CN116552075A - Composite material containing material with adjustable thermal expansion coefficient and application thereof - Google Patents

Composite material containing material with adjustable thermal expansion coefficient and application thereof Download PDF

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Publication number
CN116552075A
CN116552075A CN202310627118.6A CN202310627118A CN116552075A CN 116552075 A CN116552075 A CN 116552075A CN 202310627118 A CN202310627118 A CN 202310627118A CN 116552075 A CN116552075 A CN 116552075A
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China
Prior art keywords
composite layer
composite
thermal expansion
adjustable
coefficient
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Pending
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CN202310627118.6A
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Chinese (zh)
Inventor
杨瑞
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Shenzhen Juyuan New Material Technology Co ltd
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Shenzhen Juyuan New Material Technology Co ltd
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Priority to CN202310627118.6A priority Critical patent/CN116552075A/en
Publication of CN116552075A publication Critical patent/CN116552075A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The application provides a composite material containing a material with adjustable thermal expansion coefficient and application thereof, comprising the following steps: a first composite layer and a second composite layer; the first composite layer and the second composite layer are combined into a whole through external force, and an interface exists between the first composite layer and the second composite layer after the first composite layer and the second composite layer are combined; the raw materials of the second composite layer comprise cut LCP fibers and high-molecular components, the second composite layer is prepared and formed by evenly and physically mixing the raw materials, and the cut LCP fibers keep their own physical forms in the slurry and the formed second composite layer; the thermal expansion coefficient of the second composite layer is regulated and controlled by adjusting the proportion of the raw materials, so that the thermal expansion coefficient of the second composite layer is consistent with that of the first composite layer. The composite material provided by the invention can effectively solve the problem of mismatch of thermal expansion coefficients of different materials in a composite system, and has good economic value.

Description

Composite material containing material with adjustable thermal expansion coefficient and application thereof
Technical Field
The invention belongs to the field of composite materials, and particularly relates to a composite material containing a material with an adjustable thermal expansion coefficient and application thereof.
Background
The thermal expansion effect refers to a phenomenon that the volume of an object changes with the change of temperature, and most materials show a positive thermal expansion effect, i.e. the volume of the material becomes larger with the increase of temperature.
In practical applications, components or devices of most equipment adopt a composite system, that is, two or more materials are combined into a whole through external physical means (such as lamination, adhesion, cementing, hot rolling and the like), various composite materials often have different Coefficients of Thermal Expansion (CTE), when the components or structures undergo obvious changes in ambient temperature, the materials expand or contract at different rates and degrees, great interfacial stress is caused between the materials, fatigue aging and even falling of the components or devices are easily caused by mismatch of the coefficients of thermal expansion of the materials, and further, the precision of instruments is reduced and functions are disabled. For example, aerospace vehicles rub against air during high speed flight causing severe temperature increases in the equipment enclosure, severe thermal deformation of the enclosure, and different materials expand to different extents for enclosures in which composite materials are present, which can easily cause damage to the enclosure. For example, in the case of a PCB board for various electronic devices, most of the PCB boards are copper-clad boards, the upper layer and the lower layer are copper-clad boards, the middle layer is made of non-conductive organic material, the element is welded on the PCB board to form a welding spot, and the CTE difference between copper and the organic material can cause the materials of different layers to expand to different degrees when the PCB board is heated, so that the welding spot falls off and information is distorted; for another example, the camera lens barrel expands when heated, and the difference in expansion degree easily causes aging of the lens barrel, thereby causing light path change to affect imaging. Therefore, in the fields of precision instruments, microelectronics, and the like, devices or components made of composite materials are required to have high structural accuracy, particularly temperature sensitive elements, and thermal expansion of different materials in a composite system needs to be matched as much as possible so as to reduce the influence of temperature variation on the performance of the devices.
Some negative expansion materials have been innovatively applied to solve such problems, and compounding positive and negative thermal expansion materials can solve the problem of thermal expansion coefficient mismatch to a certain extent, but how to regulate the thermal expansion behavior of one material to match the thermal expansion of another material is relatively deficient, and it is more urgent that a composite system with better and even consistent thermal expansion coefficient matching can adapt to the change of environmental temperature than a composite system with positive and negative combination.
Disclosure of Invention
Based on the above, the invention provides a composite material containing a material with an adjustable thermal expansion coefficient and application thereof, wherein the thermal expansion coefficient of one material component in the composite system is adjustable, so that the material is matched and consistent with the thermal expansion coefficient of the other material component, the interface stress between materials caused by thermal expansion is reduced, and the defects of the existing composite system material are overcome.
In a first aspect, a composite material comprising a coefficient of thermal expansion adjustable material, comprising:
a first composite layer and a second composite layer;
the first composite layer and the second composite layer are combined into a whole through external force, and an interface exists between the first composite layer and the second composite layer after the first composite layer and the second composite layer are combined;
the raw materials of the second composite layer comprise cut LCP fibers and high-molecular components, the second composite layer is prepared and formed by evenly and physically mixing the raw materials, and the cut LCP fibers keep own physical forms in the slurry and the formed second composite layer;
the thermal expansion coefficient of the second composite layer is regulated and controlled by adjusting the proportion of raw materials, so that the thermal expansion coefficient of the second composite layer is consistent with that of the first composite layer.
Preferably, the length of the cut LCP fibers is 1-40 mm.
Preferably, the polymeric component is a thermoset or thermoplastic.
Preferably, when the polymeric component is a thermoset, it is the thermoset in solution that is physically mixed with the severed LCP fibers.
Preferably, when the polymeric component is a thermoplastic, it is the thermoplastic in the molten state that is physically mixed with the chopped LCP fibers.
Preferably, the cut LCP fibers, when physically mixed with the thermoplastic in the molten state, melt at a temperature not less than the melting point of the thermoplastic and less than the melting point of the LCP fibers, such that the LCP fibers maintain their physical form in the slurry.
Preferably, the LCP fibers have a volume fraction of 30% to 90%.
Preferably, the volume fraction of the polymeric component is 10% to 80%.
Preferably, the raw material of the second composite layer further includes silica particles.
Preferably, the volume fraction of silica is 10% to 80%.
In a second aspect, the present invention also provides a method of preparing a second composite layer, particularly when the polymeric component is a thermosetting plastic, the method comprising:
dissolving thermosetting plastic by using a solvent, and uniformly and physically mixing the cut LCP fibers and the dissolved thermosetting plastic in proportion to prepare slurry, wherein the cut LCP fibers keep the physical form in the slurry;
and molding the slurry by using a molding die to obtain the second composite layer.
In a third aspect, the present invention also provides another method of preparing a second composite layer, particularly when the polymeric component is a thermoplastic, the method comprising:
melting the thermoplastic at a first temperature;
the method comprises the steps of (1) physically and uniformly mixing the cut LCP fibers and molten thermoplastic plastics in proportion to prepare slurry, wherein the thermoplastic plastics are in a molten state at a first temperature, and the cut LCP fibers keep the physical form in the slurry;
and pressing and forming the slurry at a second temperature by using forming equipment to obtain the second composite layer.
In a fourth aspect, the present invention provides a PCB board, the substrate of which is prepared from the composite material of the first aspect.
The PCB board manufactured according to the fourth aspect is incorporated in at least one of: music players, video players, entertainment units, navigation devices, communications devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, and/or laptop computers.
The invention also provides application of the composite material obtained by the first aspect of the invention in preparing temperature sensitive elements and precision instrument parts.
In addition, the invention also provides application of the composite material obtained by the first aspect of the invention in the structure of aerospace equipment.
Compared with the existing composite material system, the invention has the following advantages:
the thermal expansion coefficient of the second composite layer is adjustable, so that the problem of expansion coefficient mismatch in a composite system is effectively solved, the composite material can be matched with the first composite layer made of different materials, the application range is wide, the composite material can be used for preparing, for example, a PCB (printed circuit board), chip packaging, a temperature sensitive element, a precision instrument, aerospace equipment and the like, the LCP fiber and polymer components used for preparing the second composite layer are convenient to obtain, the material cost can be well controlled, and the composite material has important practical significance as a novel composite material applied to various fields.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a composite structure according to an embodiment of the present invention;
fig. 2 is a graph showing curling of a composite board prepared by laminating a copper sheet with High Density Polyethylene (HDPE) at 150 ℃.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The thermal expansion coefficient of the Liquid Crystal Polymer (LCP) is extremely low and can be expressed as thermal expansion even under certain conditions, and the inventor of the invention finds that even though the cut LCP fiber is as short as millimeter level, the CTE of the cut LCP fiber is not changed obviously, so that the characteristic can be utilized to prepare the material with adjustable thermal expansion coefficient by adding the cut LCP fiber into a polymer material, and the thermal expansion of the material can be regulated and controlled by adjusting the proportion of the LCP fiber and the polymer material. The composite material with interfaces is prepared by using the material, and the problem of mismatch of the expansion coefficients of the composite material is solved by regulating and controlling the thermal expansion coefficient of one material to be matched and consistent with the thermal expansion coefficient of the other component in the composite material.
As shown in fig. 1, the composite material provided in the embodiment includes a first composite layer and a second composite layer;
the first composite layer and the second composite layer are combined into a whole through external force, and an interface exists between the first composite layer and the second composite layer after the first composite layer and the second composite layer are combined;
the raw materials of the second composite layer comprise cut LCP fibers and high-molecular components, the second composite layer is prepared and formed by evenly and physically mixing the raw materials, and the cut LCP fibers keep the physical form in the slurry and the formed second composite layer;
the thermal expansion coefficient of the second composite layer is regulated and controlled by adjusting the proportion of the raw materials, so that the thermal expansion coefficient of the second composite layer is matched and consistent with that of the first composite layer.
Because the thermal expansion coefficient of the second composite layer is adjustable, the thermal expansion coefficients of two material components in the composite material can be matched and consistent, for example, if the first composite layer is a copper sheet and the thermal expansion coefficient is about 17ppm/C, the thermal expansion coefficient of the second composite layer can be also 17ppm/C by adjusting the proportion of raw materials, the thermal expansion coefficients of the two components are consistent, when the composite material is subjected to environmental temperature change, the same degree of thermal expansion occurs to different components, and the interface stress between the components is far smaller than the interface stress caused by the thermal expansion of different degrees, so that the fatigue and even fracture problem of the composite material can be effectively avoided.
The first composite layer may be made of metal, such as copper, silver, alloy, etc., or inorganic compound, such as silicon dioxide, silicon carbide, etc., or engineering plastic, ceramic, etc.
The polymeric component of the second composite layer may be a thermoset or thermoplastic. The polymer components used in the embodiments of the present invention are all conventional materials in the art unless otherwise specified, for example, the thermosetting plastic may be phenolic resin, urea resin, melamine resin, unsaturated polyester resin, epoxy resin, silicone resin, polyurethane, etc.; the thermoplastic may be polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyoxymethylene, polycarbonate, polyamide, acrylic, polysulfone, polyphenylene oxide, chlorinated polyether, other polyolefin, copolymers thereof, and the like.
It will be appreciated by those skilled in the art that when a class of polymers such as thermosets or thermoplastics is selected as the polymeric component of the second composite layer, one or more of these may be used as a component in the preparation.
Raw material ratio of the second composite layer: the volume fraction of the cut LCP fiber is 10-80%, and the volume fraction of the polymer component is 30-90%. In some embodiments, the feedstock may also include silica particles, with a volume fraction of 10-80%.
When using thermosetting plastics, the thermosetting plastics are dissolved by solvent, and then the thermosetting plastics are mixed with the cut LCP fibers to prepare slurry, for example, the slurry is stirred and turned over, the short-section LCP fibers keep the short-section physical form in the slurry and are not dissolved, the slurry is molded by a mold, the molded material is dried and cured at high temperature to obtain a finished product of the second composite layer, and the curing temperature is such that the LCP fibers are not melted.
When using thermoplastic plastics, the thermoplastic plastics are heated to be in a molten state, and then are physically mixed with the cut LCP fibers to be made into slurry, for example, rotation stirring, turning stirring and the like, the short-segment LCP fibers keep the short-segment physical form of the short-segment LCP fibers in the slurry and are not dissolved, the molten state of the thermoplastic plastics in the slurry is kept, the slurry is pressed and molded by molding equipment, for example, the slurry is pressed into sheets by a pressing machine or poured on glass fiber cloth and then pressed into sheets, or other sizes matched with the first composite layer. To ensure that the materials in the first composite layer are physically mixed, the LCP fibers maintain their physical form, and the thermoplastic must be melted at a temperature not lower than the melting point of the plastic, but lower than the melting point of the LCP fibers.
Taking the example of a copper sheet compounded with High Density Polyethylene (HDPE) with a CTE of 17ppm/C and a CTE of 120ppm/C for HDPE, this means that HDPE expands more strongly than copper sheets at the same temperature, for example, a composite sheet laminated with copper sheets and HDPE, will curl to one side of the copper sheet at 150℃ due to the large difference in CTE of the two materials, as shown in fig. 2. Such temperature-induced curl is common in all physically compounded materials, and may not be visible to the naked eye when the material is strong enough to resist interfacial stresses, but it still exists, which is why the compounded interface is often seen as a weakness in the material. If the method provided by the invention is adopted, HDPE and cut LCP fibers are physically mixed to prepare a high polymer material layer, and then the high polymer material layer is laminated with a copper sheet, the CTE of the high polymer material layer can be regulated and controlled by adjusting the proportion of the HDPE and the LCP fibers, so that the CTE of the high polymer material layer is consistent with that of the copper sheet, the phenomenon of curling of the plate edge shown in figure 2 of the composite plate is avoided, the stability of parts and equipment is improved, and the service cycle of the parts and equipment is prolonged.
In some embodiments, the feedstock for the second composite layer also adds silica particles in a volume fraction of 10-80%.
By adjusting the ratio of the raw materials, the thermal expansion coefficient of the second composite layer can be regulated to be consistent with that of the first composite layer, and the composite material has isotropy due to uniform mixing of the raw materials, the CTE of the flaky composite material is not different in the X, Y directions, and the CTE of the composite material with the thickness of more than 40mm is almost not different in the X, Y, Z directions.
It will be appreciated that the methods of preparing the second composite layer set forth above are not limited in shape and size to the finished product, and that when the finished product is formed into a composite system with the first composite layer or other material, the shape and size may be adapted to the shape and size of the other material components in the composite system using a forming apparatus.
In addition, since the LCP fibers may exhibit negative thermal expansion, adjusting the raw material formulation (e.g., increasing the content of the LCP fibers) may result in a second composite layer that has zero thermal expansion or negative thermal expansion, which may be used independently as a monomeric material in addition to forming a composite system with the first composite layer.
The composite material provided by the invention can realize negative expansion, near zero expansion and positive expansion by regulating and controlling the matching of the thermal expansion coefficient of the second composite layer and the first composite layer, and is suitable for preparing various components or structures containing a composite system.
For example, the composite material provided by the invention can be used for preparing a substrate of a PCB board, the second composite layer with adjustable thermal expansion coefficient can be used as an organic material component, the copper plate or other conductive layers used as the first composite layer can be matched with the thermal expansion coefficient, and the finished product can be used for some exemplary electronic equipment, such as electronic equipment integrated with any one of a semiconductor device, an integrated circuit, a die, an intermediate or a package, for example, a mobile phone, a laptop computer and a fixed position terminal can comprise the Integrated Circuit (IC) as described above. The IC may be, for example, any of the integrated circuits, dies, or packages described herein. The electronic devices explained herein are exemplary only and other electronic devices may also feature ICs including, but not limited to, mobile devices, hand-held Personal Communication Systems (PCS) units, portable data units such as personal digital assistants, GPS enabled devices, navigation devices, set top boxes, music players, video players, entertainment units, fixed location data units such as meter reading equipment, communication devices, smart phones, tablet computers, or any other device that stores or retrieves data or computer instructions, or any combination thereof.
For another example, the composite material provided by the invention can also be used as a substrate of a chip package, wherein the chip package can be structurally divided into a substrate, an interlayer medium and a sealing material, and when the structure is a composite system (for example, the composite system is formed by combining at least two materials and an obvious interface exists between the materials), the second composite layer can be used as one component in the system, for example, as one layer in the interlayer medium or the sealing material or the substrate, so as to match the thermal expansion coefficient of the other component in the composite system, and the composite material has the functions of regulating and controlling the thermal expansion behavior of a device, preventing signal distortion and slowing down fatigue and aging damage of the device. If other encapsulation is used, the coefficient of thermal expansion of the second composite layer may also be tuned to be consistent with the coefficients of thermal expansion of other material components, such as polymer-based composites, metal-based composites, carbon/carbon composites, and ceramic-based composites.
The present invention aims to provide a composite material as disclosed above, which contains a material with an adjustable thermal expansion coefficient (i.e. a second composite layer), and the chip packaging process is not limited, and the chip packaging explained herein is a conventional packaging process in the field unless otherwise specified.
The invention is also suitable for preparing temperature sensitive elements and precise instrument parts with higher requirements on the thermal stability of devices, and can be used as a base material of a thermal protection system of an aerospace vehicle or aerospace equipment.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (14)

1. A composite material comprising a coefficient of thermal expansion adjustable material, comprising:
a first composite layer and a second composite layer;
the first composite layer and the second composite layer are combined into a whole through external force, and an interface exists between the first composite layer and the second composite layer after the first composite layer and the second composite layer are combined;
the raw materials of the second composite layer comprise cut LCP fibers and high-molecular components, the second composite layer is prepared and formed by slurry which is prepared by physically and uniformly mixing the raw materials, and the cut LCP fibers keep own physical forms in the slurry and the formed second composite layer;
the thermal expansion coefficient of the second composite layer is regulated and controlled by adjusting the proportion of raw materials, so that the thermal expansion coefficient of the second composite layer is consistent with that of the first composite layer.
2. A composite material comprising a coefficient of thermal expansion adjustable material according to claim 1 wherein the length of the cut LCP fibers is 1 to 40mm.
3. The composite material comprising a coefficient of thermal expansion adjustable material according to claim 1, wherein the polymer component is a thermosetting plastic or a thermoplastic plastic.
4. A composite material comprising a cte-adjustable material as defined in claim 3, wherein the polymer component is a thermoset and the thermoplastic in solution is physically mixed with the chopped LCP fibers.
5. A composite material comprising a cte-adjustable material as defined in claim 3, wherein the polymer component is a thermoplastic in a molten state physically mixed with the chopped LCP fibers.
6. A composite material comprising a cte-adjustable material as defined in claim 5, wherein the chopped LCP fibers, when physically mixed with the thermoplastic in a molten state, melt at a temperature not less than the melting point of the thermoplastic and less than the melting point of the LCP fibers.
7. The composite material comprising a coefficient of thermal expansion adjustable material according to claim 1, wherein the LCP fiber has a volume fraction of 30% to 90%.
8. The composite material containing a material with an adjustable thermal expansion coefficient according to claim 1, wherein the volume fraction of the polymer component is 10% to 80%.
9. The composite material comprising a coefficient of thermal expansion adjustable material according to claim 1, wherein the starting material for the second composite layer further comprises silica particles.
10. The composite material comprising a coefficient of thermal expansion adjustable material according to claim 9, wherein the volume fraction of silica is 10% to 80%.
11. A PCB board, characterized in that the substrate of the PCB board is prepared from the composite material containing the material with adjustable thermal expansion coefficient according to any one of claims 1 to 10.
12. The PCB board of claim 11, wherein the PCB board is incorporated into at least one of: music players, video players, entertainment units, navigation devices, communications devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, and/or laptop computers.
13. Use of a composite material according to any one of claims 1 to 10 comprising a material with an adjustable coefficient of thermal expansion for the preparation of temperature sensitive elements and precision instrument parts.
14. Use of a composite material according to any one of claims 1 to 10 comprising a material with an adjustable coefficient of thermal expansion in an aerospace structure.
CN202310627118.6A 2023-05-30 2023-05-30 Composite material containing material with adjustable thermal expansion coefficient and application thereof Pending CN116552075A (en)

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