. The interval between the two becomes wider. Furthermore, in the contact plate 8, the mechanism for connecting the plates 8丨-84 between the movable sides 2247-1044i-PF; Alicewu 13 201000380 is not limited to (4), for example, pantagraph or linear. Slippery and so on. Using the pantograph, as shown in Fig. 5, the back sides of the plates 81 to 84 are slightly centered, and the needle-shaped cam followers 81a to 84a are provided. These J 4 -knife protrusions 81a to 84a are moved in the cam i of the ^^ changing mechanism 26A, 42A, which will be described later, whereby the third cam groove can be made... The interval between the plates 81 is widened or changed. Furthermore, in the text, the mechanism for widening or narrowing the gap between the plates 81 to 8 4 is limited to the cam mechanism, such as a cylinder. , or connect the horse phase rolling surface (four) structure, etc. As shown in Figs. 3 and 4, each of the holding units 87 is provided. (5) h 89 for holding the IC element is formed on each of the solid-state _ 4 7 4 on the solid-state _ 4 7 4 . Each IC7G# 89 is configured as 2 rows and 4 columns. Above, 8 solid points, as shown in Figure 3, +丄 by the door...! In the pattern, the interval between the first to fourth plates 8H4 in the narrowest interval is P3, and is located between the holding holes 89 in the X-direction direction. The holding hole 89 in the X-axis direction These intervals p3, 4 4 丨 丨 α 门 。 。. r , θ 〇 之 之 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客 客The state and the passenger tray 7 are aligned by the arrangement of the holding holes 89 in the plate 8 in the arrangement of the holding holes 89 in the plate 8. The other aspect is as shown in Fig. 4, and the spacing of the holes is placed # When the fourth board 81-84 between the two brothers dared to limit the gap, the penetration of the g-element 87 was formed, and the axis 85 was formed between the adjacent holdings of the singularity and the eighty-eighths. )〇,χ., , ^# The interval in the Y-axis direction is widened from P3 to 加. This interval P4 is arranged in the interval between the holding pockets 89. 1010441卞This coffee u 14 201000380 S2, in intervals & It is preferable that the interval between the anchoring holes 89 is 5 times or more (S2$Six5), more preferably 10 times or more (SdSixlO). In the test, 'in the vicinity of the side of one side of each holding unit 87, The i-th position determining hole 87a for determining the position of the IC element to the socket 6 is formed. Further, in the fourth drawing, the protruding piece 87c' of the second position determining hole 87b is formed from the upper and lower sides of each holding unit 87. Projection. The second positioning hole 87b and the first positioning hole 87a, as in the test for

决疋IC 7L件對插座6丨的位置。如第4圖所示,在固持單 兀87的上下的側面’形成可以讓對向的突出片87c插入的 插入孔87d。如第3圖所示 隔最窄的狀態下,各突出片 如第6圖所示,固持單 女裝孔86的安裝元件88, 在此’女裳孔8 6的小後 的螺部88a的外徑,而且 大於女褒元件8 8的頭部 8 7可以分別對於第卜第 ,第1〜第4板8 1〜84之間的間 87c隱藏於插入孔87d中。 凡8 7 ’糟由插入各板81 ~ 8 4的 而分別安裝在各板81〜84上。 部8 6a的内徑’大於安裝元件88 ’安裝孔86的大徑部86b的内徑, 8 8 b的外徑。因此,各固持單元 4板81〜8 4挪動。 另一方面,安择元料 。 、 8的頭部88b的外徑,大於安裝 孔86的小徑部86a。因此,The position of the IC 7L piece to the socket 6丨 is determined. As shown in Fig. 4, an insertion hole 87d into which the opposing protruding piece 87c can be inserted is formed on the upper and lower side faces ' of the holding unit 87. As shown in Fig. 3, in the narrowest state, each of the protruding pieces, as shown in Fig. 6, holds the mounting member 88 of the single women's hole 86, and here, the small rear screw portion 88a of the female skirt hole 86 The outer diameter, and the head portion 87 of the female baboon element 8 8 can be hidden in the insertion hole 87d for the inter-division, and the inter-87c between the first to fourth plates 8 1 to 84, respectively. The 8 7's are attached to the respective plates 81 to 84 by being inserted into the respective plates 81 to 84. The inner diameter ' of the portion 864a is larger than the inner diameter of the large diameter portion 86b of the mounting hole 86 of the mounting member 88', and the outer diameter of 8 8 b. Therefore, the holding units 4 plates 81 to 8 4 are moved. On the other hand, the choice of materials. The outer diameter of the head portion 88b of the eighth member 8 is larger than the small diameter portion 86a of the mounting hole 86. therefore,

u, ^ ^ ^ 即使用反轉裝置250Λ、460A 將接觸板8反轉,固持單 脫離。 87也不會從第卜第4板8卜84 在本貫施型態中,使固持元 以互相獨立微動,藉此,在各個板8卜84中可 應力而產生的熱膨脹。 &amp;收伴隨著對1C元件施加熱 2247-l〇441-PF;Alicewu 201000380 繼之,針對本實施型態之電子元件測試裝置的各部分 詳述之。 〈搬入部1〇〇&gt; 第7圖顯示第i圖的電子元件測試裝置的搬入部的平 面圖。 如第1圖所示,搬入部100包括:第i托盤移置裝置 no’其從先前程序供應的疊放體7〇A 一 托盤7;崎心,其將第_移„請= 客端托盤7搬入施加部2 〇 〇 a。 第7圖所示,第1托盤移置|置11〇包括:在處 機1·的主基座(裝置基板)上沿著γ軸方向設置之Y軸軌 111 ’可以在上述之Y軸軌道111上沿著Y軸方向移動的 動臂112;以及藉由設置於可動臂112尖端的致動器(未 不而可以上下移動的固持頭113。固持頭113,且有朝 的開閉式的固持爪η, ”另初 —U符爪用以固持客端托盤7。 該弟1托盤移置裝置11〇,將位 面的客端托盤7m -敌體70A的最 之德,可Μ , 口持頭113的固持爪114抓住並上 12在Υ軸軌道111上移動, 7送到搬入裝置l2n。 動而將各鳊托 另外,構成疊放體7〇Α的f ^ &amp; t 以輸出入端子朝下的 的客鳊托盤t 的狀態收納IC元件。u, ^ ^ ^ The contact plate 8 is reversed using the inverting devices 250A, 460A, and the holding unit is detached. 87 also does not cause the retaining elements to be slightly inseparated from each other from the fourth plate 8 in the present embodiment, whereby the thermal expansion due to stress can be generated in each of the plates 8. &amp; is accompanied by the application of heat to the 1C element 2247-l 441-PF; Alicewu 201000380, followed by a detailed description of the various parts of the electronic component testing apparatus of the present embodiment. <Loading unit 1〇〇> Fig. 7 is a plan view showing the loading unit of the electronic component testing device of Fig. i. As shown in Fig. 1, the loading unit 100 includes: an i-th tray shifting device no' which is a stacking body 7〇A supplied from a previous program, a tray 7; a heart-shaped, which shifts the first _ please = a passenger tray 7Loading the application unit 2 〇〇a. As shown in Fig. 7, the first tray shifting|setting 11 〇 includes: a Y-axis rail provided along the γ-axis direction on the main base (device substrate) of the local machine 1· 111' can be moved in the Y-axis direction on the above-mentioned Y-axis rail 111; and an actuator provided at the tip end of the movable arm 112 (not necessarily a holding head 113 that can move up and down. The holding head 113) And the opening and closing type of holding claws η, "the other initial - U claws are used to hold the passenger tray 7. The younger 1 tray shifting device 11 〇, the passenger plane tray 7m of the plane - the enemy 70A Most of the best, the holding claws 114 of the mouth holding head 113 grasp and move the upper 12 on the yaw axis 111, and 7 is sent to the loading device 12n. The stalks are moved to form the stacking body. The f ^ &amp; t accommodates the IC component in the state of the customer tray t which is outputted with the terminal facing downward.

如第7圖所彔 1A 、 、,搬入襞置120為,例如,λ n 的複數個回轉滾叙]9, 由馬達驅 Ζ1平行並排為2列而椹士 客端托盤7沿著ν t 阳構成’而可以As shown in Fig. 7, A1A, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Constitute 'can

軸方向移動。該搬入I 托盤移置裝置110伽 衮置120’將由第 入之客端托盤7’搬運到施加部200Move in the direction of the axis. The carry-in I tray shifting device 110 gantry 120' will be carried by the first passenger tray 7' to the applying portion 200.

2247-l〇441-PF;AlicewU 16 201000380 〈施加部200A&gt; 第8及9圖顯示第1圖的電子元件測試裝置的施加部 的平面圖及正面圖。 σ 、&quot;&quot;加°卩具有恆溫槽,其對於收納在客端托盤7上 立 '&quot;牛施力所右人之鬲溫或低溫的熱應力。該恆溫槽的内 卩有如第1圖不意之垂直搬運裝置;將客端托盤7或接 觸板8水平移動# m i I τ ια 秒動的第1水平搬運裝置210Α;將接觸板8蓋 4 在客端托盤’或將客端托盤7從接觸板8上取下的第 …裝卸裝置220A ’在客端托盤7及接觸板8重疊對準的狀 。下將其反轉的第i反轉裝置25qa ;以及使接觸板8中板 81〜84之間的間隔加寬的第1間隔變更機構260A。 2直搬運裝置能夠從搬入裝置120接收客端托盤7’ 固持著該客端托盤7计#甘&amp; + 二 並使,、依序下降。在測試部300A空出 之前的期間,客端杯般7 + 1 托盤7在被該垂直搬運裝置固持的狀熊 下在施加部200A中待機中,藉此,將攝氏—55〜侧度左 右的熱應力施加於IC元件。垂直搬運裝置將位於最下方的 客端托盤7送到第i水平搬運裝置2i〇A。另外,也可以由 垂直搬運裝置使客端牦盤7依序上升。 第1水平搬運裝置21f)Ak ,, A為’例如’由馬達驅動的複數 個回轉滾軸平行並排為2 』向構成,而可以將客端托盤7 從垂直搬運裝置搬到第1反榦 轉裝置250A,並且,將接觸板 8從第1反轉裝置25〇A搬到測試部3〇〇a。 如笫9圖所示,第 1Λ 裝卸裝置220Α包括:在處理機 U的主基座(裝置基板)上 考γ軸方向設置之γ軸軌道 2247-l〇441-PF;Alicewu 17 201000380 221 ’可以在上述之γ軸軌% 1及第2可動頭〜者⑼方向移動的第 十 、230、240。另外,在第8圖中,為了 # r 弟1反轉裝置250A、回送裝置27以 $ 了使仔2247-l〇441-PF; AlicewU 16 201000380 <Applying section 200A> Figs. 8 and 9 are a plan view and a front view showing an applying portion of the electronic component testing device of Fig. 1. σ, &quot;&quot; plus 卩 has a thermostatic bath for the thermal stress of the right or low temperature of the right person who is stored in the passenger tray 7 . The inside of the thermostatic chamber has a vertical conveying device as shown in Fig. 1; the first horizontal conveying device 210 is moved horizontally by moving the passenger tray 7 or the contact plate 8 by # mi I τα; the cover plate 8 is covered by the guest The end tray 'or the first loading and unloading device 220A' that removes the passenger tray 7 from the contact plate 8 is superimposed in alignment with the passenger tray 7 and the contact plate 8. The i-th reversing device 25qa that reverses this is the first interval changing mechanism 260A that widens the interval between the plates 81 to 84 in the contact plate 8. The 2 straight conveyance device can receive the passenger tray 7' from the loading device 120, and hold the guest tray 7 to count down, and sequentially lower. During the period before the test portion 300A is vacated, the passenger cup-like 7 + 1 tray 7 stands by in the application portion 200A under the bear held by the vertical conveyance device, thereby setting the Celsius to 55 degrees to the side. Thermal stress is applied to the IC component. The vertical transport device feeds the lowermost passenger tray 7 to the i-th horizontal transport device 2i〇A. Alternatively, the passenger tray 7 may be sequentially raised by the vertical conveying device. The first horizontal conveying device 21f)Ak, A is configured such that, for example, a plurality of rotating rollers driven by a motor are arranged in parallel, and the passenger tray 7 can be moved from the vertical conveying device to the first reverse drying. The device 250A moves the contact plate 8 from the first reversing device 25A to the test portion 3A. As shown in FIG. 9, the first loading and unloading device 220 includes: a γ-axis track 2247-l 441-PF disposed on the main base (device substrate) of the processor U in the γ-axis direction; Alicewu 17 201000380 221 ' Tenth, 230, and 240 that move in the direction of the γ-axis rail % 1 and the second movable head-to-(9). In addition, in Fig. 8, in order to make the #r brother 1 inverting device 250A and the returning device 27

的構造衮異神切 Λ夂弟1返达裳置470A 〃易里解,而省略了第!裝卸裝置2m。 干):可1:: 2可動帛230 ' 240分別具有由致動器(未圖 下移動的固持頭如、241。再者,固持頭23卜 ?別具有朝下的開閉式的固持爪232、242,用以固持 客端托盤7或接觸板8。 , γ軸執道221橫跨架設在回送裝置2m '第i反轉裝 置250A及第!返送裝置47〇A的上方。而且,第)及第2 可動頭23〇、240可以移著γ軸軌道221互相獨立地移動。 在本實施型態中,第i可動頭23〇 ,在第i反轉裝置 250A和回送裝置270A之間搬運客端托盤7。另一方面,第 2可動頭240,在第丨反轉裝£25〇A和第丨返送裝置47〇a 之間移動接觸板8。 再者,回送裝置270A例如由輸送帶等構成,其能夠將 由第1裝卸裝置220A從接觸板8上取下之客端托盤7搬運 到除熱部400A。再者,由回送裝置27〇八搬運的客端托盤7, 在除熱部400A中,藉由第2裝卸裝置430A而被接觸板8 覆蓋。 第1返送裝置470A也是一樣,由例如輸送帶所構成。 該第1返送裝置470A能夠將由除熱部400A的第2裝卸裝 置430A而回收的客端托盤7搬到施加部200A。由第1返 送裝·置470A送回的接觸板8’藉由第1裝卸裝置220A而 2247 —1〇441 一 pp1; Ali cewu 18 201000380 被客端托盤7覆蓋。 如第8及第9圖所示,笫,The structure is very different. The younger brother 1 returned to the 470A 〃 里 solution, and omitted the first! Loading and unloading device 2m. Dry): 1:2: movable 帛230 '240 respectively has an actuator (a retaining head that is not moved downward, such as 241. Further, the holding head 23 has a downwardly-closed holding claw 232 And 242 for holding the passenger tray 7 or the contact plate 8. The γ-axis 221 is spanned over the returning device 2m 'i-inverting device 250A and the second returning device 47A. The second movable heads 23A and 240 are movable independently of each other by the γ-axis rails 221. In the present embodiment, the i-th movable head 23 is transported between the ith reversing device 250A and the returning device 270A. On the other hand, the second movable head 240 moves the contact plate 8 between the second reverse charging unit 25A and the second returning unit 47A. Further, the returning device 270A is constituted by, for example, a conveyor belt or the like, and can transport the passenger tray 7 removed from the contact plate 8 by the first attaching and detaching device 220A to the heat removing unit 400A. Further, the passenger tray 7 transported by the loopback device 27 is covered by the contact plate 8 by the second attaching and detaching device 430A in the heat removing portion 400A. The same applies to the first returning device 470A, for example, by a conveyor belt. The first returning device 470A can transport the client tray 7 recovered by the second attaching and detaching device 430A of the heat removing unit 400A to the applying unit 200A. The contact plate 8' returned by the first returning and detaching device 470A is covered by the first tray detaching device 220A by 2247-1 441 pp1; Ali cewu 18 201000380 is covered by the client tray 7. As shown in Figures 8 and 9, hey,

第1反轉裴置250A包括:設置 於處理機1A的主基座上的—料门姑A '對回轉°卩2 51 ;分別相對地設 置在回轉部251上的伸縮部252. μ番+ 1 ’叹置在各伸縮部252的 尖端的夹頭2 5 4。 各回轉部2 5 1,係由遠垃r~l ±* 連接於回轉馬達及其驅動軸的齒The first reversing device 250A includes: a material door A' on the main base of the processor 1A, a pair of rotations 卩2 51; and a telescopic portion 252 which is oppositely disposed on the revolving portion 251. 1 'The nip 2 4 4 which is placed at the tip end of each of the stretchable portions 252. Each of the rotating parts 2 5 1 is connected to the teeth of the swing motor and its drive shaft by a distance r~l ±*

輪機構(均未圖示)構成,可w你A A 職可以使伸縮部252以Y軸方向為 中心回轉。 各伸縮部252係由汽缸構忐,f姑〜 稱成其使得桿253沿著Y軸 方向移動。2個伸縮部2 5 2 B?番丸λ a I Ζ配置為使得桿253的尖端彼此 相對。因此,當伸縮部252分 刀⑴伸長時,桿253的尖端之 間的距離變窄’當伸縮部252分別給D士 z刀別細妞時,桿253的尖端 之間的距離變寬。 各伸縮部252的桿253的尖媸八s丨丨壯&lt; α 〜次%分別裝設了夾頭254。 各桿253係由空氣壓力等而開閉 J闭 猎此,可以抓住重疊對The wheel mechanism (none of which is shown) can be used to rotate the telescopic portion 252 around the Y-axis direction. Each of the expansion and contraction portions 252 is configured by a cylinder, and is said to move the rod 253 in the Y-axis direction. The two telescopic portions 2 5 2 B? Pills λ a I Ζ are arranged such that the tips of the rods 253 are opposed to each other. Therefore, when the stretchable portion 252 is extended by the knife (1), the distance between the tips of the rods 253 is narrowed. When the stretchable portions 252 respectively give a thinner, the distance between the tips of the rods 253 becomes wider. The tip 254 of each of the rods 253 of each of the stretchable portions 252 is sturdy and sturdy. Each rod 253 is opened and closed by air pressure, etc. J is closed, and the overlapping pair can be grasped.

kJ 準之客端托盤7及接觸板8。 第1反轉裝置250Α,當第1裝卸裝置2m把接觸板8 蓋在第1水平搬運裝置21〇Α上的客端托盤7上時,使Α 180度回轉。此時,接觸板8的固持穴89的列和客端托盤 7的收納穴7 2的配列實際上是_ ^ ^ 幻貫丁 π致的,因此,能夠將收納 於客端托盤7的收納穴72中的戶斤右沾ΤΓ — J听有的I C 7G件,直接移到 接觸板8的固持穴89。 再者’如第9圖所示’為了避免妨礙客端托盤7及接 觸板8,在由第!反轉裝置25〇A反轉時,第i水平搬運裝 2247-10441-PF;Alicewu 201000380 置210A的一部份可以下降。再者,第1水平搬運裝置21〇A 的退避方向也可以為橫向。 如第8圖所示,第1間隔變更機構260A係由形成了 4 條凸輪溝2 61〜2 6 4的板元件構成。第卜第4凸輪溝 261〜264,係對應於第5圖所示的接觸板8的第卜第4凸 輪從動件81a〜81d。 如第1圖所示’該第1間隔變更機構260A係設置於第 1反轉裝置2 5 0 A和測試部3 0 0 A之間。而且,當第1水平 搬運裝置21 0 A將接觸板8移向測試部3 0 0 A時,接觸板丨 的第卜第4凸輪從動件81 a〜84a,在第1間隔變更機構26〇」 的第1〜第4凸輪溝261〜264内移動,使接觸板8的第L 第4板8卜84間的間隔變寬。 在此施加部200A中,當客端托盤7從垂直搬運裝置这 到第1水平搬運裝置210八時’帛!水平搬運裝置21〇&quot; 該客端托盤7移動到帛丄反轉裝置25〇A。繼之,第i装飼 裝置220A的第2可動頭24。,將由第】返送裝置侧從 除熱部400A送來的接觸板8蓋在該客端粍盤7上。 繼之’第1反轉裝置250A,固梏仕安#化船π u得住客端托盤7和接觸 板8並使其回轉18〇度。藉 — -人將收納在客端托盤r 中的所有1C元件移到接觸板8的固持穴89。 在由第1反轉裝置250A反韓的ώ , 轉的d間,第1水平搬運裝 置210A的一部份下降,不過, 丄土 田弟1反轉裝置250A的反 轉、-口束時’該已下降的部分上升。繼之,當第 250A解除固持時,接觸板8 、 接觸板8和客端托盤7又被固持在第1 2247-1044i-PP;AIicewu 20 201000380 水平搬運裝置21 〇A上。 繼之’第1裝卸裝置 罝220A的第1可動頭23〇, 板8上拿下客端杯般 接觸 托盤7,並將該客端托盤7移到回送 270A。該客端托盤7由回送裝置搬到除熱部 繼之,第1水平搬運裳置210A,將接觸 部300A。在此移動期門 # n _ J ^ H藉由第1間隔變更機構2 6 0 A使 接觸板8中的各板〜Qj 一 〜8 4之間的間隔變寬,並在此狀態下 被搬入測試部3 0 〇 A中。 〜 〈測試部300A&gt; 第10圖顯示第1圖的電子元件測試裝置的測試頭的上 面圖,第u圖顯示本發明第!實施型態中接觸板和插座的 概略斷面圖。 測試部300A包括測試室,其係於將固持在接觸板8上 的IC 7L件按壓到測試頭6的插座61時,用以維持施加於 IC元件的熱應力。 在該測試室的㈣’測試頭6 #上部透過形成於處理 機A1上方的開口進入,並且設有用以將丨c元件按壓到插 座61的Z軸驅動裝置(按壓裝置)31〇(參見第u圖)。 如第10圖所示,測試頭6的上部裝設了複數個插座 61,該插座61朝向測試室的内部。在測試頭6的上部,64 個插座61配列為8行8列。該測試頭6上的插座61的配 列’和藉由第1間隔變更機構26〇A而加寬板8卜84之間的 間隔的接觸板8中的固持穴89的配列實際上是相同的。 在本實施型態中,由第1間隔變更機構260A加寬了固 2247-1044l-PF;Alicewu 21 201000380 持八8 9之間的_邮八 °卩伤的間隔’因此,如同—圖所 份的插座β 1間#; ^ y、,一部 、 形成比較大的空間65,該空間65 作為插座61周圖使用 周圍的配線空間。再者’插座61 可以為,例如樂# 1圍的配線 、°又了插座61的插座板(未圖示) 等。另外,安驴,_ 口 丁)上的配線 展在插座61周圍的電子元件也可 空間65中。 丁也'1以配置在此 如第11圖所示’各個插座61包括:和 入端子ΗΒ電性接觸 几件的輪出 蓋63。而且,在插广 以及固持接觸腳62的外 在插座6]的周圍,設置了用以決 的固持單元、 接觸板8 一 置之位置決定針6 4。另外,雖麸力 特別圖示,因為突出 ^ …又有 巧大出片87c從固持單元87向 以’面對該固掊罝;。7 万大出,所 、 7的第2位置決定孔87b的位置、、办— 針,設置在第10圖所示之空間65中。 當接觸板§;^楚1 的下方時,在Ι(:Λ 搬運裝置21GA搬運到測試頭6 軸驅動裝置:::被^ 的位置決定針64=:厂_座61。此時,插座61 定孔87a、心 丹早疋87的弟1及第2位置決 疋孔Wa、87b,藉此,分別 #。舍1C _ 凡件對插座61決定其位 置田iC7G件的輪出入端子⑽#杜念 ..,,,,^ 鳊子Ηβ和接觸腳62電性接觸時, 在此狀怎下,測試器透過測 〇f&amp; ,λ . ^ ^ 项b執仃和1C元件之測試信 號的收發’執行IC it件的測試。 該測試結果,作為條碼 ^ 7 ^ ^ ,欠 寺的識別貝料附加在各客端托 盤7本體,或以資料的方 ^ ^ $ π μ 攸處理機〗Α轉送到分類專用 裝置。當測試完畢之後,接kJ is the passenger tray 7 and the contact plate 8. In the first reversing device 250, when the first attaching and detaching device 2m covers the contact plate 8 on the passenger tray 7 on the first horizontal conveying device 21, the crucible is rotated by 180 degrees. At this time, the arrangement of the rows of the holding pockets 89 of the contact plate 8 and the accommodating pockets 7 2 of the guest tray 7 are actually _ ^ ^ π π π, so that the storage pockets accommodated in the client tray 7 can be accommodated. The household in 72 is right-handed — J listens to the IC 7G piece and moves directly to the holding hole 89 of the contact plate 8. Furthermore, as shown in Fig. 9, in order to avoid obstructing the passenger tray 7 and the contact panel 8, it is in the first! When the reversing device 25A is reversed, the i-th horizontal carrying device 2247-10441-PF; Alicewu 201000380 can be lowered by a portion of 210A. Further, the retracting direction of the first horizontal conveying device 21A may be a horizontal direction. As shown in Fig. 8, the first interval changing mechanism 260A is constituted by a plate member in which four cam grooves 2 61 to 2 6 4 are formed. The fourth fourth cam grooves 261 to 264 correspond to the fourth and fourth cam followers 81a to 81d of the contact plate 8 shown in Fig. 5. As shown in Fig. 1, the first interval changing mechanism 260A is provided between the first inverting device 250A and the test portion 300A. Further, when the first horizontal conveying device 21 0 A moves the contact plate 8 toward the test portion 300 A, the fourth cam followers 81 a to 84 a contacting the plate , are in the first interval changing mechanism 26 〇 The first to fourth cam grooves 261 to 264 are moved to widen the interval between the Lth, fourth, and fourth plates 84 of the contact plate 8. In this application portion 200A, when the passenger tray 7 is from the vertical conveyance device to the first horizontal conveyance device 210, it is 帛! The horizontal carrying device 21 〇&quot; the client tray 7 is moved to the cymbal reversing device 25A. Next, the second movable head 24 of the i-th feeding device 220A. The contact plate 8 sent from the heat removing portion 400A on the side of the returning device is placed on the passenger tray 7. Following the 'first reversal device 250A, the 梏 梏 安 化 化 得 得 得 得 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客 住客. By the person, all the 1C components housed in the passenger tray r are moved to the holding pockets 89 of the contact plate 8. When the first reversing device 250A is anti-Korean, the portion of the first horizontal conveying device 210A is lowered, but the reverse rotation of the Kawasaki 1 reversing device 250A is performed. The portion that has fallen has risen. Then, when the 250A is released, the contact plate 8, the contact plate 8, and the passenger tray 7 are again held on the 1st 2,247, 044i-PP; AIicewu 20 201000380 horizontal handling device 21 〇A. Following the first movable head 23 of the first loading and unloading device 罝220A, the tray 8 is brought into contact with the tray 7 by the take-up cup, and the passenger tray 7 is moved to the return 270A. The client tray 7 is transported to the heat removing unit by the returning device, and the first horizontal carrying skirt 210A is placed, and the contact portion 300A is placed. In this movement period door #n_J^H, the interval between the plates ~Qj ~8 4 in the contact plate 8 is widened by the first interval changing mechanism 260 A, and is carried in this state. The test unit 3 0 〇A. ~ <Test Unit 300A> Fig. 10 shows an upper view of the test head of the electronic component test apparatus of Fig. 1, and Fig. u shows the present invention! A schematic cross-sectional view of the contact plates and sockets in the implementation. The test portion 300A includes a test chamber for maintaining thermal stress applied to the IC element when the IC 7L member held on the contact plate 8 is pressed to the socket 61 of the test head 6. The (four) 'test head 6 # of the test chamber enters through an opening formed above the processor A1, and is provided with a Z-axis driving device (pressing device) 31 用以 for pressing the 丨c element to the socket 61 (see the u Figure). As shown in Fig. 10, the upper portion of the test head 6 is provided with a plurality of sockets 61 which face the inside of the test chamber. In the upper part of the test head 6, 64 sockets 61 are arranged in 8 rows and 8 columns. The arrangement of the arrangement of the socket 61 on the test head 6 and the holding hole 89 in the contact plate 8 which widens the space between the plates 8 by the first interval changing mechanism 26A is substantially the same. In the present embodiment, the first interval changing mechanism 260A widens the solid 2247-1044l-PF; Alicewu 21 201000380 holds the interval of _mail eight degrees between 8 and 8 9 ' The socket β1 is #; ^ y, one part, forming a relatively large space 65, which uses the surrounding wiring space as the socket 61. Further, the socket 61 may be, for example, a wiring around the music #1, a socket board (not shown) of the socket 61, and the like. In addition, the wiring on the ampule, the electronic components around the socket 61 can also be in the space 65. The sockets 1 are arranged here as shown in Fig. 11. The respective sockets 61 include: a wheel-out cover 63 which is in electrical contact with the terminal ΗΒ. Further, around the outer socket 6] for inserting and holding the contact pins 62, a position determining pin 64 for holding the holding unit and the contact plate 8 is provided. Further, although the gluten force is particularly illustrated, since the protrusions ... and the large pieces 87c are faced from the holding unit 87 to the solid portion; In the space of 70,000, the second position of the seventh and seventh positions determines the position of the hole 87b, and the needle is placed in the space 65 shown in Fig. 10. When the contact plate §; ^ Chu 1 is below, the Ι (: 搬运 handling device 21GA is transported to the test head 6 axis drive device::: is determined by the position of the pin 64 =: factory _ seat 61. At this time, the socket 61 The fixed hole 87a, the younger brother of the heart Danzhao 87, and the second position of the squat hole Wa, 87b, respectively, by ##舍1C _ The member of the socket 61 determines the position of the field iC7G piece of the wheel-in terminal (10) #杜When reading..,,,,^ When the 鳊βΗ and the contact pin 62 are in electrical contact, in this case, the tester transmits and receives the test signal through the test f&amp;, λ. ^ ^ b and the test signal of the 1C component. 'Execute the test of the IC it piece. The test result, as the barcode ^ 7 ^ ^, the identification of the owe temple is attached to the body of each client tray 7, or the data of the ^ ^ $ π μ 攸 processor Α transfer To the classification-specific device. When the test is completed, pick up

接觸板8在固持著測試完畢的1C 2247-1044i-PF;Alicewu ^ 201000380 . 元件的狀態下被搬出到除熱部4 0 〇 A。 第12A及12B圖顯示本發明第1實施型態中接觸板和 插座的另一例之概略斷面圖。 如第12A及12B圖所示,也可以不在接觸板8上設置 位置決定孔,當IC元件按壓到插座61時,藉由使位置決 疋針β 4抵接於固持單元8 7的側面,而決定I c元件對插座 61的位置。在此情況下,位置決定針61配置於如第1〇圖 所示之空間65中。 η — 第1 3Α及1 3Β圖顯示本發明第i實施型態中接觸板和 插座的再一例之概略斷面圖。 如第1 3A及1 3B圖所示,也可以不在接觸板8上設置 位置決定孔,當IC元件按壓到插座6 1時,藉由使位置決 定針64和1C元件的側面直接接觸,而決定κ元件對插座 61的位置。 在此情況下’可以使接觸板8 ’的表面平滑,並藉由 吸附來固持IC元件,以使得在位置決定時讓i c元件在接 觸板8’上可以稍微移動。藉此,能夠高度精確地使元 件對插座61決定其位置。再者,位置決定針64也可以為 圍繞IC元件四角的L字形狀的導件。 〈除熱部400A&gt; 除熱部400A具有除熱槽’其係用以將施加的熱應力從 測試完畢的1C元件上除去’如第丨圖所示,該除熱槽的内 部設有:將客端托盤7或接觸板7水平移動的第2水平搬 運裝置410A;使接觸板8中板81〜84之間的間隔變窄的第 2247-10441-PF;Alic ewu 23 201000380 2間隔變更機構420A;將客端托盤7蓋在接觸板8上,或 將接觸板8從客端托盤7上取下的第2裝卸裝置伽;在 接觸板8及客端托盤7重疊對準的狀態下將其反轉的第2 反轉裝置46〇A;以及第1圖中示意之垂直搬運裝置。 第2水平搬運裝置41G“’例如,由馬達驅動的複數 個回轉滚軸實際上平行並㈣2列而構成,而可以將接觸 板8從測試部300A搬到第2反轉裝置46〇A,並且,將客 端托盤7從第2反轉裝置460A搬到垂直搬運裝置。 如第1圖所示’帛2間隔變更機構42〇A具有和第丄間 隔變更機構260A之第卜第4凸輪溝26卜264成線對稱關 係的4條凸輪溝。而且,第2水平搬運裝置4ι_接觸板 8移向第2反轉裝置460A時,使接觸板8的第卜第4板 81〜84間的間隔變窄,而和客端托盤7的收納穴72之間的 間隔實際上為一致。 如第1圖所示,第2裝卸裝置43〇A和第i裝卸裝置 220A —樣,具有γ軸軌道431及2個可動頭44〇、45〇。 在本實施型態中,第1可動頭44〇在第2反轉裝置46〇八 和.回送裝置270A之間搬運客端粍盤7。相對於此,第2可 動頭450在第2反轉裝置460A和第!返送裝置47〇A之間 搬運接觸板8。 雖然並未特別圖示,第2反轉裝置46〇A和上述的第i 反轉裝置250A —樣,具備一對回轉部、分別相對地設置在 回轉部上的伸縮部、以及分別設置在各伸縮部的尖端的夾 2247-1044l-PF;Alicewu 201000380 2裝卸裝置43 0A將將客端 置41 0 A從測試部3 0 0 A搬出 18〇度’將固持在接觸板8 第2反轉裝置460A,在第 托盤7蓋在由第2水平搬運農 的接觸板8上之後,將其回轉 的固持穴89的所有1C元件,亩垃欲不,步 1个罝接移到客端托盤7的收納 八7 2中。再者’雖然並来4± Si| 禾特別圖不,為了避免客端托盤7 及接觸板8之干擾,第2水平掩谨驻罢^ &gt;卞搬連裝置41 0A的一部份,可 以在由第2反轉裝置460A反轉時下降。The contact plate 8 is carried out to the heat removing unit 40 〇 A while holding the tested 1C 2247-1044i-PF; Alicewu ^ 201000380 . Figs. 12A and 12B are schematic cross-sectional views showing another example of the contact plate and the socket in the first embodiment of the present invention. As shown in FIGS. 12A and 12B, the position determining hole may not be provided on the contact plate 8, and when the IC element is pressed to the socket 61, the position determining needle β 4 is abutted against the side of the holding unit 87. The position of the Ic element to the socket 61 is determined. In this case, the position determining needle 61 is disposed in the space 65 as shown in Fig. 1 . η - The first and third figures show a schematic cross-sectional view of still another example of the contact plate and the socket in the i-th embodiment of the present invention. As shown in FIGS. 1A and 13B, the position determining hole may not be provided on the contact plate 8, and when the IC element is pressed to the socket 61, the position determining pin 64 and the side of the 1C element are directly contacted. The position of the κ element to the socket 61. In this case, the surface of the contact plate 8' can be made smooth, and the IC element can be held by adsorption so that the ic element can be slightly moved on the contact plate 8' when the position is determined. Thereby, the position of the component to the socket 61 can be determined with high precision. Further, the position determining pin 64 may be an L-shaped guide that surrounds the four corners of the IC component. <The heat removal unit 400A> The heat removal unit 400A has a heat removal tank 'which is used to remove the applied thermal stress from the tested 1C element'. As shown in the figure, the inside of the heat removal tank is provided: The second horizontal conveying device 410A in which the passenger tray 7 or the contact plate 7 is horizontally moved; the 2247-10441-PF which narrows the interval between the plates 81 to 84 in the contact plate 8; Alic ewu 23 201000380 2 interval changing mechanism 420A The second loading and unloading device 380 is attached to the contact plate 8 or the contact plate 8 is removed from the passenger tray 7; and the contact plate 8 and the passenger tray 7 are overlapped and aligned. The inverted second inverting device 46A; and the vertical conveying device illustrated in Fig. 1. The second horizontal conveying device 41G "" is configured such that a plurality of rotating rollers driven by a motor are substantially parallel and (four) two rows, and the contact plate 8 can be moved from the test portion 300A to the second inverting device 46A, and The passenger tray 7 is transported from the second reversing device 460A to the vertical transport device. As shown in Fig. 1, the 帛2 interval changing mechanism 42A has the fourth cam groove 26 of the second interval changing mechanism 260A. In the case of the second horizontal conveying device 4i, the contact plate 8 is moved to the second inverting device 460A, and the interval between the fourth plates 81 to 84 of the contact plate 8 is made. The narrowing is substantially the same as the interval between the receiving pockets 72 of the passenger tray 7. As shown in Fig. 1, the second loading and unloading device 43A and the i-th loading and unloading device 220A have a γ-axis rail 431. And two movable heads 44A and 45〇. In the present embodiment, the first movable head 44〇 transports the passenger tray 7 between the second inverting device 46〇8 and the returning device 270A. The second movable head 450 conveys the contact plate 8 between the second inverting device 460A and the second returning device 47A. The second inverting device 46A and the above-described i-th inverting device 250A have a pair of turning portions, an elasticizing portion that is provided on the rotating portion, and a tip end of each of the extending and contracting portions. Clamp 2427-1041-4-PF; Alicewu 201000380 2 loading and unloading device 43 0A will carry the passenger terminal 41 0 A out of the test part 300 A to 18 degrees 'will be held on the contact plate 8 second reversal device 460A, in the tray 7After being placed on the contact plate 8 of the second level, the 1C component of the holding hole 89 which is rotated is transferred to the storage tray 8 of the passenger tray 7 in the first step. In addition, although the 4± Si| and the special picture are not, in order to avoid the interference between the passenger tray 7 and the contact plate 8, the second level is blocked, and a part of the moving device 41 0A is It can be lowered when inverted by the second inverting device 460A.

垂直搬運裝置’從第2水平搬運裝置4m接收客端托 盤7,並能夠固持著該客端托盤7使其依序上升。在該除 熱部400A中以施加部20(^對IC元件施以高溫的情況下, 藉由送風使1C元件冷卻回復到室溫後,班出道搬出部 500。另一方面,以施加部2〇(^對IC元件施以低溫的情況 下,以溫風或加熱器等將I c元件加熱回復到不產生凝結水 的概度後’搬出到搬出部5 〇 〇中。再者,施加部2 〇 〇 a中以 垂直搬運裝置使客端托盤7依序上升的情況下,在除熱部 400A中以垂直搬運裝置使客端托盤7依序下降。 在該除熱部400A中,藉由第2水平搬運裝置41〇a, 將固持著測試完畢的IC元件的接觸板8從測試部3 0 0 A搬 出到除熱部400A。第2水平搬運裝置410A將接觸板8移 到第2反轉裝置460A。繼之,第2裝卸裝置430A的第1 可動頭440,將由回送裝置270A從施加部200A出運的客 端托盤7,蓋在該接觸板8上。 繼之’第2反轉裝置460A,固持著接觸板8及客端托 盤7並使其回轉18 0度。藉此,將固持在接觸板8的固持 2247-1044l-PF;Alicewu 25 201000380 八89的所有Ic元件’一次移到客端托盤7的收納穴”。 由弟2反轉裝置侧反轉的期間,第… Γ;的一部份下降’但當…反轉農置的反^ 切 了降的』分即上升。繼之,當第2反轉裝置4_ %除固持時,接觸姑 接觸板8和客端托盤7被固持 運裝置410A上。 繼之’第2裝卸裝置43〇A的第2可動頭45〇,從客端 托盤7上旱下接觸板8 ’並將該接觸板8移到帛1返送裝 置47〇A。該接觸板8由帛1返送裝置47GA搬到施加部2_。 繼之,第2水平搬運裝置4m將客端托盤7移到垂直 搬運裝置。垂錢運裝置,在使客端托盤7上升之後,將 該客端托盤7交給搬出部5〇〇。 〈搬出部500&gt; 士第1圖所不,搬出部5〇〇包括:將客端托盤7從除 熱部400A搬出的搬出裝置51〇;將客端托盤7 一牧—枚地 從搬出裝置510疊放到疊放體7〇B的第2托盤移載裝置 520。 搬出裝置510和上述搬入裝置12〇 一樣,例如,由馬 達驅動的複數個回轉滾軸平行並排為2列而構成,而可以 將客端托盤7沿著γ軸方向移動。該搬出裝置5丨〇將位於 除熱部400A的垂直搬運裝置最上方的客端托盤7,從垂直 搬運裝置接收並將之搬出到搬出部500。 再者’如第1圖所示,第2托盤移載裝置520和搬入 部100的第1托盤移置裝置11〇 一樣,包括:γ軸軌道、 2247-10441-PF/Aiicewu 26 201000380 可動臂、固持頭、纟固持爪。該第2托盤移載裝置52〇, 能夠將由搬出裝i 510搬運之客端托盤7疊放在疊放體7〇β 的最上面。 如上述,在本實施型態中,藉由第1間隔變更機構 260A,變更在接觸板8的固持單元87之間的間隔。因此, 固持在接觸板8的固持穴89中的IC元件之間的間隔有一 部份變寬,測試頭6上的插座61之間的間隔的_部份也隨 f 之變寬,因此,能夠確保用於測試頭6上的配線的空間65 寬廣。 另外,在本實施型態中,設定2種間% P” P4作為接 觸板8中的固持單凡87之間的間隔。因此,能夠將固持在 接觸板1 2的IC元件之間的間隔部分地變寬,測試頭6上 、插座61之間的間隔的—部份也隨之變寬,而能夠確保用 於測試頭6上的配線的空間65寬廣。 [第2實施型態] 第14圖,.’、員不依據本發明第2實施型態之電子元件測試 裝置的全體構成之概略平面圖,第15及16圖顯示顯示用 ;第^ 4圖的電子70件測試裝置的第1及第2接觸板的斜視 圖第17及18圖顯示顯示用於第14圖的電子元件測試裝 置的第1及第2蓋板的斜視圖。 、如第14 16圖所示,在本實施型態中,接觸板的形狀 以及施加部、測辞' k 1 ° °卩及除熱部的構成和第1實施型態不 同’但其他的構成目丨丨4 &amp; 、和第1實施型態相同。以下,僅就第 2實施型態中的電子 几件測減裝置與第1實施型態之相異 2247-10441-PF;Alicewu 27 201000380 點進行說明,對於知楚1〜 _ '矛第1貫施型態為同樣構成之部分則標 示以同一符號並省略其說明。 首先,針對本實施型態中的接觸板(固持托盤)9A、9B 進行說明。 在本實施型態中,使用2種的接觸板9八、兆。接觸板 9A、9B兩者都不像第1營_ — # #上 — 弟1實轭型態中的接觸板8那樣伸縮, 如第15及16圖所示,複數的固持單元92以互相獨立而可 :微動的方式設置在本體板91上。固持單元92分別形成 口持IC tl件的固持穴93,固持單元92能夠—個一個 地口持ic兀件。再者’各固持單元92中,分別形置 在插座6i側之位置決定針可以插入的位置決定孔μ。° 接觸板9A、9B兩者都有32個固持 單元9 2的配置不相同。 &lt;一疋固持 如第15圖所示,第丄接觸板9A中,僅在第 一 之客端托盤7中配列於奇數行(第丨、 ^ 圖所示 禾3、第5、第7许) 的收納穴72所對應之位置配置固持單元 ^ / 則不配置固持單元92。 其他的位置 相對於此,第2接觸板9B中,如窜,p 如弟16圖所示 第2圖所示之客端托盤7中配列於偶數行(第 ' ’ 1 6、第8行)的收納穴72所對應之位置配置=、弟4、第 其他的位置則不配置固持單元92。 疋92 ’ 亦即,將第1接觸板9 A中的固持^ 、八的配置 2 接觸板9B中固持穴93整合觀之,則愈哲 i和弟^ -、第2圖所示 盤7的收納穴72的配置一致。 I h扣 2247-l〇441-PF;Aiicewu 28 201000380 再者,在本實施型態中’將1C元件在客端托盤7和接 觸板9A、9B之間移置時,分別使用如第1?及18圖所示之 板狀的蓋板1〇A、10B。蓋板1〇Α、1〇β兩者都開了複數的 窗部11。 第1蓋板10A係為’在施加部2〇〇A中,將κ元件從 客端托盤7移置到帛i接觸板9,時所使用的蓋板。該第ιThe vertical transport device ' receives the guest tray 7 from the second horizontal transport device 4m, and can hold the guest tray 7 in order to ascend. In the heat removing unit 400A, when the application unit 20 applies a high temperature to the IC element, the 1C element is cooled to room temperature by air blowing, and then the exiting unit 500 is removed. On the other hand, the applying unit 2 is applied. 〇 (^) When the IC device is subjected to a low temperature, the Ic element is heated and returned to the unloading water by the warm air or the heater, and then moved out to the carry-out unit 5. In addition, the application unit In the case where the passenger tray 7 is sequentially raised by the vertical conveyance device in the 〇〇a, the passenger tray 7 is sequentially lowered by the vertical conveyance device in the heat removal unit 400A. In the heat removal unit 400A, The second horizontal conveyance device 41Aa carries out the contact plate 8 holding the tested IC component from the test portion 300A to the heat removal portion 400A. The second horizontal conveyance device 410A moves the contact plate 8 to the second reverse Next, the first movable head 440 of the second loading and unloading device 430A covers the passenger tray 7 that is transported from the applying unit 200A by the returning device 270A on the contact plate 8. Following the second inversion The device 460A holds the contact plate 8 and the guest tray 7 and rotates it by 180 degrees. Thereby, it is held in contact The holding of the plate 8 is 2247-1044l-PF; all the Ic components of the Alicewu 25 201000380 八89 are moved to the storage hole of the passenger tray 7 at one time. The period of the reverse rotation of the device 2 is reversed, the first one Partial decline 'but when ... reverses the reverse of the farmer's cut, the score is increased. Then, when the 2nd reversal device 4_% is held, the contact panel 8 and the client tray 7 are held. On the transport device 410A, following the second movable head 45A of the 'second loading and unloading device 43A', the contact plate 8' is lowered from the passenger tray 7 and the contact plate 8 is moved to the 帛1 returning device 47A. The contact plate 8 is moved to the application unit 2_ by the 帛1 returning device 47GA. Then, the second horizontal conveying device 4m moves the passenger tray 7 to the vertical conveying device. After the passenger tray 7 is raised, the passenger tray 7 is raised. The passenger tray 7 is delivered to the carry-out unit 5〇〇. <Removing unit 500> The first carrying unit 5 includes a carrying-out unit 51 that carries the passenger tray 7 out of the heat removing unit 400A. The second tray transfer device 520 of the stack tray 7 is stacked from the carry-out device 510 to the stack 7B. The carry-out device 510 and the above-described carry-in Similarly, for example, a plurality of rotary rollers driven by a motor are arranged in parallel in two rows, and the passenger tray 7 can be moved in the γ-axis direction. The carry-out device 5 will be located in the heat removal portion. The passenger tray 7 at the top of the vertical conveyance device of the 400A is received from the vertical conveyance device and carried out to the carry-out unit 500. Further, as shown in Fig. 1, the second tray transfer device 520 and the loading unit 100 are 1 pallet shifting device 11〇, including: γ-axis track, 2247-10441-PF/Aiicewu 26 201000380 movable arm, holding head, tamping claw. The second tray transfer device 52A can stack the client tray 7 transported by the carry-out device i 510 on the uppermost side of the stack 7β. As described above, in the present embodiment, the interval between the holding units 87 of the contact plate 8 is changed by the first interval changing mechanism 260A. Therefore, a portion of the space between the IC elements held in the holding holes 89 of the contact plate 8 is widened, and the portion of the space between the sockets 61 on the test head 6 is also widened with f, thereby enabling Make sure that the space 65 for the wiring on the test head 6 is wide. Further, in the present embodiment, the two kinds of % P" P4 are set as the interval between the holding members 87 in the contact plate 8. Therefore, the interval portion between the IC elements held by the contact plate 12 can be set. As the ground is widened, the portion of the gap between the test head 6 and the socket 61 is also widened, and the space 65 for the wiring on the test head 6 can be widened. [Second Embodiment] No. 14 FIG. 2 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to a second embodiment of the present invention, and FIGS. 15 and 16 are for display; and FIG. Fig. 17 and Fig. 18 are perspective views showing the first and second cover plates for the electronic component testing device of Fig. 14. As shown in Fig. 1416, in the present embodiment, In the middle, the shape of the contact plate, the application portion, the measurement 'k 1 ° °卩, and the configuration of the heat removal unit are different from those of the first embodiment', but other configuration items 4 &amp; and the first embodiment are the same. In the following, only the electronic measuring and reducing device of the second embodiment is different from the first embodiment 2247-10441-P. F; Alicewu 27 201000380 Pointing, the same components are denoted by the same reference numerals, and the description thereof will be omitted. First, the contact plate in the present embodiment (for the first embodiment) The holding trays 9A and 9B will be described. In the present embodiment, two kinds of contact plates are used, and the contact plates 9A and 9B are not like the first camp __##上-弟1 The contact plate 8 in the form is stretched and contracted. As shown in Figures 15 and 16, the plurality of holding units 92 are independently and independently movable on the body plate 91. The holding units 92 respectively form the mouth holding IC tl pieces. The holding unit 93 can hold the ic unit one by one. In addition, the position of each holding unit 92 on the side of the socket 6i determines the position determining hole that the needle can be inserted. ° Contact plate 9A, 9B have 32 holding units 9 2 different configurations. &lt;One 疋 holding, as shown in Fig. 15, in the second contact plate 9A, only in the first guest tray 7 is arranged in odd rows (Differs, ^, Figure 3, 5, 7th) The holding unit is not disposed. The other positions are opposite to each other. In the second contact plate 9B, the second tray 9B is arranged in the passenger tray 7 shown in Fig. 2 as shown in Fig. 16. The positional arrangement corresponding to the storage hole 72 of the even-numbered row (the ' '16, the 8th row) = the second position, the other position is not the holding unit 92. 疋92', that is, the first contact plate 9 In the arrangement of the holdings and the eight in the A, the holding holes 93 in the contact plate 9B are integrated, and the arrangement of the receiving holes 72 of the disk 7 shown in Fig. 2 is the same. I h button 2247-l 〇 441-PF; Aiicewu 28 201000380 Furthermore, in the present embodiment, when the 1C element is displaced between the client tray 7 and the contact plates 9A, 9B, the first one is used. And the plate-shaped cover plates 1A, 10B shown in Fig. 18. Both of the cover plates 1 and 1 〇 β open a plurality of window portions 11. The first cover 10A is a cover plate used when the κ element is displaced from the passenger tray 7 to the 帛i contact plate 9 in the application unit 2A. The first

盖板^A+’如第17圖所*,係對應於第i接觸板9人中 固持單兀92的配列而配置了 32個窗部丨^。 方面第2蓋板10B係為,在除熱部中將 客端托盤7反轉時所使用的蓋板。該第2蓋板⑽中,如 第18圖所示,係對應於第2接觸S9B中固持單^的配 列而配置了 32個窗部ι j。 繼之,針對本實施型態之電子元件測試裝置說明之。 如第14圖所示,處理機1β包括:載人部⑽、施加 部20 0B、測試部3_、除熱部4_及搬出部5〇〇。 本實施型態中的施加部2〇〇β,和第t實施型態的施加 部20 0A 一樣具有恆溫槽。在該恆溫槽的内部設有如第 圖示意之垂直搬運裝置、第i水平搬運裝置麗、 卸裝置220B'第i反轉裝置25叩、第3反轉裝置、As shown in Fig. 17, the cover plate ^A+' is provided with 32 window portions corresponding to the arrangement of the holding members 92 of the i-th contact plate 9. The second cover 10B is a cover plate used when the guest tray 7 is reversed in the heat removing unit. In the second cover (10), as shown in Fig. 18, 32 window portions ι are arranged corresponding to the arrangement of the holding members in the second contact S9B. Next, the electronic component testing device of the present embodiment will be described. As shown in Fig. 14, the processor 1β includes a passenger unit (10), an application unit 20 0B, a test unit 3_, a heat removal unit 4_, and a carry-out unit 5A. The application portion 2〇〇β in the present embodiment has a constant temperature bath like the application portion 20 0A of the t-th embodiment. In the inside of the thermostatic chamber, a vertical conveyance device as shown in the drawings, an i-th horizontal conveyance device, a discharge device 220B'i-inversion device 25A, and a third reversing device are provided.

以^第3水平搬«置⑽。在本實施型態中的施加部2nR 和弟1實施型態中的施加部200A之相異處在於,其不且 第1間隔變更機構,而加入第3反轉裝置28〇β及第“、有 搬運裝置290。 &amp;平 水平 再者,該施加部200B具有之垂直搬運裝置、第 224 7-104 41-PF;Alicewu 29 201000380 搬運裝置2咖、第}裝卸裝置22qb、及第 若以下沒有特別說明,就表轉f置咖 搬運裝置、第1每竑刑诈心 、一孓態中的垂直 〗… 中的第1水平搬運繁置2m览 1裝卸裝置220A、及第i反轉 置210A、第 筮q g ±± 置25〇A為同樣的構成。 弟3反轉裝置28〇β和 攻 个罘1反轉裝置25〇b為 成,其係配置於第i反轉裝置_ 為相同之構 p , ^ λ ^ 达裝置270Β之間。 隨此W裝卸裝置2_的γ軸軌道221 裝置270Β、第3及第1凫隸壯 罘叹在回达 弟d及第1反轉裝置2議、25qb 裝置侧的上方。再者,本實施型態中的回弟1返达Move to the third level (10). The application unit 2nR in the present embodiment differs from the application unit 200A in the first embodiment in that the third inversion device 28〇β and the “,” are added instead of the first interval changing mechanism. There is a transport device 290. &amp; Leveling again, the application unit 200B has a vertical transport device, 224 7-104 41-PF; Alicewu 29 201000380 transport device 2 coffee, the first loading and unloading device 22qb, and the following In particular, the first horizontal conveyance 2m view 1 loading and unloading device 220A and the ith reverse reversal 210A are used in the vertical transfer of the first hand. , 筮qg ±± 25〇A is the same configuration. The brother 3 inverting device 28〇β and the attacking unit 1 inverting device 25〇b are formed, and the system is arranged in the ith inversion device_ The structure p, ^ λ ^ reaches between 270 装置. The γ-axis orbital 221 of the W loading and unloading device 2_ is 270 Β, the third and the first 凫 罘 罘 在 在 在 回 回 回 回 回 回 回 及 及 及, the top of the 25qb device side. Furthermore, the return of the brother 1 in this embodiment

及第1返送裝置470B,和第丨實施型r中的I、置270B 弟1貝%型悲中的回送裝置270A 及第1返达裝置470A為相同的構成。 第3水平搬運裝置290和帛1水平搬運裝置2⑽一 樣、,係為:例如…達驅動的複數個回轉滾軸實際上平 打並排為2列而構成,而可以將接觸板從第3反轉裝置m〇b 搬到測試部3 0 0 B。 如第14圖所不,本實施型態中的測試部3〇⑽中,$ 個測試頭6透過開口而進人測試室中,可以同時測試㈣ 在2牧的接觸&amp; 9A、9B中的Ic元件。本實施型態中的除 熱部400B,和第i實施型態中的除熱部4〇〇A 一樣具有除 熱槽。在該除熱槽的内部設有:第2水平搬運裝置4ι〇β、 第2裝卸裝置430B、第2反轉裝置460B、第4水平搬運裝 置480、第4反轉裝置490B、以及第14圖中示意之垂直搬 運裝置。 本貫施型悲中的除熱部4 0 0 B和第1實施型態之除熱部 224 7-104 41-PF;Alicewu 30 201000380 遍之相異處在於,其不具備第2 除熱部400B 1有μ ^置4_。再者’該 置侧、第2、^ 水平搬衫置41叩、第2農卸裝 有特別說明id置麵^直搬運裝置,若以下沒 裝置⑽、第”:其和第丨實施型態中的第2水平搬運 直搬運步署么 僅、第2反轉裝置侧及垂 直搬運裝置為同樣的構成。The first returning device 470B has the same configuration as the first transfer device 270A and the first return device 470A in the second embodiment. Similarly to the horizontal conveyance device 2 (10) of the first horizontal conveyance device 290, for example, a plurality of rotary rollers that are driven to be driven are actually laid in parallel and arranged in two rows, and the contact plate can be removed from the third inversion device. M〇b moved to the test section 300B. As shown in Fig. 14, in the test portion 3 (10) of the present embodiment, $ test heads 6 are inserted into the test chamber through the opening, and can be simultaneously tested (4) in the contact of &lt; 2A, 9B Ic component. The heat removing portion 400B in this embodiment has a heat removing groove like the heat removing portion 4A in the i-th embodiment. Inside the heat removal tank, a second horizontal conveyance device 4 〇β, a second attachment/detachment device 430B, a second reversing device 460B, a fourth horizontal conveyance device 480, a fourth reversing device 490B, and a 14th drawing are provided. A vertical handling device as indicated in the figure. The heat removal part of the present embodiment and the heat removal part 224 7-104 41-PF of the first embodiment; Alicewu 30 201000380 is different in that it does not have the second heat removal unit. 400B 1 has μ ^ set 4_. In addition, 'the side, the second, the second horizontal transfer shirt 41 叩, the second agricultural unloading special id surface straight handling device, if the following devices (10), the first: and the third implementation type The second horizontal conveyance straight conveyance step is the same as the second reverse rotation device side and the vertical conveyance device.

樣,2水平搬運裳置彻和第2水平搬運裝£ 410B 一 , ' ’’、、例如由馬達㈣的複數個回轉滾軸平行並排為2 列而構成’而可以將接觸板從測試部咖搬運到第*反轉 裝置490β ’並且,可以將客端托盤7俨篦4 搬到垂直搬運裳置。再者= 反轉裝置49°Β 運…。“第二二Γ型態中12水平搬 到第2反轉裝置46。:…不同,僅設置於測試部議 μ第j反轉裳置490Β和第2反轉裝置460Β的構成相同, °又置於第2反轉裝置460β和回送裝置270B之間。隨此, 第1裝卸裝置430Β的Υ軸軌道431橫跨架設在回送裝置 270Β、第4及第2反轉裝置4_、46〇β、及第i返&amp; 47〇β的上方。 繼之,說明本實施型態中電子元件測試裝置的動作。 本貝細型態申的處理機1 β中,將客端托盤7從裁入部 100搬入施加部200Β後,垂直搬運裝置使客端托盤7下降, 將該客端托盤7交給第1水平搬運裝置21〇β。第!水平搬 運裝置210Β,將該客端托盤7移到第}反轉裝置25〇β。 2247-10441-PF;Alicewu 31 201000380 繼之’第1裝卸裳置 + 置」20Β的苐1可動頭230,將固持 著的第1蓋板10Α蓋在該客端 今碼托盤7上。另一方面,第2 可動頭240,移動到筮】茯、、,# m ^运裝置470B,固持住從除埶部 400B搬來的第1拯觸姑〇A 、, A亚將其移動’蓋在客端托盤7 和第1蓋板10A上。 +繼之’ f 1反轉裝置250B,固持住客端托盤7、第1 盖板1〇A及第1接觸板9A並使其回轉⑽度。藉此,將收 納於位於客端托盤7中奇數耔夕 了數仃之收納穴72中的1C元件, 透過第1蓋板10A的窗部丨丨,一In this case, the 2 horizontal transporter is cut and the 2nd horizontal transporter is installed with a 410B, ''', for example, a plurality of rotary rollers of the motor (4) are arranged side by side in parallel to form 2 columns, and the contact plate can be taken from the test section. It is carried to the *reverse rotation device 490β' and the passenger tray 7俨篦4 can be moved to the vertical conveyance. Again = reversing device 49°Β.... "The second level is shifted to the second inversion device 46. The difference between the 12th and the second inversion devices 460 is set to be the same as that of the second reversal device 460. The second reversing device 460β is disposed between the second reversing device 460β and the rewinding device 270B. Accordingly, the reeling device 431 of the first loading and unloading device 430A is spanned across the returning device 270Β, the fourth and second reversing devices 4_, 46〇β, And the upper part of the i-th &amp; 47〇β. Next, the operation of the electronic component testing device in the present embodiment will be described. In the processor 1 β of the present embodiment, the guest tray 7 is taken from the cutting unit 100. After moving into the application unit 200, the vertical conveyance device lowers the passenger tray 7, and delivers the passenger tray 7 to the first horizontal conveyance device 21〇β. The second horizontal conveyance device 210Β moves the passenger tray 7 to the Inverting device 25〇β. 2247-10441-PF; Alicewu 31 201000380 Following the '1st loading and unloading set + setting' 20Β 苐1 movable head 230, the first cover 10 held by the cover is placed on the passenger end On the code tray 7. On the other hand, the second movable head 240 moves to the 筮, ,, #m 运机 470B, and holds the first sacred aunt A, which is moved from the sputum part 400B, and A ya moves it' Covered on the client tray 7 and the first cover 10A. + Following the ' f 1 reversing device 250B, the guest end tray 7, the first cover 1A, and the first contact plate 9A are held and rotated (10) degrees. As a result, the 1C component received in the storage pocket 72 located in the odd number of times in the guest tray 7 passes through the window portion of the first cover 10A.

-人扣置到苐1接觸板9A 的固持早元92中。另一方; 面’因為被第1蓋板1 0A堵住, 所以在位於客端托盤7 Φ彼去i / 盤7中偶數行之收納穴72中,1C元件 不會移到第1接觸板9A中。 由第1反轉裝置25〇b反轉 得的期間,弟1水平搬運裝置 21 0B的一部份下降, 告 社 田第1反轉裝置250B的反轉 '.、口束時,該已下降的部分上升。 木- The person is snapped into the holding element 92 of the 苐1 contact plate 9A. The other side; because the face is blocked by the first cover 10A, the 1C component does not move to the first contact plate 9A in the storage hole 72 located in the even-numbered row of the passenger tray 7 Φ to the i/disk 7. in. When the first reversing device 25〇b is reversed, a part of the horizontal conveying device 21 0B of the younger brother 1 is lowered, and the reverse rotation of the first reversing device 250B of the social field is reduced. Part of the rise. wood

解田姑士 繼之s弟1反轉裝置250B 解示口持¥,第!接觸板9Α、 又弟板1 〇A和客端托盤7 破固持在《1水平搬運裝置210B上。 繼之’第1裝卸裝置220B的筮1可知 第]宴4 , 的第1可動頭230,固持住 凰如1 0A和客端托盤7,並 移到筮Q , 卫竹具攸弟1接觸板9A上升, 移至i弟3水平搬運裝置29〇。 冲 Ψ 〇1Πβ 方面’弟1水平搬運裝 ’將第1接觸板9Α搬入測試部3_。 繼之’第3反轉裝置28〇β固 托盤7允枯甘姑 U得住弟1盍板10Α和客端 祀盤7並使其回轉ι8〇度。Jie Tian Gu Shi Following the s brother 1 reversal device 250B to explain the mouth holding ¥, the first! The contact plate 9A, the other board 1A and the client tray 7 are broken and held on the "1 horizontal conveying device 210B. Following the first movable head 230 of the '1st loading and unloading device 220B', the first movable head 230 of the first feast 4, holds the phoenix such as 10A and the client tray 7, and moves to the 筮Q, Weizhu with the younger brother 1 contact plate 9A rises and moves to the i-third level horizontal handling device 29〇. In the case of 冲 〇1Πβ, the first contact plate 9Α is carried into the test unit 3_. Following the '3rd reversal device 28', the β-solid tray 7 allowed the dry Gu Gu to get the 1st board 10 Α and the customer 祀 7 and turn it ι8〇.

反轉的细叫# 在由弟3反轉裝置280B 轉的』間,第3水平搬運裝置2qn沾 戒罝290的—部份下降,不過, 丄24 丄〇44_i-pp;Alicewu 32 201000380The reversal of the squeaking ## 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在

當第3反轉裝置28 OB的反轉結束時,兮P ^ 該已下降的部分上 升。繼之,當第3反轉裝置280B解除固牲蛀 u得㈠,客端托盤7 及弟1盍板10A又被固持在第3水平搬運襄置29〇上 繼之,第1裝卸裝置220B的第1可叙 布1』動碩230,從客端 托盤7上將第1蓋板10Α取下。繼之, 第1裝卸裝置220Β 的第2可動頭240將由第1返送裝置47〇R嫩才^ ㈧B搬來的第2接觸 板9B蓋在客端托盤7上。 繼之,第3反轉裝置麵,固持住客端托盤7及第2 接觸板9B並將其回轉18〇度。藉此,將留在位於客端托盤 7中偶數行之收納穴中的iC元件,— -入移置到第2接 觸板9B的固持單元92中。 如上述,在本實施型態中,藉由3次的反轉操作,將 收納在客端托盤7中的所有IC元件,移到第i及第 觸板9A、9B中。 由第3反轉裝置280B反轉的期問,笛Q a 丁When the inversion of the third inverting means 28 OB is ended, 兮P ^ the lowered portion rises. Then, when the third inverting device 280B releases the solid state, the guest tray 7 and the first board 10A are held by the third horizontal carrying device 29, and the first loading and unloading device 220B The first reproducible cloth 1 is moved 230, and the first cover 10 is removed from the passenger tray 7. Then, the second movable head 240 of the first loading and unloading device 220A covers the second contact plate 9B carried by the first returning device 47〇R (8) B on the guest tray 7. Next, the third reversal device surface holds the guest end tray 7 and the second contact plate 9B and rotates it by 18 degrees. Thereby, the iC element remaining in the accommodating pockets of the even rows in the passenger tray 7 is moved into the holding unit 92 of the second contact panel 9B. As described above, in the present embodiment, all of the IC components housed in the guest tray 7 are moved to the i-th and the first touch panels 9A and 9B by the three-time reversal operation. The period reversed by the third inversion device 280B, the flute Q a

L U間,第3水平搬運裝置 2二的—部份下降,不過,當第3反轉裝置議的反轉結 該已下降的部分上升。繼之,當第3反轉裝置2_ 解除固持時,第2接觸板9B和客端杯般7 v^ τ谷鲕托盤7又被固持在第3 水平搬運裝置290上。 繼之,第!裝卸裝置220Β的第2可動頭24〇,從第2 接觸板9Β上拿下客端托盤7,並 I肘忒客端托盤7移到回送 裝置270Β。另一方面,第3水平 &gt;卞搬運裝置290將第2接觸 VB搬入測試部麵。再者,為了避免裝卸裝置22〇β、 的可動頭之間的干擾,各卸裝置220Β、侧中的γ 2247-i〇44i_PF;Alicewu 33 201000380 軸執道221、431延長到同圖下方。 在測試部300B中執行IC元件的測試之後,第】及第 2的接觸板9A、9B被搬出到除熱部40〇b。 在除熱部400B中,由第2水平搬運裝置41〇β將第工 接觸板9A移到第2反轉裝置46qb時,第2 |卸裝置伽 的第2可動頭450,將由回送裝置27〇β從施加部2〇⑽搬 來的客端牦盤7’蓋在第1接觸板9A上。 繼之,f 2反轉裝置460B,固持住第i接觸板^及 客:㈣7並使其回轉180度。藉此,將第ι接觸板^固 持¥的所有1(:元件’—次移置到位於客端托盤7 之收納穴72中。 由第2反轉裝置460B反轉的期間,第2水平搬運裝置 侧的-部份下降’不過,當第2反轉裝置侧的:轉 結束時,該已下降的部分上升。繼之,當第2反轉裝置_ 解除固持時,客端托盤7及第i接觸板9八又被固持 水平搬運裝置41 0B上。 繼之,第2裝卸裝置430B的第2可叙π。 不4』動碩450,從客端 托盤7上取下第丨接觸板9Α,並將 乐1接觸板9Α移到 弟1返送裝置4 70Β。另一方面,第2奘知壯 弟Ζ裝卸裴置430Β的第1 可動頭440,將固持著的第2蓋板1 〇Β, ^ 汉υβ盍在位於第2水平 抵^運裳置41 0Β上的客端托盤7上。 繼之’第2反轉裝置460Β,固持住安#』Λ —4 行住各端托盤7和第2 盍板10Β並將其回轉18〇度。在此 ^ . 1n W轉之時,因為被第2 1板1 0 B堵住,所以在位於客端托盤 〖中奇數行之收納穴 2247-l〇441-Pr;Allcewu 34 201000380 72中,1C元件不會從收納穴72中掉出。 由第2反轉裳置侧反轉的期間,第2水平 1部份下降,不過,當第2反轉裝置·的反二 結束時,該p 丁陳AA _、 j久轉 叮連已下降的部分上升。 解除固拄&lt; 田弟2反轉裝置460B 除固持時,第2蓋板1 0B和客端杯 Λ ^ m 各為托盤7又被固持在第2 水十搬運裝置41〇B上。 、繼之’第2裝卸裝置侧的第1可動頭440,將第2 盍板10B及客端托盤7,芸在 |在由第水平搬運裝置48〇送 第4反轉裝置49〇B的第2接觸板9b上。 1繼之,第4反轉裝置侧固持住第2接觸板9B、第2 盍板1〇B和客端托#7並使其回轉18。度。藉此,將第2 接觸板9B固持著的所有IC元件,_ _人移置到位於客端杯 盤7的偶數行的收納穴72中。 繼之,第2裝卸農置侧的第2可動頭45〇,從將第 接觸板9B從第2蓋板_及客端托盤7上取下,並將該 弟2接觸板9B移到第i返送裝置47〇b。繼之 裝置43〇B的第1可動頭440從客端托盤7上取下第2蓋板 1 0B。 客端托盤7從第4水平搬運裝置48〇交給垂直搬運裝 置,並藉由垂直搬運裝置下降後搬㈣搬㈣_。、 如上述,本實施型態中,藉由第1及第3反轉裝置 250B、280B,將1C το件疏散並從客端拓 托盤7移到接觸板 9A、9B。因此’固持於接觸板9A、_ic元件之間的間 隔有部分變寬,測試頭6上的插座61之間的間隔也隨之加 2247-10441-PF;Alicewu 35 201000380 寬a因此’忐夠確保用於測試頭上的配線的空間寬廣。 [第3實施型態] 、、 第19圖顯不依據本發明第3實施型態之電子元件測試 、置的全體構成之概略平面圖,第2〇圖顯示顯示用於第 圖的电子元件測試裴置的接觸板的斜視圖,第21 a ~ 2 ^ ρ ^顯示用以說明本發明第3實施型態中電子元件測試裝置 的動作的斷面圖。 如弟19圖所示,右太杏始并】山 在本貝施型態中,%加部及除熱部的 構成和第1實施型能π π U冋。另外,在本實施型,態中,使用 1實施型態中被使用作為接觸板的第3及4圖所示之板 8作為中間板,並使用第2〇圖所示之板12作為接觸板。 亦即’在本實施型態中’先將1C元件從客端托盤7移到中 間板(固持板)8’再將IC元件從中間板8移到接觸板(固持 ^ )1 2 M T ’僅就第3實施型態、中的電子元件測試裝置與 第^實施型態之相異點進行說明,對於和第工實施型態為 5 κ構成之„卩分則標示以同一符號並省略其說明。 、 耳先,針對本實施型態中的接觸板】2進行說明。 士弟2 0圖所示,本實施型態中的接觸板12包括:基 板12a、固持在該基板12a的8個固持單元12b。該接觸板 ^之各固持單元12b不能相對於基板⑺滑動,此點和 1實施型態之接觸板8大不相同。 固持單7L 1 2b和第1實施型態之接觸板8的固持單元 87的構成相同。各固持單元12b的表面上,分別形成第1 位置決定1 ]2d和8個固持穴12c。再者,形成第2位置 2247-a〇442_PF;Alicewu 36 201000380 決疋孔12e的突出片12f從固持單元12b的側面突出,而 且還形成該突出片12f可以插入的插入孔12g。雖然並 未特別圖不’各固持單元12b以相同於第1實施型態的要 7貝’以犯夠對於基板12a分別獨立微動的方式固持著。 接觸板12中固持穴12 c的配列,和中間板8中固持穴 89的配列實際上是一致的。S者,帛20 SI所示之接觸板 12的間隔pe、p8和第2圖所示之客端托盤7中的間隔、 P2實質上是一致的。(Ρ6 = Ρι、匕叶2)。亦即,接觸板i2中在 X方向鄰接的2個固持單元12b中的16個固持穴12c的配 列’和第2圖所示之客端托盤7中的固持穴89的一部份的 配列實質上是一致的。 再者,如第20圖所示,在本實施型態中,和第i實施 里態中展開的接觸才反8 一樣’以相對較窄的第】間隔h及 較第1間隔P6寬的第2間隔p7(p6&lt;p7),作為沿著γ軸方向 之固持穴1 2c之間的間隔。依第2間隔P?配列之固持穴丄&amp; 之間的間隔S4為依第i間隔p6配列之固持穴12。之間的間 隔Ss的5倍以上較佳(S4S3X5),為1〇倍以上更佳(sg SsxlO)。 繼之,針對本實施型態之電子元件測試裝置說明之。 如第19圖所示,處理機1C包括:載人部⑽、施加 部200C、測試部300C、除熱部4〇〇c及搬出部5〇〇。而且, 本實施型態、的測試部3〇〇C和帛i實施型態中的測試部讓 為同樣的構成。 本實施型態中的施加部 200C,和第1實施型態的施加 224 7- ]_〇“l-PF; Ali ce wu 37 201000380 部200A —樣具有恆溫槽。在該恆溫槽的内部設有如第i9 圖示意之垂直搬運裝置、第i水平搬運裝置21〇c、第i裝 卸裝置220C、第3裝卸裝置225、第i反轉裝置25〇c、第 1間隔變更機構260C、第3間隔變更機構265、第2反轉 裝置2_ '以及第2返送裝置295。在本實施型態中的施 加部200C和第1實施型態令的施加部2〇〇A之相異處在 於’加入第3裝卸裝置225、f 3間隔變更機構265、第2 反轉裝置280B、及第2返送裝置295。 再者,該施加部200C具有之垂直搬運裝置 '第i水平 搬運裝置21GC、第1裝卸裝置22()(:'及第工反轉裝置2抓 及第/間隔變更機構2,,若以下沒有特別說明,就表示 其和第1實施型態中的垂直搬運裝置、f i μ 第1水平搬運裝置210Α、第1裝卸裝置22〇Α、第i反轉裝 置25〇A及第丨間隔變更機構26(^為同樣的構成。 在本實施型態中,第i裝卸裝置讀橫跨架設在回送 裝置27〇C、第1水平搬運裝置2i〇c、及第2返送裝置295 '方而且’第1裝卸裳置22〇c的第i可動頭將 中間板8從第2返送裝置295搬運到第】水平搬運裝置 210C。相對於此,$ 2可動頭24〇,將客端托盤7從第工 水平搬運裝置21⑽搬運到回送裝置270C。 、弟2反轉裝置280c配置在第丄間隔變更機構和 測減部3〇〇C之間。該第2反韓步 反轉衣置280C和第2實施型態 〒的第2反轉裝置28〇β為相同的構成。 弟3裝卸裝置225包括:在處理機1C的主基座上沿著 38 201000380 Y軸方向架号夕 VL ^ v . 軸軌道226 ;以能夠在該Y軸軌道226上 ;;8者。轴方向移動的方式支撐之第1及第2可動頭227、 第2 = 3裴卸裴置225橫跨架設在第1返送装置47〇C、 裝卸裝^置咖、及第2返送裝置295的上方。該第3 搬運裝置2125的第1可動頭奶,將中間板8從第1水平 e 、QC运到第2返送裳置295。相對於此,第2可 動頭2 2 8將接觸板i 2從篦^ 搬運裝置咖。 第返送裝置峨送到第1水平 =返送農置295為,例如,由馬達驅動的複數個回 ΓΓ上平行並排…而構成,而可以使中間板8 向移動。另外’在該第2返送裝置295上,設 間隔變更機構峨相同構造之第3間隔變更機 構265,在第2返送裝 … 將中間板8從第3裝卸裝置 225搬到第1裝告梦 .1 , 卸裝置22〇C的期間,能夠使中間板8中的 第卜弟4板8卜84間的間隔變窄。 ”再者’本實施型態中的回送裳置270C,和第!實施型 悲中的回送裝置27〇a 』之構成。再者,本實施型態中 的^返送裝置峨係設置在第4裝卸裝置挪和第2裝 卸I置225之間,除此點外 送裝置侧的構成相同。…第1實施型態的第丨返 本實施型態中的除埶部4〇 卜 熱部侧-樣具有除熱槽。在外和/1實施型態中的除 μ除熱槽的内部設有:第2 水平搬運裝置㈣、第2間隔變更機構嫩、第4間隔變 2247-l〇441-pF;Alicewu 39 201000380Between the L U and the third horizontal conveying device 2 - the portion is lowered, but when the third reversing device is reversing, the lowered portion rises. Then, when the third reversing device 2_ is released from holding, the second contact plate 9B and the guest cup-like 7 v^ τ trough tray 7 are again held by the third horizontal conveying device 290. Following, the first! The second movable head 24A of the loading and unloading device 220A removes the passenger tray 7 from the second contact plate 9A, and moves the elbow passenger tray 7 to the returning device 270. On the other hand, the third level &gt; 卞 conveyance device 290 carries the second contact VB into the test portion surface. Further, in order to avoid interference between the movable heads of the loading and unloading device 22〇β, the γ 2247-i〇44i_PF of each of the unloading devices 220 and the side, and the Alicewu 33 201000380 shafts 221 and 431 are extended to the lower side of the same figure. After the test of the IC element is performed in the test unit 300B, the first and second contact plates 9A and 9B are carried out to the heat removing unit 40〇b. In the heat removing unit 400B, when the second contact conveying device 41A moves the second working device 9A to the second reversing device 46qb, the second movable head 450 of the second unloading device is returned by the returning device 27. The guest disk 7' carried by the application unit 2A (10) is placed on the first contact plate 9A. Next, the f 2 inverting device 460B holds the i-th contact plate and the guest: (4) 7 and rotates it by 180 degrees. Thereby, all 1 (: element ' of the first contact plate holding member ¥ is displaced to the storage pocket 72 located in the passenger tray 7. During the period of reverse rotation by the second reversing device 460B, the second horizontal conveyance On the side of the device, the portion is lowered. However, when the second reversing device is turned: the lower portion is raised. Then, when the second reversing device _ is released, the client tray 7 and the The i-contact plate 9 is again held by the horizontal transporting device 41 0B. Next, the second loading and unloading device 430B can be twentieth π. The fourth contact plate 9 is removed from the passenger tray 7. And the Le 1 contact plate 9 is moved to the brother 1 returning device 4 70. On the other hand, the second movable head 440 of the second 奘 壮 壮 Ζ Β Β Β Β , , , , , , 第 第 第 第 第 第 第 第^ ^ 汉υβ盍 is located on the passenger tray 7 on the 2nd level of the 裳 运 置 41 41 41 41 41 。 。 。 。 。 。 。 。 Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β 第 第 第 第The second raft 10 turns and turns it 18 degrees. At this time, when the 1 n W turns, it is blocked by the 21st board 10B, so it is located in the storage tray 224 of the odd-numbered row in the passenger tray. 7-l〇441-Pr; Allcewu 34 201000380 72, the 1C element does not fall out of the accommodating hole 72. The second level 1 part falls during the period in which the second reversal side is reversed, but when At the end of the second inversion of the second inverting device, the portion of the p-single AA_, j that has been lowered for a long time has risen. The release of the solid body &lt; the Tiandi 2 reversing device 460B, in addition to the holding, the second cover 1 0B and the client cup Λ ^ m each of the trays 7 is held by the second water ten transport device 41〇B. Next, the first movable head 440 on the second loading and unloading device side, the second seesaw 10B And the passenger tray 7 is placed on the second contact plate 9b of the fourth reversing device 49A by the horizontal conveyance device 48. 1 Next, the fourth reversing device side holds the second contact plate. 9B, the second slab 1 〇 B and the guest pedestal #7 are rotated by 18. degrees. Thereby, all the IC components held by the second contact plate 9B, _ _ people are displaced to the guest cup tray In the storage hole 72 of the even-numbered row of 7th, the second movable head 45A on the second loading/unloading side is removed from the second cover_and the guest tray 7 from the second contact plate and the guest tray 7 The brother 2 contact plate 9B moves to the i-th return device 47〇b Next, the first movable head 440 of the device 43〇B removes the second cover 10B from the passenger tray 7. The passenger tray 7 is handed over from the fourth horizontal conveyance device 48 to the vertical conveyance device, and is vertically conveyed. After the device is lowered, the device is moved (four) to move (4). As described above, in the present embodiment, the 1C and the third inverting devices 250B and 280B are evacuated and moved from the guest tray 7 to the contact plate 9A. 9B. Therefore, the interval between the contact plates 9A and _ic elements is partially widened, and the interval between the sockets 61 on the test head 6 is also increased by 2247-10441-PF; Alicewu 35 201000380 is wide a thus ensuring The space for wiring on the test head is wide. [Third Embodiment] FIG. 19 is a schematic plan view showing the overall configuration of an electronic component according to a third embodiment of the present invention, and FIG. 2 is a view showing an electronic component test for the drawing. The oblique view of the contact plate, the 21st to 2^ ρ ^ shows a cross-sectional view for explaining the operation of the electronic component testing device in the third embodiment of the present invention. As shown in Figure 19, the right apricot is the same as the first embodiment. The composition of the % plus and heat removal parts can be π π U冋. Further, in the present embodiment, the plate 8 shown in Figs. 3 and 4 used as the contact plate in the first embodiment is used as the intermediate plate, and the plate 12 shown in Fig. 2 is used as the contact plate. . That is, 'in this embodiment', the 1C component is first moved from the client tray 7 to the intermediate plate (holding plate) 8' and the IC component is moved from the intermediate plate 8 to the contact plate (holding ^) 1 2 MT 'only In the third embodiment, the electronic component testing apparatus and the second embodiment will be described. The same reference numerals are given to the fifth embodiment of the first embodiment, and the description thereof is omitted. The ear contact plate 2 in the present embodiment will be described. The contact plate 12 in this embodiment includes a substrate 12a and eight holdings held on the substrate 12a. The unit 12b. The holding unit 12b of the contact plate cannot slide relative to the substrate (7), which is quite different from the contact plate 8 of the first embodiment. The holding sheet 7L 1 2b and the contact plate 8 of the first embodiment are The configuration of the holding unit 87 is the same. The first position determination 1] 2d and the eight holding holes 12c are formed on the surface of each holding unit 12b. Further, the second position 2247-a 〇 442_PF is formed; Alicewu 36 201000380 The protruding piece 12f of 12e protrudes from the side of the holding unit 12b, and also forms the protrusion 12f can be inserted into the insertion hole 12g. Although not specifically shown, the respective holding units 12b are held in the same manner as in the first embodiment, so that the substrate 12a is independently micro-moved. The arrangement of the retaining pockets 12c is substantially identical to the arrangement of the retaining pockets 89 in the intermediate plate 8. S, the spacing of the contact plates 12 shown by 帛20 SI, pe, p8, and the passenger tray shown in Fig. 2 The interval between P7 and P2 is substantially the same (Ρ6 = Ρι, 匕 leaf 2), that is, the arrangement of 16 holding holes 12c of the two holding units 12b adjacent in the X direction in the contact plate i2 and The arrangement of a part of the holding pockets 89 in the guest tray 7 shown in Fig. 2 is substantially identical. Further, as shown in Fig. 20, in the present embodiment, and the i-th implementation The contact developed in the middle is the same as the 'relatively narrower interval' h and the second interval p7 (p6 &lt; p7) wider than the first interval P6, as between the holding holes 1 2c along the γ-axis direction Interval. The interval S4 between the holding holes amp and the spacing according to the second interval P? is the holding hole 12 arranged at the ith interval p6. More preferably 5 times or more (S4S3X5), more preferably 1 time or more (sg SsxlO). Next, the electronic component testing device of the present embodiment will be described. As shown in Fig. 19, the processor 1C includes: The human part (10), the application part 200C, the test part 300C, the heat removal part 4〇〇c, and the carry-out part 5〇〇. Moreover, the test part 3〇〇C and the 帛i implementation type test part of this embodiment form. The application unit 200C in the present embodiment has a constant temperature bath as in the application 224 7- ]_〇 "l-PF; Ali ce wu 37 201000380 part 200A" of the first embodiment. A vertical conveyance device, an i-th horizontal conveyance device 21〇c, an i-th loading and unloading device 220C, a third attachment/detachment device 225, an i-th reversing device 25〇c, and a first one as shown in the i-th diagram are provided inside the thermostatic chamber. The interval changing mechanism 260C, the third interval changing mechanism 265, the second inverting device 2_', and the second return device 295. The difference between the application unit 200C in the present embodiment and the application unit 2A in the first embodiment is that the third attachment/detachment device 225, the f3 interval changing mechanism 265, and the second inversion device 280B are added. And a second return device 295. Further, the application unit 200C includes the vertical conveyance device 'i-th horizontal conveyance device 21GC and the first attachment/detachment device 22 () (: 'and the reversing device 2 grasps the second/interval change mechanism 2, if none of the following In particular, the vertical conveyance device, the fi μ first horizontal conveyance device 210 , the first attachment/detachment device 22 , the i-th reversing device 25A, and the second interval changing mechanism 26 in the first embodiment are shown. (^ is the same configuration. In the present embodiment, the i-th loading and unloading device reads across the returning device 27〇C, the first horizontal conveying device 2i〇c, and the second returning device 295' and the first The i-th movable head that attaches and detaches the skirt 22〇c transports the intermediate plate 8 from the second returning device 295 to the first horizontal conveying device 210C. On the other hand, the $2 movable head 24〇 and the passenger tray 7 are from the working level. The conveyance device 21 (10) is conveyed to the return device 270C. The second rotation device 280c is disposed between the second interval changing mechanism and the measurement and reduction unit 3C. The second anti-Korean step reverse clothing 280C and the second embodiment The second inversion device 28〇β of the state has the same configuration. The third loading and unloading device 225 includes: in the processor 1C's main base along the 38 201000380 Y-axis direction frame VL VL ^ axis track 226; can be supported on the Y-axis track 226; 8 in the axial direction to support the first and second The movable head 227 and the second = 3 裴 裴 225 are placed across the first returning device 47〇C, the loading and unloading device, and the second returning device 295. The first moving device 2125 is movable first. The head milk transports the intermediate plate 8 from the first level e and QC to the second returning skirt 295. On the other hand, the second movable head 2 28 transports the contact plate i 2 from the 篦^ to the device. It is sent to the first level = the returning farm 295 is configured, for example, a plurality of backs that are driven by the motor are arranged in parallel, and the intermediate plate 8 can be moved. Further, the second returning device 295 is provided. The third interval changing mechanism 265 of the same structure can move the intermediate plate 8 from the third attaching and detaching device 225 to the first cloaking machine 1 and the unloading device 22 〇 C. The interval between the first and fourth plates 8 and 84 in the intermediate plate 8 is narrowed. "Furthermore" in the present embodiment, the returning skirt 270C, and the implementation of The configuration of the returning device 27〇a 』 in the present type of sorrow. Further, the returning device in the present embodiment is disposed between the fourth loading and unloading device and the second loading and unloading I 225, and the feeding device is removed. The configuration of the side is the same. The third embodiment of the first embodiment has the heat removing groove on the side of the heat removing portion 4, and the heat removing groove in the outer and /1 embodiment. The inside is provided with: 2nd horizontal conveying device (4), 2nd interval changing mechanism tender, 4th interval changing 2247-l〇441-pF; Alicewu 39 201000380

更機構425、第4裝卸襞置Q 置435、第2反轉裝置460C、第3 返送裝置4 75、第4反轉裝罢 釋裝置49〇C、以及第19圖中示意之 垂直搬運裝置。 本實她型態中的除熱部4〇〇c和第i實施型態之除熱部 400A之相異處在於’新加 入弟4間隔變更機構425、第4 裝卸裝置435、第3返送裝罢jryp; 裝置475、及第4反轉裝置49〇c。 另外,該除熱部400C具有mm 9 + τ ’的弟2水平搬運裝置410C、第2 間隔變更機構420C、第?骷土壯w 2裝卸裝置430C、第2反轉裝置 460C及垂直搬運裝置,若 卜 以下,又有特別說明,就表示其和Further, the mechanism 425, the fourth loading/discharging device Q 435, the second reversing device 460C, the third returning device 475, the fourth reversing device 49C, and the vertical conveying device illustrated in Fig. 19 are provided. The difference between the heat removal unit 4〇〇c in the present embodiment and the heat removal unit 400A in the i-th embodiment is that the 'new addition brother 4 interval changing mechanism 425, the fourth loading and unloading device 435, and the third returning device are different. The jryp; the device 475, and the fourth inverting device 49〇c. Further, the heat removal unit 400C has a younger horizontal conveyance device 410C of mm 9 + τ ', a second interval changing mechanism 420C, and a first?骷土壮w 2 loading and unloading device 430C, second reversing device 460C and vertical conveying device, if specifically described below,

第1實施型態中的第2水平搬谨#jΛ A 十搬運扁置410A、第2間隔變更 機構420A'第2裝 … 裝卸裝置430A、第2反轉裝置460A及垂 直搬運裝置為同樣的構成。 施型態中’第2裳卸裝置復係橫跨架設在回 =置加:第2反轉裝置㈣及第4返送裝置仍的 板 第2裝卸裝置43〇C的第2可動頭440將中間 ==二搬運咖搬到第3返送裝置475。相 到第2 〇將客端托盤7從回送裝置厦送 到弟2水平搬運裝置41 0C。 弟4反轉裝置49〇c配置於測試部3〇 更機構420C之, 不弟Z間Ik變 間。該第4反轉裝置490C和第2 f 中的第4反糙壯里々弟」貫把型恶 欠轉衣置490B的構成相同。 第4裝卸裝置435包括··在處理機 Υ軸方向竿〜纟處理機1C的主基座上沿著 沿著道436;以能夠在該Y輛軌道樓上 心向移動的以支撐之第可動頭437、 2247一10441 一㈣ icewu 仏 201000380 438 ° 第4裝卸裝置435橫 4反轉裝置49QC、及第3方又在^返送裝置鐵、第 卸裝置435的第!可動&lt;/^置475的上方。該第4裝 置475送 S 437,將中間板8從第3返送裝 _ 水平搬運裝置41〇C。相對於此,第2可動 頭438將接觸板12從第2 送裝置4取。 尺千搬運裝置⑽送到第 送裝置475 $,例如,由馬達驅㈣複數㈣ 轉滾軸只際上平行並排為 沿著X軸方向移動。另― 使甲間板8 審七 動另外,在該第 :第2間隔變更機構42〇c相同構造之 籌-,在第3返送裝置4?5將中間板8從第2裝卸= 430C搬到第4梦、置 〗弟4裝卸裝置435的期間,能夠使中間板8中的 第卜弟4板81〜84間的間隔變寬。 繼之,說明本實施型態中電子元件測試裝置的動作。 本實施型態中的處理機1C中,將客端托盤7從載入部 1〇0搬入施加部讀後,垂直搬運裝置使客端托盤7下降° 將該客端托盤7交給第1水平搬運裝置⑽。第!水平搬 運裝置21°C,將該客端托盤7移到第i反轉裝置250C。另 外’在本實施型態中,如第21A圖所示,ic元件係以輪出 入端子朝上的狀態收納於客端牦盤7中。 繼之,第1裝卸裝置220C的第1可動頭221,使中間 板8攸第2返送裝置295移動,如第21A圖所示,將 間板8蓋在客端托盤7上。 2247*l〇441-PF;Alicewu 41 201000380 繼之’第1反轉襞置250Γ in姥 8 It# J: ι«η ^ 口持住客端托盤7及中間板 8並使其180度回轉。藉 般7 * ΛΑ Μ 士 Μ 得—次將收納在客端托 盤7中的所有1C元件移到中 „ ^ Α 】中間板8的固持穴89中。在此 反轉的期間,第1水平搬運 ώ ^ 1 c ^ ^ 置Z1〇C的一部份下降,但當 由弟1反轉裝置250C的反轉社走日士 „ 得、、,α束蚪,該已下降的部分即上 升。繼之,當第1反轉裝置2卩μ μ ^ — 发置250C %除固持時,中間板8和 各端托盤7被固持在第1次芈 ' 承丄水干搬運襞置210C上。 繼之’第1裝卸震詈9 — 〇C的第2可動頭240,固持住 蓋在中間板8上的客端私般7 、, 托盤7,亚使其移動到回送裝置 270C(參照第21Β圖)。由 田回达裝置270C將該客端托盤7搬 運到除熱部400C。 繼之,第1水平搬運奘罟9inr At丄 逆裝置21 0C使中間板8朝向第3反 轉裝置28〇c移動。在此移動期間,藉由第1間隔變更機構 260C使中間板8中各板81〜84之間的間隔變寬。第1水平 搬運裝置2 1 0C使中間板8 A銘# # &amp; # π , &gt; j饭8再移動,並使其停止在第3裝卸 裝置225下方。 又 繼之,第3裝卸農置225的第2可動頭228,使接觸 板12從第1返送裝置47〇c移動,並將該接觸板12蓋在中 間板8上。 繼之,第2反轉裝置28〇c固持住中間板8和接觸板 12並使其回轉180度(參見第2Κ圖藉由此回轉,_次 將收納在中間板8中的所有IC元件移到接觸板丨2的固持 穴12c中。在此反轉的期間,第i水平搬運裝置2l〇c的— 部份下降,但當由第2反轉裝置280C的反轉結東時,該已 2247-10441-PF;Alicewu 42 201000380 下降的部分即上升。 ^之’當第2反轉裝置280C解除固持 時,接觸板12和中鬥 甲間板8又被固持在第1水平搬運奘 210C 上。 如上述,在本實施型態中,藉由2次的反轉操作,將 收納在客端托盤7中的所有I。元件,移到接觸板12中。 而且’在1C元件以輪出入端子朝下狀態收納在客端托盤7 中的情況下,要再追加一牧接觸板12,執行3次的反轉操 作。 Γ·' 、鏖之第3裝卸裝置225的第1可動頭227,固持住 蓋在接觸板12上的中間板8,並使其移動到第2返送裝置 295。並猎由第2返送裝置295將該中間板8送回第1裝卸 裝置220C。在此移動期間,藉由第3間隔變更機構挪使 中間板8中的第1〜第4板8卜84間的間隔變窄。 第1水平搬運裝置210C,將接觸板12搬入測試部 300C,如第21D圖所示,在測試部3〇〇c中執行ic元件之 D 測試。當測試結束之後,將接觸板12搬出到除熱部4〇〇c。 在除熱部4〇〇C中’第2水平搬運裝置41叱將接觸板 12移到第4反轉裝置_C。繼之’第4裝卸裝置435的第 1可動頭437’將中間板8從第3返送裝置475移動,使該 接觸板12蓋在中間板8上。 繼之,第4反轉裝 8’並使其回轉180度。藉由此回轉’―次將收納在接觸板 12中的所有1C元件移到中間板8的固持穴89中。在此反 轉的期間,第2水平搬運裝置410C的一部份下降,但當由 2247-1044l-PF;Alicewu 43 201000380 第1反轉裝置25GC的反轉結束時,該已下降的部分即上 升繼之田第4反轉裝置490c解除固持時,中間板8和 接觸板12被固持在第2水平搬運裝置41〇c上。 繼之,第4襄卸裳置435的第2可動頭,固持住 蓋在中間板8上的接觸板12 ’並使其移動到第i返送装置 470C由第1返送裳置47〇c將該接觸板搬運到施加部 200C。 繼之,第2水平搬運裝置41qc使中間板8朝向第2反 轉裝置460C移動。在此移動期 420C使中間板8中各板81〜84 搬運裝置410C使中間板8再移 裝置430C下方。 間’藉由第2間隔變更機構 之間的間隔變窄。第2水平 動’並使其停止在第2裝卸 繼之,f 2裝卸裝置43〇c的第2可動頭45〇,使客端 托盤7從回送裝置270C移動,並將該客端㈣了蓋在中間 板8上。 繼之,第2反轉裝置46〇c固持住中間板8和客端托 7並使其回轉18〇度。藉由此回轉,一次將收納在中間板 中的所有ic元件移到客端托盤7的固持7”。在此反 的期間,f 2水平搬運裝置41GC的—部份下降,但當由 2反轉裝f 46GC的反轉結束時,該已下降的部分即上升 繼之’當帛2反轉裝置460C解除固持時,客端托盤7和 間板8又被固持在第2水平搬運裝置41 〇c上。 “繼之’第2裝卸裝置430C的第1可動頭440,固持 盍在客端托盤7上的中間板8,使其移動到第3返送裝 2247-104^i-pF;AiiCewu 201000380 . 475。第3返送裝置475將該中間板8送回第4裝卸裝置 4 3 5 ’並在此送回的期間,藉由第4間隔變更機構4 2 5使中 間板8中的第1〜第4板81〜84間的間隔變寬。 客端托盤7係由第2水平搬運裝置410C交給垂直搬運 裝置’藉由垂直搬運裝置上升之後,即搬出到搬出部5〇〇。 如上述,在本實施型態中’藉由第1間隔變更機構 260C ’變更在中板8的固持單元89之間的間隔,並在維持 配列的狀態下從中間板8移到接觸板12,並在承載於接觸 板12的狀態下執行I c元件的測試,因此,固持在接觸板 12的固持穴8 9中的IC元件之間的間隔有一部份變寬,測 試頭6上的插座61之間的間隔的一部份也隨之變寬,因 此’能夠確保用於測試頭6上的配線的空間6 5寬廣。 另外’在本實施型態中,設定2種間隔pe、P7作為接 觸板1 2中的固持穴12 c之間的間隔。因此,能夠將固持在 接觸板12的1C元件之間的間隔部分地變寬,測試頭6上 I 的插座61之間的間隔的一部份也隨之變寬,而能夠確保用 於測試頭6上的配線的空間6 5寬廣。 [第4實施型態] 第22圖顯示依據本發明第4實施型態之電子元件測試 裝置的全體構成之概略平面圖,第23圖顯示第22圖的電 子元件測试裝置的移置裝置之吸附頭的底面圖。 … 如第22圖所示,在本實施型態中,施加部及除熱部的 構成和第1實施型態不同。而且,本實施型態和第1實施 型態不同處還有,使用第2〇圖所示之接觸板(固持板)^ 2247-10441-PF;Alicewu Δς 201000380 來取代第3及4圖所示之接觸板8。另外,本實施型態有 別於第3實施型態’不使用第3及4圖所示之中間板8, 而將1C元件直接從第2圖所示之客端托盤7移置到第2〇 圖所示之接觸板1 2。以下,僅就第3實施型態中的電子元 件測試裝置與第1實施型態之相異點進行說明,對於和第 1實施型態為同樣構成之部分則標示以同一符號並省略其 說明。 如第22圖所示,處理機1D包括:載入部1〇〇、施加 部200D、測試部300D、除熱部4〇〇D及搬出部5〇(^而且, 本實施型態的測試部300D和第!實施型態中的測試部3〇〇a 為同樣的構成。 本實施型態中的施加部200D,和第1實施型態的施加 邛2 0 0 A —樣具有恆溫槽。在該恆溫槽的内部設有如第2 2 圖不思之垂直搬運裝置、第!水平搬運裝置2i〇D、第丄裝 卸裝置22GD、及第!移置裝置2Q5。在本實施型態中的施 加°卩2〇〇D和第1實施型態中的施加部200A之相異處在 於,不具有第1反轉裝置及第丄間隔變更裝置,並新加入 第1移置裝置205。 再者該施加部200D具有之垂直搬運裝置、第丨水平 搬運裝置21GD、第1 I卸裝置22GD,若以下沒有特別說明, =表不其和第1實施型態中的垂直搬運裝置、帛1實施型 ^中的第1水平搬運裝置2〗0A、第1裝卸裝置220A為同 樣的構成。 該知加部2〇〇D之垂直搬運裝置,和帛1實施型態之施 2247-l〇441-PF;Allcewu 201000380 加部200A之垂直搬運梦 裝置不同,其使得客端托盤依序上 升。另外,該施加部? η η η以松,仙 的第1裝卸裝置22〇]),i第i 可動頭230由Y軸軌谨991 „ * /、 裨軌遏221早邊固持支撐住,並且In the first embodiment, the second horizontal transport unit #jΛ A ten transport flat 410A, the second interval changing mechanism 420A' second assembly... the loading and unloading device 430A, the second reversing device 460A, and the vertical transport device have the same configuration. . In the embodiment, the second movable head 440 is placed across the second movable head 440 which is erected in the back = setting plus: the second reversing device (4) and the fourth returning device still plate second loading and unloading device 43A == Two carriers are moved to the third return device 475. The second tray is transported from the returning device to the second horizontal conveying device 41 0C. The 4th inversion device 49〇c is disposed in the test unit 3, the mechanism 420C, and does not change the I-between. The fourth inverting device 490C and the fourth inversion in the second f are the same in the configuration of the type of the under-returning device 490B. The fourth loading and unloading device 435 includes: along the main pedestal of the processor Υ 竿 纟 纟 processor 1C along the track 436; to be movable in the heart of the Y track, to support the movable Head 437, 2247 - 10441 - (4) icewu 仏 201000380 438 ° 4th loading and unloading device 435 horizontal 4 reversing device 49QC, and the third party in the ^ return device iron, the first unloading device 435! Move &lt;/^ to set the top of 475. The fourth device 475 sends S 437 to move the intermediate plate 8 from the third returning device _ horizontal conveying device 41 〇C. On the other hand, the second movable head 438 takes the contact plate 12 from the second feeding device 4. The thousands of handling devices (10) are sent to the delivery device 475$, for example, by the motor drive (four) plural (four) the revolving shafts are parallel and parallel along the X-axis direction. In addition, the inter-board 8 is reviewed and the other structure is the same as that of the second interval changing mechanism 42〇c, and the intermediate plate 8 is moved from the second loading/unloading=430C to the third returning device 4-5. During the fourth dream and the fourth loading and unloading device 435, the interval between the fourth plates 81 to 84 in the intermediate plate 8 can be widened. Next, the operation of the electronic component testing device in the present embodiment will be described. In the processor 1C of the present embodiment, after the client tray 7 is carried from the loading unit 1〇0 into the application unit, the vertical transport device lowers the client tray 7 and delivers the client tray 7 to the first level. Handling device (10). The first! The horizontal transport device 21 ° C moves the passenger tray 7 to the ith reversing device 250C. Further, in the present embodiment, as shown in Fig. 21A, the ic element is housed in the guest tray 7 with the wheel inlet and outlet terminals facing upward. Then, the first movable head 221 of the first attaching and detaching device 220C moves the intermediate plate 8 and the second returning device 295, and as shown in Fig. 21A, the intermediate plate 8 is placed on the passenger tray 7. 2247*l〇441-PF; Alicewu 41 201000380 Following the '1st reversal setting 250Γ in姥 8 It# J: ι«η ^ Hold the passenger end tray 7 and the intermediate plate 8 and make it rotate 180 degrees. By the way, 7C ΛΑ Μ Μ — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — ώ ^ 1 c ^ ^ Set a part of Z1 〇C to fall, but when the reversal of the brother 1 reversing device 250C goes to the Japanese, the falling part rises. Then, when the first inverting device 2 卩 μ μ ^ - is placed at 250 C % for holding, the intermediate plate 8 and the end trays 7 are held by the first 芈 ' 丄 丄 丄 襞 210 210 210 210C. Following the second movable head 240 of the 'first loading and unloading shock 9', the holder 2 is held by the guest on the intermediate plate 8, and the tray 7 is moved to the returning device 270C (refer to the 21st page). Figure). The guest tray 7 is transported to the heat removing unit 400C by the field return device 270C. Then, the first horizontal conveyance 奘罟9inr At reverse device 21 0C moves the intermediate plate 8 toward the third reverse rotation device 28〇c. During this movement, the interval between the plates 81 to 84 in the intermediate plate 8 is widened by the first interval changing mechanism 260C. The first level conveyance device 2 1 0C causes the intermediate plate 8 A Ming # # &amp;# π , &gt; j rice 8 to move again, and stops it below the third loading and unloading device 225. Then, the second movable head 228 of the third loading/unloading 225 is moved to move the contact plate 12 from the first returning device 47〇c, and the contact plate 12 is placed on the intermediate plate 8. Then, the second inverting device 28〇c holds the intermediate plate 8 and the contact plate 12 and rotates it by 180 degrees (see the second drawing, by which the entire IC component housed in the intermediate plate 8 is moved. In the holding hole 12c of the contact plate 丨2, during the reversal period, the portion of the i-th horizontal conveying device 211c is lowered, but when it is reversed by the reversal of the second reversing device 280C, 2247-10441-PF; Alicewu 42 201000380 The falling portion is raised. ^" When the second reversing device 280C is released, the contact plate 12 and the middle armor plate 8 are again held on the first horizontal carrying cassette 210C. As described above, in the present embodiment, all of the I components housed in the guest tray 7 are moved into the contact plate 12 by the two inversion operations, and 'in the 1C component, the wheel is inserted into the terminal. When it is stored in the passenger tray 7 in the downward state, a further grazing contact plate 12 is added, and the reverse operation is performed three times. The first movable head 227 of the third loading and unloading device 225 of Γ·' The intermediate plate 8 covering the contact plate 12 is moved and moved to the second returning device 295. The hunting device 295 is used by the second returning device 295. The intermediate plate 8 is returned to the first attaching and detaching device 220C. During this movement, the interval between the first to fourth plates 8 and 84 in the intermediate plate 8 is narrowed by the third interval changing mechanism. 210C, the contact plate 12 is carried into the test portion 300C, and as shown in Fig. 21D, the D test of the ic element is performed in the test portion 3〇〇c. After the end of the test, the contact plate 12 is carried out to the heat removing portion 4 c. In the heat removing unit 4〇〇C, the second horizontal conveying device 41 moves the contact plate 12 to the fourth inverting device_C. Then, the first movable head 437' of the fourth loading and unloading device 435 is in the middle. The plate 8 is moved from the third returning device 475, and the contact plate 12 is placed on the intermediate plate 8. Then, the fourth reversing device 8' is rotated by 180 degrees. All of the 1C elements in the plate 12 are moved into the holding pockets 89 of the intermediate plate 8. During this reversal, a portion of the second horizontal handling device 410C is lowered, but when by 2247-10414-PF; Alicewu 43 201000380 When the reversal of the reversing device 25GC is completed, the lower portion, that is, the rising fourth row reversing device 490c is released, the intermediate plate 8 is connected. The plate 12 is held by the second horizontal conveying device 41〇c. Then, the second movable head of the fourth unloading 435 is held, and the contact plate 12' covering the intermediate plate 8 is held and moved to the first The i returning device 470C transports the contact plate to the applying unit 200C by the first returning skirt 47〇c. Then, the second horizontal conveying device 41qc moves the intermediate plate 8 toward the second inverting device 460C. The plates 81 to 84 of the intermediate plate 8 are transported by the device 410C so that the intermediate plate 8 is moved again below the device 430C. The interval between the second interval changing mechanisms is narrowed. The second horizontal movement 'stops the second movable head 45〇 of the f 2 loading and unloading device 43〇c, and the passenger tray 7 is moved from the returning device 270C, and the passenger (four) is covered. On the intermediate plate 8. Next, the second reversing device 46A holds the intermediate plate 8 and the passenger carrier 7 and rotates it by 18 degrees. By this rotation, all the ic elements housed in the intermediate plate are moved to the holding 7' of the passenger tray 7 at a time. During this period, the portion of the f 2 horizontal carrying device 41GC is lowered, but when inverted by 2 At the end of the reversal of the reloading f 46GC, the lowered portion is raised, and then when the reversing device 460C is released, the client tray 7 and the intermediate plate 8 are again held by the second horizontal conveying device 41. c. "Next, the first movable head 440 of the second loading and unloading device 430C holds the intermediate plate 8 on the passenger tray 7, and moves it to the third returning device 2247-104^i-pF; AiiCewu 201000380 475. The third returning device 475 returns the intermediate plate 8 to the fourth loading and unloading device 4 3 5 ' and returns the first to fourth plates of the intermediate plate 8 by the fourth interval changing mechanism 4 5 5 during the return period. The interval between 81 and 84 is widened. The client tray 7 is delivered to the vertical transport device by the second horizontal transport device 410C, and is carried out to the carry-out portion 5A after being raised by the vertical transport device. As described above, in the present embodiment, the interval between the holding units 89 of the intermediate plate 8 is changed by the first interval changing mechanism 260C', and is moved from the intermediate plate 8 to the contact plate 12 while the arrangement is maintained. The test of the Ic element is performed in a state of being carried on the contact plate 12, and therefore, a portion of the space between the IC elements held in the holding hole 8.9 of the contact plate 12 is widened, and the socket 61 on the test head 6 is widened. A portion of the interval between them is also widened, so that the space for the wiring on the test head 6 can be ensured to be wide. Further, in the present embodiment, two kinds of intervals pe and P7 are set as the interval between the holding holes 12c in the contact plate 12. Therefore, the interval between the 1C elements held by the contact board 12 can be partially widened, and a portion of the interval between the sockets 61 of the test head 6 is also widened, and the test head can be secured. The space on the wiring 6 of 6 is wide. [Fourth embodiment] Fig. 22 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to a fourth embodiment of the present invention, and Fig. 23 is a view showing the adsorption of the displacement device of the electronic component testing device of Fig. 22. The bottom view of the head. As shown in Fig. 22, in the present embodiment, the configuration of the applying portion and the heat removing portion is different from that of the first embodiment. Further, in the present embodiment, the difference between the first embodiment and the first embodiment is that the contact plate (holding plate) 2247-10441-PF shown in Fig. 2; Alicewu Δς 201000380 is used instead of the third and fourth figures. Contact plate 8. Further, this embodiment differs from the third embodiment in that the intermediate plate 8 shown in Figs. 3 and 4 is not used, and the 1C element is directly displaced from the guest tray 7 shown in Fig. 2 to the second. The contact plate 1 2 shown in the figure. In the following, the electronic component testing apparatus of the third embodiment will be described with reference to the first embodiment, and the same components as those of the first embodiment will be denoted by the same reference numerals and will not be described. As shown in Fig. 22, the processor 1D includes a loading unit 1A, an application unit 200D, a test unit 300D, a heat removal unit 4D, and a carry-out unit 5 (and, in addition, the test unit of this embodiment) The test unit 3〇〇a in the 300D and the third embodiment has the same configuration. The application unit 200D in the present embodiment has a constant temperature bath as in the application of the first embodiment. The inside of the constant temperature bath is provided with a vertical conveyance device, a second horizontal conveyance device 2i〇D, a second loading and unloading device 22GD, and a second displacement device 2Q5 as shown in Fig. 2 in the present embodiment. The difference between the 卩2〇〇D and the application unit 200A in the first embodiment is that the first reversing device and the second interposition changing device are not provided, and the first disposing device 205 is newly added. The vertical conveyance device, the second horizontal conveyance device 21GD, and the first discharge device 22GD provided in the portion 200D are not described below, and the vertical conveyance device and the first embodiment are in the first embodiment. The first horizontal conveyance device 2A and the first loading and unloading device 220A have the same configuration. The vertical transport device is different from the vertical transport dream device of the ce1 implementation type 2247-l〇441-PF; Allcewu 201000380 plus 200A, which causes the guest tray to rise sequentially. In addition, the application portion η η η Iso, the first loading and unloading device 22〇]), i, the i-th movable head 230 is supported by the Y-axis rail 991 „ * /, 裨 rail curb 221, and

可動頭240。另外,a 士一 、嘴弟ZThe movable head 240. In addition, a Shi Yi, Mouth Z

在本貫靶型態中,第1裝卸裝置220D 僅橫跨架設在第1水平搬運W㈣ 的上方。該第1裝卸裝置2_,將接觸板12從第!返送 裝置47GD搬到第1水平搬運裝置21GD。再者,第工返、关 裝置侧和第1實施型態之第1返送裝置4m 一樣 由例如輸送帶所構成,脸,, 苒成將接觸板12從除熱部400D送回施 加部200D。 如第22圖所示,第丄移置裝置2〇5包括:在處理機 1D的主基座上沿著γ軸方向設置之γ軸軌道2〇6 ;被固持 為能夠在上述之Υ轴執道上沿著¥軸方向移動的吸附 頭207。該第!移置裝置挪將以件從位於垂直搬運震 置最上面的客端托盤7移到固持於第i水平搬運裳置2丨肋 的接觸板1 2。 如第23圖所示,吸附頭207上裝設有可以吸附固持 1C元件的16個吸附墊2〇8。該吸附墊2〇8配列為2行8列。 沿著Y軸方向的吸附墊208之間的間隔為Pg,而沿著X軸 方向的吸附墊208之間的間隔為Ριβ。此Pg#〇 ρ!。,和第$ 圖所示之客端托盤7中的間隔P!、P2實質上為—致,並 也和第20圖所示之接觸板12中的間隔pe、h實質上為— 致(P9 = p1 = pe’ 。藉此,第i移置裝置,不2改 變間隔’而能夠將16個1(;元件從客端托盤7移置到接: 2247-l〇441-PF;Aiicewu 47 201000380 板12。再者,裝在吸附頭2ϋ7^ 只要在不需要改變間隔的範圍内即可,並不特別限制己列, 如’將8個吸附塾2〇8以間隔pe、ps配列成2行“例 f承載於客端托盤7的1。元件由第1移置裳置205移置 到接觸板12之後,空的客料盤了㈣由回送 從施加部2嶋搬運到除熱部伽。在本實施型離中的 送裝置咖為’例如,由馬達驅動的複數個回轉;;二回 :排…而構成,…將客端托盤7沿著心I: Λ本實施型態的除熱部侧,和第1實施型態中的除埶 »&quot;〇〇Α —樣具有除熱槽。在該除熱槽的内部設有: =一第2裝卸裝置、第2移置裝置二 二第22圖中示意之垂直搬運製置。本實施型態的除敎部 讎和第i實施型態之除熱部_之相異處在於,其不 具備第2間隔變更機構,及第2反轉裝置。 、 再者,該除熱部4GDD具有的第2水平搬運裝置4_ 第2一裝卸裝置側、及垂直搬運裝置,若以下沒有特別說 ^就表不其和第i實施型態中的第2水平搬運裝置“θ'、 第2裳卸裝置43GA、及垂直搬運裝置為同樣的構成。 該除熱部4_的第2裝卸裝置其帛i可動頭 糊由y轴軌道431單邊固持支撑住,並具有第2可動頭 45〇。另外,在本實施型態中,第2裝卸裝置侧僅橫跨 架設在第2水平搬運裝置4⑽和第工返送裝置侧的: 方。該第2裝卸裝置430D,將接觸板12從第2水平搬運 224 ,-l〇441-PF;Alicewu 4 6 201000380 裝置410D搬到第1返送裝置47〇d。 第2移置裝置叫上述第丨移 構成,其能夠將1C元件從固持於 5為相同的 的接觸板i2,移置到回回送袭置2_水平搬運裝置⑽ 上。除熱部4GGD的垂直搬運裝置 =的各端托盤7 部400A不同’其使客端托盤7依序下降Y貫施型態的除熱 繼之,說明本實施型態中電 兔子70件測試裝置的動作。 本實施型態中的處理機1D中,將客端托盤7從載入部 100搬入⑯加部2GGD後,垂直搬運裝置使客端托盤7上升。 繼之,第^移置裝置205,將測試前的以件從位於垂直 搬運裝置最上面的客端托盤7移到固持於第!水平搬運裝 置210D的接觸板12上。 在此移置之時,在本實施型態中,客端把盤7中收納 穴72之間的間隔Pl、?2及接觸板12中固持穴12。之間的 間隔p6、P8實際上是一致的(Pl=P6,P2=P8),因此,能夠不 V,/ 變更1C το件之間的間隔,而藉由第i移置裝置2〇5 一次將 16個1C元件移置。在本實施型態中,能夠藉由一共4次 的移置,將客端托盤7上的所有的Ic元件移置到接觸板 12上。 藉由第1水平搬運裝置210D將滿载了 IC元件的接觸 板1 2搬入測試部3 〇 〇 D。繼之,當在測試部3 〇 〇 d中結束IC 元件的測試之後,將接觸板1 2搬出到除熱部4 〇 〇 D。另一 方面’沒有1C元件的客端托盤7’則藉由回送裝置270D 送回除熱部400D。 2247-1044l-PF;Alicewu 49 201000380 在除熱°卩40 0D中,第2水平搬運裝置410D將接觸板 12移到第2裝卸裳置430D及第2移置裝f 405的動作區 域内。繼之,笛 〇 &gt; 、' 弟2移置裝置4 0 5將測試完畢的IC元件,從 固持在第2水平搬運裝置41 0D上的接觸板12移到藉由回 L裝置270D而從施加部2〇〇D送回的客端托盤7上。 由垂直搬運裝置使滿載測試完畢的1C元件之客端托 盤7下降之後,搬出到搬出部500。 h作為接 能夠將固持在 ,測試頭6上 而能夠確保用 如上述,本實施型態中,設定2種間隔 觸板1 2中的固持穴87之間的間隔。因此, 接觸板1 2的I c元件之間的間隔部分地變寬 的插座61之間的間隔的一部份也隨之變寬, 於測試頭6上的配線的空間65寬廣。 ,在本實施型態中,客端托盤7的收納穴72 的:間隔P]、P2及接觸板12中固持穴12c之間的間隔/In the normal target type, the first attaching and detaching device 220D is spanned only above the first horizontal transport W (four). The first loading and unloading device 2_, the contact plate 12 is from the first! The return device 47GD is moved to the first horizontal conveyance device 21GD. Further, the first returning and closing device side is constituted by, for example, a conveyor belt in the same manner as the first returning device 4m of the first embodiment, and the face is brought back to the applying unit 200D from the heat removing unit 400D. As shown in Fig. 22, the second displacement device 2〇5 includes: a γ-axis track 2〇6 disposed along the γ-axis direction on the main base of the processor 1D; is held to be capable of being held on the above-mentioned axis A suction head 207 that moves in the direction of the ¥ axis on the track. The first! The displacement device moves the member from the passenger tray 7 located at the uppermost position of the vertical transporting movement to the contact plate 12 held at the ith level to carry the ribs. As shown in Fig. 23, the adsorption head 207 is provided with 16 adsorption pads 2〇8 which can adsorb and hold the 1C element. The adsorption pad 2〇8 is arranged in two rows and eight columns. The interval between the adsorption pads 208 along the Y-axis direction is Pg, and the interval between the adsorption pads 208 along the X-axis direction is Ριβ. This Pg#〇 ρ!. And the intervals P!, P2 in the guest tray 7 shown in Fig. $ are substantially the same, and also the intervals pe, h in the contact plate 12 shown in Fig. 20 are substantially - (P9 = p1 = pe'. By this, the i-th displacement device can change 16 intervals without changing the interval'; the component is displaced from the client tray 7 to: 2247-l〇441-PF; Aiicewu 47 201000380 Plate 12. Further, it is installed in the adsorption head 2ϋ7^ as long as it does not need to change the interval, and is not particularly limited. For example, '8 adsorption 塾2〇8 are arranged in 2 rows at intervals pe and ps. "Example f is carried on the passenger tray 7 1. After the element is displaced by the first displacement skirt 205 to the contact plate 12, the empty passenger tray (4) is transported from the application portion 2 to the heat removal portion by the return. In the present embodiment, the delivery device is 'for example, a plurality of rotations driven by a motor; two: a row... constitutes, ... the heat removal of the passenger tray 7 along the center I: In the side of the unit, and in the first embodiment, the sputum has a heat removal tank. The inside of the heat removal tank is provided with: = a second loading and unloading device, and a second displacement device. Figure 22 The vertical transportation device is schematically illustrated. The decoupling portion of the present embodiment differs from the heat removal portion of the i-th embodiment in that it does not include the second interval changing mechanism and the second inverting device. Further, the second horizontal conveying device 4_the second loading and unloading device side and the vertical conveying device included in the heat removing portion 4GDD are not particularly described below, and the second horizontal conveying in the i-th embodiment is not described. The device "θ', the second swinging device 43GA, and the vertical transporting device have the same configuration. The second attaching and detaching device of the heat removing portion 4_ is supported by the y-axis rail 431 and supported by the y-axis rail 431, and The second movable head 45 is provided. In the present embodiment, the second loading and unloading device side spans only the side of the second horizontal conveying device 4 (10) and the second working device. The second loading and unloading device 430D, The contact plate 12 is moved from the second horizontal conveyance 224, -l 441-PF; Alicewu 4 6 201000380 device 410D to the first return device 47 〇d. The second displacement device is called the above-described third transfer configuration, which is capable of 1C. The component is moved from the contact plate i2 which is held at 5 to the same, and is moved to the returning and feeding device 2_ horizontal conveying device The vertical transfer device of the heat removal part 4GGD=the end tray 7 part 400A is different', which causes the guest tray 7 to be sequentially lowered, and the heat removal of the end tray type is followed, indicating that the electric rabbit is 70 pieces in this embodiment. In the processor 1D of the present embodiment, after the client tray 7 is carried into the 16-plus-part 2GGD from the loading unit 100, the vertical transport device raises the guest tray 7. Then, the second shift is performed. The device 205 moves the pre-test components from the client tray 7 located at the top of the vertical transport device to the first stage! The contact plate 12 of the horizontal transporting device 210D is placed. At the time of this displacement, in the present embodiment, the passenger places the interval P1 between the pockets 72 in the tray 7. 2 and holding the hole 12 in the contact plate 12. The interval between p6 and P8 is actually the same (Pl=P6, P2=P8). Therefore, it is possible to change the interval between the members without V, /, and by the ith shifting device 2〇5 once. The 16 1C elements are displaced. In the present embodiment, all of the Ic components on the guest tray 7 can be displaced onto the contact board 12 by a total of four displacements. The contact plate 1 2 loaded with the IC element is carried into the test unit 3 〇 〇 D by the first horizontal transfer device 210D. Then, after the test of the IC element is ended in the test portion 3 〇 〇 d, the contact plate 1 2 is carried out to the heat removing portion 4 〇 〇 D. On the other hand, the passenger tray 7' without the 1C component is returned to the heat removing portion 400D by the returning device 270D. 2247-1044l-PF; Alicewu 49 201000380 In the heat removal device 40D, the second horizontal conveying device 410D moves the contact plate 12 into the operation area of the second loading and unloading skirt 430D and the second displacement loading device 405. Then, the flute&gt; and the "2" shifting device 405 move the tested IC component from the contact plate 12 held on the second horizontal transfer device 41 0D to the return from the L device 270D. The part 2〇〇D is sent back to the passenger tray 7. The guest tray 7 of the 1C component that has been fully loaded and tested is lowered by the vertical conveyance device, and then carried out to the carry-out portion 500. The h can be held by the test head 6 and can be secured as described above. In the present embodiment, the interval between the holding holes 87 in the two kinds of the spaced contact plates 1 2 is set. Therefore, a portion of the interval between the sockets 61 in which the interval between the Ic elements of the contact plate 12 is partially widened is also widened, and the space 65 of the wiring on the test head 6 is wide. In the present embodiment, the spacing P], P2 of the receiving pockets 72 of the client tray 7 and the spacing between the holding pockets 12c in the contact panel 12 /

Ps實際上是-致的’因此,能夠不變更ic元件之門的Μ 6 而藉由第1移置裝…UC元件。件之間的間隔 初再者’上述說明的實施型態’係記载用以使得容“ 解本發明,並非記載用於限定 離中揭露夕“主 因此,上述實施变 :變更或4:包含屬於本發明技術領域内所有_ N如,在第1實施 的固持穴構成之固持群之間的間㈣ 、疋數 限。例如,名mI _ π 4、 ~並不特別以此 」如纟固持…成—個一個的固持穴 心…個—個裝在板上’藉由使 4 更更機構將板. ^247-i〇44i-PF;Alicewu 5〇 201000380 間的間隔拉寬,而使得所有的固持穴之間的間隔變寬亦可。 再者,第1實施型態中,係說明如將收納在客端托盤 的所有的IC元件都移置到接觸板上。在第2實施型態中, 、i說月如將IC兀件從客端托盤隔行地拉開間隔移置到接 仁疋並不特別以此為限。例如,冑IC元件從客 端托盤隔2行地移置到接觸板上,或將特定行除外之其他 IC 7L件從客端托盤移到接觸板上均可。 Γ 再I +用反轉裝置作為將1(:元件在客端托盤和接觸 之間移置的移置手段,而使用取放裝置等亦可。 【圖式簡單說明】 第1圖顯示依據本發明望1眘 采不土明弟1實知型態之電子元件測試 裝置的全體構成之概略平面圖。 元件測試裝置的客端托 第2圖顯示用於第1圖的電子 盤之斜視圖。Ps is actually - so that the UC element can be mounted by the first displacement without changing the Μ 6 of the gate of the ic element. The interval between the pieces is the same as the description of the embodiment described above, which is used to make the invention "unexplained" and is not intended to limit the disclosure. "Therefore, the above implementation changes: change or 4: inclusion It belongs to the technical field of the present invention, such as the number of turns (four) and the number of turns between the holding groups constituted by the holding holes of the first embodiment. For example, the name mI _ π 4, ~ is not particularly "as 纟 纟 成 成 成 成 个 个 个 个 个 个 个 个 个 个 个 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 ^ ^ ^ The gap between the 〇44i-PF; Alicewu 5〇201000380 is widened, so that the interval between all the holding holes can be widened. Further, in the first embodiment, it is explained that all the IC elements housed in the guest tray are placed on the contact plate. In the second embodiment, it is not particularly limited to the fact that the IC device is intermittently displaced from the passenger tray to the connector in the month. For example, the 胄IC component can be displaced from the guest tray to the contact panel 2 rows, or other IC 7L components except the specific row can be moved from the guest tray to the contact panel. Γ I + use the reversing device as the displacement means for displacement of the component between the passenger tray and the contact, and use the pick-and-place device or the like. [Simple description of the drawing] Figure 1 shows the basis SUMMARY OF THE INVENTION A schematic plan view of the overall configuration of an electronic component testing apparatus of a well-known type is disclosed. Fig. 2 is a perspective view of the electronic disk used in Fig. 1 .

第3圖顯示顯示用於第i圖的電子元件測試裝置的接 觸板的斜視圖。 面 圖 面圖 第4圖顯示第3圖的接觸板展開 第5圖顯示第3圖的接觸板的背 第6圖顯示沿著第3圖的VI-VI 第7圖顯示第1圖的電子元件測 狀態的斜視圖。 面圖。 線的斷面圖。 試裳置的搬入部的 平 8園顯不弟 圖的電子元件測試叢置的施加部的平 2247-1044l-PF;Alicewu 201000380 第9圖顯示沿著X軸觀看第!圖的電子元件測試裝置 的施加部的正面圖。 第10圖顯示第1圖的電子元件測試裝置的測試頭的上 面圖。 第11圖顯示本發明第1實施型態中接觸板和插座的概 略斷面圖。 第1 2A圖顯示本發明第1實施型態中接觸板和插座的 另一例之概略斷面圖。 第1 2B圖顯示將固持在第1 2A圖之接觸板上的! c元件 按壓到插座的狀態之概略斷面圖。 第13A圖顯示本發明第1實施型態中接觸板和插座的 再一例之概略斷面圖。 第13B圖顯示將固持在第13A圖之接觸板上的IC元件 按壓到插座的狀態之概略斷面圖。 第14圖顯示依據本發明第2實施型態之電子元件測試 裝置的全體構成之概略平面圖。 第15圖顯示顯示用於第14圖的電子元件測試裝置的 第1接觸板的斜視圖。 第1 6圖顯示顯示用於第14圖的電子元件測試裝置的 第2接觸板的斜視圖。 第1 7圖顯示顯示用於第14圖的電子元件測試裝置的 第1蓋板的斜視圖。 第丨8圖顯示顯示用於第14圖的電子元件測試裝置的 第2蓋板的斜視圖。 &gt;AlicewuFig. 3 is a perspective view showing a contact pad for the electronic component testing device of Fig. i. FIG. 4 shows the contact plate of FIG. 3. FIG. 5 shows the back of the contact plate of FIG. 3. FIG. 6 shows the electronic component of FIG. 1 along the VI-VI of FIG. An oblique view of the measured state. Surface map. Sectional view of the line. The flat part of the moving part of the test dress is not flat. The electronic component test set of the application part is 2247-1044l-PF; Alicewu 201000380 Figure 9 shows the view along the X axis! A front view of the application portion of the electronic component testing device of the drawing. Fig. 10 is a top view showing the test head of the electronic component testing device of Fig. 1. Fig. 11 is a schematic sectional view showing a contact plate and a socket in the first embodiment of the present invention. Fig. 1 2A is a schematic cross-sectional view showing another example of the contact plate and the socket in the first embodiment of the present invention. Figure 1 2B shows that it will be held on the contact plate of Figure 1A! A schematic cross-sectional view of the state in which the c component is pressed to the socket. Fig. 13A is a schematic cross-sectional view showing still another example of the contact plate and the socket in the first embodiment of the present invention. Fig. 13B is a schematic cross-sectional view showing a state in which the IC component held on the contact plate of Fig. 13A is pressed to the socket. Fig. 14 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to a second embodiment of the present invention. Fig. 15 is a perspective view showing the first contact plate for the electronic component testing apparatus of Fig. 14. Fig. 16 is a perspective view showing the second contact plate for the electronic component testing device of Fig. 14. Fig. 17 is a perspective view showing the first cover plate for the electronic component testing device of Fig. 14. Fig. 8 is a perspective view showing the second cover of the electronic component testing device used in Fig. 14. &gt;Alicewu

2247-10441-PP 201000380 * 第19圖顯示依據本發明第3實施型態之電子元件測試 裝置的全體構成之概略平面圖。 第20圖顯示顯示用於第19圖的電子元件測試裝置的 接觸板的斜視圖。 第21A圖顯示用以說明本發明第3實施㈣中電子元 件測試裝置的動作的斷面圖(之一)。 第21B圖顯示用㈣明本發明帛3實施型態中電子元 件測試裝置的動作的斷面圖(之二)。 (\ 一 ) 第21C圖顯不用以說明本發明第3實施型態中電子元 件測試裝置的動作的斷面圖(之三)。 第21D圖顯示用以說明本發明第3實施型態中電子元 件測試裝置的動作的斷面圖(之四)。 第22圖顯示依據本發昍 + 士明第4實施型態之電子元件測試 裝置的全體構成之概略平面圖。 第23圖顯示第22圖的雪1 -从 121的電子το件測試裝置的移置裝置 / Ϊ 之吸附頭的底面圖。 【主要元件符號說明】 1A-1D 處理機; 100 載入部; 200A~200D 施加部; 210A〜210D第1水平搬運裳置 220A〜220C第1裝卸襄置. 250A-250C 第1反轉裳置. 2247-10441-PF;Alicewu 53 201000380 251 回轉部 , 252 伸縮部 253 桿; 254 夾頭; 260A,260C 第 1間隔變更機構; 261-264 第 1〜 第4凸輪溝; 310 Z軸驅動裝置; 400A-400D 除熱部; 410A, -410D 第 2水平搬運裝置; 420A,420C 第 2間隔變更機構; 430A- -430C 第 2裝卸裝置; 460A- 、460C 第 2反轉裝置; 500 搬出部 6 測試頭; 61 插座; 62 接觸腳; 63 外蓋; 64 位置決定針; 65 空間; 7 客端托盤; 70A, 70B 疊放體; 71 托盤本体; 7 2 收納穴; 8 接觸板(中間板); 2247-10441-PF;Aiicewu 4201000380 84 第1〜第 4板; 81a 〜84a 第1〜 第4凸輪從動件; 85 軸; 86 安裝孔; 86a 小徑部; 86b 大徑部; 87 固持單元; 87a 第1位置決定孔; 87b 第2位置決定孔; 87c 突出片; 87d 插入孔; 88 安裝元件; 88a 螺部; 88b 頭部; 89 固持穴; 9A, 9B 第 1,第 2接觸板, 92 固持單元; 93 固持穴; 10A,10B 第 1, 第2蓋板; 12 接觸板; 12b 固持單元 12c 固持穴。 2247-1044l-PF;Alicewu 552247-10441-PP 201000380 * Fig. 19 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to a third embodiment of the present invention. Fig. 20 is a perspective view showing a contact plate for the electronic component testing device of Fig. 19. Fig. 21A is a cross-sectional view (1) for explaining the operation of the electronic component testing apparatus in the third embodiment (4) of the present invention. Fig. 21B is a cross-sectional view (No. 2) showing the operation of the electronic component testing apparatus in the embodiment of the invention of Fig. 3 in the fourth embodiment. (Fig. 21C) Fig. 21C is a cross-sectional view (No. 3) for explaining the operation of the electronic component testing apparatus in the third embodiment of the present invention. Fig. 21D is a cross-sectional view (fourth) for explaining the operation of the electronic component testing apparatus in the third embodiment of the present invention. Fig. 22 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to the fourth embodiment of the present invention. Fig. 23 is a view showing the bottom view of the adsorption head of the snow absorbing device / Ϊ of the electron το member test device of Fig. 22; [Main component symbol description] 1A-1D processor; 100 loading section; 200A~200D application section; 210A~210D 1st horizontal handling skirt 220A~220C 1st loading and unloading device. 250A-250C 1st reversal 2247-10441-PF; Alicewu 53 201000380 251 swivel, 252 telescopic 253 rod; 254 collet; 260A, 260C 1st interval changing mechanism; 261-264 1st to 4th cam groove; 310 Z-axis drive; 400A-400D heat removal unit; 410A, -410D 2nd horizontal handling device; 420A, 420C 2nd interval changing mechanism; 430A--430C 2nd handling device; 460A-, 460C 2nd reversing device; 500 moving out part 6 test Head; 61 socket; 62 contact foot; 63 outer cover; 64 position determining needle; 65 space; 7 passenger tray; 70A, 70B stacking body; 71 tray body; 7 2 receiving hole; 8 contact plate (middle plate); 2247-10441-PF; Aiicewu 4201000380 84 1st to 4th plates; 81a to 84a 1st to 4th cam followers; 85 shafts; 86 mounting holes; 86a small diameter parts; 86b large diameter parts; 87 holding unit; 87a 1st position decision hole; 87b 2nd position Fixed hole; 87c protruding piece; 87d insertion hole; 88 mounting element; 88a screw; 88b head; 89 holding hole; 9A, 9B 1st, 2nd contact plate, 92 holding unit; 93 holding point; 10A, 10B 1, the second cover; 12 contact plate; 12b holding unit 12c to hold the hole. 2247-1044l-PF; Alicewu 55

Claims (1)

201000380 七、申請專利範歷 一 '·—種電子元件運搬裝置,其能夠操縱處理可固持電 子70件的固持托盤,其包括間隔變更裳置,其變更該固持 托盤具有的複數個固持部中至少一部份的該固持部之間的 間隔。 如申請專利範圍第i項所述之電子^件運搬裝置, 該複數個固持部係相互獨立而可以微動。 &amp;如中請專利範圍第丨項所述之電子元件運搬裝置, 該間隔變更裝置變更該複數個固持部中至少一部份的該固 持部之間犧,使得該固持部之間的間隔為配置於出入 :電件運搬裝置的客端托盤中的該電子元件之間的間 之-數倍,或者’和測試頭中接觸部之間的間隔相同。 申月專利乾圍帛1項所述之電子元件運搬裝置, ^ B 。變更裝置,係變更由特定數 之複數個固持群中至少—持群=:構成 :广申清專利範圍f 4項所述之電子元件運搬裝置, 該禝數個固持群係相互獨立而可以微動。 6. 如申請專利範圍第4項所述之電子元件運搬 該間隔變更裝置變更該複數個固持群中至少#、 牲链★叫 v —部份的該固 ,間的間隔’使得該固持部之間的間隔為配 ==運搬裝置的客端托盤中的該電子元件之間的間 正。’或者’和測試頭中接觸部之間的間隔相同 7. 如申請專利範圍第3或6項所述之電 置,該固持托盤直接從該客端托盤接收該電子元件。&quot;裝 2247~10441-PF;Alicewu 56 201000380 8. —種電子元件 元件,其包括: 測試裝置, 其係用以測試被測試電子 圍第卜6項中任—項所述之運搬農置; 試電子元件電性接觸的接觸部之测試 和該測試頭電性連接之測試器; 該運搬裳置,在剛試時 該接觸部。 、-被測试電子元件按壓到 9.如申請專利範圍第8項 該間隔變更裝置,為…这之電子兀件測試裳置, 固持部之間的間隔,你,… 千H式’加寬該 列相對應, $ °』持部的配列和該接觸部的配201000380 VII. Application for Patent Model 1 - An electronic component transporting device capable of manipulating a holding tray capable of holding 70 pieces of electrons, comprising an interval changing skirt, which changes at least a plurality of holding portions of the holding tray A portion of the spacing between the retaining portions. For example, in the electronic component transporting device described in claim i, the plurality of retaining portions are independent of each other and can be slightly moved. The electronic component transporting apparatus according to the above aspect of the invention, wherein the interval changing means changes the between the retaining portions of at least one of the plurality of retaining portions so that the interval between the retaining portions is It is disposed in the access: several times between the electronic components in the passenger tray of the electronic component transport device, or 'the same as the interval between the contact portions in the test head. Shenyue Patent Co., Ltd. The electronic component transport device described in 1 item, ^ B . The changing device is configured to change at least the holding group of the specific number of holding groups: the electronic component transporting device described in the patent scope f 4 of the Guangshenqing, the plurality of holding groups are independent of each other and can be jogged . 6. The electronic component transporting apparatus according to claim 4, wherein the interval changing means changes at least # of the plurality of holding groups, and the interval between the solids and the portion of the v-group is such that the holding portion The interval between them is the positive between the electronic components in the passenger tray of the == transport device. 'or' is the same as the spacing between the contacts in the test head. 7. The holding tray receives the electronic component directly from the guest tray, as described in claim 3 or 6. &quot;Installation 2247~10441-PF; Alicewu 56 201000380 8. An electronic component component, comprising: a test device for testing the transported agricultural plant described in any of the items of the test electronic enclosure; The test of the contact portion of the test electronic component and the tester electrically connected to the test head; the transfer is performed, the contact portion at the time of the test. - The electronic component to be tested is pressed to 9. According to the scope of the patent application, the interval changing device, for the electronic component test, the spacing between the holding parts, you, ... thousand H-type 'widening Corresponding to the column, the arrangement of the holder and the matching of the contact 如申請專利範 具有和該被測 頭;及 在該固持托盤巾p 加寬間隔的該固持部之間的空 對應的該測試頭上的』幻二間所 配線、安裝於該接觸部月圖2 1 丨β圍的 頌ρ周®的電子兀件、或者該固持部對 該接觸部決定位置之位 p 且〜议罝決叱裝置中的至少一個。 10. —種電子元件運搬裝置,其能夠操縱處理具有可固 持電子元件的複數個固持部之固持托盤, 其包括移置裝置,從具有收納該電子元件的收納裝置 之收納部,將該電子元件疏散並移置到該固持托盤之該固 持部。 11.如申請專利範圍第10項所述之電子元件運搬裝 置’該複數個固持部或由特定數的該固持部分別構成之複 數個固持群,係相互獨立而可以微動。 2247-1044l-PF;Alicewu 57 201000380 !2.如申請專利範圍第心所述之電子元件 置,更包括複數個搬運震置,其將固持該電子元件的 持托盤搬運到對向測試頭的位置; 3 該移置裳置,將該收納震置中收納著的該被測試電子 ==疏散並移置到分別供應至該各搬運裝置的該各固 ^如中睛專利範圍第1()項所述之電子元件運搬裝 置’該收納裝置,係為出 巧®入邊電子几件運搬裝置的客端托 盤:該複數個固持部之間的間隔,係為該客端托盤中該收 納。卩之間的間隔之整數倍, ;Τ固持&amp;盤’在維持該電子元件之配列的狀態下,從 S玄客端耗盤接收該電子元件。 Μ·如申請專利範圍第1G項所述之電子元件運搬裝 置4固持托盤直接從該收納裝置接收該電子元件。 申》月專利範15第14項所述之電子元件運搬裝 閉塞裝置’當將該電子元件從該收納裝置移置到 該固持托盤時,擋住收納著留在職納裝置之該電子元件 的收納部。 種電子元件測試裝置,其係用以測試被測試電子 元件,其包括: 申吻專利範圍帛1G〜15 $中任-項所述之運搬裝 置; /、有和該被測試電子元件電性接觸的接觸部之測試 頭;及 2247-l〇44l-PF;Alicewu 58 201000380 .和該測試頭雷地 碩電性連接之測試器; 該運搬震詈,/、 、 測試時,將該被測試電子元件按壓到 該接觸部。 :申叫專利範圍第1 6項所述之電子元件測試裝 置一在該固持托盤中由該移置裝置疏散移置的該被測試電 子元件之間的空卩卩% 二間所對應的該測試頭上的空間中,設置用 以將該接觸部周圍的配線、安裝於該接觸部周圍的電子元 D件、或者該固持部對該接觸部決定位置之位置決定裝置中 的至少一個。 18· 一種電子元件固持托盤其包括分別可以固持被測 試電子元件的複數個第1固持部, 該㈣個第1固持部至少沿著第i方向配列; 沿著該第1方向之該第1固持部之間的間隔包含:第 1間隔’以及與該第i間隔相異之第2間隔。 19. 如申請專利範圍第18項所述之電子元件固持托 〇盤,以該第2間隔配列之該第丄固持部之間的間距,為以 該第1間隔配列之該第i固持部之間的間距之5倍以上。 20. 如申請專利範圍第18項所述之電子元件固持托 盤包括使該弟2間隔可改變的可變機構, 該可變機構可以改變該第2間隔,使得該第2間隔和 該第1間隔實質上為同一。 21_如申請專利範圍第18項所述之電子元件固持托 盤,該複數個第1固持部或由特定數目的該第丨固持部構 成之固持群,係相互獨立而可以微動。 2247-10441-PF;A1ice wu 201000380 22. 種電子元件運搬裝置,其能夠操縱處理如申請專 利範圍第18〜21項中任一項所述之固持托盤, 其包括第1移置裝置,在維持出入該電子元件運搬裝 置之客端托盤中的該電子元件的配列的狀態下,在該客端 托盤及該固持托盤之間移置該電子元件。 23. 如申請專利範圍第22所述之電子元件運搬裝置, 該客端托盤具有可以收納該電子元件的複數個收納部, 該固持托盤中的該第1間隔,與該客端托盤中沿著該 第1方向之該收納部之間的間隔實際上為同一, 該固持托盤中沿著第2方向之該第1固持部之間的間 隔,和該客端托盤中沿著該第2方向之該收納部之間的間 隔實際上為同一。 24·如申請專利範圍第23所述之電子元件運搬裝置, 該第1移置裝置具有吸附固持該電子元件的複數個吸附 σ , 沿著該第1方向之該吸附口之間的間隔和該第1間隔 貫際上為同一’並且,沿著該第2方向之該吸附口之間的 間隔’和該固持托盤中沿著該第2方向之該第1固持部之 間的間隔實際上為同_。 25.如申請專利範圍第22所述之電子元件運搬裝置, 包括按壓裝置’其於該電子元件收納在該固持托盤的狀態 下,將該電子元件按壓到該接觸部。 26·如申請專利範圍第22所述之電子元件運搬裝置, 其包括: 2247-i〇44l-PF;Alicewu 60 201000380 第2移置裝置,其將該電子元件在該固持托盤及具 複數個可固持該電子元件 2 間移置; U符权弟2固持托盤之 ^裝置’在該電子元件被固持在該第2固持托盤的 狀』、下,將該電子元件按壓到測試頭之接觸部。 27·—種電子元件測試裝置,其係用以測試被測試電子 兀件’其包括: 如申請專利範圍第22項所述之運搬裝置; :有和該被測試電子元件電性接觸的接觸部之測試 頭,及 和該測試頭電性連接之測試器; 該運搬裝置,在測試時,將該被測試電 該接觸部。 卞牧i到 28·—種電子元件測試裝置’其在被測試電子元件分別 具有複數個固持部之固持托盤的狀態下,將該被測 =元件按壓到測試頭的接觸部,用以執行該被測試電 子凡件的測試, ==該接觸部具有和被固持在該固持部的該被 =電子凡件直接接觸,將該被測試電子元件對該接觸部 决疋其位置的位置決定裝置。 29·如申請專利範圍第28所述之電子元件測試裝置, 該固持托盤,直接從 直接攸搬入出該電子兀件測試裝置的客端托 i接收該被測試電子元件。 2247-i〇44i-pF;Alicewu 61For example, the patent application has a wiring with the probe; and the phantom of the test head corresponding to the space between the holding portions of the holding tray towel p widened, and is installed in the contact portion. An electronic component of the 颂β circumference of the 丨β, or the holding portion determines at least one of the position p of the contact portion and the device. 10. An electronic component transporting apparatus capable of manipulating a holding tray having a plurality of holding portions capable of holding electronic components, comprising a displacement device, the electronic component from a housing portion having a housing device housing the electronic component The evacuation portion is evacuated and displaced to the holding portion of the holding tray. 11. The electronic component transporting apparatus according to claim 10, wherein the plurality of retaining portions or the plurality of retaining groups respectively formed by the specific number of the retaining portions are independent of each other and are frillable. 2247-1044l-PF; Alicewu 57 201000380 !2. The electronic component set as described in the patent application scope further includes a plurality of handling shocks, which carry the holding tray holding the electronic component to the position of the opposite test head 3, the displacement skirt, the tested electronic object stored in the storage vibration == evacuated and displaced to the respective patents of the respective handling devices, the first (1) item The electronic component transporting device 'the accommodating device is a passenger tray of the smart-input-side electronic transport device: the interval between the plurality of retaining portions is the storage in the passenger tray. An integer multiple of the interval between turns, and the holding &amp;disk&apos; receives the electronic component from the S-sinus consumer in a state in which the electronic component is maintained. The electronic component transporting device 4 as described in claim 1G of the patent application holds the electronic component directly from the storage device. The electronic component transporting and closing device described in Item 14 of the Japanese Patent Application No. 14 is configured to block the accommodating portion of the electronic component that is stored in the arranging device when the electronic component is displaced from the accommodating device to the holding tray. . The electronic component testing device is used for testing the electronic component to be tested, and includes: the handling device described in the patent application scope 帛1G~15 $ zhong--; and having electrical contact with the electronic component to be tested The test head of the contact portion; and 2247-l〇44l-PF; Alicewu 58 201000380. and the test head of the test head lightning electrical connection; the transport shock, /, test, the tested electronic The component is pressed to the contact. The electronic component testing device according to claim 16 of the patent application, wherein the test is performed by the displacement device in the holding tray, and the space between the tested electronic components is separated by the displacement device. At least one of the wiring around the contact portion, the electronic component D attached to the periphery of the contact portion, or the position determining device for determining the position of the contact portion by the holding portion is provided in the space above the head. 18. An electronic component holding tray comprising a plurality of first holding portions respectively capable of holding a tested electronic component, wherein the (four) first holding portions are arranged along at least an i-th direction; the first holding along the first direction The interval between the portions includes a first interval 'and a second interval different from the i-th interval. 19. The electronic component holding tray according to claim 18, wherein a spacing between the third holding portions arranged at the second interval is the ith holding portion arranged at the first interval More than 5 times the spacing between the two. 20. The electronic component holding tray of claim 18, wherein the variable mechanism is configured to change the second interval such that the second interval and the first interval Essentially the same. The electronic component holding tray according to claim 18, wherein the plurality of first holding portions or the holding group constituted by the specific number of the second holding portions are independent of each other and can be slightly moved. 2247-10441-PF; A1ice wu 201000380 22. An electronic component transporting device capable of handling a holding tray according to any one of claims 18 to 21, comprising a first displacement device, being maintained The electronic component is displaced between the guest tray and the holding tray in a state in which the electronic component is placed in the guest tray of the electronic component transport device. 23. The electronic component transport device of claim 22, wherein the guest tray has a plurality of storage portions that can accommodate the electronic component, the first interval in the retention tray, along with the passenger tray The interval between the accommodating portions in the first direction is substantially the same, and the interval between the first holding portions along the second direction in the holding tray and the second direction in the guest tray The interval between the accommodating portions is substantially the same. [24] The electronic component transport device of claim 23, wherein the first displacement device has a plurality of adsorption σ adsorbing and holding the electronic component, and an interval between the adsorption ports along the first direction The first interval is the same as the same 'and the interval between the adsorption ports along the second direction and the interval between the first holding portions along the second direction in the holding tray is actually with_. The electronic component transporting device according to claim 22, comprising a pressing device that presses the electronic component to the contact portion while the electronic component is housed in the holding tray. The electronic component transport device of claim 22, comprising: 2247-i〇44l-PF; Alicewu 60 201000380 second displacement device, wherein the electronic component is in the holding tray and has a plurality of The electronic component 2 is placed between the electronic components 2; the device 2 holds the tray, and the electronic component is held in the second holding tray, and the electronic component is pressed to the contact portion of the test head. 27. An electronic component testing device for testing an electronic component to be tested, comprising: the transporting device as described in claim 22; having a contact portion in electrical contact with the electronic component to be tested a test head, and a tester electrically connected to the test head; the transport device, when tested, electrically contacts the contact portion.卞 i i to 28 ─ ─ electronic component testing device 'in the state in which the tested electronic components respectively have a plurality of holding portions of the holding tray, the measured = component is pressed to the contact portion of the test head, to perform the The test of the electronic component to be tested, == the contact portion has a position determining means for directly contacting the electronic component held by the holding portion, and the electronic component to be tested is determined by the position of the contact portion. The electronic component testing device according to claim 28, wherein the holding tray receives the electronic component to be tested directly from a passenger terminal that is directly loaded into the electronic component testing device. 2247-i〇44i-pF; Alicewu 61
TW098114005A 2008-05-28 2009-04-28 Electronic component handling apparatus, electronic component test apparatus and electronic component holding tray TW201000380A (en)

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