WO2019196598A1 - Structure d'encapsulation, dispositif électronique et procédé d'encapsulation - Google Patents

Structure d'encapsulation, dispositif électronique et procédé d'encapsulation Download PDF

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Publication number
WO2019196598A1
WO2019196598A1 PCT/CN2019/078509 CN2019078509W WO2019196598A1 WO 2019196598 A1 WO2019196598 A1 WO 2019196598A1 CN 2019078509 W CN2019078509 W CN 2019078509W WO 2019196598 A1 WO2019196598 A1 WO 2019196598A1
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WO
WIPO (PCT)
Prior art keywords
substrate
package structure
bonding
antenna
region
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Application number
PCT/CN2019/078509
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English (en)
Chinese (zh)
Inventor
常明
林来存
刘亮胜
曲恒
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华为技术有限公司
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Publication of WO2019196598A1 publication Critical patent/WO2019196598A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

  • the present application relates to the field of wireless communications technologies, and in particular, to a package structure, an electronic device, and a packaging method.
  • AiP Antenna in Package
  • EIRP Equivalent Isotropic Radiated Power
  • the technical problem to be solved by the embodiments of the present application is to provide a package structure and a packaging method thereof for improving reliability.
  • an embodiment of the present application provides a package structure including a first substrate, a second substrate, and a chip, the second substrate being mounted on an upper surface of the first substrate, the chip being mounted on the first substrate
  • the upper surface of the first substrate is provided with spaced protrusions
  • the lower surface of the second substrate is provided with spaced protrusions
  • the convex portions on the second substrate are opposite to each other and surround the bonding region between the first substrate and the second substrate and an antenna region for accommodating the antenna radiator
  • on the second substrate a through hole penetrating through the upper and lower surfaces of the second substrate, the through hole communicating with the bonding region, wherein the through hole and the bonding region are filled with an adhesive colloid
  • the bonding area overflows into the through hole, and the adhesive colloid is condensed into a rivet structure in the bonding area and the through hole.
  • the second substrate includes at least one through hole penetrating the upper and lower surfaces of the second substrate, and the through hole communicates with the bonding region, and the first substrate and the second substrate are When the substrate is bonded, the pressure of the first substrate is pressed by the second substrate, and the blocking action of the convex portion of the first substrate and the convex portion of the second substrate, excess adhesive colloid (viscous material) Filling into the through hole, the adhesive colloid is condensed in the bonding area and the through hole to form a rivet structure capable of firmly connecting the first substrate and the second substrate.
  • the rivet structure strengthens the connection strength between the first substrate and the second substrate, thereby improving the reliability of the package structure.
  • the convex portion of the first substrate can effectively control the amount of dispensing at the solder joint of the first substrate, thereby effectively improving the packaging efficiency of the package structure.
  • an upper surface of the second substrate is also provided with an antenna radiator, and an antenna radiator of an upper surface of the second substrate corresponds to an antenna radiator in the antenna region.
  • the sidewall of the through hole includes an uneven microstructure, and the microstructure can increase a contact surface of the sidewall of the through hole with the adhesive colloid, thereby improving the adhesion. The reliability of bonding the colloid to the sidewall of the through hole.
  • the convex portion of the first substrate and the corresponding convex portion of the second substrate are seamlessly bonded together.
  • the convex portion of the first substrate and the corresponding convex portion of the second substrate serve to support the first substrate and the second substrate, and the first substrate and the first substrate can be effectively maintained.
  • the spacing of the second substrate ensures stability of a gap between the antenna radiator on the first substrate and the second substrate, thereby ensuring antenna performance.
  • the width of the gap between the antenna radiator and the second substrate is between 0 and 100 um, and the package structure is used to implement a frequency band of 40 G or more, for example, a frequency band of 40 G to 70 G. Millimeter wave.
  • the package structure further includes a peripheral region disposed adjacent to an edge of the package structure, wherein a width of a cross section of the protrusion portion of the first substrate in the peripheral region is smaller than a width of the second substrate at the periphery
  • the cross-sectional width of the raised portion of the region is such that the bonding interface between the adhesive colloid and the first substrate in the peripheral region becomes larger, enhancing the connection strength between the first substrate and the second substrate And the sealing property, thereby improving the reliability of the package structure.
  • the first substrate includes a first plate body and a protective layer
  • the protective layer is disposed on a lower surface of the first plate body
  • the protrusion portion is disposed on the first plate body
  • the upper surface of the chip is disposed adjacent to the protective layer, and the protective layer is used to protect a line in the first board.
  • the package structure further includes a ball grid array mounted on a lower surface of the first substrate, the ball grid array being disposed adjacent to the chip. After the information received by the antenna of the package structure is processed, the ball grid array ball is sent to the main board of the electronic device to realize signal transmission.
  • the adhesive colloid comprises at least one of copper paste, solder paste, silver paste, and low flow adhesive resin glue.
  • the chip includes at least one of a radio frequency chip, a digital chip, a filter chip, and a power chip.
  • an embodiment of the present application further provides an electronic device including a main board and a package structure as described above, wherein the main board and the package structure have signal transmission.
  • an embodiment of the present application further provides a packaging method, including the following steps:
  • the first bonding zone corresponds to the bonding zone
  • the bonding gel overflows from the bonding zone to the second a through hole of the substrate, wherein the adhesive colloid is condensed into a rivet structure in the bonding region and the through hole.
  • the packaging method further comprises the step of mounting a chip on a lower surface of the first substrate.
  • the packaging method further includes the step of: implanting the ball grid array on the lower surface of the first substrate, The ball grid array is disposed adjacent to the chip.
  • the information received by the antenna of the package structure is processed and sent to the main board of the electronic device through the ball grid array ball to realize signal transmission.
  • the second substrate in the step of “pressing the second substrate on the first substrate”, the second substrate is vacuum-adsorbed by the upper sheet device and the second substrate is crimped to the The first substrate.
  • the top sheet device adopts vacuum adsorption of the second substrate, in the process of crimping the second substrate to the first substrate, almost no adhesive colloid due to the action of vacuum Entering between the convex portion of the first substrate and the convex portion of the corresponding second substrate, thereby facilitating stabilization of the width of the gap between the antenna radiator and the second substrate to ensure antenna performance.
  • FIG. 1 is a cross-sectional view of a package structure according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a first substrate according to an embodiment of the present invention.
  • FIG 3 is a schematic cross-sectional view of a second substrate according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a through hole according to an embodiment of the present invention.
  • FIG. 5 is a schematic flowchart diagram of a packaging method according to an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view showing the injection of the first adhesive region of the first substrate into the adhesive.
  • FIG. 7 is a schematic cross-sectional view showing the second substrate being crimped onto the first substrate.
  • FIG. 8 is a schematic cross-sectional view showing the chip mounted on the first substrate.
  • an embodiment of the present application provides a package structure 100 including a first substrate 10 , a second substrate 30 , and a chip 50 .
  • the first substrate 10 includes an upper surface 101 and a lower surface 102 which are oppositely disposed.
  • the second substrate 30 is mounted on the upper surface 101 of the first substrate 10, and the chip 50 is fixed on the lower surface. 102.
  • the second substrate 30 includes an upper surface 103 and a lower surface 104 disposed opposite to each other, and a lower surface 104 of the second substrate 30 is disposed toward the first substrate 10 .
  • the chip 50 is not limited to be fixed on the lower surface 102 of the first substrate 10, and the chip 50 can be fixed to the receiving slot/hole by the receiving hole/hole in the first substrate 10. Not limited.
  • the upper surface 101 of the first substrate 10 is provided with spaced protrusions 15
  • the lower surface 104 of the second substrate 30 is provided with spaced protrusions 35
  • the convex portions 15 on the second substrate 30 are opposed to each other and surround the bonding region 107 and the antenna region 108 for accommodating the antenna radiator 17 between the first substrate 10 and the second substrate 30.
  • the second substrate 30 further includes at least one through hole 31 penetrating through the upper surface 103 and the lower surface 104 of the second substrate 30, each through hole 31 communicating with a bonding region 107, the through hole 31 and the The bonding area 107 is filled with an adhesive colloid 60, and the adhesive colloid 60 overflows from the bonding area 107 into the through hole 31, and the adhesive colloid 60 is in the bonding area 107 and
  • the condensed structure in the through hole 31 is a rivet structure.
  • each of the through holes 31 is disposed in communication with one of the bonding regions 107, when the first substrate 10 and the second substrate 20 are bonded, the first substrate 10 is crimped by the second substrate 30.
  • the pressure, and the blocking action of the boss 15 and the boss 35, the excess adhesive colloid 60 (viscous material) is squeezed into the through hole 31 to condense to form the rivet structure, the rivet structure reinforcing the first
  • the strength of the connection between the substrate 10 and the second substrate 30 improves the reliability of the package structure 100.
  • the first substrate 10 is a multi-layer structure, which can be adjusted according to wiring and performance requirements, and is not limited to the laminated structure shown in FIGS. Further, the convex portion 15 on the first substrate 10 surrounds the first bonding region 11 and the first antenna region 12.
  • the at least one antenna radiator 17 is attached to the upper surface 101 of the first substrate 10, and each of the antenna radiators 17 is disposed in a first antenna region 12.
  • the first substrate 10 is provided with a line.
  • the antenna radiator 17 and the chip 50 are fed through a line in the first substrate 10.
  • the upper surface 101 of the first substrate 10 is a soldering surface.
  • a non-solder resist layer defining pad NON-SOLDER MASK DEFINE PAD, NSMD
  • a solder resist layer defining pad SOLDER MASK DEFINE PAD, SMD
  • a copper-free pad may be used, for example, in a first paste.
  • the junction region 11 is NSMD
  • a first bonding region 11 is made of SMD
  • a first bonding region 11 is made of a copper-free pad.
  • the raised portion 35 of the second substrate 30 surrounds at least one second bonding region 32 and at least one second antenna region 34.
  • Each of the second bonding regions 32 corresponds to a first bonding region 11.
  • Each of the second antenna regions 34 corresponds to a first antenna region 12.
  • Each of the bosses 35 is disposed opposite to and attached to one of the bosses 15. The raised portion 35 can effectively prevent the adhesive colloid 60 in the second bonding region 32 from overflowing into the second bonding region 32 into the second antenna region 34 during packaging, thereby causing contamination of the second antenna region 34.
  • the raised portion 15 and the raised portion 35 are made of a liquid photo-resistance flux, which is an acrylic oligomer, also known as green oil/green paint.
  • a liquid photo solder resist to the upper surface 101 of the first substrate 10, forming a plurality of protrusions 15 on the first substrate 10 by a photolithography process; applying a liquid photo solder resist to the second substrate 30
  • the lower surface 104 is formed with a plurality of convex portions 35 on the second substrate 30 by a photolithography process.
  • the bonding area 107 and the antenna area 108 are alternately arranged. It can be understood that the bonding area 107 and the antenna area 108 are not alternately arranged. The number and arrangement of the bonding area 107 and the antenna area 108 are set according to actual needs.
  • An antenna cavity for accommodating the antenna radiator 17 is surrounded by the convex portion 15, the corresponding convex portion 35, the first plate body 13, and the second plate body 33.
  • the cavity of the antenna cavity is the antenna region 107. region.
  • a convex cavity for accommodating the adhesive body 60 is formed by the convex portion 15, the convex portion 35, the first plate body 13, and the second plate body 33.
  • the cavity of the bonding cavity is a bonding region. 108 area.
  • a bank-shaped convex portion 15 is formed on the upper surface 101 of the first substrate 10, and a bank-shaped convex portion 35 is formed on the lower surface 104 of the second substrate 30, which is advantageous for controlling the amount of the adhesive colloid 60 to avoid bonding.
  • the colloid 60 enters the first antenna region 12 and the second antenna region 34 due to excessive usage, resulting in contamination.
  • each of the protrusions 35 is disposed corresponding to one of the protrusions 15 to facilitate the alignment of the first substrate 10 and the second substrate 30, thereby improving packaging efficiency.
  • a gap 170 is formed between the antenna radiator 17 and the second substrate 30.
  • the width d of the slit 170 is between 0 and 100 ⁇ m, and the package structure 100 is used to realize a millimeter wave of a frequency band of 40 G or more, for example, a band millimeter wave of a range of 40 G to 70 G.
  • the antenna radiator 37 is provided on the upper surface 103 of the second substrate 30. Each of the antenna radiators 37 is disposed corresponding to the antenna radiator 17 of one antenna region 108.
  • the second substrate 30 is vacuum-adsorbed by a top sheet device, and then the second substrate 30 is pressure-bonded to the first substrate 10.
  • the adhesive colloid 60 is self-sufficient due to the action of pressing and the action of vacuum.
  • the bonding region 107 overflows to the through hole 31, and only a small amount, or the non-adhesive colloid 60 enters between the convex portion 15 and the convex portion 35. It can be understood that, in an embodiment, the convex portion 15 of the first substrate 10 and the convex portion 35 of the second substrate 30 are seamlessly bonded together.
  • the convex portion 151 and the convex portion 35 are provided with the stabilizing slit 170 while the thickness of the convex portion 151 and the convex portion 35 serves to support the first substrate 10 and the second substrate 30, and the package structure 100 is ensured. Antenna performance.
  • the antenna radiator 17 and the antenna radiator 37 are both metal layers, and the antenna radiator 17 and the antenna radiator 37 are used to radiate electromagnetic wave signals.
  • the package structure 100 further includes a peripheral region 105 disposed adjacent to an edge of the package structure 100, and a convex portion 15 located in the peripheral region 105 has a smaller cross-sectional width than a convex portion 35 of the peripheral region 105.
  • the cross-sectional width increases the bonding interface between the adhesive colloid 60 of the peripheral region 105 and the first substrate 10, enhancing the connection strength and sealing between the first substrate 10 and the second substrate 30. Thereby improving the reliability of the package structure 100.
  • the chip 50 is a radio frequency chip, and the antenna radiator 17 is communicatively connected with the chip 50.
  • the package structure 100 is an integrated antenna package structure (AiP, Antenna in Package).
  • the chip 50 can also be a digital chip, a filter chip, a power chip, or the like.
  • the manner in which the chip 50 is connected to the first substrate 10 can be connected by flip chip bonding. In one embodiment, the number of chips 50 may be two, three or more.
  • the package structure 100 may also include passive components (eg, resistors, capacitors, inductors, etc.), control chips, and the like.
  • the control chip is electrically connected to the RF chip and is used to process signals transmitted by the RF chip. Passive devices are used to provide filtering or noise reduction for the RF chip.
  • the adhesive colloid 60 includes at least one of copper paste, solder paste, silver paste, and low flow adhesive resin glue. It can be understood that the applicable adhesive colloid 60 can be selected according to the structure/material of the first substrate 10 disposed in the first bonding region 11, thereby strengthening the bonding strength between the adhesive colloid 60 and the first substrate 10. For example, in the present embodiment, the first bonding region 11 designed by NSMD and SMD is used. Since the copper pad is provided, the adhesive colloid 60 is selected from a solder paste, and the copper paste and the silver paste are also suitable for the copper pad. The first bonding region 11; for the first bonding region 11 without the copper pad, at least one of resin glue, copper paste and silver glue may be used.
  • the package structure 100 further includes a Ball Grid Array (BGA) 70 that is implanted on the lower surface 102 of the first substrate 10, the ball grid array 70 being disposed adjacent to the chip 50.
  • the ball grid array 70 is used to transmit information received by the antenna to the motherboard of the device/device.
  • the first substrate 10 includes a first plate body 13 and a protective layer 19.
  • the first plate body 13 is provided with a line.
  • the protective layer 19 is disposed on a lower surface of the first board 13 for protecting a line in the first substrate 10.
  • the protruding portion 15 is disposed on an upper surface of the first plate body 13 , and the chip 50 and the ball grid array 70 are disposed adjacent to the protective layer 19 .
  • the first plate 13 comprises a copper clad laminate (CCL) and a prepreg (PPG).
  • the number of the copper clad laminates is four, the number of the prepregs is one, and the two prepregs are respectively provided with two copper clad laminates.
  • a circuit is disposed in the copper clad laminate and the prepreg.
  • the second substrate 30 is made of a copper clad laminate.
  • the first plate body 13 may be other laminated structures, which is not limited herein.
  • the sidewall of the through hole 31 includes an uneven microstructure 311, which can increase the contact surface between the sidewall of the through hole 31 and the adhesive colloid 60. The reliability of bonding of the adhesive colloid 60 to the sidewall of the through hole 31 can be improved.
  • the embodiment of the present application further provides an electronic device including a main board (not shown) and the package structure 100 as described above. There is signal transmission between the main board and the package structure 100.
  • the embodiment of the present application further provides a packaging method. Referring to FIG. 5, the method includes the following steps:
  • Step 401 referring to FIG. 6, the adhesive layer 60 is injected into the first bonding region 11 surrounded by the convex portion 15 of the first substrate 10.
  • the glue may be applied to the first bonding region 11 of the first substrate 10 by a dispensing device (not shown) or by a stencil printing process.
  • the second substrate 30 is crimped onto the first substrate 10, and the convex portion 15 on the first substrate 10 and the convex portion 35 on the second substrate 30 are mutually connected to each other.
  • the first bonding area 11 corresponds to the bonding In the region 107
  • the adhesive colloid 60 overflows from the bonding region 107 to the through hole 31 of the second substrate 30, and the adhesive colloid 60 is in the bonding region 107 and the through hole 31.
  • the condensate structure becomes a rivet structure.
  • the top sheet device is a vacuum adsorption device, and the top sheet device adsorbs the second substrate 30 by vacuum.
  • the adhesive colloid 60 is extruded into the through hole 31 to form a rivet structure, and the rivet structure
  • the first substrate 10 and the second substrate 30 can be firmly connected together, thereby enhancing the connection strength between the first substrate 10 and the second substrate 30.
  • the top sheet device vacuum-adsorbs the second substrate 30, in the process of crimping the second substrate 30 to the first substrate 10, the second substrate 30 is adsorbed by the vacuum.
  • the non-adhesive colloid 60 enters between the convex portion 15 and the convex portion 35, thereby facilitating the stabilization of the slit 170 between the antenna radiator 17 and the second substrate 37, ensuring the antenna. performance.
  • Step 403 referring to FIG. 8, the chip 50 is fixed to the first substrate 10.
  • the chip 50 is attached to the lower surface 102 of the first substrate 10 by a conventional flip chip process.
  • the chip 50 is fed into a line within the first substrate 10.
  • Step 404 referring again to FIG. 1, the ball grid array 70 is implanted on the lower surface 102 of the first substrate 10, and the ball grid array 70 is disposed adjacent to the chip 50.
  • the ball grid array 70 is connected to the line of the first substrate 10.
  • the package structure, the electronic device, and the packaging method provided by the embodiment of the present application because the second substrate 30 is provided with the through hole 31 corresponding to the first bonding region 11, so that the adhesive colloid 60 in the bonding region 107 is encapsulated at the time of packaging. Extrusion into the through hole 31 to form a rivet structure connecting the first substrate 10 and the second substrate 30 to prevent the adhesive colloid 60 from entering the antenna region 108, and strengthening the first substrate 10 The strength of the connection with the second substrate 30. Further, the convex portion 15 and the convex portion 35 can effectively control the amount of the adhesive colloid 60, and further prevent the adhesive colloid 60 from entering the antenna region 108.
  • the thickness of the convex portion 15 and the convex portion 35 serves to support the first substrate 10 and the second substrate 30, the first substrate 10 and the second substrate 30 can be effectively maintained.
  • the spacing ensures the stability of the gap 170 between the antenna radiator 17 and the second substrate 30, ensuring the antenna performance of the package structure 100.
  • the height of the slit 170 between the first substrate 10 and the second substrate 30 is stable, and good stability can be maintained even after a plurality of high-temperature heat cycles.
  • the through hole 31 of the second substrate 30 effectively absorbs excess overflow glue, and effectively solves the technical problem that the overflow of the antenna area and the thickness of the viscous material are difficult to control.
  • the glue overflows with the glue of the welding surface to form a rivet structure, which plays a good role in welding the first substrate 10 and the second substrate 30.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Details Of Aerials (AREA)

Abstract

Les modes de réalisation de la présente invention concernent une structure d'encapsulation, comprenant un premier substrat, un second substrat et une puce, le second substrat étant monté sur la surface supérieure du premier substrat, et la puce étant montée sur le premier substrat ; la surface supérieure du premier substrat étant pourvue de saillies espacées sur cette dernière, et une surface inférieure du second substrat étant pourvue de saillies espacées ; les saillies du premier substrat et du second substrat étant opposées les unes aux autres et formant une région de liaison et une région d'antenne servant à recevoir un radiateur d'antenne entre le premier substrat et le second substrat ; le second substrat comportant un trou traversant qui est en communication avec la région de liaison ; et un gel de liaison dans le trou traversant et la région de liaison débordant de la région de liaison dans le trou traversant et étant solidifié en une structure de rivet. Le trou traversant selon l'invention empêche que le gel de liaison ne déborde et ne contamine la région d'antenne pendant l'encapsulation, garantissant ainsi la performance d'antenne de la structure d'encapsulation, et améliorant ainsi la fiabilité de la structure d'encapsulation. La présente invention concerne également un dispositif électronique et un procédé d'encapsulation.
PCT/CN2019/078509 2018-04-08 2019-03-18 Structure d'encapsulation, dispositif électronique et procédé d'encapsulation WO2019196598A1 (fr)

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CN201810307078.6 2018-04-08
CN201810307078.6A CN110349931B (zh) 2018-04-08 2018-04-08 封装结构、电子装置及封装方法

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