CN108008288B - Copper thickness self-recognition and glue-shortage risk early warning system for copper-free area of multilayer circuit board - Google Patents
Copper thickness self-recognition and glue-shortage risk early warning system for copper-free area of multilayer circuit board Download PDFInfo
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- CN108008288B CN108008288B CN201711486425.8A CN201711486425A CN108008288B CN 108008288 B CN108008288 B CN 108008288B CN 201711486425 A CN201711486425 A CN 201711486425A CN 108008288 B CN108008288 B CN 108008288B
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
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Abstract
The invention discloses an automatic identification and glue-shortage risk early warning system for accumulated copper thickness of a copper-free area of a multilayer circuit board. The invention can estimate the glue shortage risk of the circuit board more accurately, and grade the defect condition so as to take corresponding measures in time, thereby greatly reducing the glue shortage risk in the pressing process of the printed circuit board.
Description
Technical Field
The invention relates to the field of printed circuit board manufacturing, in particular to a copper thickness self-identification and glue-shortage risk early warning system for a copper-free area of a multilayer circuit board.
Background
In the process of laminating and manufacturing a multilayer/high multilayer printed circuit board, the rejection of the adhesive shortage is a big problem faced by the laminating process, wherein one of the reasons for the abnormal adhesive shortage is that the height difference of the accumulated copper thickness designed in the inner layer copper-free area is large, so that the local pressure of the copper-free area is too small, and the resin flows and is poor in combination.
Currently, the solution to the above problems in the industry is: in the design of the inner layer copper-free area, the size of the copper-free area is defined to warn the glue-shortage risk circuit board, namely, when the size of the copper-free area exceeds the defined size, for example, when the size of the copper-free area exceeds 20mm by 20mm, the board is judged to be a press-fit easy-glue-shortage board, and a special process can be adopted during press-fit manufacture.
The above prior art methods have the following drawbacks: 1) when the shape of the copper-free area is irregular, the area cannot be accurately calculated, so that the glue-lacking risk early warning error is caused; 2) under the no copper district of the same size, the accumulative copper thickness of multilayer inlayer plate under this no copper district has great influence to the starved risk, ignores that accumulative copper thickness can lead to starved risk early warning sensitivity not high.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a copper thickness self-identification and glue-deficiency risk early warning system for a copper-free area of a multilayer circuit board, which can make more accurate prejudgment on the glue-deficiency condition of the multilayer circuit board and grade the defect condition so as to take corresponding countermeasures in time and greatly reduce the defect risk in the pressing process of the printed circuit board.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a multilayer circuit board copper thickness self-recognition and glue-deficiency risk early warning system in a copper-free area is characterized by comprising a layer unit dividing module, a layer unit copper-residue rate calculating module, a board unit accumulated copper thickness calculating module, a board unit glue-deficiency risk judging module, a multilayer circuit board glue-deficiency risk judging module and an output module;
the layer unit dividing module divides each inner layer circuit board of the multilayer circuit board into the same layer unit;
the layer unit residual copper rate calculating module calculates the residual copper rate of each layer unit, each layer unit is marked according to the residual copper rate in each layer unit, when the local residual copper rate in each layer unit is less than or equal to 20%, the layer unit is marked as a difficulty layer unit, when the local residual copper rate in each layer unit is less than 20%, the layer unit is marked as a risk layer unit, and when the local residual copper rate in each layer unit is more than or equal to 45%, the layer unit is marked as a risk-free layer unit;
the board unit accumulated copper thickness calculation module carries out copper thickness summation calculation on layer units at the same positions of all inner layer circuit boards of the multilayer circuit board to obtain the accumulated copper thickness of all board units of the multilayer circuit board;
the plate unit glue shortage risk judgment module judges whether the plate unit is in a glue shortage state or not according to the accumulated copper thickness of the plate unit and the marking condition of each layer unit in the plate unit, judging the risk of glue shortage of the plate unit, judging the plate unit as a risk-free plate unit when the cumulative copper thickness of the plate unit is less than 8oz, when the accumulated copper thickness of the plate unit is more than or equal to 8oz, the marking condition of the bonding layer unit judges the glue shortage risk of the plate unit, when the number of the continuous difficulty layer units in the plate unit is more than or equal to 4, the plate unit is judged to be the difficulty plate unit, when the number of the continuous risk layer units in the plate unit is more than or equal to 4, the plate unit is judged to be a risk plate unit, when continuous three-layer difficulty layer units exist in the plate units, and the layer units adjacent to the three-layer difficulty layer units are risk layer units, the plate unit is judged to be a risk plate unit, and the plate unit is judged to be a risk-free plate unit under other conditions;
the multilayer circuit board glue-deficiency risk judging module judges the defect risk of the whole multilayer circuit board according to the judging result of each board unit, when a difficulty board unit exists in the multilayer circuit board, the multilayer circuit board is judged to be a glue-deficiency difficulty board, when a risk board unit does not exist in the multilayer circuit board and does not exist in the difficulty board unit, the multilayer circuit board is judged to be a glue-deficiency risk board, and when a difficulty board unit does not exist in the multilayer circuit board and does not exist in the risk board unit, the multilayer circuit board is judged to be a glue-deficiency-free risk board;
and the output module is used for outputting the result of the multilayer circuit board glue shortage risk judgment module.
Preferably, the size of the layer unit is 1inch by 1 inch.
Drawings
FIG. 1 is a schematic structural diagram of a copper thickness self-identification and glue-shortage risk early warning system for a copper-free area of a multilayer circuit board according to the present invention;
fig. 2 is a schematic diagram of determination in the copper thickness self-identification and adhesive shortage risk early warning system for the copper-free area of the multilayer circuit board.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
In the following detailed description of the embodiments of the present invention, in order to clearly illustrate the structure of the present invention and to facilitate explanation, the structure shown in the drawings is not drawn to a general scale and is partially enlarged, deformed and simplified, so that the present invention should not be construed as limited thereto.
In the following detailed description of the invention, reference is made to fig. 1 and 2. The utility model provides a multilayer circuit board does not have copper district copper thickness self-identification and scarce gluey risk early warning system, includes that layer unit divides module, the local incomplete copper rate of layer unit calculation module, the thick calculation module of board unit accumulative total copper, board unit scarce gluey risk decision module, multilayer circuit board scarce gluey risk decision module and output module.
The layer unit dividing module divides each inner layer circuit board of the multilayer circuit board into the same layer unit. The layer unit divides too big, easily leads to defect risk to judge inaccurately, and layer unit divides undersize, and it is long easily to increase calculation, and preferably, the size of layer unit is 1 inch.
The layer unit residual copper rate calculation module calculates the residual copper rate of each layer unit, and the calculation formula of the residual copper rate is as follows: the residual copper rate is 100% of the area of a copper area in each layer unit per layer unit area, the defect risk of each layer unit is marked according to the residual copper rate in each layer unit, the larger the residual copper rate is, the smaller the defect risk is, preferably, when the local residual copper rate in each layer unit is less than or equal to 20%, the layer unit is marked as a difficulty layer unit, when the local residual copper rate in 20% < layer unit is less than 45%, the layer unit is marked as a risk layer unit, and when the local residual copper rate in each layer unit is more than or equal to 45%, the layer unit is marked as a risk-free layer unit.
And the board unit accumulated copper thickness calculation module is used for carrying out copper thickness summation calculation on the layer units at the same positions of the inner layer circuit boards of the multilayer circuit board to obtain the accumulated copper thickness of each board unit of the multilayer circuit board.
The plate unit glue shortage risk judgment module judges whether the glue shortage risk of each layer of the plate unit exists in the plate unit or not according to the accumulated copper thickness of the plate unit and the marking condition of each layer of the plate unit, judging the risk of glue shortage of the plate unit, judging the plate unit as a risk-free plate unit when the cumulative copper thickness of the plate unit is less than 8oz, when the accumulated copper thickness of the plate unit is more than or equal to 8oz, the marking condition of the bonding layer unit judges the glue shortage risk of the plate unit, when the number of the continuous difficulty layer units in the plate unit is more than or equal to 4, the plate unit is judged to be the difficulty plate unit, when the number of the continuous risk layer units in the plate unit is more than or equal to 4, the plate unit is judged to be a risk plate unit, when the continuous three-layer difficulty layer unit exists in the plate unit, and the layer unit adjacent to the upper part or the lower part of the three-layer difficulty layer unit is a risk layer unit, the plate unit is judged to be a risk plate unit, and the plate unit is judged to be a risk-free plate unit under other conditions.
The multilayer circuit board glue-deficiency risk judgment module judges the defect risk of the whole multilayer circuit board according to the judgment result of each board unit, when the multilayer circuit board has a difficulty board unit, the multilayer circuit board is judged to be a glue-deficiency difficulty board, when the multilayer circuit board does not have the difficulty board unit and has a risk board unit, the multilayer circuit board is judged to be a glue-deficiency risk board, and when the multilayer circuit board does not have the difficulty board unit and does not have the risk board unit, the multilayer circuit board is judged to be a glue-deficiency risk board.
The output module is used for outputting the result of the multi-layer circuit board glue shortage risk judgment module, the multi-layer circuit board glue shortage risk result is divided into three grades, namely a glue shortage difficulty board, a glue shortage risk board and a glue shortage free risk board, and a worker can take corresponding measures in the pressing process of the multi-layer circuit board according to the grade classification.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (2)
1. The system is characterized by comprising a layer unit dividing module, a layer unit residual copper rate calculating module, a board unit cumulative copper thickness calculating module, a board unit adhesive shortage risk judging module, a multilayer circuit board adhesive shortage risk judging module and an output module;
the layer unit dividing module divides each inner layer circuit board of the multilayer circuit board into the same layer unit;
the layer unit residual copper rate calculating module calculates the residual copper rate of each layer unit, each layer unit is marked according to the residual copper rate in each layer unit, when the local residual copper rate in each layer unit is less than or equal to 20%, the layer unit is marked as a difficulty layer unit, when the local residual copper rate in each layer unit is less than 20%, the layer unit is marked as a risk layer unit, and when the local residual copper rate in each layer unit is more than or equal to 45%, the layer unit is marked as a risk-free layer unit;
the board unit accumulated copper thickness calculation module carries out copper thickness summation calculation on layer units at the same positions of all inner layer circuit boards of the multilayer circuit board to obtain the accumulated copper thickness of all board units of the multilayer circuit board;
the plate unit glue shortage risk judgment module judges whether the plate unit is in a glue shortage state or not according to the accumulated copper thickness of the plate unit and the marking condition of each layer unit in the plate unit, judging the glue shortage risk of the board unit, when the cumulative copper thickness of the board unit is less than 8oz, judging the board unit as a risk-free board unit, when the accumulated copper thickness of the plate unit is more than or equal to 8oz, the marking condition of the bonding layer unit judges the glue shortage risk of the plate unit, when the number of the continuous difficulty layer units in the plate unit is more than or equal to 4, the plate unit is judged to be the difficulty plate unit, when the number of the continuous risk layer units in the plate unit is more than or equal to 4, the plate unit is judged to be a risk plate unit, when continuous three-layer difficulty layer units exist in the plate units, and the layer units adjacent to the three-layer difficulty layer units are risk layer units, the plate unit is judged to be a risk plate unit, and the plate unit is judged to be a risk-free plate unit under other conditions;
the multilayer circuit board glue-deficiency risk judging module judges the defect risk of the whole multilayer circuit board according to the judging result of each board unit, when a difficulty board unit exists in the multilayer circuit board, the multilayer circuit board is judged to be a glue-deficiency difficulty board, when a risk board unit does not exist in the multilayer circuit board and does not exist in the difficulty board unit, the multilayer circuit board is judged to be a glue-deficiency risk board, and when a difficulty board unit does not exist in the multilayer circuit board and does not exist in the risk board unit, the multilayer circuit board is judged to be a glue-deficiency-free risk board;
and the output module is used for outputting the result of the multilayer circuit board glue shortage risk judgment module.
2. The system of claim 1, wherein the size of the layer unit is 1inch by 1 inch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711486425.8A CN108008288B (en) | 2017-12-29 | 2017-12-29 | Copper thickness self-recognition and glue-shortage risk early warning system for copper-free area of multilayer circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711486425.8A CN108008288B (en) | 2017-12-29 | 2017-12-29 | Copper thickness self-recognition and glue-shortage risk early warning system for copper-free area of multilayer circuit board |
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| CN108008288A CN108008288A (en) | 2018-05-08 |
| CN108008288B true CN108008288B (en) | 2020-05-12 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109815556B (en) * | 2018-12-30 | 2023-04-18 | 广州兴森快捷电路科技有限公司 | Method, device, equipment and storage medium for identifying isolated region of line layer |
| CN110187262B (en) * | 2019-06-28 | 2021-08-24 | 广东正业科技股份有限公司 | Selection method of surface copper thickness detection test point |
| CN110636717A (en) * | 2019-09-24 | 2019-12-31 | 北大方正集团有限公司 | Method and device for reducing press rejection rate of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05206647A (en) * | 1991-05-07 | 1993-08-13 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
| CN103582324B (en) * | 2012-07-26 | 2017-02-08 | 深南电路有限公司 | Press fitting and glue filling method and equipment for circuit board |
| CN102883534B (en) * | 2012-09-27 | 2015-08-12 | 沪士电子股份有限公司 | The thick copper coin internal layer of printed circuit is without copper district decompression problem-solving approach |
| CN103512832B (en) * | 2013-10-09 | 2015-08-19 | 广东生益科技股份有限公司 | The method of glue flow state during detection pressing plate |
| CN104254196A (en) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | Asymmetric copper thickness double-sided aluminum substrate and processing method thereof |
| CN105979707B (en) * | 2016-07-01 | 2018-06-19 | 广州兴森快捷电路科技有限公司 | A kind of line layer is without copper area recognizing method and system |
| CN206452609U (en) * | 2017-02-24 | 2017-08-29 | 胜宏科技（惠州）股份有限公司 | It is a kind of to be used to improve the wiring board of the local starved of thick copper coin |
| CN107155267B (en) * | 2017-06-29 | 2019-08-27 | 广州兴森快捷电路科技有限公司 | Circuit board filler method, equipment, system and computer storage medium |
| CN107509302A (en) * | 2017-07-28 | 2017-12-22 | 胜宏科技（惠州）股份有限公司 | A kind of multi-functional wiring board detection module and detection method |
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