MX9708604A - Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos. - Google Patents

Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos.

Info

Publication number
MX9708604A
MX9708604A MX9708604A MX9708604A MX9708604A MX 9708604 A MX9708604 A MX 9708604A MX 9708604 A MX9708604 A MX 9708604A MX 9708604 A MX9708604 A MX 9708604A MX 9708604 A MX9708604 A MX 9708604A
Authority
MX
Mexico
Prior art keywords
dielectric layer
polyimidebenzoxazole
wiring board
printed wiring
pibo
Prior art date
Application number
MX9708604A
Other languages
English (en)
Inventor
David A Dalman
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of MX9708604A publication Critical patent/MX9708604A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/18—Polybenzimidazoles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Una película de poliimidabenzoxazol (PIBO) que tiene una capa eléctricamente conductiva adherida a cuando menos una superficie a la misma, en donde la película de poliimida-benzoxazol tiene una resistencia a la traccion mayor de 200 MPa. Un tablero de circuitos impresos que tiene cuando menos una capa dieléctrica y cuando menos una capa de circuitos en donde cuando menos una capa dieléctrica es una película de poliimidabenzoxazol. Un tablero de circuitos impresos (PWB) que tiene cuando menos una capa de poliimidabenzoxazol (PIBO) en donde un tablero de circuitos impresos tiene cuando menos una capa delgada de material de base dieléctrico, cuando menos un conductor delgado, y cuando menos una anchura de conductor estrecha y cuando menos una vía de diámetro pequeño.
MX9708604A 1995-05-09 1996-05-02 Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos. MX9708604A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/437,710 US5670262A (en) 1995-05-09 1995-05-09 Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
PCT/US1996/006202 WO1996036204A1 (en) 1995-05-09 1996-05-02 Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof

Publications (1)

Publication Number Publication Date
MX9708604A true MX9708604A (es) 1998-02-28

Family

ID=23737561

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9708604A MX9708604A (es) 1995-05-09 1996-05-02 Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos.

Country Status (8)

Country Link
US (1) US5670262A (es)
EP (1) EP0826294A1 (es)
JP (2) JP3979607B2 (es)
KR (1) KR100448296B1 (es)
CN (1) CN1093366C (es)
CA (1) CA2219124C (es)
MX (1) MX9708604A (es)
WO (1) WO1996036204A1 (es)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099939A (en) * 1995-04-13 2000-08-08 International Business Machines Corporation Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6207595B1 (en) 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
US6174405B1 (en) 1998-09-11 2001-01-16 Northrop Grumman Corporation Liquid crystal polymer in situ coating for co-cured composite structure
US6207522B1 (en) * 1998-11-23 2001-03-27 Microcoating Technologies Formation of thin film capacitors
CA2289239C (en) * 1998-11-23 2010-07-20 Micro Coating Technologies Formation of thin film capacitors
US6488198B1 (en) * 1999-07-01 2002-12-03 International Business Machines Corporation Wire bonding method and apparatus
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
US7061084B2 (en) * 2000-02-29 2006-06-13 Advanced Semiconductor Engineering, Inc. Lead-bond type chip package and manufacturing method thereof
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
US20040247921A1 (en) * 2000-07-18 2004-12-09 Dodsworth Robert S. Etched dielectric film in hard disk drives
US6923919B2 (en) * 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
CN100346493C (zh) * 2001-01-24 2007-10-31 皇家菲利浦电子有限公司 在基底上制作印刷线路的方法
TW555787B (en) * 2001-10-25 2003-10-01 Ind Tech Res Inst Synthesis of poly(imide-benzoxazole) copolymer
US6819373B2 (en) * 2002-10-03 2004-11-16 International Business Machines Corporation Lamination of liquid crystal polymer dielectric films
JP2005112891A (ja) * 2003-10-03 2005-04-28 Toyobo Co Ltd 半導体実装用フィルムサブストレート
KR100798537B1 (ko) 2003-12-26 2008-01-28 토요 보세키 가부시기가이샤 폴리이미드 필름
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
JP4590982B2 (ja) * 2004-04-21 2010-12-01 日立化成工業株式会社 樹脂付き金属箔
JP2007106836A (ja) * 2005-10-12 2007-04-26 Toyobo Co Ltd シラン変性ポリアミド酸樹脂組成物
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
CN100355810C (zh) * 2006-07-14 2007-12-19 哈尔滨工业大学 一种含噁唑环聚酰亚胺及其合成方法
TWI304719B (en) * 2006-10-25 2008-12-21 Phoenix Prec Technology Corp Circuit board structure having embedded compacitor and fabrication method thereof
TWI334747B (en) * 2006-12-22 2010-12-11 Unimicron Technology Corp Circuit board structure having embedded electronic components
US20100012354A1 (en) * 2008-07-14 2010-01-21 Logan Brook Hedin Thermally conductive polymer based printed circuit board
KR101319090B1 (ko) 2008-12-19 2013-10-17 도요보 가부시키가이샤 적층체 및 적층체 회로판
JP5152104B2 (ja) * 2009-06-08 2013-02-27 東洋紡株式会社 積層体およびその製造方法
US8051560B2 (en) * 2009-10-16 2011-11-08 Unimicron Technology Corp. Method of fabricating a solder pad structure
JP5486020B2 (ja) * 2010-01-13 2014-05-07 三菱電機株式会社 回路基板およびその製造方法
US9604391B2 (en) 2011-04-15 2017-03-28 Toyobo Co., Ltd. Laminate, production method for same, and method of creating device structure using laminate
JP5224011B2 (ja) 2011-04-15 2013-07-03 東洋紡株式会社 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
KR101531737B1 (ko) * 2011-06-30 2015-06-25 코오롱인더스트리 주식회사 폴리아믹산，폴리아믹산 용액，폴리이미드 보호층 및 폴리이미드 필름
TWI460211B (zh) * 2012-04-20 2014-11-11 Taimide Technology Inc 芳香族聚醯亞胺膜、其製備方法、及其應用
WO2013191052A1 (ja) 2012-06-20 2013-12-27 東洋紡株式会社 積層体の作成方法および、積層体および、この積層体を利用したデバイス付き積層体の作成方法および、デバイス付き積層体
KR20140083233A (ko) * 2012-12-26 2014-07-04 코오롱인더스트리 주식회사 폴리아믹산 용액, 이미드화막 및 표시소자
JP5610018B2 (ja) * 2013-03-28 2014-10-22 東洋紡株式会社 多層フッ素樹脂基板
JP6293457B2 (ja) * 2013-11-12 2018-03-14 学校法人東邦大学 ポリイミドおよび耐熱性フィルム
DE102014118464A1 (de) * 2014-12-11 2016-06-16 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplatte mit einem asymmetrischen Schichtenaufbau
CN106827693B (zh) * 2016-12-06 2018-12-04 太仓大唐化纤厂 一种耐用型导电纤维板材
CN108314782A (zh) * 2017-01-16 2018-07-24 臻鼎科技股份有限公司 树脂组合物及应用该树脂组合物的聚酰亚胺膜及电路板
US11342256B2 (en) * 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
JP7370145B2 (ja) * 2019-03-06 2023-10-27 太陽ホールディングス株式会社 感光性樹脂組成物
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4487911A (en) * 1979-07-23 1984-12-11 The P. D. George Company Stable polyamic acids
US4376195A (en) * 1982-01-07 1983-03-08 E. I. Du Pont De Nemours And Company Method of preparing high purity polyamic acids for use in electronic circuitry
DE3506524A1 (de) * 1985-02-25 1986-08-28 Akzo Gmbh, 5600 Wuppertal Flexible polyimid-mehrschichtlaminate
US4943471A (en) * 1986-05-20 1990-07-24 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Patterned thin film and process for preparing the same
US4871595A (en) * 1986-12-16 1989-10-03 Foster Miller, Inc. Lyotropic liquid crystalline oriented polymer substrate for printed wire board
US5098985A (en) * 1988-10-11 1992-03-24 The Dow Chemical Company Copolymers containing polybenzoxazole, polybenzothiazole and polybenzimidazole moieties
US4980447A (en) * 1989-03-09 1990-12-25 Hoechst Celanese Corp. Polyamide-polyimide and polybenzoxazole-polyimide polymer
US5071948A (en) * 1989-03-09 1991-12-10 Hoechst Celanese Corporation Polyamide-polyimide and polybenzoxazole-polyimide polymer
FI105605B (fi) * 1989-04-27 2000-09-15 Siemens Ag Planarisoiva eriste
US5112462A (en) * 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
US5248760A (en) * 1991-01-25 1993-09-28 Unc At Charlotte Chemically cured low temperature polyimides
JPH0656992A (ja) * 1992-08-05 1994-03-01 Unitika Ltd ポリイミドフィルム
US5290909A (en) * 1993-05-28 1994-03-01 Industrial Technology Research Institute Polyimide composition for polyimide/copper foil laminate

Also Published As

Publication number Publication date
CN1093366C (zh) 2002-10-23
CN1183887A (zh) 1998-06-03
JP3979607B2 (ja) 2007-09-19
US5670262A (en) 1997-09-23
CA2219124A1 (en) 1996-11-14
EP0826294A1 (en) 1998-03-04
JP2006297942A (ja) 2006-11-02
JPH11505184A (ja) 1999-05-18
WO1996036204A1 (en) 1996-11-14
KR19990008383A (ko) 1999-01-25
CA2219124C (en) 2007-04-17
KR100448296B1 (ko) 2004-12-14

Similar Documents

Publication Publication Date Title
MX9708604A (es) Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos.
EP0851724A3 (en) Printed circuit board and electric components
AU9792698A (en) Wiring board constructions and methods of making same
MY125599A (en) Printed circuit boards and method of producing the same
TW342579B (en) Manufacturing method of printed circuit board and printed circuit board
TW236070B (es)
EP0774888A3 (en) Printing wiring board and assembly of the same
TW351911B (en) Laminar stackable circuit board structure with capacitor
MY115696A (en) Integrated circuit and process for its manufacture
MY108905A (en) Copper-clad laminate and printed wiring board
MY139405A (en) Printed circuit board and method for its production
IL134414A0 (en) Value and security product with a luminescent element
CA2169547A1 (en) Multiple Layer Printed Circuit Boards and Method of Manufacture
MY105814A (en) Method for fabricating multilayer circuits.
MY120367A (en) Composite material used in making printed wiring boards.
AU1040895A (en) Method of mounting a piezoelectric element to a substrate
MY115697A (en) Integrated circuit device and process for its manufacture
EP0731539A3 (en) electrical connector for printed circuit board assembly
CA2030826A1 (en) Composite circuit board with thick embedded conductor and method of manufacturing the same
CA2160751A1 (en) Shielded Switch
SE9802157D0 (sv) Elektrisk komponent
EP0295848A3 (en) Fabrication of a multilayer conductive pattern on a dielectric substrate
AU2966399A (en) Electric conductor with a surface structure in the form of flanges and etched grooves
MY105148A (en) Unitary capacitance trimmer.
NO980889D0 (no) Kontakthode for opprettelse av elektrisk kontakt med en ledende gjenstand, og anordning utstyrt med et slikt kontakthode