TW200405857A - Lamination of liquid crystal polymer dielectric films - Google Patents

Abstract

A multi-layered structure and method of formation. A page is generated by stacking N substructures (N≥2) in an ordered sequence. A first substructure of each pair of adjacent substructures comprises liquid crystal polymer (LCP) dielectric material to be bonded with a second substructure of a pair of adjacent substructures. The page is subjected to a temperature less then the lowest nematic to isotropic transition temperature of LCP dielectric material within the page. The dwell time and elevated pressure are sufficient to cause all LCP dielectric material within the page to plastically deform and laminate each pair of adjacent substructures without extrinsic adhesive layer disposed between the first and second substructures of each pair of adjacent substructures.

Description

200405857 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to the lamination of liquid crystal polymer dielectric films to form a multi-layer laminated structure. [Prior art]

Organic substrates including at least a multilayer laminate structure have been continuously developed for many applications. However, the technology that can reduce costs and produce multilayer laminate structures inefficiently is still the current industry goal. SUMMARY OF THE INVENTION In a first embodiment, the present invention provides a multi-layer structure including at least: a first layer; and

The second layer, wherein the first layer includes at least a first liquid crystal polymer (LCP) dielectric material, and wherein the first layer is combined with the second layer to make the first liquid crystal polymer dielectric material unnecessary In the case of adding a bonding material, it is directly bonded to the second layer. In a second embodiment, the present invention provides a method for manufacturing a multi-layer structure. The method includes at least the following steps: forming a page layer including stacked N substrates, which are stacked in a regular order so that N is at least 2, wherein each A first secondary structure of the adjacent secondary structure includes at least a liquid crystal polymer to be combined with a second secondary structure of the adjacent secondary structure; and 3 200405857 so that the page layer is higher than the liquid crystal in the page layer The minimum phase sequence of the molecular dielectric material is one of the lower isotropic transition temperatures, and it is under a pressure that is high enough to plastically deform all the liquid crystal polymer dielectric materials in the page layer, and does not require Each pair of adjacent secondary structures is directly laminated by placing any additional adhesive layer between the first secondary structure and the second secondary structure of each pair of adjacent secondary structures. The invention effectively reduces the manufacturing time, the manufacturing cost 'and reduces the thickness of the dielectric material layer in manufacturing the multilayer structure. [Embodiments] Liquid crystal polymer (LCP) dielectric materials have many advantages in forming a dielectric layer, including good dielectric properties, low cost, and good mechanical properties. Ancient and daily molecular dielectric materials have some properties similar to polyimide (polymer), such as good crack resistance and spread resistance, making liquid crystal polymers suitable for very thin layer processes (such as electroplating). The liquid crystal polymer dielectric film can provide better dielectric properties, better water resistance, better performance and lower cost than polyimide films. However, regardless of the multilayer structure formed by the liquid crystal polymer dielectric material, a bonding dielectric layer is usually required. The invention discloses how to eliminate the need to add an intervening adhesive layer to bond the liquid crystal polymer dielectric 2 to another material layer (such as a metal layer or a dielectric layer), so as to reduce the layer thickness, process time, and material cost. In addition, this type of liquid crystal polymer dielectric film is flame retardant without the addition of tooth additives. Multilayer composites made from this material are flame retardant without the use of self-produced materials. The liquid crystal polymer dielectric material 4 which is currently available for use in the present invention 4 200405857 is a BIAC thermotropic liquid crystal high breakup that can exhibit thermal anisotropy characteristics. It was produced by WLGore & Associates, Inc. in a sheet or roll form. Information on the South molecule of the BIAC liquid crystal can be made 2 Wang Wang searched from the website: http // www · gore · com / electronics. Another liquid crystal polymer dielectric material that is on the market and is used in the present invention is a ZYVEX LCP thermotropic liquid crystal polymer that can exhibit thermal anisotropy characteristics, which is manufactured by ⑴ Corporation in a rolling manner. In general, any liquid crystal polymer dielectric material may be suitable for the present invention depending on the required material characteristics of the application. US Patent No. 627424290 (obtained by Onodera et al. In 2001, hereinafter referred to as Onodera '242 patent), the entire contents of which are incorporated herein by reference, this patent discloses a method for manufacturing liquid crystal The method of molecular thin film includes a known thermotropic liquid crystal polyester and a thermotropic liquid crystal polyester amino compound. The liquid crystal polymer film is prepared from four compound grades shown in * 1 to Table 4 in ONODERA '242 patent. An illustration of the synthesized liquid crystal south molecular structural unit is derived from the four compound levels in Table 5 of the Ondera '242 patent. The liquid crystal polymer dielectric material disclosed in Onodera '242 patent is merely exemplary, and other liquid crystal polymer dielectric materials still fall within the scope of the present invention. In general, any method known to those skilled in the art can be used for manufacturing the liquid crystal polymer dielectric material. Liquid crystal polymer dielectric materials can exist in one of three phases: a liquid crystal phase (such as a nematic, a torsion layer), an isotropic phase, and a chemically unstable phase, each of which corresponds to three temperature zones. Crystallization temperature zone, isotropic temperature zone 5 200405857, chemically unstable attitude zone. In the liquid crystal phase or liquid crystal temperature region, the local molecular regions or ranges of liquid crystal two-molecule dielectric materials containing polymer chains can be directionally arranged (that is, anisotropic distribution) through the process. In the liquid crystal phase, different molecular regions may have different directional arrangements, and many molecular regions have only some or non-directional arrangements. These polymer chains are generally less prone to f-curves. The directionally arranged local molecular regions may include regional molecules and adjacent molecular groups, so that the spatial range of the local molecular regions may reach thousands or hundreds of angstroms or less. The macroscopic material properties of liquid crystal polymer dielectric materials (such as the coefficient of thermal expansion (CTE), dielectric constant, and thermal conductivity) are sensitive to the directional arrangement of local molecular regions, and the material characteristics of liquid crystal polymer dielectric materials also conform to the direction Sexuality is anisotropic. The macroscopic material properties of liquid crystal polymer dielectric materials also depend on the shape, size, shape distribution, and size distribution of local molecular regions. The liquid crystal polymer dielectric material is formed into a directional arrangement by a technique familiar to those skilled in the art to provide desired characteristics in a liquid crystal phase. These technologies can include: unrolling the liquid crystal polymer dielectric material at a specified temperature and speed, and extruding the liquid crystal polymer dielectric material through the film, or extruding through the film, or stretching in the direction of the roller or perpendicular to the roller, Dimensional shearing, which can also optionally be performed with a strongly polarized electric field. The liquid crystal polymer dielectric material will maintain the liquid crystal phase if its strict production is located in the liquid crystal temperature layer, that is, lower than what is called a nematic soil seeking transition temperature (TNI). Therefore, Tni represents a liquid crystal polymer dielectric material, which has a solid characteristic in the direction of liquid crystal 200405857, and its material is guided by gravity, plasticity, quasi-pressure, etc.), the dielectric characteristic pressure surface effect rises to uniformity. The liquid crystal phase transitions to an isotropic phase transition temperature. The value of Tni depends on the characteristics of the liquid crystal high-discharge material. In addition, the liquid crystal polymer dielectric material's sexual arrangement and macroscopic material characteristics will not change qualitatively within the liquid crystal temperature range, nor will it exceed the liquid crystal temperature range. The macroscopic material will not change under the temperature change of the liquid crystal temperature layer, because there is not enough thermal energy in the liquid crystal temperature layer to adapt to the directionality of the polymer chain of the liquid crystal polymer medium, in other words, to overcome the internal molecules 〇The liquid crystal polymer dielectric material is deformed when subjected to high pressure in the liquid crystal phase. For example, 'when manufacturing a link', the high voltage may be caused by the applied standard force and local irregular geometry (such as a coarse M surface sm channel, etc.) Stress concentration). Therefore, if the liquid crystal polymer dielectric material is laminated to a material layer (at least containing dielectric materials, metals, and the temperature is raised to a range of liquid crystal phase under high pressure), the liquid crystal polymer material will undergo plastic deformation and conform to The macroscopic geometry and surface features (such as channels) of the surface of the material layer. The liquid crystal polymer dielectric material is in a sufficient state and in the I state during the manufacturing process. The adjacent layer% surface and the characteristic plastic deformation ability are passed through the experimental meeting of the present invention. Unexpectedly, it is also the basis of the present invention. With the present invention, by raising the temperature to the liquid crystal temperature range, the crystalline polymer π electric material will be the adjacency table Φ of the lamination material layer, and S is enough pressure A plastic deformation process that can cause plastic deformation to adhere to adjacent surfaces while retaining its macroscopic characteristics does not require the additional adhesive layer to be bonded to the polymer dielectric material to combine with the adjacent layer. 200405857 Figure 1 is Preferred according to the present invention: The examples describe a local molecular range of 200 in the direction of a polymer chain with azimuth orientation in an isotropic liquid crystal phase. Contains directional polymer chains 201 to 208. The average azimuth direction and integration angle of polymer chains 201 to 208 are roughly the same as orientation 21. The integration of this angle can be obtained by performing any of the conventional methods (if known different The combined polymer chain can be adjusted in the manner of angular integration. However, regardless of how these special definitions define the average angle, the angular distribution of its azimuth

Both are anisotropic so that the preferred pointing system is azimuth 2 10 or close to azimuth 2 10. In this illustration, each of the polymer chains 201 to 208 shows linear links with alternating rigid and semi-elastic structures. For example, the polymer chain 2 05 includes at least continuous structures 2 2 1 to 2 2 6, wherein the structures 2 2 1, 2 2 3, and 225 are rigid structures, and the structures 222, 224, and 226 are semi-elastic structures. The rigid structure in the example refers to an aromatic ring (such as benzene, biphenyl, camphor, etc.) that is repeatedly replaced, as disclosed in US Patent No. 6274242 (by 0nodera #, please refer to Table 1 to Table 5) and US Patent No. 5900292 (applied by Moriya et al., See Formulas 1 to 4). The rigid structure may have a reactive functional group (such as a hydroxide, an ammonium group, a S group, and a compound thereof). The exemplified semi-elastic structure refers to a

A polymer backbone structure that contains repeating fatty units (such as oxymethyl units, ethylene oxide units, ethylene test units, and oxocell units). The semi-sexual structure may have chemical functional groups (such as hydroxide, amine, cyano, carboxylic acid, and compounds thereof, etc.) The above-mentioned polymers can be prepared in two ways. The first is the rigidity and semi-adjacentness of adjacent esters. The ends of the elastic structure can be chemically coupled to each other, bonds, amino compounds, etc. and connected to the polymer chain. 200405857, the same purpose, but the link or linking segments (esters, ethers, amino compounds, etc.) will only be Semi-elastic structure.

Figure 1 shows that each of the polymer chains 201 to 208 is a linear chain with rigid and semi-elastic structures alternately linked. Any linear chain-like rigid and semi-elastic structure (such as discontinuous alternating rigidity and semi-elastic structure) Elastic structure) are evenly located in local molecular regions. Figure 丨 shows that each of the high molecular bonds 201 to 208 ', like a linear chain, is in any local molecular region. For example, 'a local molecular region may or may contain a chain structure, and it contains one or more branched chains linked to a linear chain. At the same time, figure 丨 shows a two-dimensional linear chain. The local part + area is generally a three-dimensional space-oriented chain structure. For example, a portion of any of the polymer chains 201 to 208 may extend above or below the plane described in FIG. Therefore, Figure 1 can also be regarded as a three-dimensional local molecular region projected on a two-dimensional surface, and the chain links can extend above or below the description plane.

In the isotropic phase or isotropic temperature zone, the temperature at or above the specific nematic to isotropic transition temperature (TNI) is sufficient thermal energy to allow the polymer to diffuse or move within the translated polymer dielectric material. To change its directionality. Therefore, when the temperature rises from TNI to Tm, the directivity and azimuth will become more random. Therefore, as previously described, “because the macroscopic material characteristics are more sensitive to the orientation of the polymer chains in the liquid crystal polymer dielectric material, the general macroscopic material characteristics will be somewhat different when the temperature rises from TN I to T NI. Variety. When the liquid crystal polymer dielectric material is laminated to the material layer in the isotropic layer range, the liquid crystal polymer dielectric material becomes soft and liquefied to become a feature of the surface of the material layer and the macroscopic geometric surface. This all depends on the subsequent cooling and directional treatment of 9 200405857. When the material is laminated to the material layer within the temperature range of the liquid crystal temperature layer, the liquid crystal will be characterized by the macroscopic geometry of the material layer. The present invention teaches that only the liquid dielectric material is laminated to the material layer, leaving the macroscopic geometric surface of the material layer. On the contrary, as explained earlier, the liquid crystal polymer dielectric material will not flow under sufficient pressure, and the liquid crystal polymer method will be taught in the range of the special crystal temperature layer with plastic deformation on the reverse surface and the surface. Preserved surface characteristics during pressing. Lower temperature range in the liquid crystal warming layer can reduce material melting or large-area molecular reorientation

risks of. Another advantage is that the liquid crystal high-molecular dielectric material can be laminated to the material layer without an additional bonding layer. FIG. 2 illustrates a local molecular region 250 with some or no directional polymer chains in an isotropic phase according to a preferred embodiment of the present invention. The region 250 contains directional polymer chains 251 to 260 to make it average orientation. The direction and integration angle divided by the azimuth direction of the polymer chain 201-208 is approximately zero, that is, there is no better direction or azimuth in the area 25 °.

Each of the polymer chains 251 to 260 has been shown as a linear chain consisting of alternating rigid and semi-elastic structures. For example, the polymer chain 259 is composed of continuous structures 271 to 277. Among them, 271, 273, 275, and 277 are semi-elastic structures, and 272, 274, and 276 are rigid structures. The polymer chains of the rigid and semi-elastic structures in Figure 2 are similar to the rigid and semi-elastic structures in Figure 1, respectively, and the illustrations of the rigid and semi-elastic structures discussed earlier with reference to Figure 1 also apply. The rigid and semi-elastic structure in Figure 2. Figure 2 shows that each polymer bond 25i to 260 is a linear link with rigidity alternating with 10 200405857 and semi-elastic structure. Any rigid and semi-elastic structural linear link (such as discontinuous alternating rigidity and semi-elastic structure) ) Is also located in the local molecular region. At the same time, the polymer chains of each linear chain structure 2 51 to 2 60 are also shown in Figure 2. Any polymer chain structure is located in the local sub-region. For example, a local molecular region may also / or may contain a chain structure with one or more branch chains linked to a linear chain. Figure 2 is a two-dimensional linear chain representation. The local molecular region generally has a three-dimensionally oriented chain structure. For example, any part of the polymer chain 25 1 to 260 may extend above or below the plane described in FIG. 2. Therefore, Figure 2 can also be regarded as a three-dimensional local molecular region projected on a two-dimensional surface, and the link systems can extend above or below the description plane. In a chemically unstable phase or chemically unstable temperature range, that is, a temperature that is higher than the nematic to isophase transition temperature (Tni), which has sufficient thermal energy to cause chemical decomposition in the liquid crystal polymer dielectric . This chemically unstable phase has little to do with the present invention. The invention discloses a method for laminating a liquid crystal polymer dielectric material on a material layer (such as a dielectric layer, a metal layer, or a combination thereof). As described in the background of the invention, the implementation tests of the invention will be discussed below. Until the test of 1994, the present invention used conventional techniques to melt the liquid crystal polymer to establish a multilayer. The junction uses' accurate temperature control; it is equal to or above the melting point temperature (that is, Tni). These materials are laminated below, and the melting point temperature is determined by a differential scanning calorimeter or a plate rheometer. The characteristics of these experiments are the sticking caused by repeated iterations, the extrusion of the thickness of the edges of the laminate, etc. 'What is important is the physical characteristics of the laminates. It should be particularly noted that these 11 υυ ^ 5857 are anti-reflective and have the same amount of change. When the connection is used, the thermal expansion coefficient caused by the temperature of the package is 4. Obviously, the characteristics of the substrate laminate have been changed. , λ & 'The use efficiency is destroyed, so the use of an adhesive layer can form a multilayer material. ; Experiments between June and September 2002 have proven that at temperatures as low as T, 1, / «ΤΓ Μ will achieve adhesion without changing the characteristics of substrate lamination-for example, Gero BIAC materials can also be used, Its thickness is 002mil and the sides are covered with 15μm thick copper. After the copper is etched, the inventor has a thermal expansion coefficient of about 20 to 25 ppmrc, which is in line with that provided by the manufacturer.

The thermomechanical analyzer is used to determine the thermal expansion coefficient on a flat plate (measured at about 13M8 inches at different positions. The thermal expansion is measured in the X and Y directions (the two directions are at right angles to the thickness of the BIAC material layer). And they are perpendicular to each other.) Both the film fiber structure and the more common contact probes are being measured. ~ Α ~ μ, Gong Yi You Yier multilayer

Compression consists of four to six layers of material using GO BIAC, of which copper has been etched away. The process was performed at a heating rate of 15 ° F per minute to 56 ° F for lamination, and the temperature was maintained at about 20 to 30 minutes while cooling to room temperature at a rate of about 20 ° F per minute. The interval defined here includes those within the scope of the patent application, the time interval during the lamination process, so that some of the experiments during the lamination process, all laminations, and all process steps reach the highest temperature (due to statistical errors and variations, This maximum temperature still falls within a reasonable temperature), the main temperature should be 5 60 ° F is still lower than the liquid degree of Gore BIAC material 63 5 ° F (assuming here is equivalent to τΝΙ). The lamination system uses electric 12 200405857 steel plate for flattening, and the pressure is maintained at 2500 psi throughout the entire process. Use stainless steel pressure plate and copper release sheet. Long uses tetrafluoride polyethylene (PTFE) and copper insert layer to form a pressure plate on the tool or ~. After removing these pressures, the inventors did not find any dielectric or electrical materials overflowing the edges in the lamination. Thermal expansion in X and Y directions. After performing the adhesion test until the inner layer adhesion strength was measured, the thermodynamic analysis was repeated and determined. The expansion coefficient was not changed after the lamination process was processed. ′ Pulled 1 inch per minute at 180 degrees.

Get more than 6 pieces / British pair.

The same lamination process is not repeated until the actual circuit characteristics can be evaluated. A dielectric layer Roger 2800 (PTFE / SiO 2 filler) is used here, and the surface characteristics of the dielectric layer Roger 2800 include 12 μm thick copper to form circuit lines with a width of 30 to 50 μm. Gore BIAC LCP (50 μm thick) was placed on the surface of the Roger 2800 dielectric layer and laminated under the previously described conditions. It was found in the removed and subsequent cross-cut sections that the circuit features were completely covered. As before, no dielectric material overflowed the edges in the laminate. Adhesion tests have proven that the inner layer adhesion strength between the liquid crystal polymer and the Roger 2800 dielectric material exceeds 4 pounds per inch. In another experiment, standard lithography technology was applied to a liquid crystal polymer covered with copper. (That is, 15 μm of copper is covered by Gore BIAC LCP) to form a 50-500 μm wide hole in one of the copper surfaces. pattern. The second sheet of Gore BIAC LCP (copper removed) will rest on the first sheet with holes. As described previously, after repeating the lamination process, cross-cut the 13 200405857 parts of it and determine the ‘child L-hole P —

电 材料。 Electric materials. At the same time, it was found again that the edge of the BIAC LCP was completely filled, and the adhesion of the board was consistent with any dielectric material overflowing in the lamination. For the first time, the lamination experiment was carried out on a 4 /, X ,, ton press with a non-vacuum push-down—the flat plate size of 4 was electro-thermal 7 ″ Dan Gongye, the company ’s S, made the 4 heat press. The effect is doubled by the pressure of PHI shares. The most and the real two are laminated with 125 tons of Wabash machine to 13〃 X18〃 specifications and then 600-mouth electrothermal TMP pressure.

These larger samples are used to formulate the uniform size, hole filling, and physical properties of the plate when actually manufactured. Depends on the experiment by Xiangang and the analysis of the auxiliary Uye U + to help 77 analysis, it will be the same as the directional order characteristic of the liquid crystal polymer J electric material # ,,, and (as described earlier), that is, in the liquid day And the direction of the net will be ^ t | 〇t Wu. The basic technology of laminating a liquid crystal polymer dielectric material to a material layer (such as a dielectric layer, a metal layer, and a compound layer) of the present invention is implemented in a liquid state in a temperature range that does not fall at all. Crystallization / Range τ (i.e., T < TNI), sufficient pressure for a period of time to enable the liquid crystal polymer electroluminescent material to effectively layer a to the material layer.

For Gore BIAC LCP materials, the nematic to isotropic transition temperature is 63 5 0F. For Gore BIA LCP materials, the maximum lamination temperature: a] is 635 ° F. However, due to temperature uncertainty and environmental changes, the maximum process temperature can be about 620 ° F, and the typical lamination temperature range especially

Eight daggers: 540F to 620oF and 545F to 580 ° F. For ZYVEX LCP, the nematic to isotropic transition temperature is about 536 ° F, and its maximum lamination temperature should be less than 536 ° F; however, due to the uncertainty of the temperature and the change in temperature, the highest process temperature It can be about 520 ° F, and the typical lamination temperature is 14 200405857 degrees. Fan Jg female, # 印 九 * include: 4400F to 520 ° F and 4650F to 590 ° F. Although the pressure was performed at a pressure of 25 OOpsi in the previous experiment, the present invention can obtain better viscosity using a pressure range of 1000 to 3 000 p si.

Knot degree. " 4 ^ D D The improvement in cylinder uniformity is proportional to the increase in pressure. The effectiveness of this pressure depends on the aspect ratio of the features that must be filled during the lamination process. The experiments performed by sun and moon jfer1 rttl jli have also pointed out that the pressure range of 2000 to 25 OOpsi is particularly effective, which is also practical and economically applicable in the traditional clothing environment. Excessive pressure will have the disadvantage of shortening the life of the pressure tool and the plate ... The process time used by the inventor includes applying the liquid crystal polymer dielectric at a maximum temperature for a minimum of 2 to 5 minutes and a maximum of 60 minutes. It was also found that although the syntactic properties of some bonds would improve over time, no boundary extrusion or overflow phenomenon was found. Because of &, the maximum process time is dependent on temperature and pressure, and the pressure is usually at least 2 minutes, and the more feasible process time range is especially white and red. t, including 2 to 60 minutes and 15 to 30 minutes. The shortest process is required, and the & must be uniform. However, increasing the processing time is more helpful for filling the σ ▲ feature of this feature. On the other hand, the time for manufacturing is relatively square.疋 It is more convenient and has shorter processing time to achieve economic goals. However, judging from the advantages of the characteristics obtained by lamination, there is no upper limit on the processing time. From the point of view of Jianzhang, the results obtained by repeatedly performing the lamination and lamination pressure are changed by changing the value of a 1 and turning 18 0), so that the low point becomes the high point, which will make the sticky, uniform, and mouth uniformity better. In particular, 1, especially the part that extends along the edge. According to the theory and test of liquid crystal two-molecule dielectric materials, the liquid crystal 200405857 == material is laminated to the material layer related lamination technology for its own reasons Dimorph ... Dielectric material: It is a sorted liquid crystal polymer, partly based on the production of ## + 电 材 枓 (that is, square :: domain directionality is pointed at 1 to: under order). Now. Consuming the previous discussion, Jiao Shi 4 praised the lamination and bonding process is also a particle of liquid crystal polymer ㈣, such as ceramics ...

Make λ === dimension, or even metal particles. Furthermore, the reinforced layer of the PTF £ 77 gate " electrical material is also within the scope of the present invention. In the present invention, the desired properties of the liquid crystal polymer dielectric material have application properties. For different applications, the material properties may include: a planar two-y expansion coefficient (that is, perpendicular to the thickness of the liquid crystal polymer dielectric layer) Directional heat = expansion coefficient) is about 10 to 25 ppm / 〇c; dielectric constant is about 25 to 30, θ gas, 3 to 6 GPa, the dissipation factor is less than 0.003, and the humidity is about 2 atm. 〇2% less. The thickness of the liquid crystal polymer dielectric layer can be differently designed according to the desired performance characteristics of the inner layer structure.

Ten performance requirements' can also be equal. In terms of manufacturing efficiency, lamination is generally performed with a "book" containing multiple pages. The following #theory will reveal two methods of performing a multi-layer laminated internal bonding structure (called a ply), called a flat laminator (see Figures 3 to 4) and a pressure cooker laminator (see Figure Figure 5). Figures 3 and 4 describe a flat plate type for laminating several stacked layers containing a liquid crystal polymer dielectric material according to a preferred embodiment of the present invention. 16 200405857

The laminator, in FIG. 3, includes a flat-bed laminator 300 supported by a bracket 302 as a structure, which has an upper platform support 304, an intermediate platform support 308, a lower platform support 306, An upper plate 3 22, two middle plates 324 and 326, a lower plate 328, several book plates 311 to 313, a guide rod 320, a hydraulic system 329, a vacuum pump 340, and a vacuum supplier 342. The flat plates 322, 324, 326, 328, and book plates 311 to 313 can be supported by the middle platform support body 308 from below, and restrained from above by the upper platform support body 304. The flat plates 322, 324, 326, and 328 are laterally supported and vertically guided by the guide rod 320. The hydraulic system 329 includes a hydraulic cylinder 322, a hydraulic fluid 334, a piston 330, and a pump (not shown). The pump circulates the hydraulic fluid 334 through a supply line coupled to the pump. The hydraulic fluid 334 is used to provide pressure to the plates. The hydraulic fluid 334 typically has an operating pressure in the range of approximately 5000 psi. The pressure applied to the plate depends on the size of the plate relative to the diameter of the hydraulic piston 3 3 0. In the present invention, it is a product layer in a booklet that is applied with a pressure range of about 1,000 to 3,000 p si. A vacuum pump 340 and a vacuum supplier 342 can also be used to form a vacuum in the processing chamber pressure to reduce oxidation and voids in the lamination process. Alternatively, the vacuum pump 340 can be omitted or turned off during the laminating operation. The supply channels or supply lines for the heating or cooling system of the plate (which can be electrically or liquid-heated or fluid-cooled) are not shown here. The book plate 311 is placed between the upper plate 322 and the middle plate 324. The plate 312 is placed between the middle plate 324 and the middle plate 326, and the booklet plate 313 is placed between the middle plate 3 2 6 and the lower plate 3 2 8. Figure 3 also shows 17 200405857

The book plates 311 to 313, the flat-bed laminator 300 can handle at least one of the book plates, and between the upper support body 304 and the middle support body 308, and as many book plates as possible can be installed geometrically. Plate and booklet thickness in the 310 direction. Each of the book plates 311 to 313 includes at least one or more page layers, and each page layer includes at least a multi-layer and / or multi-layer structure, which are to be moved in the 310 direction through the piston 330 together So that each book plate is compressed between the flat plates on both sides of the contact book plates (for example, the book plate 312 is compressed between the flat plates 3 24 and 326). The multi-layer or multi-layer structure of each page layer includes at least one or more liquid crystal polymer dielectric layers. During the pressing operation, the piston 330 is raised in the 310 direction, so that the flat plates 322, 324, 326, 328 come into contact with the plates 311 to 313. During the lamination process, the flat plates contacting the book plates not only compress the book plates by the surface, but also raise the temperature of the liquid crystal polymer dielectric layer in the page layer in each book plate by a heat source. Discussed below.

FIG. 4 shows the detailed structure of the book plate 312 and the flat plates 3 24 and 326 in FIG. 3 according to the preferred embodiment of the present invention. The book plate 3 1 2 includes at least a plurality of plate layers in a replaceable order and a plurality of page layers between the pressure pads 3 62 and 3 64. In particular, the book plate 3 1 2 includes at least the exchangeable plate plate 37, the page layer 357, the plate layer 380, the page layer 358, and the plate layer 390. The flat plate layer 370 includes at least a flattening plate 372 located between the release sheets 371 and 373. The platen 372 helps to flatten the sheet layer 357. There are many considerations in selecting the material for the flattening plate 372, including its thickness, size, and thermal expansion characteristics. In many applications, the platen 3 72 may include several pieces of stainless steel. The release sheets 371 and 373 should contain a material (such as copper) so that the plate layer can be easily separated from the sheet layer after the lamination process. The plate layer 380 includes a platen 382 located between the release plates 381 and 383, and the platen 382 and the release plates 381 and 383 are similar to the platen 372 and the release plates 371 and 373, respectively. The plate layer 390 includes a platen 392 located between the release plates 391 and 393, and the platen 392 and the release plates 391 and 393 are similar to the platen 372 and the release plates 371 and 373, respectively. The autoclaving pads 362 and 364 may include a reinforcing material for more uniform lamination by compensating for uneven thicknesses of the sheets and the space in the release sheet. The flat plates 324 and 326 have similar structures. In the flat plate 324, the heating element 354 can generally be heated in any manner well known in the art, such as heating with several resistance heaters or a heated circulating fluid such as oil. The inlet pipe 351 and the outlet pipe 352 are used to pass circulating fluid (such as air, water, etc.) through the flat plate 324 for cooling. The plate 324 also includes a thermal coupling port 353 to measure the temperature of the plate 324 using the thermal coupling. The plate 324 is bundled with a covering plate 3 55 so as to flatten the book plate 3 12 when the book plate 312 is flattened. The covering plate 355 is a heat conductor, and transfers heat generated by the heating element 354 to the book plate 312. These cladding plates should have a more good ", conduct 1 ± ' and may also include harder steel in some applications. Figure 5 illustrates a pressure cooker laminator for laminating stacked layers containing a liquid crystal polymer dielectric material according to a preferred embodiment of the present invention. In FIG. 5, the one-layer pressure cooker 400 includes a groove 404 surrounded by a surrounding wall 402. The tank 404 includes a vacuum bag 419 enclosed by an elastic film 418. A volume plate 410 is placed in the vacuum bag 419. The vacuum bag 々Η can have different structures, but it must completely cover the booklet 4 丨 〇 and have some flexibility 19 200405857 so that the vacuum bag 419 can adapt to the booklet 4ιo when vacuuming (described in infra) . The vacuum bag 419 and the booklet plate 41 were then placed behind the tank body 404 and then sealed. The vacuum bag 419 also includes a gas channel 409 to facilitate vacuuming the vacuum bag 419. The vacuum bag 419 and the included plate 410 are supported by a tray 412. The elastic film 418 has a pressure limit and interfaces with the pressurized and heated gas (e.g., nitrogen) in the groove body 404 outside the elastic film 418. The vacuum pump 4106 is used to exhaust the air in the vacuum bag 4 19 through a vacuum supply line 4 08 to control the pressure difference between the outer surface of the elastic film 4 丨 8 and the vacuum bag 419. The pressurized and heated gas 420 is supplied into the tank 404 through a gas inlet line 416 through a gas source 414. Therefore, 'the gas 42o passes through the medium of the heated and boosted booklet 410 to laminate some of the sheet layers into the booklet 41o. The obtained laminations are similar to those obtained by flat lamination, and both can reach compressive stress perpendicular to the plate 410. However, due to the lack of shear stress on the outer surface of the plate 4, the pressure cooker 400 is generally used to improve the pressure uniformity. Although FIG. 5 shows only one vacuum bag, the scope of the present invention also includes several vacuum bags that can be located in the tank 404. For flat laminators and laminating pressure cookers, temperature, pressure, and process time can be used to laminate one or more liquid crystal polymer dielectric materials to other material layers (discussed below). Therefore, during the lamination process, the polymer dielectric material should be sufficiently pressurized for a period of time at a temperature T (i.e., T < TNI) within the liquid crystal temperature range within the isotropic temperature range to make the liquid crystal polymer dielectric The electrical material can be efficiently laminated to the material layer. For many applications, pressures between 1 000 and 3 000 psi will have very good adhesion. 20 200405857 For the maximum temperature and pressure process time ... generally at least two points and suitable reaction temperatures include: 2 to 60 minutes and 5 to 30 minutes. The person skilled in the art knows that the conventional thermally stable dielectric layers (such as epoxy-based, pre-glass) can be laminated, and the comparison results (such as adhesion and fluidity) can be obtained with reduced strength. This suggests that in liquid crystal polymers, reducing the pressure (there may be two factors) may be more effective ' and it may reduce the cost of laminating pressure steel. The pressure cooker can be used to stack other well-known conditions in the field and the process time. Except for the flat laminator and the laminated high-pressure liquid crystal high-splitting dielectric layer to the material layer, the lamination pressure hardware is in accordance with the foregoing. The lamination can be performed under temperature and pressure. The s pressing process can be used to stack stacked liquid crystal polymer dielectric materials (either liquid crystal polymer dielectric materials or non-liquid crystal molecular dielectric materials), 4 metal layers (such as signal layers, power layers, base layers, etc.) And its signal layer. In # 搂 cognition floor occupancy, this kind of stack should pay attention to the standard between layers. Each copper-clad medium mine is) 丨 Electric material center has reference (reference) hole to

Mechanical pins can provide layer-to-layer & I_ layer alignment. The circuit formed by this lithography step and the pressing process of this layer

J r uses a court-like reference hole. You can use special tools that contain holes corresponding to I and can be as thin as pins. This is a reference for the core of dielectric materials. Holes can be formed before the material denting, as a reference, or can be lithographic After the step, reference the characteristics of the RadiM circuit to drill holes. Such a technique allows calculations to determine the ot q ideal position of the pinhole to compensate for distortions or dimensional changes during the lithography process (牿 by ββ ^ V and 符 by 疋 thin layer). Alternatively, the technology of Optics 21 200405857 can be used, by which the central circuit feature can be detected, and then in the lamination process, the layers are positioned without relying on any pins. The following figures describe the lamination with one or more liquid crystal polymer dielectric layers: Figures 6A to 6B (to Figure 7B (collectively referred to as "Figure 7" is "Figure 8"); Figures 9A to 10A to 10B (collectively referred to as Figure 11B (collectively referred to as "Figure U") and the combination of Figures 12 to 13 is to laminate all dielectric layers on at least one Containing a liquid crystal polymer dielectric material is called "Figure 6"); Figure 7A); Figures 8A to 8B (collectively referred to as Figure 9B (collectively referred to as "Figure 9"); "Figure! 0" ”); Figures 11A to) ° For the lamination of the layer diagrams of Figures 6 to 11 (to be described below) but adjacent to the surface, the dielectric layer material 'is implemented in an isotropic temperature range

The temperature T (that is, τ < T n I) within the liquid crystal temperature range within the range, sufficient pressure (such as 1000 to 3000 psi) for a period of time to enable the liquid crystal polymer dielectric material to be effectively laminated to the Material layer. For the highest temperature and pressure, the process time should generally be at least 2 minutes, and more suitable process times include: 2 to 60 minutes and 15 to 30 minutes. If the multi-layer liquid crystal polymer dielectric material layer and / or the multi-layer liquid crystal polymer dielectric layer substructure are simultaneously laminated to adjacent surfaces, the TNI value satisfying T < TNI will be all dielectric materials, including the foregoing The minimum value of the multilayer liquid crystal polymer dielectric material and the secondary structure of the liquid crystal polymer dielectric layer. All dielectric layers are assumed to contain & crystalline polymer dielectric materials, and the conditions of previous temperature, pressure, and process time will be referred to as "invented TPD conditions" hereinafter. FIG. 13 shows various substructures as laminated constructions according to the present invention. 22 200405857 In Figure 13, the substructure 500oθ structure, which consists of any of the well-known, "D-type" dielectric layer subjunction dielectric materials, ceramic dielectric materials, Dielectric materials (such as crystalline polymer dielectric materials, etc.). If the secondary structure is a two-molecule dielectric material or a non-hydraulic material, the secondary structure 500 is ~, and the secondary structure 500 contains a liquid crystal polymer. If the secondary structure 500 does not contain a liquid crystal, the molecular structure is "D type". Vice structure. This is a non-liquid crystal polymer "D-type sub-dielectric material, and the substructure is 500". The secondary structure 5 1 0 is a "P-type_ which is a continuous conductor layer (such as a metal structure, also known as a" power layer ", and the body layer contains one or more holes (not Q gold, etc.). In any of the techniques well known in the continuous guide (for example, transformation and extraction), the holes are formed by the pin domain substructure 520-"DS /: engraved, laser money hole, etc." The "W" structure on the signal layer 522, which includes a "D-type field manager, -D-type" substructure 521 l, which includes any dielectric layer that is already well-known in the field; ^ Such as organic dielectric materials, ceramic dielectric materials, (Example 1 / Ή ', liquid crystal polymer dielectric materials, non-liquid crystal polymer dielectric materials, etc.). The pass-through layer is characterized by containing a conductive circuit layer. The secondary structure 520 may be formed in any conventional manner. For example, it can conventionally laminate a continuous metal sheet (such as a copper-clad dielectric material) to a "D" substructure 5 2 1 to or electroplating (or other deposition method) the continuous metal sheet onto the " D-type "substructure 521. Then, the sub-structure 520 can pattern the metal sheet by lithography technology, and chemically etch the metal sheet to form the circuit lines of the signal layer 522. The sub-structure 53 0 is an "SDS-type" sub-structure, which includes at least the signal layers 5 3 2 and 5 3 3 and is located on the opposite side of the "D-type" sub-structure 5 31. The Φ 23 200405857 the pair (such as materials, a kind of dielectric between the borrowed microchip and the layer). A kind of subjunction structure layer surface pressure can be matched to the subjunction organic liquid crystal, and the structure 5 3 1 1-a dielectric acoustic organic dielectric material containing any known type of dielectric material, ceramic dielectric material, liquid crystal Polymer dielectric materials for liquid crystal polymer dielectric materials, etc.). This sub-structure 530 can be formed by conventional techniques. For example, the metal flakes can be plated on the opposite side of the "D-type" substructure 531 using conventional techniques. Next, the secondary structure 53 can be patterned by the metal thin film, and then the signal layers 532 and 533 are chemically formed. The thin secondary structure 540 is a "DSD-type" secondary junction, which contains at least one letter 54 \ mediation. "D-type" substructure 54 丨 and "D-type" substructure 54 ° 2. Each of these "D-type" substructures 541 and 542 is a dielectric layer including at least one conventional dielectric material (such as organic dielectric materials, ceramic materials, liquid crystal polymer dielectric materials, non-liquid crystal polymer dielectrics). The sub-structure 540 of the electrical material can be formed by any conventional technique. For example, one of them starts with the DS-type sub-structure (such as the “DS-type” structure 520 described previously), and then the “D-type” sub-structure is laminated on The "ds-type" sub-structure is such that the "D-type" sub-structure is laminated on the signal surface of the "DS" sub-structure. If at least one of the D-type sub-structures 541 and 542 is a liquid crystal dielectric layer, the sub-structure 540 can be formed in the manner of the present invention (as described below with reference to Figure 7). The sub-structure 550 is a "pD-type" sub-structure that includes at least one "P-type" sub-structure 5 5 2 "D-type" sub-structure Structure 5 51. The "D-type" structure 551 is a dielectric layer containing any conventional dielectric material (such as dielectric materials, ceramic dielectric materials, liquid crystal polymer dielectric materials, non-polymer dielectric materials). Etc.). The secondary structure 550 can be formed by any known technique 24 200405857. For example, it In the acquisition of the sub-structure 550 is formed. Examples of it as it, as it may in conventional manner, a continuous plated metal sheet in the "D-type" sub-structure 551.

The sub-structure 560 is a "DPD-type" sub-structure, and includes at least one P-type sub-structure 562 between the "D-type" sub-structure 561 and the "D-type" sub-structure 5 63. Each of the "D-type" substructures 561 and 563 is a dielectric layer (such as an organic dielectric material, a ceramic dielectric material, a liquid crystal polymer dielectric material, Liquid crystal polymer dielectric materials, etc.). The secondary structure 560 can be formed by any conventional technique. For example, starting with a PD-type secondary structure (such as the “PD-type” secondary structure 5 50 described previously), laminating the D-type secondary structure 561 on the first surface of the P-type secondary structure 5 62, another way may be The D-type secondary structure 563 is laminated on the second surface of the P-type secondary structure 562, that is, opposite to the first surface of the P-type secondary structure 562.

The substructure 570 is a "PDS type" substructure, which includes at least one "P type" substructure 5 71 laminated on a "DS type" substructure including a signal layer 5 73 placed on a "D type" substructure 572 . The "P-type" substructure 571 is laminated on the surface of the "D-type" substructure 572, wherein the surface does not include the signal layer 573. The "D-type" substructure 572 is a dielectric layer containing any known dielectric material (such as organic dielectric materials, ceramic dielectric materials, liquid crystal polymer dielectric materials, non-liquid crystal polymer dielectric materials, etc.) . The secondary structure 5 70 can be formed by any known technique. For example, starting with a "PD-type" substructure, the power supply layer 5 71 is laminated to the first surface of the "D-type" substructure 5 7 2. In another way, the signal layer 5 73 type layer can be placed on the "D" The surface 574 of the "type" 25 200405857 sub-structure 572, as described previously, fits into the "DS-type" sub-structure 520 to form a signal line 522. The sub-structure 5 80 is a "SDPDS type" sub-structure, which includes at least: a signal layer 5 8 5 on the "D-type" sub-structure 5 8 3, and a signal layer 5 8 4 on the "D-type" sub-structure 5 8 1 And "D-type" substructures 5 81 and 5 8 3 are laminated on the opposite sides of the P substructure 5 82 as shown in the figure. The "D-type" substructures 5 8 1 and 5 8 3 are each a dielectric layer containing any conventional dielectric material (such as organic dielectric materials, ceramic dielectric materials, liquid crystal polymer dielectric materials, non-liquid crystals). Polymer dielectric materials, etc.). The secondary structure 580 can be formed by any conventional technique. For example, starting with a "DPD-type" substructure and setting a P-type substructure 5 8 2 between the "D-type" substructure 5 8 1 and 5 8 3, the other way is to form a signal layer 5 8 4 and 5 8 5 form signal lines 522 on the surfaces 586 and 587 of the “D-type” substructure 581 and 582, as described previously, and cooperate with the “DS-type” substructure 520. Figures 6 to 11 illustrate a laminated structure including one or more liquid crystal polymer dielectric layers: Figures 6A to 6B illustrate a liquid crystal polymer dielectric layer 10 laminated on a "D" sub-layer The structure 11 forms an auxiliary structure 12, which is an embodiment formed according to the TPD conditions of the present invention. The dielectric layer 11 may include any conventional dielectric material (such as an organic dielectric material, a ceramic dielectric material, a liquid crystal polymer dielectric material, a non-liquid crystal polymer dielectric material, etc.). Figures 7A to 7B illustrate the lamination of a liquid crystal polymer dielectric layer 13 on a "DS-type" substructure 14 to form a substructure 17 which is an embodiment formed according to the TPD conditions of the invention. The "DS" substructure 14 includes at least 26 200405857 a signal layer 15 and a dielectric layer 16. The dielectric layer 16 may include conventional dielectric materials (such as organic dielectric materials, ceramic dielectric materials, liquid crystal polymer dielectric materials, non-liquid crystal polymer dielectric materials, etc.). It should be noted that the sub-structure 17 is a "DSD-type" sub-structure (see Fig. 13 / Fig. 8A to Fig. 8B). A liquid crystal polymer dielectric layer 20 is laminated on the power source layer 21 to form The secondary structure 22 is an embodiment formed according to the TpD conditions of the invention. It should be noted that the secondary structure 22 is a "pD-type" secondary structure (see Fig. 13). Figs. 9A to 9B are descriptions A liquid crystal polymer dielectric layer 23 is laminated on the power supply layer 24 with holes 25 to pass through to form a secondary structure 26, which is an embodiment formed according to the TPD conditions of the invention. Figure 9 shows the result of the lamination process. The hole 25 is filled with a dielectric material to form a liquid crystal polymer dielectric layer 23. It should be noted that the secondary structure 26 is a "j &d; d-crack" secondary structure (see Figure 13). Figures 10A to FIG. 10B is a diagram illustrating an embodiment in which a liquid crystal polymer dielectric layer 3 1 and 3 3 are laminated to opposite sides of the power source layer 32 to form a substructure 34, according to the TPD conditions of the invention. It should be noted The sub-structure 34 is a "DPD-type" sub-structure (see Fig. I3). Figs. 11A to 11B describe the high score of the liquid crystal. The dielectric layers 41 and 43 are collectively laminated to the opposite side of the power supply layer 42 with the holes 44 penetrating therethrough to form the substructure 45, which is an embodiment formed according to the TPD conditions of the invention. Figure 11 shows the laminate The hole 44 caused by the process is filled with a dielectric material to form a dielectric layer 41, a dielectric layer 43, or a combination thereof. It should be noted that the substructure 45 is a "DPD type" substructure (see section 13 27 200405857

FIG. 12 illustrates the sequential stacking of n-layer substructures S !, s2, s3, Sn_ .. _ 2) according to a preferred embodiment of the present invention to form a laminate page layer. Each = N-layer substructure is shown in FIG. 13 Any of the listed sub-structure representatives, or any sub-structure that can be formed by laminating the structure combination shown in Figure 13 as a representative, and meets the following conditions: each of the N-layer sub-structures-a pair of adjacent sub-structures The first sub-structure of the structure includes at least a liquid crystal polymer (Lcp) dielectric material, which needs to be combined with the second sub-structure of each pair of adjacent sub-structures. Then the page layer includes at least: the N-layer sub-structures of the sequential stack are laminated according to the embodiment of the TPD condition of the invention. It should be noted that manufacturing such structures or sub-structures may include an additional process step 'especially such as drilling or blind vias or through-holes using techniques well known in the art, and such features as plated blind Holes and vias are used for layer-to-layer electrical connections. Although the preferred embodiments of the present invention have been disclosed herein for illustration, other retouching or changes should be understood by those skilled in the art. Therefore, the scope of the appended patents may cover such modifications or changes without departing from the spirit of the scope of the present invention. [Brief Description of the Drawings] FIG. 1 is a partial subregional diagram illustrating a liquid crystal phase of a liquid crystal polymer (LPC) dielectric material having a directional polymer chain according to a preferred embodiment of the present invention. FIG. 2 is a diagram illustrating a localized molecular region of an isotropic phase of a sub-dielectric material having no directional polymer chain according to one of the preferred embodiments of the present invention. 3 and 4 illustrate a flat laminator for laminating a stacked layer of a liquid crystal polymer dielectric material according to one of the preferred embodiments of the present invention. Figure 5 illustrates a laminated pressure cooker for laminating a stacked layer of a liquid crystal polymer dielectric material according to a preferred embodiment of the present invention. Figures 6A to 6B illustrate laminating a liquid crystal polymer dielectric layer to another liquid crystal polymer dielectric layer according to a preferred embodiment of the present invention.

Figures 7A to 7B illustrate laminating a liquid crystal polymer dielectric layer to another DS-type secondary structure according to a preferred embodiment of the present invention. Figures 8A to 8B illustrate lamination of a liquid crystal polymer dielectric layer to another power supply layer according to a preferred embodiment of the present invention. Figures 9A to 9B illustrate the lamination of a liquid crystal polymer dielectric layer to another power supply layer having a perforation according to a preferred embodiment of the present invention.

Figures 10A to 10B illustrate lamination of the first and second liquid crystal polymer dielectric layers on both sides of a power supply layer according to a preferred embodiment of the present invention. 11A to 11B illustrate lamination of the first and second liquid crystal polymer dielectric layers to both sides of a power supply layer having a perforation according to a preferred embodiment of the present invention. Figure 1.2 illustrates a sequentially stacked secondary structure according to one of the preferred embodiments of the present invention. FIG. 13 is a sub-structure table describing a preferred embodiment of the present invention. 29 200405857 [Simple description of component representative symbols] 10, 11, 13, 16, 20, 23, 33, 31, 43, 41, 521, 531, 541, 542, 551, 563, 561, 572, 5 8 1, 5 8 3 Liquid crystal polymer dielectric layer 1 2, 2 6, 4 5 Substructure 14, 520, 587, 586, 574 DS type substructure 15, 522, 532, 533, 543, 573,

584, 585 Signal layer 1 7, 5 4 0 DSD 畐 '' J structure 21, 24, 32, 42, 552, 562, 5 7 1, 5 8 2 Power supply layer 2 2, 5 5 0 PD-type substructure 2 5, 4 4 Holes 3 4, 5 6 0 DPD-type substructure 200, 250 Partial molecular range

201, 202, 203, 204, 205, 206, 207, 2 0 8, 251, 252, 253, 25 4, 255, 256, 257, 25 8, 259, 260, 2 6 1 Polymer chain 2 10 Vector 2 2 1, 2 2 .3, 2 2 5, 2 7 2, 2 7 4, 2 7 6 Rigid structure 222, 224, 226, 271, 273, 275, 277 Semi-elastic structure 300 Flat laminator 3 0 2 Bracket 30 200405857 3 0 4 Upper platform support 306 Lower platform support 308 Intermediate platform support 3 10 Lamination direction 311-313 Booklet 3 2 0 Guide bar 322 Upper plate 324, 326 Middle plate

328 Lower plate 329 Hydraulic system 3 3 0 Piston 3 3 2 Hydraulic cylinder 334 Hydraulic fluid 340 Vacuum pump 342 Vacuum supply 3 5 1 Inlet pipe

352 Outlet tube 3 5 3 Thermal coupling port 354 Heating element 355 Cover plate 3 5 7, 3 5.8 Page layer 362, 364 Pressure pad 370, 380, 390 Plate layer 371, 373, 381, 383, 391, 393 Release sheet 31 200405857 372, 382, 392 pressure plate 400 laminated pressure cooker 4 0 2 fence 4 0 4 tank 406 vacuum pump 408 vacuum supply line 409 gas channel 4 10 volume plate

4 12 Tray 4 14 Gas source 416 Gas inlet line 4 18 Elastic membrane 4 19 Vacuum bag 420 Heating gas 5 0 0 D-type substructure 5 10 P-type substructure

5 3 0 S D S-type secondary structure 5 7 0 P D S-type secondary structure 5 8 0 S D P D S-type secondary structure 32

Claims (1)

200405857 The scope of patent application: 1. A multilayer structure including at least: a first layer; and a second layer, wherein the first layer includes at least a first liquid crystal polymer (LCP) dielectric material, and wherein The first layer is coupled to the second layer, so that the first liquid crystal polymer dielectric material is directly bonded to the second layer without relying on an external bonding material. 2. The multi-layer structure according to item 1 of the scope of patent application, wherein the first liquid crystal south molecular dielectric material has a polymer bond structure and the related azimuth is substantially combined with the first layer to the first layer. The polymer chain structure and related orientations of the first liquid crystal polymer dielectric material before the second layer are the same. 3. The multilayer structure according to item 1 of the scope of patent application, wherein the first liquid crystal polymer dielectric material has a coefficient of thermal expansion (CTE) which is substantially before the first layer is bonded to the second layer. The first liquid crystal polymer dielectric material has the same thermal expansion coefficient. 4. The multilayer structure according to item 1 of the scope of patent application, wherein the second layer is a dielectric layer that does not contain any liquid crystal polymer dielectric material. 5. The multilayer structure according to item 1 of the scope of the patent application, wherein the second layer includes at least a second liquid crystal polymer dielectric material, and wherein the first and 33 200405857 the second liquid crystal polymer dielectric material system Directly bonded to each other without the need for external bonding materials. 6. The multilayer structure according to item 1 of the scope of patent application, wherein the second layer includes at least a dielectric material, and further includes a signal layer buried inside the multilayer structure, so that the signal layer is in contact with the first layer. One and the second layer. 7. The multi-layer structure according to item 1 of the scope of patent application, wherein the second layer includes at least a power supply layer, which is dielectric with the first liquid crystal polymer of the first layer in a manner that does not rely on an external bonding material. Materials. 8. The multi-layer structure according to item 7 of the scope of the patent application, wherein the power supply layer includes at least a hole penetrating therethrough, and wherein the hole is filled with the first liquid crystal 1¾ molecular dielectric material. 9 · The multilayer structure described in item 7 of the scope of the patent application, further comprising at least a third layer including a second liquid crystal polymer dielectric material, wherein the third layer is bonded to the second layer so that The second layer is sandwiched between the first layer and the third layer, and the second liquid crystal polymer dielectric material is directly bonded to the power layer without relying on an external bonding material. 10. The multilayer structure according to item 9 of the scope of the patent application, wherein the power supply layer includes at least a hole penetrating therethrough, and wherein the hole is filled with a material, and the material is made of the first liquid crystal polymer Dielectric material, the second 34 200405857 crystal two molecules & u, materials, and combinations thereof are selected from the group of η • a manufacturing one to form a page layer so that N is at least 2, including Sub-structure; and a method for evening layer structure, which includes at least the following steps: 'It includes stacking N-layer sub-structures in a regular order, wherein each pair of adjacent sub-structures has at least a first sub-structure followed by a second sub-structure. Combined LCD high score Compared with the side of the liquid crystal polymer dielectric material in the page layer, the low-phase phase to isotropic transition ^ _ changes the loneness to one of the lower temperatures for a period of time, and is at-,, or two, which is enough to make this hundred s ^ ^ ~ All liquid crystal polymer dielectric materials in the page layer can be plasticized. 5. And without the need to put any additional bonding layer on the first sub-j, ·, σ structure and the second sub-structure of each pair of adjacent sub-structures. Substructures are laminated in a way between each Tung; adjacent substructures. : The method described in Shi Rushen's patent scope 帛 1, wherein the polymer chain F π structure and the related orientation of all liquid crystal polymer dielectric materials in the page layer are substantially unchanged throughout the entire process time . 13. The method as described in item u of the scope of patent application, wherein the thermal expansion coefficients of all liquid-day and molecular-dielectric materials in the page layer have not changed substantially during the entire process time. 14. The method as described in item 11 of the patent application range, wherein the elevated pressure range is between about 1000 psi and 3,000 psi. 35 200405857 15 · The method as described in item 11 of the scope of patent application, wherein the first substructure of the first pair of substructures of the N-layer substructure includes at least one D-type having a first liquid crystal polymer dielectric material The secondary structure, and wherein the second secondary structure of one of the first pair of secondary structures includes at least one dielectric layer. 16 · The method according to item 11 of the scope of patent application, wherein the first pair of sub-structures of the N-layer sub-structure includes at least one D-type sub-structure having a first liquid crystal polymer dielectric material And one of the first pair of secondary structures includes at least one P-type secondary structure. 17. The method according to item 16 of the scope of patent application, wherein the P-type substructure includes at least one hole penetrating therethrough, and wherein the main step includes at least filling the hole with the first liquid crystal polymer dielectric material . 18 · The method as described in item 11 of the scope of patent application, wherein one of the first pair of substructures of the N-layer substructure includes at least one D-type having a first liquid crystal polymer dielectric material A secondary structure in which one of the first pair of secondary structures includes at least one DS-type secondary structure, and wherein the first and second secondary structures are arranged in order so that the D-type secondary structure is in the main In the step, it is laminated on the signal layer of the DS-type sub-structure, and there is no additional bonding material between the D-type sub-structure and the signal layer of the DS-type sub-structure. 36 200405857 19. The method according to item 11 of the scope of patent application, wherein one of the N-layer secondary structures includes at least one D-type secondary structure having a first liquid crystal polymer dielectric material, wherein the N-layer secondary structure One of the structures has a second sub-structure including at least a P-type sub-structure, wherein one of the N-layer sub-structures has a third sub-structure including at least a D-type sub-structure having a second liquid crystal polymer dielectric material, and wherein the first The second and third sub-structures are arranged in order, so that the first and third sub-structures are respectively laminated to opposite sides of the second sub-structure in the main step. 2 0. The method as described in item 19 of the scope of patent application, wherein the P-type substructure includes at least a hole passing therethrough, and wherein the main step includes at least filling the hole with a material, and the material is formed by The first liquid crystal polymer dielectric material, the second liquid crystal polymer dielectric material, and a combination thereof are selected. 37