NL1028907C2 - Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten. - Google Patents

Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten. Download PDF

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Publication number
NL1028907C2
NL1028907C2 NL1028907A NL1028907A NL1028907C2 NL 1028907 C2 NL1028907 C2 NL 1028907C2 NL 1028907 A NL1028907 A NL 1028907A NL 1028907 A NL1028907 A NL 1028907A NL 1028907 C2 NL1028907 C2 NL 1028907C2
Authority
NL
Netherlands
Prior art keywords
electronic components
carrier
processing
storage container
processed
Prior art date
Application number
NL1028907A
Other languages
English (en)
Dutch (nl)
Inventor
Johannes Lambertus Ge Venrooij
Albertus Franciscus Gera Driel
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1028907A priority Critical patent/NL1028907C2/nl
Priority to PCT/NL2006/050101 priority patent/WO2007001179A2/en
Priority to KR1020077027573A priority patent/KR101236878B1/ko
Priority to CN2006800140284A priority patent/CN101167172B/zh
Priority to MYPI20061950A priority patent/MY162382A/en
Priority to TW095114996A priority patent/TWI453847B/zh
Application granted granted Critical
Publication of NL1028907C2 publication Critical patent/NL1028907C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Specific Conveyance Elements (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
NL1028907A 2005-04-29 2005-04-29 Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten. NL1028907C2 (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL1028907A NL1028907C2 (nl) 2005-04-29 2005-04-29 Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.
PCT/NL2006/050101 WO2007001179A2 (en) 2005-04-29 2006-04-25 Method and device for supplying and discharging carriers with electronic components
KR1020077027573A KR101236878B1 (ko) 2005-04-29 2006-04-25 전자 부품을 갖는 캐리어를 공급 및 취출하는 방법 및 장치
CN2006800140284A CN101167172B (zh) 2005-04-29 2006-04-25 用于提供和卸除具有电子元件的承载器的方法和设备
MYPI20061950A MY162382A (en) 2005-04-29 2006-04-27 Method and device for supplying and discharging carries with elecronic components
TW095114996A TWI453847B (zh) 2005-04-29 2006-04-27 用於供應及卸放具有電子元件之載具之方法及裝置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028907 2005-04-29
NL1028907A NL1028907C2 (nl) 2005-04-29 2005-04-29 Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.

Publications (1)

Publication Number Publication Date
NL1028907C2 true NL1028907C2 (nl) 2006-10-31

Family

ID=35756366

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1028907A NL1028907C2 (nl) 2005-04-29 2005-04-29 Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.

Country Status (6)

Country Link
KR (1) KR101236878B1 (ko)
CN (1) CN101167172B (ko)
MY (1) MY162382A (ko)
NL (1) NL1028907C2 (ko)
TW (1) TWI453847B (ko)
WO (1) WO2007001179A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6804409B2 (ja) * 2017-08-04 2020-12-23 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
TWI671847B (zh) * 2018-02-09 2019-09-11 鴻勁精密股份有限公司 電子元件作業設備
DE102018205926B3 (de) * 2018-04-18 2019-08-29 Asm Assembly Systems Gmbh & Co. Kg Beladevorrichtung, Bestücksystem und Verfahren zum Bestücken von SMT Leiterplatten mit SMT Bauteilen
JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
KR20220090156A (ko) * 2020-12-22 2022-06-29 (주)테크윙 전자부품 전달장치 및 전자부품 처리용 핸들러

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0272141A2 (en) * 1986-12-19 1988-06-22 Applied Materials, Inc. Multiple chamber integrated process system
JPS6487016A (en) * 1987-09-30 1989-03-31 Mitsubishi Heavy Ind Ltd Operating method for roller leveler
NL9401211A (nl) * 1993-07-22 1995-02-16 Towa Corp Werkwijze en inrichting voor het vormen van hars om elektronische delen af te dichten.
NL9401930A (nl) * 1994-11-18 1996-07-01 Fico Bv Modulaire omhulinrichting.
NL1003366C2 (nl) * 1996-06-18 1997-12-19 Fico Bv Inrichting en werkwijze voor het omhullen van produkten.
US6069342A (en) * 1996-12-18 2000-05-30 Texas Instruments Incorporated Automated multiple lead frame strip radiant die attach material curing apparatus
US20020170672A1 (en) * 1997-06-04 2002-11-21 Ilya Perlov Method and apparatus for improved substrate handling

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128940A (en) * 1981-02-04 1982-08-10 Sony Corp Heat treating method for substrate
KR101120497B1 (ko) * 2002-11-15 2012-02-29 외를리콘 솔라 아게, 트뤼프바흐 2차원 확장 기판의 진공처리용 장치 및 그기판의 제조방법
CN100410750C (zh) * 2003-06-17 2008-08-13 友达光电股份有限公司 承载翻转平台
NL1028824C2 (nl) * 2005-04-20 2006-10-23 Fico Bv Werkwijze en inrichting voor het verplaatsen van in een rechthoekige structuur gerangschikte elektronische componenten.

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0272141A2 (en) * 1986-12-19 1988-06-22 Applied Materials, Inc. Multiple chamber integrated process system
JPS6487016A (en) * 1987-09-30 1989-03-31 Mitsubishi Heavy Ind Ltd Operating method for roller leveler
NL9401211A (nl) * 1993-07-22 1995-02-16 Towa Corp Werkwijze en inrichting voor het vormen van hars om elektronische delen af te dichten.
NL9401930A (nl) * 1994-11-18 1996-07-01 Fico Bv Modulaire omhulinrichting.
NL1003366C2 (nl) * 1996-06-18 1997-12-19 Fico Bv Inrichting en werkwijze voor het omhullen van produkten.
US6069342A (en) * 1996-12-18 2000-05-30 Texas Instruments Incorporated Automated multiple lead frame strip radiant die attach material curing apparatus
US20020170672A1 (en) * 1997-06-04 2002-11-21 Ilya Perlov Method and apparatus for improved substrate handling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 296 (M - 846) 10 July 1989 (1989-07-10) *

Also Published As

Publication number Publication date
KR20080005447A (ko) 2008-01-11
WO2007001179A2 (en) 2007-01-04
MY162382A (en) 2017-06-15
TWI453847B (zh) 2014-09-21
CN101167172A (zh) 2008-04-23
CN101167172B (zh) 2010-05-19
WO2007001179A3 (en) 2007-08-16
TW200727383A (en) 2007-07-16
KR101236878B1 (ko) 2013-02-26

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