CN103687315B - Designing method of punching alignment target - Google Patents
Designing method of punching alignment target Download PDFInfo
- Publication number
- CN103687315B CN103687315B CN201310684324.7A CN201310684324A CN103687315B CN 103687315 B CN103687315 B CN 103687315B CN 201310684324 A CN201310684324 A CN 201310684324A CN 103687315 B CN103687315 B CN 103687315B
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- CN
- China
- Prior art keywords
- punching
- alignment target
- distribution pattern
- harmomegathus
- designing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a designing method of a punching alignment target. The designing method comprises the following steps that an original wire distribution graph is designed on a computer, wherein the original wire distribution graph comprises a punching alignment target graph; the original graph scale of the part of the punching alignment target graph in the original wire distribution graph is maintained, and expansion and contraction are conducted on the other parts in the wire distribution graph to obtain an expansion and contraction wire distribution graph. The expansion and contraction wire distribution graph is transferred onto a film, and a film graph is obtained accordingly. The designing method is beneficial for improving the punching precision.
Description
Technical field
The present invention relates to a kind of punching alignment target method for designing being applied to multi-layer sheet wiring board.
Background technology
With electronic product to miniaturization, multifunction and high integration development, multi-layer sheet early becomes wiring board
Main flow.Multi-layer sheet number of plies more and more higher, wiring density is increasing, the requirement also more and more higher to interlayer alignment precision.Multilamellar
Plate is formed by the pressing of multiple core materials, and core material is designed with conductor fig, and core material is all using first punching, Ran Houyong
Hole punched para-position, is bound or riveted etc., to be ensured the aligning accuracy of interlayer conductor fig.Therefore, the precision of punching is to
Whole interlayer alignment precision impact is very big.Perforating press is to capture punching alignment target using CCD camera lens, and adjust automatically internal layer core
Plate placement location, to ensure punching precision.For ensureing the accuracy of CCD grabbing graphics, the position of perforating press CCD camera lens can only be done
Fixed position is moved.
As shown in figure 1, in current industry, for the punching of core material, all using design punching pair on the internal layer film
Bit pattern, then transfers to the figure on the film on core material, is punched out further according to aligning graph.Due to core material
Size can change after laminating, and the central layer change in size of different-thickness is variant, not lose for guarantee finished product board size
Very, internal layer film figure can carry out pre- harmomegathus, and that is, inner figure is not 1:1.Two problems thus can be brought：
(1) because CCD distance of camera lens is 1:1, punching alignment target and CCD camera lens not in same upright position, to CCD mirror
The accuracy of head grabbing graphics has certain impact, and then affects punching precision.
(2) punching target patterns are not 1:1, and the multi-layer sheet perforating press using in industry is 1:1 punching, leads to go out
The hole relative graphical coming can occur certain deviation, due to punching board it some times happens that punching off normal, bad during hand inspection sentences
This skew disconnected is normal phenomenon or punching precision is problematic.
Content of the invention
Based on this, the invention reside in overcoming the defect of prior art, provide a kind of method for designing of punching alignment target, should
Method for designing is conducive to improving punching precision.
Its technical scheme is as follows：
A kind of method for designing of punching alignment target, comprises the following steps：
Design first original circuit distribution pattern on computers, this first original circuit distribution pattern includes punching alignment target figure
Shape；
Former graphics proportion is kept to the part of punching consistent alignment target figure in first original circuit distribution pattern, to this routing layout
The remainder of figure carries out harmomegathus, obtains harmomegathus circuit distribution pattern；
Harmomegathus circuit distribution pattern is transferred on the film, obtains film figure.
Further, described harmomegathus has a corresponding harmomegathus value, the scope of this harmomegathus value be more than 0.997 and less than 1 or
More than 1 and less than 1.003.
Further, when designing first original circuit distribution pattern on computers, first original circuit distribution pattern and reality are made
The ratio of circuit distribution pattern is 1:1.
Below the advantage or principle of preceding solution is illustrated：
1st, perforating press, when being punched out to core material, is to arrest punching para-position target by CCD camera lens, and then accurately
Determine punching position.Because CCD distance of camera lens is with 1:1 carries out figure arrests, then by not carrying out to punching consistent alignment target figure
Harmomegathus is it can be ensured that the line at the center of the center of CCD camera lens and corresponding punching alignment target, perpendicular to core material, makes CCD
Camera lens can more be accurately aligned with corresponding punching alignment target and be arrested with carrying out figure, and then in perforating press with 1:1 is carried out
It can be ensured that the precision of punching in the case of punching.Therefore the method for designing of described punching alignment target is conducive to improving punching
Precision.
2nd, because punching occurs off normal relevant with punching consistent alignment target figure, in some cases also with punching machine punch certainly
Body is relevant, thus, after the method for designing using described punching alignment target, if punching deviation problem still occurs, can be determined that
Possibly there is perforating press itself punching to cause, thus can judge punching precision problem or normal phenomenon, thus favorably
In carrying out improvement problem.Therefore, can intuitively confirm whether board punching precision is abnormal by this method for designing and corresponding construction,
Avoid every time checking punching precision with special inspecting equipment, can improve production efficiency, and equipment testing cost can be saved.
3rd, the scope of described harmomegathus value is more than 0.997 and less than 1 or more than 1 and is less than 1.003, then it can be avoided that internal layer
The finished product board size problem of dtmf distortion DTMF that central layer causes because of change in size after laminating, and then it is advantageously ensured that the quality of production board.
4th, when designing first original circuit distribution pattern on computers, first original circuit distribution pattern is made to be distributed with actual track
The ratio of figure is 1:1, then ensure that the actual track distribution of wiring board can be consistent with first original circuit distribution pattern or basic
Unanimously.
5th, after obtaining described film figure, by this film figure with 1:1 ratio is transferred on core material, then punching
Machine can be punched out according to this film figure, in addition, enterprising in core material also according to this film figure in subsequent handling
The making of row line.
6th, the method for designing of described punching alignment target does not increase flow process and production cost.
Brief description
Fig. 1 is the structural representation of the punching off normal occurring when first original circuit distribution pattern all carries out harmomegathus.
Fig. 2 is the dependency structure schematic diagram using punching after the method for designing of the punching alignment target described in the present embodiment.
Fig. 3 is the flow chart of the method for designing of punching alignment target described in the embodiment of the present invention.
Description of reference numerals：
10th, core material, 20, punching alignment target, 30, the hole gone out, 40, CCD camera lens.
Specific embodiment
Below embodiments of the invention are described in detail：
As shown in Figures 2 and 3, a kind of method for designing of punching alignment target, comprises the following steps：
Design first original circuit distribution pattern on computers, this first original circuit distribution pattern includes punching alignment target figure
Shape；
Former graphics proportion is kept to the part of punching consistent alignment target figure in first original circuit distribution pattern, to this routing layout
The remainder of figure carries out harmomegathus, obtains harmomegathus circuit distribution pattern；
Harmomegathus circuit distribution pattern is transferred on the film, obtains film figure.
Further, described harmomegathus has a corresponding harmomegathus value, the scope of this harmomegathus value be more than 0.997 and less than 1 or
More than 1 and less than 1.003.
Further, when designing first original circuit distribution pattern on computers, first original circuit distribution pattern and reality are made
The ratio of circuit distribution pattern is 1:1.
The present embodiment has advantages below or principle：
1st, perforating press, when being punched out to core material 10, is to arrest punching alignment target 20 by CCD camera lens 40, enters
And accurately determine punching position.Because CCD camera lens 40 distance is with 1:1 carries out figure arrests, then by punching alignment target figure
Shape does not carry out harmomegathus it can be ensured that the line at the center of CCD camera lens 40 and the center of corresponding punching alignment target 20 is perpendicular to interior
Layer central layer 10, enables CCD camera lens 40 to be more accurately aligned with corresponding punching alignment target 20 and is arrested with carrying out figure, and then
In perforating press with 1:It can be ensured that the precision of punching in the case that 1 is punched out.Therefore the design of described punching alignment target 20
Method is conducive to improving the precision of punching.As shown in Fig. 2 by using described method, the hole 30 gone out does not occur off normal,
The center of CCD camera lens 40 is aligned with the center of corresponding punching alignment target 20.
2nd, because punching occurs off normal relevant with punching consistent alignment target figure, in some cases also with punching machine punch certainly
Body is relevant, thus, after the method for designing using described punching alignment target 20, if punching deviation problem still occurs, can sentence
Fixed possibly have perforating press itself punching to cause, and thus can judge punching precision problem or normal phenomenon, thus having
It is beneficial to carry out improvement problem.Therefore, can intuitively confirm whether board punching precision is different by this method for designing and corresponding construction
Often, it is to avoid every time check punching precision with special inspecting equipment, can improve production efficiency, and equipment testing cost can be saved.
3rd, the scope of described harmomegathus value is more than 0.997 and less than 1 or more than 1 and is less than 1.003, then it can be avoided that internal layer
The finished product board size problem of dtmf distortion DTMF that central layer 10 causes because of change in size after laminating, and then it is advantageously ensured that the product of production board
Matter.
4th, when designing first original circuit distribution pattern on computers, first original circuit distribution pattern is made to be distributed with actual track
The ratio of figure is 1:1, then ensure that the actual track distribution of wiring board can be consistent with first original circuit distribution pattern or basic
Unanimously.
5th, after obtaining described film figure, by this film figure with 1:1 ratio is transferred on core material 10, then rush
Hole machine can be punched out according to this film figure, in addition, also according to this film figure in core material 10 in subsequent handling
The making of enterprising row line.
6th, the method for designing of described punching alignment target does not increase flow process and production cost.
Embodiment described above only have expressed the specific embodiment of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the guarantor of the present invention
Shield scope.
Claims (4)
1. a kind of method for designing of punching alignment target is it is characterised in that comprise the following steps：
Design the first original circuit distribution pattern proportional to actual track distribution pattern, this first original circuit scattergram on computers
Shape includes punching consistent alignment target figure；
Former graphics proportion is kept to the part of punching consistent alignment target figure in first original circuit distribution pattern, to this routing layout figure
Remainder carry out harmomegathus, obtain harmomegathus circuit distribution pattern；
Harmomegathus circuit distribution pattern is transferred on the film, obtains film figure.
2. the method for designing of punching alignment target according to claim 1 is it is characterised in that described harmomegathus has accordingly
Harmomegathus value, the scope of this harmomegathus value is more than 0.997 and less than 1 or more than 1 and is less than 1.003.
3. the method for designing of punching alignment target according to claim 1 and 2 is it is characterised in that ought set on computers
During meter first original circuit distribution pattern, the ratio making first original circuit distribution pattern and actual track distribution pattern is 1:1.
4. the method for designing of punching alignment target according to claim 3 is it is characterised in that further comprising the steps of：Will
The film figure being obtained is with 1:1 ratio is transferred on core material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684324.7A CN103687315B (en) | 2013-12-12 | 2013-12-12 | Designing method of punching alignment target |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684324.7A CN103687315B (en) | 2013-12-12 | 2013-12-12 | Designing method of punching alignment target |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687315A CN103687315A (en) | 2014-03-26 |
| CN103687315B true CN103687315B (en) | 2017-02-15 |
Family
ID=50323196
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310684324.7A Expired - Fee Related CN103687315B (en) | 2013-12-12 | 2013-12-12 | Designing method of punching alignment target |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270889B (en) * | 2014-09-28 | 2017-06-13 | 广州兴森快捷电路科技有限公司 | Partial high-precision printed wiring board and preparation method thereof |
| CN104302098A (en) * | 2014-10-31 | 2015-01-21 | 华进半导体封装先导技术研发中心有限公司 | Circuit board lamination alignment target structure and manufacturing method thereof |
| CN104470265B (en) * | 2014-11-19 | 2017-09-22 | 广州兴森快捷电路科技有限公司 | A kind of preparation method of multilayer circuit board |
| CN105632941B (en) * | 2016-02-02 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | A kind of production and processing method of the package substrate based on harmomegathus process control |
| CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
| CN107295749B (en) * | 2017-07-12 | 2019-09-17 | 奥士康精密电路（惠州）有限公司 | A kind of inclined management-control method in pcb board hole |
| CN110708874B (en) * | 2019-09-24 | 2021-06-04 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN114501799B (en) * | 2020-10-27 | 2023-05-30 | 健鼎（无锡）电子有限公司 | Alignment method for circuit board manufacturing process and composite target point |
| CN112440329B (en) * | 2020-11-04 | 2022-09-13 | 东莞王氏港建机械有限公司 | Multilayer board punching method and punching machine with double-sided circuit based on layer deviation detection |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085836A (en) * | 1999-09-14 | 2001-03-30 | Nippon Avionics Co Ltd | System for adjusting pattern forming film of printed wiring board |
| CN101640978A (en) * | 2009-08-29 | 2010-02-03 | 深圳市深联电路有限公司 | Method and device for manufacturing single-side nickel-plated sheet |
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
| CN102883557B (en) * | 2012-10-17 | 2015-06-03 | 厦门爱谱生电子科技有限公司 | Production process improvement method of flexible printed circuit board containing welding finger |
| CN102962319A (en) * | 2012-12-13 | 2013-03-13 | 昆山诺瑞信机械设备有限公司 | Punching machine |
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Granted publication date: 20170215 Termination date: 20211212 |