200928620 九、發明說明： 【發明所屬之技術領域】 J 本發明涉及一種自動對位裝置，特別涉及應用於電路 •基板之曝光定位之自動對位裝置。 【先前技術】 印刷電路板之導電線路之製作係先通過曝光顯影過 程，使預設於光罩上之線路圖像轉移至基板上之幹膜等感 ©光材料上，之後再通過蝕刻工藝於基板上形成所需線路。 請參見文獻，Moon-Youn Jung，Won Ick Jang ’ Chang Auck Choi，Myung Rae Lee，Chi Hoon Jun，Youn Tae Kim ; Novel lithography process for extreme deep trench by using laminated negative dry film resist; 2004: 685-688; 2004. 17th IEEE International Conference on Micro Electro Mechanical Systems 〇於曝光過程中，光罩與基板必須對準，才能保證 曝光成像之位置之準確性，以及製作印刷電路板之線路之 ®後續製程（如顯影、蝕刻或去膜連線等）之品質。 目前，基板之曝光定位通常採用傳統之人工目視對 位。首先，預先於光罩與基板設置位置相對應之對位用之 標靶。其次，通過人工觀察將光罩上之標靶與基板上相對 應之標靶對準，進行光罩與基板之對位。再次，用膠將光 罩固定於基板上，以待曝光裝置使用。惟，上述人工目視 對位方法，於對位過程中可能存於之對位誤差無法滿足精 細線路印刷電路板之嚴格要求。另外，如果基板為雙面線 200928620 路板’即需要雙面曝光，則以上對位操作需要分別對印刷 -電路板之相料面，與所對應之光罩對位，如此既耗時， 又增加了生產成本。 【發明内容】 有鑑於此，提供-種自動對位裳置，以提高印刷電路 板曝光對位之準確性以及對位效率實屬必要。 以下將以實施例說明一種自動對位裝置。 ❹該自動對位裝置，其包括基台、承載台、支撐件盘升 降裝置。該支撐件固定於基台，支撐該承載台。該承載台 用於放置待對位物件進行對位，並設有至少一對位通孔。 該升降裝置包括至少一制動部及與該至少一制動部相連之 升降台，該制動部固定於基台，用於控制升降台於基台與 承載台之間反復升降；該升降台設有與該至少一對位通孔 相配合之對位件，用於與待對位物件相應之對位孔相配 ❹合，進行對位。 册與先前技術相比，該自動對位裝置之升降台於制動部 之π動下於基台與承載台之間升降，以使設置於升降台之 對位件從承載台相應之對位通孔伸出，並穿過待對位i件 相應之對位孔，進行對位。特別係對於需要雙面曝光之電 路基板，可一次性完成電路基板之相對兩面 對位，既提高對位效率，又可避免人工目視對位:^之 滿足精細線路印刷電路板之嚴格要求。 9 200928620 【實施方式】 下面將結合附圖及實施例對本技術方案實施例提供之 自動對位裝置及作進一步說明。 ' 請一併參閱圖1及圖2,為本技術方案實施例提供之自 動對位裝置10，其包括基台11、承載台12、支撐件13與 升降裝置14。該支撐件13與該升降裝置14位於基台11與 承載台12之間。 該基台11具有基面111。該基面111與承載台12相對， ❹用於設置承載台12、支撐件13以及升降裝置14。本實施 例中，基台11之基面111開設有第一固定孔112，用於固 定支撐件13。該第一固定孔112位於基面111之四個頂角 區域，以供與支撐件13配合。當然，基台11與支撐件13 之固接方式不限，如基台11與支撐件13可一體成型實現 固接，其固接方式可根據自動對位裝置10之需要採用不同 設計。 _ 該承載台12用以設置待對位物件進行對位。該承載台 ❹ 12具有第一表面121及與第一表面121相對設置之第二表 面122。該第一表面121為與基台11之基面111之相對之 表面，該第二表面122用於放置待對位物件，如：光罩與 電路基板（圖未示）。根據不同待對位物件，承載台12可 設置複數大小、形狀及孔徑不同之對位通孔125。該對位通 孔125貫通第一表面121與第二表面122。此外，本實施例 中，為與基板11配合固定支撐件13，第一表面121之四個 頂角區域開設與基板11之第一固定孔112相應之第二固定 200928620 孔123。該第二固定孔123與第一固定孔112相對同轴設置。 該支撐件13用於支撐承載台12, 一端固接於基台11， 另一端固接於承載台12,使基台11與承載台12形成可收 '容升降裝置14之空間。本實施例中，支撐件13 —端固接 於基台11之第一固定孔112，另一端通過螺釘124固定於 承載台12之第二固定孔123，使基台11與承載台12之間 具有一定距離，以供收容升降裝置14。可理解，該支撐件 13亦可通過膠黏或其他方式與承載台12固接。為滿足不同 ❹厚度之待對位物件，支撐件13可為長度可調節式設計，或 可滑動地固定於承載台12,例如可使支撐件13 —端穿設于 第二固定孔123，使支撐件13於第二固定孔123中滑動固 定，以方便調節承載台12之固定位置，即：承載台12與 基台11之間距離，以保證升降裝置14正常工作。 該升降裝置14包括制動部141及與制動部141相連之 升降台142。 該制動部141固定於基台11之基面111，其包括升降 部1411、制動器1412及控制部1413。該升降部1411 一端 設於制動器1412，可於制動器1412之驅動下自由升降。該 升降部1411另一端與升降台142固接，使升降台142可於 升降部1411帶動下於基台11與承載台12之間反復升降。 該制動器1412用於向升降部1411提供升降動力。本 實施例中，制動器1412為氣壓升降裝置，即制動器1412 内設有氣壓閥（圖未示）。該氣壓閥吸入與釋放氣體，以使 升降台142上升與下降。當然，制動器1412亦可為液壓升 η 200928620 降裝置、電動升降裝置、油壓升降裝置或其他可實現升降 之裝置。 該控制部1413與制動器1412相連，以控制制動器1412 •作動。本實施例中，為與制動器1412之氣壓升降裝置配合， 控制部1413設計為踏板控制器，即踩壓踏板使制動器1412 之氣壓閥吸入氣體與釋放氣體，以使升降裝置14之升降台 142於基台11與承載台12之間作反復升降運動。可理解， 控制部1413亦可為手動控制器、自動控制器或其他形式之 ❹控制器，以能方便控制制動器1412,以使升降台142反復 升降為宜。 該升降台142具有第一平面1421及與第一平面1421 相對設置之第二平面1422。該第一平面1421為與基台11 相對之面，其固接於制動部141之升降部1411，以使制動 部141支撐該升降台142。該第二平面1422為與承載台12 相對面，並設置有與承載台12之對位通孔125相配合之對 位件1423，用於與相應地待對位物件之對位孔（圖未示） 相配合對位該物件。該對位件1423可採用直接固定、滑動 固定或其他不同方式設置於升降台142，以能方便調整對位 件1423於第二平面1422之位置，以及對位件1423自第二 平面1422向承載台12方向伸出部分之高度，並最終固定 於升降台142為宜。 本實施例中，升降台142之第二平面1422開設複數螺 紋孔1424，對位件1423 —端相應地設有螺紋，使對位件 1423於螺紋孔1424中可根據需要調節自第二平面1422向 12 200928620 承載台12方向伸出部分之高度，並通過與螺帽配合，將對 位件1423固定於升降台142。其中，該升降台142開設之 螺紋孔1424之數量等於承載台12之對位通孔125之數量， ‘而大於對位件1423之數量，以使對位件1423根據待對位 物件之對位孔之設計，可選擇地固定於升降台142上進行 對位。當然，螺紋孔1424之數量亦可等於對位件1423之 數量。另外，升降台142之第二平面1422亦可開設複數具 有一定長度之滑動槽，使對位件1423於滑動槽中滑動，以 ❹調節固定位置。 對位物件時，該對位件1423穿過承載台12之對位通 孔125與待對位物件對應之對位孔（圖未示），使物件對位。 因此該對位件1423長度等於或大於與對位件1423相對應 之對位通孔125與待對位物件上相應之對位孔之軸向長度 之和。另外，承載台12之對位通孔125與升降裝置14之 對位件1423之數量、長度、大小等參數亦需根據待對位物 _件採用不同設計。例如，當對位光罩與電路基板時，該對 位件1423可為銷釘。根據不同之電路基板與光罩規格，該 對位通孔125直徑為1.95mm~2.00mm，與對位通孔125相 配合之對位件1423直徑小於或等於1.95mm〜2.00mm，且長 度為0.1cm〜5cm，以與電路基板與光罩預設對位孔匹配為 宜。 考慮到待對位物件之大小尺寸、厚度、以及預設對位 孔之孔徑與對位孔數量，升降裝置14之設計亦需要相應地 改變。例如，待對位物件具有較大面積時，升降台142需 13 200928620 要相應地擴大面積，此時單個制動部141之升降部1411可 能無法支撐升降台142正常地升降。因此，可設置複數制 動部141於基台11同時作業，以使升降台142升降。此外， 1還可於基台11增設輔助支撐件16，以輔助支撐升降台 142，減小升降台142反復升降過程中.，對制動部141之升 降部1411之衝擊力，避免自動對位裝置10受損。該輔助 支撐件16可為具有彈性之支撐構件或其他可伸縮之支撐構 件，以滿足不影響升降台142升降為宜。本實施例中，基 ©台11固定兩個輔助支撐件16,以缓解升降台142對制動部 141之壓力。 請一併參閱圖2至圖4，以對電路基板20雙面曝光對 位為例，詳細說明實施例所提供之自動對位裝置10之使用 過程，其包括以下步驟： 第一步：提供電路基板20、第一光罩30與第二光罩 40 ° _ 如圖3所示，該電路基板20為已貼合幹膜之雙面電路 基板，並包括複數線路板單元21與線路板單元21之週邊 區域22,並具有第一幹膜面24與第二幹膜面25。該線路 板單元21對應與圖3電路基板20中虛線所圍合區域。該 第一幹膜面24與第二幹膜面25用於經曝光後，於對應各 線路板單元21之準確位置形成預設線路圖案。該週邊區域 22開設有基板對位孔23，以供自動對位裝置10之對位件 1423穿過對位。該基板對位孔23可為一個或複數。 該苐一光罩30開設與電路基板20之基板對位孔23相 14 200928620 對應之第一對位孔31，以供對位件1423穿過對位。同樣 地，第二光罩40開設與電路基板20之基板對位孔23相對 應之第二對位孔41，以供對位件1423穿過對位。當對位件 • 1423穿過對應之第一對位孔31、基板對位孔23及第二對 位孔41時，電路基板20與第一光罩.30與第二光罩40即 可準確對位，以滿足電路基板20之第一幹膜面24與第二 幹膜面25曝光後，於對應各線路板單元21之準確位置形 成預設線路圖案，以備後續顯影及蝕刻等工序於導電層形 ❿成所需導電線路。 第二步：調整自動對位裝置10之對位件1423。 根據電路基板20、第一光罩30與第二光罩40之各自 對位孔之位置與軸向長度，選擇合適尺寸與高度之對位件 1423，調整升降裝置14之對位件1423自升降台142之第 二平面1422向承載台12方向伸出部分之高度，以及於升 降台142之第二平面1422之位置，與基板對位孔23相對 應應，並固定對位件1423於升降台142。藉由控制部1413 啟動制動器1412，使升降台142上升，從而使固定於升降 台142之對位件1423穿過承載台12之對位通孔125，並由 第二表面122伸出，如圖2所示。由於本實施例中控制部 1413為踏板控制器，制動器1412為氣壓升降裝置，因此藉 由踩動控制部1413之踏板，使制動器1412吸氣，以使升 降台142上升。 第三步：將第一光罩30、電路基板20與第二光罩40 依次放置於承載台12進行對位。 15 200928620 首先，放置第一光罩30於承載台12,使自動對位裝置 10之對位件1423穿過相對應第一光罩30之第一對位孔 31。其次，將電路基板20之第一幹膜面24朝向第一光罩 ‘ 30，對位件1423穿過電路基板20上相對應之基板對位孔 23，完成第一光罩30與電路基板20 .之對位，並藉由塗覆 于電路基板20週邊區域22之黏合劑貼合於第一光罩30， 使第一幹膜面24與第一光罩30緊密貼合。再次，放置第 二光罩40于電路基板20之第二幹膜面25，使對位件1423 〇穿過第二光罩40上相對應之第二對位孔41，完成第二光罩 40與第一光罩30及電路基板20之對位。藉由塗覆于電路 基板20週邊區域22之黏合劑與第二光罩40貼合，以使第 二幹膜面25與第二光罩40緊密貼合。如圖4所示，由此 得到已準確對位並依次貼合之第一光罩30、電路基板20 與第二光罩40。 第四步：取下已對位之電路基板20、第一光罩30與第 二光罩40。 利用控制部1413，使升降裝置14之制動器1412控制 升降台142下降，並從自動對位裝置10之承載台12上取 下已對位並貼合成一體之第一光罩30、電路基板20與第二 光罩40，即可進行曝光、顯影與蝕刻等後續操作。與啟動 制動器1412相同，本實施例中，藉由鬆開控制部1413之 踏板，使升降裝置14之制動器1412放氣，以使升降台142 下降。 綜上所述，本發明確已符合發明專利之要件，遂依法 16 200928620 提出專利ψ μ。惟，以上所述者僅為本發明之較佳實施方 .式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之自動對位裝置之立體 分解圖。 圖2係本技術方案實施例提供之自動對位裝置之立體 W圖。 圖3係本技術方案待對位電路基板及光罩之結構示意 圖。 圖4係本技術方案實施例提供之自動對位裝置對圖3 中電路基板及光罩對位之狀態示意圖。 【主要元件符號說明】 自動對位裝置 10 基台 11 基面 111 第一固定孔 112 承載台 12 第一表面 121 第二表面 122 第二固定孔 123 螺釘 124 17 200928620200928620 IX. Description of the invention: [Technical field to which the invention pertains] J The present invention relates to an automatic alignment device, and more particularly to an automatic alignment device applied to an exposure positioning of a circuit board. [Prior Art] The conductive circuit of the printed circuit board is firstly processed by an exposure and development process to transfer the image of the line preset on the reticle to a dry film or the like on the substrate, and then through an etching process. The desired wiring is formed on the substrate. See literature, Moon-Youn Jung, Won Ick Jang 'Chang Auck Choi, Myung Rae Lee, Chi Hoon Jun, Youn Tae Kim; Novel lithography process for extreme deep trench by using laminated negative dry film resist; 2004: 685-688; 2004. 17th IEEE International Conference on Micro Electro Mechanical Systems 〇 During the exposure process, the reticle and the substrate must be aligned to ensure the accuracy of the position of the exposure image, and the subsequent process of making the printed circuit board (such as development, The quality of etching or stripping, etc.). At present, the exposure positioning of the substrate is usually aligned by conventional manual visual alignment. First, the target for alignment is corresponding to the position where the mask and the substrate are disposed in advance. Next, the target on the reticle is aligned with the corresponding target on the substrate by manual observation to align the reticle with the substrate. Again, the hood is glued to the substrate for use with the exposure device. However, the above-mentioned manual visual alignment method cannot meet the strict requirements of the fine circuit printed circuit board in the alignment error that may exist in the alignment process. In addition, if the substrate is a double-sided line 200928620, which requires double-sided exposure, the above alignment operation needs to respectively align the phase of the printed-circuit board with the corresponding mask, which is time consuming and Increased production costs. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an automatic alignment to improve the accuracy of alignment of printed circuit boards and alignment efficiency. An automatic alignment device will be described below by way of example. The automatic alignment device comprises a base, a carrying platform, and a support plate lifting device. The support member is fixed to the base and supports the carrier. The carrying platform is configured to position the object to be aligned, and is provided with at least one pair of through holes. The lifting device comprises at least one braking portion and an lifting platform connected to the at least one braking portion, the braking portion is fixed on the base platform for controlling the lifting platform to repeatedly rise and fall between the base platform and the loading platform; the lifting platform is provided with The at least one pair of the through holes are matched with the alignment member for matching the alignment holes corresponding to the object to be aligned, and performing alignment. Compared with the prior art, the lifting platform of the automatic alignment device is lifted and lowered between the base and the loading platform under the action of the π of the braking portion, so that the alignment member disposed on the lifting platform is correspondingly aligned from the carrying platform. The hole protrudes and passes through the corresponding alignment hole of the to-be-aligned piece to perform alignment. In particular, for a circuit substrate that requires double-sided exposure, the opposite sides of the circuit substrate can be aligned at one time, thereby improving the alignment efficiency and avoiding manual visual alignment: the strict requirements of the fine circuit printed circuit board are met. 9 200928620 [Embodiment] The automatic alignment device provided by the embodiments of the present technical solution will be further described with reference to the accompanying drawings and embodiments. Referring to FIG. 1 and FIG. 2 together, an automatic alignment device 10 according to an embodiment of the present invention includes a base 11, a carrier 12, a support member 13, and a lifting device 14. The support member 13 and the lifting device 14 are located between the base 11 and the carrying platform 12. This base 11 has a base surface 111. The base surface 111 is opposed to the stage 12 for providing the stage 12, the support member 13, and the lifting device 14. In the present embodiment, the base surface 111 of the base 11 is provided with a first fixing hole 112 for fixing the support member 13. The first fixing holes 112 are located at four corner regions of the base surface 111 for mating with the support member 13. Of course, the fixing manner of the base 11 and the supporting member 13 is not limited. For example, the base 11 and the supporting member 13 can be integrally formed and fixed, and the fixing manner can be differently designed according to the needs of the automatic alignment device 10. The carrier 12 is used to set the alignment of the object to be aligned. The carrier 12 has a first surface 121 and a second surface 122 disposed opposite the first surface 121. The first surface 121 is a surface opposite to the base surface 111 of the base 11, and the second surface 122 is used for placing an object to be aligned, such as a reticle and a circuit substrate (not shown). According to different objects to be aligned, the carrier 12 can be provided with a plurality of alignment vias 125 of different sizes, shapes and apertures. The alignment via 125 penetrates the first surface 121 and the second surface 122. In addition, in this embodiment, in order to cooperate with the substrate 11 to fix the support member 13, the four corner regions of the first surface 121 define a second fixed hole 2009123 corresponding to the first fixing hole 112 of the substrate 11. The second fixing hole 123 is disposed coaxially with the first fixing hole 112 . The support member 13 is configured to support the loading platform 12, one end of which is fixed to the base 11 and the other end of which is fixed to the loading platform 12, so that the base 11 and the loading platform 12 form a space for receiving the lifting device 14. In this embodiment, the support member 13 is fixed to the first fixing hole 112 of the base 11 and the other end is fixed to the second fixing hole 123 of the bearing table 12 by screws 124 so that the base 11 and the carrying platform 12 are There is a certain distance for accommodating the lifting device 14. It can be understood that the support member 13 can also be fixed to the carrier 12 by adhesive or other means. The support member 13 can be of a length-adjustable design or can be slidably fixed to the carrier 12 for example, such that the end of the support member 13 can be passed through the second fixing hole 123. The support member 13 is slidably fixed in the second fixing hole 123 to facilitate adjusting the fixed position of the loading platform 12, that is, the distance between the loading platform 12 and the base 11, to ensure the normal operation of the lifting device 14. The lifting device 14 includes a braking portion 141 and a lifting platform 142 connected to the braking portion 141. The braking portion 141 is fixed to the base surface 111 of the base 11, and includes a lifting portion 1411, a stopper 1412, and a control portion 1413. One end of the lifting portion 1411 is provided on the brake 1412, and is freely movable up and down by the brake 1412. The other end of the elevating portion 1411 is fixed to the elevating table 142, so that the elevating table 142 can be repeatedly raised and lowered between the base 11 and the stage 12 by the elevating portion 1411. The brake 1412 is for providing lifting power to the lifting portion 1411. In the present embodiment, the brake 1412 is a pneumatic lifting device, that is, a pneumatic valve (not shown) is disposed in the brake 1412. The pneumatic valve draws in and releases gas to raise and lower the lifting platform 142. Of course, the brake 1412 can also be a hydraulic lift η 200928620 drop device, an electric lift device, a hydraulic lift device, or other device that can be lifted and lowered. The control unit 1413 is coupled to the brake 1412 to control the brake 1412 to actuate. In this embodiment, in order to cooperate with the air pressure lifting device of the brake 1412, the control portion 1413 is designed as a pedal controller, that is, the pressing pedal pushes the air valve of the brake 1412 into the gas and releases the gas, so that the lifting platform 142 of the lifting device 14 is The base 11 and the carrier 12 are repeatedly moved up and down. It can be understood that the control unit 1413 can also be a manual controller, an automatic controller or other type of cymbal controller to facilitate the control of the brake 1412 so that the lifting platform 142 is repeatedly raised and lowered. The lifting platform 142 has a first plane 1421 and a second plane 1422 disposed opposite the first plane 1421. The first plane 1421 is a surface opposite to the base 11, and is fixed to the lifting portion 1411 of the braking portion 141 such that the braking portion 141 supports the lifting table 142. The second plane 1422 is opposite to the loading platform 12, and is provided with a positioning member 1423 that cooperates with the alignment through hole 125 of the loading platform 12 for the alignment hole of the corresponding object to be aligned (Fig. Show) Match the object in alignment. The aligning member 1423 can be disposed on the lifting platform 142 by direct fixing, sliding fixing or other different manners, so that the position of the aligning member 1423 at the second plane 1422 can be conveniently adjusted, and the aligning member 1423 can be carried from the second plane 1422. Preferably, the height of the projecting portion of the table 12 is fixed to the lifting platform 142. In this embodiment, the second plane 1422 of the lifting platform 142 defines a plurality of threaded holes 1424, and the end of the positioning member 1423 is correspondingly provided with a thread, so that the positioning member 1423 can be adjusted from the second plane 1422 in the threaded hole 1424 as needed. The height of the portion extending toward the 12 200928620 loading platform 12 is fixed to the lifting platform 142 by mating with the nut. The number of the threaded holes 1424 of the lifting platform 142 is equal to the number of the alignment holes 125 of the loading platform 12, and is greater than the number of the alignment members 1423, so that the alignment member 1423 is aligned according to the object to be aligned. The design of the aperture is optionally fixed to the lifting platform 142 for alignment. Of course, the number of threaded holes 1424 can also be equal to the number of alignment members 1423. In addition, the second plane 1422 of the lifting platform 142 can also open a plurality of sliding slots having a certain length, so that the positioning member 1423 slides in the sliding slot to adjust the fixed position. When the object is aligned, the alignment member 1423 passes through the alignment hole 125 of the carrying table 12 and the alignment hole (not shown) corresponding to the object to be aligned to align the object. Therefore, the length of the alignment member 1423 is equal to or greater than the sum of the axial lengths of the alignment through holes 125 corresponding to the alignment member 1423 and the corresponding alignment holes on the object to be aligned. In addition, the number, length, size and the like of the alignment through hole 125 of the carrying platform 12 and the alignment member 1423 of the lifting device 14 are also required to be differently designed according to the object to be aligned. For example, when the photomask and the circuit substrate are aligned, the alignment member 1423 can be a pin. According to different circuit board and mask specifications, the diameter of the alignment via 125 is 1.95 mm to 2.00 mm, and the diameter of the alignment member 1423 matched with the alignment via 125 is less than or equal to 1.95 mm to 2.00 mm, and the length is 0.1cm~5cm, it is better to match the circuit board and the mask preset alignment hole. The design of the lifting device 14 also needs to be changed correspondingly in consideration of the size and thickness of the object to be aligned, the thickness of the alignment hole and the number of the counter holes. For example, when the object to be aligned has a large area, the lifting platform 142 needs 13 200928620 to enlarge the area accordingly, and the lifting portion 1411 of the single braking portion 141 may not be able to support the lifting table 142 to normally rise and fall. Therefore, the plurality of brake portions 141 can be provided to operate simultaneously on the base 11 to raise and lower the lift table 142. In addition, an auxiliary support member 16 may be added to the base 11 to assist in supporting the lifting platform 142, and the impact force on the lifting portion 1411 of the braking portion 141 during the repeated lifting and lowering of the lifting portion 142 is reduced to avoid the automatic alignment device. 10 damaged. The auxiliary support member 16 can be a resilient support member or other retractable support member to ensure that the lifting platform 142 is not affected. In the present embodiment, the base/stage 11 fixes the two auxiliary supports 16 to relieve the pressure of the lifting platform 142 against the braking portion 141. Referring to FIG. 2 to FIG. 4 together, the double-sided exposure alignment of the circuit substrate 20 is taken as an example to describe in detail the use process of the automatic alignment device 10 provided by the embodiment, which includes the following steps: Step 1: Provide a circuit The substrate 20, the first reticle 30 and the second reticle 40° _ as shown in FIG. 3, the circuit substrate 20 is a double-sided circuit substrate to which a dry film has been attached, and includes a plurality of circuit board units 21 and a circuit board unit 21 The peripheral region 22 has a first dry film surface 24 and a second dry film surface 25. The board unit 21 corresponds to an area enclosed by a broken line in the circuit board 20 of Fig. 3. The first dry film surface 24 and the second dry film surface 25 are used to form a predetermined line pattern at an accurate position corresponding to each of the circuit board units 21 after being exposed. The peripheral region 22 is provided with a substrate alignment hole 23 for the alignment member 1423 of the automatic alignment device 10 to pass through the alignment. The substrate alignment holes 23 may be one or plural. The first photomask 30 defines a first alignment hole 31 corresponding to the substrate alignment hole 23 of the circuit substrate 20, and the alignment member 1423 passes through the alignment. Similarly, the second mask 40 opens a second alignment hole 41 corresponding to the substrate alignment hole 23 of the circuit substrate 20 for the alignment member 1423 to pass through the alignment. When the alignment member 1423 passes through the corresponding first alignment hole 31, the substrate alignment hole 23 and the second alignment hole 41, the circuit substrate 20 and the first mask 30 and the second mask 40 can be accurately After the alignment is performed to meet the first dry film surface 24 and the second dry film surface 25 of the circuit substrate 20, a predetermined line pattern is formed at an exact position corresponding to each of the circuit board units 21 for subsequent development and etching processes. The conductive layer is shaped into the desired conductive lines. The second step: adjusting the alignment member 1423 of the automatic alignment device 10. According to the position and the axial length of the respective alignment holes of the circuit substrate 20, the first mask 30 and the second mask 40, the alignment member 1423 of the appropriate size and height is selected, and the alignment member 1423 of the lifting device 14 is adjusted to be lifted and lowered. The height of the protruding portion of the second plane 1422 of the table 142 toward the carrying platform 12 and the position of the second plane 1422 of the lifting platform 142 correspond to the substrate matching holes 23, and the positioning member 1423 is fixed to the lifting platform. 142. The control unit 1413 activates the brake 1412 to raise the lifting platform 142, so that the alignment member 1423 fixed to the lifting platform 142 passes through the alignment through hole 125 of the loading table 12 and is extended by the second surface 122, as shown in the figure. 2 is shown. Since the control unit 1413 is a pedal controller and the brake 1412 is a pneumatic lifting device in the present embodiment, the brake 1412 is inhaled by stepping on the pedal of the control unit 1413 to raise the lifting platform 142. The third step: the first mask 30, the circuit substrate 20 and the second mask 40 are sequentially placed on the carrier 12 for alignment. 15 200928620 First, the first mask 30 is placed on the carrier 12 such that the alignment member 1423 of the automatic alignment device 10 passes through the first alignment hole 31 of the corresponding first mask 30. Next, the first dry film surface 24 of the circuit substrate 20 faces the first mask '30, and the alignment member 1423 passes through the corresponding substrate alignment hole 23 on the circuit substrate 20 to complete the first mask 30 and the circuit substrate 20. The first dry film surface 24 is in close contact with the first mask 30 by the bonding of the adhesive applied to the peripheral region 22 of the circuit board 20 to the first mask 30. The second mask 40 is placed on the second dry film surface 25 of the circuit substrate 20, and the alignment member 1423 is passed through the corresponding second alignment hole 41 of the second mask 40 to complete the second mask 40. The alignment with the first mask 30 and the circuit substrate 20. The adhesive applied to the peripheral region 22 of the circuit substrate 20 is bonded to the second mask 40 so that the second dry film surface 25 and the second mask 40 are in close contact with each other. As shown in Fig. 4, the first photomask 30, the circuit substrate 20, and the second photomask 40 which have been accurately aligned and sequentially bonded are obtained. The fourth step: the aligned circuit substrate 20, the first mask 30 and the second mask 40 are removed. The control unit 1413 causes the brake 1412 of the lifting device 14 to lower the lifting table 142, and removes the aligned and integrated first mask 30 and circuit board 20 from the carrier 12 of the automatic registration device 10. The second mask 40 can perform subsequent operations such as exposure, development, and etching. Similarly to the start brake 1412, in the present embodiment, the brake 1412 of the lifting device 14 is deflated by releasing the pedal of the control portion 1413 to lower the lift table 142. In summary, the present invention has indeed met the requirements of the invention patent, and the patent ψ μ is proposed according to law 16 200928620. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of an automatic alignment device provided by an embodiment of the present technical solution. 2 is a perspective view of an automatic alignment device provided by an embodiment of the present technical solution. FIG. 3 is a schematic structural view of a substrate to be aligned and a photomask according to the present technical solution. FIG. 4 is a schematic diagram showing the state of the alignment of the circuit substrate and the reticle of FIG. 3 by the automatic alignment device provided by the embodiment of the present technical solution. [Main component symbol description] Automatic alignment device 10 Abutment 11 Base surface 111 First fixing hole 112 Carrier table 12 First surface 121 Second surface 122 Second fixing hole 123 Screw 124 17 200928620
對位通孔 125 支撐件 13 升降裝置 14 制動部 141 升降部 1411 制動器 1412 控制部 1413 升降台 142 第一平面 1421 第二平面 1422 對位件 1423 螺紋孔 1424 輔助支撐件 16 電路基板 20 線路板單元 21 週邊區域 22 基板對位孔 23 第一幹膜面 24 第二幹膜面 25 第一光罩 30 第一對位孔 31 第二光罩 40 第二對位孔 41 18Alignment through hole 125 Support member 13 Lifting device 14 Brake portion 141 Lifting portion 1411 Brake 1412 Control portion 1413 Lifting table 142 First plane 1421 Second plane 1422 Alignment member 1423 Threaded hole 1424 Auxiliary support member 16 Circuit board 20 Circuit board unit 21 Peripheral area 22 Substrate alignment hole 23 First dry film surface 24 Second dry film surface 25 First mask 30 First alignment hole 31 Second mask 40 Second alignment hole 41 18