CN107509302A - A kind of multi-functional wiring board detection module and detection method - Google Patents

A kind of multi-functional wiring board detection module and detection method Download PDF

Info

Publication number
CN107509302A
CN107509302A CN201710630682.8A CN201710630682A CN107509302A CN 107509302 A CN107509302 A CN 107509302A CN 201710630682 A CN201710630682 A CN 201710630682A CN 107509302 A CN107509302 A CN 107509302A
Authority
CN
China
Prior art keywords
copper
layers
hole
test
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710630682.8A
Other languages
Chinese (zh)
Inventor
李雄杰
李波
钟招娣
何艳球
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victory Giant Technology Huizhou Co Ltd
Original Assignee
Victory Giant Technology Huizhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victory Giant Technology Huizhou Co Ltd filed Critical Victory Giant Technology Huizhou Co Ltd
Priority to CN201710630682.8A priority Critical patent/CN107509302A/en
Priority to KR1020197010197A priority patent/KR102215664B1/en
Priority to PCT/CN2017/103329 priority patent/WO2019019339A1/en
Publication of CN107509302A publication Critical patent/CN107509302A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention designs test block for the process control needs of internal layer, pressing, drilling, capable judgement conveniently can be biased to the etch quantity in internal layer process, the hole of the layer in pressing working procedure partially, in drilling operating, reliable reference is provided before formally being made so as to assist side product, so as to carry out the adjustment of engineering data and process implementing, process capability is improved, so as to improve product quality.

Description

A kind of multi-functional wiring board detection module and detection method
Technical field
The present invention relates to circuit board technique field, more particularly to a kind of multi-functional wiring board detection module and detection method.
Background technology
In PCB production processes, the hands-on background of each process（Process capability）Height as PCB enterprises Core competitiveness, the lifting of process capability and the demand of enterprise development；How each process in effective monitoring manufacturing process Process capability, reference frame is provided for lifting process capability, turns into PCB enterprises key problems-solving, especially multi-layer sheet（Six It is more than layer）Internal layer harmomegathus, internal layer etch capabilities, pressing harmomegathus, pressing layer partially, drilling harmomegathus, the problems such as drilling hole is inclined, occur not It is good to directly affect product function.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of multi-functional wiring board detection module, including PCB test boards, it is described PCB test boards are multilayer circuit board, including first set gradually from top to bottom be to N layers of copper, altogether N layers layers of copper, N be more than 6 even number；
PCB test boards are provided with one or more test blocks, and the test block includes first through hole group and the second sets of vias, described First through hole group includes 6 ~ 12 instrument connections for being arranged in 3 rows, and the instrument connection is aperture identical through hole；Second sets of vias bag The first connecting hole is included to N-1 connecting holes, N-1 connecting hole, the connecting hole are aperture identical through hole altogether；The test Hole copper is equipped with hole and connecting hole；
First layers of copper is provided with the corresponding with first through hole group first paving copper billet；N layers of copper is provided with corresponding with first through hole group N paving copper billet;Described first and N paving copper billets are connected with the hole copper in all instrument connections；
Described second to being sequentially provided with corresponding with first through hole group second in N-1 layers of copper to N-1 copper strips respectively, altogether N- 2 copper strips, the second layers of copper are provided with the second copper strips corresponding with first through hole group, and the 3rd layers of copper is provided with and first through hole group Corresponding 3rd copper strips, the like；The width at the most narrow place of copper strips is identical in same test block；Described second to N-1 copper strips Often the upper and lower sides of row instrument connection curve around along first through hole group, and corresponding each on second to N-1 layers of copper respectively Instrument connection forms annular without copper area；The annular width without copper area in same test block is identical；Described second to N-1 copper strips One end is connected with the first connecting hole, and the other end is connected with second to N-1 connecting holes successively respectively, the other end of the second copper strips It is connected with the second connecting hole, the other end of the 3rd copper strips is connected with the 3rd connecting hole, the like.
Preferably, first and N layers of copper on all connecting holes in corresponding second sets of vias be provided with copper orifice ring；Described second Corresponding first connecting hole is provided with copper orifice ring on to N-1 layers of copper；Second to being corresponding in turn to second in N-1 layers of copper N-1 connecting holes are provided with copper orifice ring, and corresponding second connecting hole is provided with copper orifice ring in the second layers of copper, and the corresponding 3rd connects in the 3rd layers of copper Hole is provided with copper orifice ring, the like；The copper orifice ring is connected with the hole copper in corresponding connecting hole；Described second to N-1 copper strips Both ends connected respectively with two copper orifice rings being set in corresponding layers of copper.
Preferably, described second on N-1 copper strips in first through hole group the every part difference between row instrument connection Form copper bridge；Minimum range on same copper strips between adjacent copper bridge is more than or equal to 0.1mm.
Further, according to any multi-functional wiring board detection module of claims 1 to 3, it is characterised in that：It is adjacent The pitch of holes of connecting hole is 1.0 ~ 1.1mm；The aperture of instrument connection and connecting hole is 0.2mm；Between instrument connection and connecting hole Distance is more than 1mm.
Further, the first through hole group includes 9 instrument connections for being arranged in 3 rows.
Further, PCB test boards are provided with six test blocks.
Further, on six test blocks width of the annular without copper area be respectively 0.075mm, 0.1mm, 0.127mm、0.15mm、0.178mm、0.2mm。。
Further, on six test blocks the width at the most narrow place of copper strips be respectively 0.075mm, 0.1mm, 0.127mm、0.15mm、0.178mm、0.2mm。
The present invention also provides a kind of detection method using multi-functional wiring board detection module, including, to completing internal layer, pressure Close, the manufactured multi-functional wiring board detection module after drilling operating, carry out following test event：
Each test block is tested respectively, second is tested in each test block successively and whether turns on to N-1 copper strips, specifically It is whether to be turned between the first connecting hole of detection and other connecting holes, if being not turned on, judges etch during internal layer process Excessively, and the width at the most narrow place of copper strips judges over etching amount on the test result of the different test blocks of combination and each test block；
Each test block is tested respectively, second is tested in each test block successively and whether is turned on between N-1 layers of copper, Specifically whether detection second turns on between N-1 connecting holes, if there is conducting, judges that generation layer is inclined in pressing；If institute There is layers of copper to turn on, then judge that hole is inclined during drilling, and upper ring on the test result of the different test blocks of combination and each test block The width in Xing Wutong areas judges the inclined offset in hole.
Preferably, second is tested in each test block successively to when whether being turned between N-1 layers of copper, if there is second Any two layers of copper turns in N-1 layers of copper, then can be determined that layer occurs between the two layers of copper partially, and combine different surveys Width of the annular without copper area judges the inclined offset of floor in the test result of test block and each test block；
If there is any number of layers of copper conductings in second to N-1 layers of copper, then it is inclined to can be determined that layer occur in all layers of copper, and Judge the inclined offset of each layers of copper floor with reference to width of the annular on the test result of different test blocks and each test block without copper area；
The present invention designs test block for the process control needs of internal layer, pressing, drilling, can be conveniently in internal layer process Etch quantity, the hole of the layer in pressing working procedure partially, in drilling operating be biased capable judgement, before formally being made so as to assist side product Reliable reference is provided, so as to carry out the adjustment of engineering data and process implementing, process capability is improved, so as to improve product matter Amount.
Brief description of the drawings
Fig. 1 is multi-functional wiring board detection module example structure schematic diagram.
Fig. 2 is test block schematic diagram in the first layers of copper of multi-functional wiring board detection module embodiment.
Fig. 3 is test block schematic diagram in the second layers of copper of multi-functional wiring board detection module embodiment.
Fig. 4 is test block schematic diagram in the multi-functional layers of copper of wiring board detection module embodiment the 3rd.
Fig. 5 is test block schematic diagram in the multi-functional layers of copper of wiring board detection module embodiment the 4th.
Fig. 6 is test block schematic diagram in the multi-functional layers of copper of wiring board detection module embodiment the 5th.
Fig. 7 is test block schematic diagram in the multi-functional layers of copper of wiring board detection module embodiment the 6th.
Fig. 8 is test block schematic diagram in the multi-functional layers of copper of wiring board detection module embodiment the 7th.
Fig. 9 is test block schematic diagram in the multi-functional layers of copper of wiring board detection module embodiment the 8th.
Embodiment
The technology contents of the present invention are understood for convenience of those skilled in the art, below in conjunction with the accompanying drawings and embodiment is to this hair It is bright to be described in further detail.
A kind of multi-functional wiring board detection module as shown in Figure 1, including PCB test boards 1, the PCB test boards are multilayer Wiring board, including the first layers of copper L1, the layers of copper L8 of the second layers of copper L2 ... the 8th set gradually from top to bottom, altogether 8 layers of layers of copper；
PCB test boards 1 are provided with six test blocks 2, and for one of test block as shown in Fig. 2 to 9, each test block includes the One sets of vias A1 and the second sets of vias A2, first through hole group A1 include 9 instrument connection B for being arranged in 3 rows；Second sets of vias A2 bags The first connecting hole C1, the connecting hole C7 of the second connecting hole C2 ... the 7th are included, altogether seven connecting holes, instrument connection and connecting hole are hole Footpath identical through hole, and hole copper is equipped with hole.The pitch of holes of adjacent connecting hole is 1.1mm；The aperture of instrument connection and connecting hole It is 0.2mm；The distance between instrument connection and connecting hole are more than 1mm.
First layers of copper L1 is provided with the corresponding with first through hole group A1 first paving copper billet D1；8th layers of copper L8 is provided with and the 8th paving copper billet D8 corresponding to one sets of vias A1;First and the 8th paving copper billet be connected with the hole copper in all instrument connections；Second to It is sequentially provided with second copper strips E2 corresponding with first through hole group, the copper strips E7 of the 3rd copper strips E3 ... the 7th in 7th layers of copper respectively, six On individual test block the width at the most narrow place of copper strips be respectively set to 0.075mm, 0.1mm, 0.127mm, 0.15mm, 0.178mm, 0.2mm.Can be thick according to internal layer different Cu, different copper strips width is designed, because the width of copper strips is to be used to verify that internal layer etches Ability, different internal layer copper are thick, and it is different that erosion amount is stung in etching.
Part on second to the 7th copper strips in the first through hole group often between row instrument connection forms copper bridge F respectively；Together Minimum range on one copper strips between adjacent copper bridge F is 0.1mm.
Often the upper and lower sides of row instrument connection curve around second to the 7th copper strips along first through hole group, and respectively second Each instrument connection is corresponded on to the 7th layers of copper and forms annular without copper area G；Width of the annular without copper area is set respectively on six test blocks It is set to 0.075mm, 0.1mm, 0.127mm, 0.15mm, 0.178mm, 0.2mm.
One end of second to the 7th copper strips is connected with the first connecting hole, and the other end is connected with second to the 7th successively respectively Hole is connected, and the other end of the second copper strips is connected with the second connecting hole, and the other end of the 3rd copper strips is connected with the 3rd connecting hole, successively Analogize.
Connection for ease of copper strips and corresponding connecting hole is reliable and during test it is convenient and swift, first and the 8th corresponding in layers of copper All connecting holes in second sets of vias are provided with copper orifice ring H；Corresponding first connecting hole is provided with copper hole in second to the 7th layers of copper Ring H；The second to the 7th connecting hole is corresponding in turn in second to the 7th layers of copper and is provided with copper orifice ring H, corresponding the in the second layers of copper Two connecting holes are provided with copper orifice ring, and corresponding 3rd connecting hole is provided with copper orifice ring in the 3rd layers of copper, the like；Copper orifice ring is with accordingly connecting Connect the hole copper connection in hole；The two copper orifice ring H connections with being set in corresponding layers of copper respectively of the both ends of second to the 7th copper strips.
When the multi-functional wiring board detection module referred in using above-described embodiment is detected, to completing internal layer, pressure Close, the manufactured multi-functional wiring board detection module after drilling operating, carry out following test event：
Each test block is tested respectively, tests whether the second to the 7th copper strips in each test block turns on successively, specifically It is whether to be turned between the first connecting hole of detection and other connecting holes, if being not turned on, judges etch during internal layer process Excessively, and the width at the most narrow place of copper strips judges over etching amount on the test result of the different test blocks of combination and each test block；
Each test block is tested respectively, tests in each test block and whether is turned between the second to the 7th layers of copper successively, Specifically whether turned between the second to the 7th connecting hole of detection, if there is conducting, judge that generation layer is inclined in pressing；If go out Any two layers of copper conducting in existing second to the 7th layers of copper, then can be determined that layer occurs between the two layers of copper partially, and combine Width of the annular without copper area judges the inclined offset of floor in the test result of different test blocks and each test block；If there is second It any number of layers of copper conducting in the 7th layers of copper, then can be determined that all layers of copper occur that layer is inclined, and combine different test blocks Width of the annular without copper area judges each offset inclined layer by layer in test result and each test block.
If all layers of copper turn on, judge that hole is inclined during drilling, and combine the test result of different test blocks and each Upper width of the annular without copper area judges the inclined offset in hole on test block.
It is the specific implementation of the present invention above, its description is more specific and detailed, but can not therefore be interpreted as Limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, this hair is not being departed from On the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention's Protection domain.

Claims (10)

  1. A kind of 1. multi-functional wiring board detection module, it is characterised in that:
    Including PCB test boards, the PCB test boards are multilayer circuit board, including first set gradually from top to bottom is to N copper Layer, N layers layers of copper, N are the even number more than 6 altogether；PCB test boards are provided with one or more test blocks, and the test block includes First through hole group and the second sets of vias, the first through hole group include 6 ~ 12 instrument connections for being arranged in 3 rows, and the instrument connection is Aperture identical through hole；Second sets of vias includes the first connecting hole to N-1 connecting holes, altogether N-1 connecting hole, the connection Hole is aperture identical through hole；Hole copper is equipped with the instrument connection and connecting hole；
    First layers of copper is provided with the corresponding with first through hole group first paving copper billet；N layers of copper is provided with corresponding with first through hole group N paving copper billet;Described first and N paving copper billets are connected with the hole copper in all instrument connections；
    Described second to being sequentially provided with corresponding with first through hole group second in N-1 layers of copper to N-1 copper strips respectively, altogether N- 2 copper strips, the second layers of copper are provided with the second copper strips corresponding with first through hole group, and the 3rd layers of copper is provided with and first through hole group Corresponding 3rd copper strips, the like；The width at the most narrow place of copper strips is identical in same test block；Described second to N-1 copper strips Often the upper and lower sides of row instrument connection curve around along first through hole group, and corresponding each on second to N-1 layers of copper respectively Instrument connection forms annular without copper area；The annular width without copper area in same test block is identical；Described second to N-1 copper strips One end is connected with the first connecting hole, and the other end is connected with second to N-1 connecting holes successively respectively, the other end of the second copper strips It is connected with the second connecting hole, the other end of the 3rd copper strips is connected with the 3rd connecting hole, the like.
  2. 2. according to multi-functional wiring board detection module described in claim 1, it is characterised in that：First and N layers of copper on corresponding the All connecting holes in two sets of vias are provided with copper orifice ring；Described second is provided with copper to corresponding first connecting hole in N-1 layers of copper Orifice ring；Second is provided with copper orifice ring to N-1 connecting holes to being corresponding in turn to second in N-1 layers of copper, corresponding in the second layers of copper Second connecting hole is provided with copper orifice ring, and corresponding 3rd connecting hole is provided with copper orifice ring in the 3rd layers of copper, the like；The copper orifice ring with Hole copper connection in corresponding connecting hole；Described second to the both ends of N-1 copper strips two copper with being set in corresponding layers of copper respectively Orifice ring connects.
  3. 3. according to multi-functional wiring board detection module described in claim 1, it is characterised in that：Described second on N-1 copper strips Part in first through hole group often between row instrument connection forms copper bridge respectively；Most narrow spacing on same copper strips between adjacent copper bridge From more than or equal to 0.1mm.
  4. 4. according to any multi-functional wiring board detection module of claims 1 to 3, it is characterised in that：The hole of adjacent connecting hole Spacing is 1.0 ~ 1.1mm；The aperture of instrument connection and connecting hole is 0.2mm；The distance between instrument connection and connecting hole are more than 1mm。
  5. 5. according to any multi-functional wiring board detection module of claims 1 to 3, it is characterised in that：The first through hole group Including 9 instrument connections for being arranged in 3 rows.
  6. 6. according to any multi-functional wiring board detection module of claims 1 to 3, it is characterised in that：Set on PCB test boards There are six test blocks.
  7. 7. according to multi-functional wiring board detection module described in claim 6, it is characterised in that：Annular nothing on six test blocks The width in copper area is respectively 0.075mm, 0.1mm, 0.127mm, 0.15mm, 0.178mm, 0.2mm.
  8. 8. according to multi-functional wiring board detection module described in claim 6, it is characterised in that：Copper strips is most on six test blocks The width at narrow place is respectively 0.075mm, 0.1mm, 0.127mm, 0.15mm, 0.178mm, 0.2mm.
  9. 9. a kind of detection method using multi-functional wiring board detection module, including,
    To completing internal layer, pressing, multi-functional wiring board detection module made of after drilling operating, carry out following test event：
    Each test block is tested respectively, second is tested in each test block successively and whether turns on to N-1 copper strips, specifically It is whether to be turned between the first connecting hole of detection and other connecting holes, if being not turned on, judgement is lost when carrying out internal layer process Carve excessively, and the width at the most narrow place of copper strips judges over etching amount on the test result of the different test blocks of combination and each test block；
    Each test block is tested respectively, second is tested in each test block successively and whether is turned on between N-1 layers of copper, Specifically whether detection second turns on between N-1 connecting holes, if there is conducting, judges that generation layer is inclined in pressing；If institute There is layers of copper to turn on, then judge that hole is inclined during drilling, and upper ring on the test result of the different test blocks of combination and each test block The width in Xing Wutong areas judges the inclined offset in hole.
  10. 10. according to the detection method that multi-functional wiring board detection module is used described in claim 9, it is characterised in that：
    Second is tested in each test block successively to when whether being turned between N-1 layers of copper, if there is second to N-1 layers of copper Interior any two layers of copper conducting, then can be determined that layer occurs between the two layers of copper partially, and combine the test of different test blocks As a result and on each test block width of the annular without copper area judges the inclined offset of floor；
    If there is any number of layers of copper conductings in second to N-1 layers of copper, then it is inclined to can be determined that layer occur in all layers of copper, and Judge the inclined offset of each layers of copper floor with reference to width of the annular on the test result of different test blocks and each test block without copper area.
CN201710630682.8A 2017-07-28 2017-07-28 A kind of multi-functional wiring board detection module and detection method Pending CN107509302A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201710630682.8A CN107509302A (en) 2017-07-28 2017-07-28 A kind of multi-functional wiring board detection module and detection method
KR1020197010197A KR102215664B1 (en) 2017-07-28 2017-09-26 Multifunctional circuit board detection module and detection method
PCT/CN2017/103329 WO2019019339A1 (en) 2017-07-28 2017-09-26 Multi-functional circuit board detection module and detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710630682.8A CN107509302A (en) 2017-07-28 2017-07-28 A kind of multi-functional wiring board detection module and detection method

Publications (1)

Publication Number Publication Date
CN107509302A true CN107509302A (en) 2017-12-22

Family

ID=60690340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710630682.8A Pending CN107509302A (en) 2017-07-28 2017-07-28 A kind of multi-functional wiring board detection module and detection method

Country Status (3)

Country Link
KR (1) KR102215664B1 (en)
CN (1) CN107509302A (en)
WO (1) WO2019019339A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108008288A (en) * 2017-12-29 2018-05-08 大连崇达电路有限公司 A kind of multilayer circuit board is without copper area automatic identification early warning system
CN108430165A (en) * 2018-02-08 2018-08-21 广州兴森快捷电路科技有限公司 Pcb board etches detection method
CN108901128A (en) * 2018-08-26 2018-11-27 陈赵军 Double-faced flexible pcb board
CN109287082A (en) * 2018-11-28 2019-01-29 郑州云海信息技术有限公司 A kind of test method and device of easy short circuit line plate
CN112188726A (en) * 2020-10-20 2021-01-05 江西强达电路科技有限公司 Multilayer board for performing V _ CUT depth detection through electrical test
CN113435156A (en) * 2021-07-08 2021-09-24 苏州悦谱半导体有限公司 Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement
CN113660773A (en) * 2021-07-14 2021-11-16 深圳市景旺电子股份有限公司 Reliability test board and manufacturing method thereof
CN113740713A (en) * 2021-09-09 2021-12-03 博敏电子股份有限公司 Test board for detecting incomplete glue removal of PCB and test method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114205991B (en) * 2020-09-18 2024-05-03 重庆方正高密电子有限公司 PCB (printed circuit board)
CN113613394B (en) * 2021-08-04 2023-06-09 吉安满坤科技股份有限公司 Manufacturing process of chip IC packaging printed circuit board
CN114531775A (en) * 2022-03-04 2022-05-24 生益电子股份有限公司 Printed circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894606A (en) * 1988-07-07 1990-01-16 Paur Tom R System for measuring misregistration of printed circuit board layers
JPH0661652A (en) * 1992-05-27 1994-03-04 Nec Corp Inspection method for multilayer printed wiring board
JPH10270860A (en) * 1997-03-26 1998-10-09 Meidensha Corp Multilayered printed wiring board
JPH11112152A (en) * 1997-10-03 1999-04-23 Matsushita Electric Ind Co Ltd Multilayered printed board for mounting flip chip
JP2008218925A (en) * 2007-03-07 2008-09-18 Fujitsu Ltd Wiring board, manufacturing method of wiring board and inspection method thereof
CN104378909A (en) * 2013-08-12 2015-02-25 英业达科技有限公司 Printed circuit board
CN104582331B (en) 2014-12-31 2017-10-17 广州兴森快捷电路科技有限公司 The internal layer off normal detection method of multilayer circuit board
CN106455293B (en) * 2016-09-27 2019-05-17 惠州市金百泽电路科技有限公司 A kind of production method having a size of 500mm*800mm or more multilayer large scale High speed rear panel

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108008288A (en) * 2017-12-29 2018-05-08 大连崇达电路有限公司 A kind of multilayer circuit board is without copper area automatic identification early warning system
CN108430165A (en) * 2018-02-08 2018-08-21 广州兴森快捷电路科技有限公司 Pcb board etches detection method
CN108901128A (en) * 2018-08-26 2018-11-27 陈赵军 Double-faced flexible pcb board
CN108901128B (en) * 2018-08-26 2021-12-28 深圳华秋电子有限公司 Double-sided flexible PCB
CN109287082A (en) * 2018-11-28 2019-01-29 郑州云海信息技术有限公司 A kind of test method and device of easy short circuit line plate
CN109287082B (en) * 2018-11-28 2022-02-18 郑州云海信息技术有限公司 Testing method and device for circuit board easy to short circuit
CN112188726A (en) * 2020-10-20 2021-01-05 江西强达电路科技有限公司 Multilayer board for performing V _ CUT depth detection through electrical test
CN113435156A (en) * 2021-07-08 2021-09-24 苏州悦谱半导体有限公司 Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement
CN113660773A (en) * 2021-07-14 2021-11-16 深圳市景旺电子股份有限公司 Reliability test board and manufacturing method thereof
CN113740713A (en) * 2021-09-09 2021-12-03 博敏电子股份有限公司 Test board for detecting incomplete glue removal of PCB and test method thereof
CN113740713B (en) * 2021-09-09 2024-02-13 博敏电子股份有限公司 Test board for detecting whether PCB is incomplete in glue removal and test method thereof

Also Published As

Publication number Publication date
KR102215664B1 (en) 2021-02-10
WO2019019339A1 (en) 2019-01-31
KR20190049826A (en) 2019-05-09

Similar Documents

Publication Publication Date Title
CN107509302A (en) A kind of multi-functional wiring board detection module and detection method
CN205749810U (en) Pcb board internal layer off normal test device
CN106197250B (en) The test method of pcb board internal layer deviation
CN104582330B (en) The production method of the ATE plates of buried blind via structure
CN101762750B (en) Structure and method for measuring resistance of through hole
CN104918423B (en) A kind of method for manufacturing circuit board of detectable internal layer orifice ring
CN101964008B (en) Wiring design assisting apparatus and wiring design assisting method
CN108197349A (en) A kind of DFMEA analysis methods of structuring
CN115618803A (en) Method and system for detecting micropores in integrated circuit layout
CN103702516B (en) Printed circuit board coefficient calculation method and the system of calculating
CN101013258A (en) A mask set and formed semiconductor device
US20090259984A1 (en) Method of printed circuit boards
CN105376963A (en) Method for grabbing internal layer compensation coefficients
CN106908713A (en) A kind of decision method of wiring board internal layer circuit short circuit reason
US20090132977A1 (en) Method of establishing coupon bar
CN102858098A (en) Production method of asymmetric PCB (printed circuit board)
CN108333496B (en) Rapid test method for precision capability of flying probe machine capacitance method
CN201904970U (en) Printed circuit board
CN110493977A (en) A kind of inclined detection structure of layer and method of high frequency plate
CN201805023U (en) Circuit board process-based USB plug connector
CN102819049A (en) Method for detecting whether auxiliary materials of flexible printed circuit (FPC) are missed
CN203826347U (en) WAT test structure for monitoring over-etching of metal layer
CN110188463B (en) Sawtooth smoothing method of via hole array
CN202085396U (en) Carbon film plate with foolproof structures
CN105992451A (en) Printed circuit board and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20171222