WO2014187335A1 - Led灯芯和包含其的led球泡灯 - Google Patents

Led灯芯和包含其的led球泡灯 Download PDF

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Publication number
WO2014187335A1
WO2014187335A1 PCT/CN2014/078113 CN2014078113W WO2014187335A1 WO 2014187335 A1 WO2014187335 A1 WO 2014187335A1 CN 2014078113 W CN2014078113 W CN 2014078113W WO 2014187335 A1 WO2014187335 A1 WO 2014187335A1
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WO
WIPO (PCT)
Prior art keywords
led
heat dissipation
substrate
dissipation housing
housing
Prior art date
Application number
PCT/CN2014/078113
Other languages
English (en)
French (fr)
Inventor
赵依军
Original Assignee
Zhao Yijun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhao Yijun filed Critical Zhao Yijun
Publication of WO2014187335A1 publication Critical patent/WO2014187335A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Definitions

  • LED wick and LED bulb comprising the same
  • the present invention relates to semiconductor lighting technology, and more particularly to an LED wick that integrates a heat sink and a light source module, and an LED bulb including the LED wick. Background technique
  • LEDs As a new type of light source, light-emitting diodes (LEDs) are widely used in various aspects of lighting because of their energy saving, environmental protection, long life and small size.
  • LED is a solid-state semiconductor device capable of converting electrical energy into visible light. Its basic structure generally includes a leaded support, a semiconductor wafer disposed on the support, and an encapsulating material (such as fluorescent silicone or epoxy) that seals the periphery of the wafer. ).
  • the semiconductor wafer includes a PN structure. When a current passes, electrons are pushed toward the P region. In the P region, electrons and holes recombine, and then energy is emitted in the form of photons, and the wavelength of the light is determined by the material forming the PN structure. .
  • Synjet® a fluidizer
  • Synjet® which internally includes a diaphragm that, when vibrated, generates airflow inside the device and quickly jets through the nozzle to the heat sink. The jetted air moves the surrounding air together to the vicinity of the radiator, thereby carrying away the heat of the radiator with high heat exchange efficiency.
  • SynJet® ejector see, for example, U.S. Patent Application Serial No. 12/288,144, filed on Jan. 16, 2008. This patent application is hereby incorporated by reference in its entirety in its entirety in its entirety in its entirety in its entirety.
  • An object of the present invention is to provide an LED wick which has the advantages of a structural unit and a high heat dissipation capability.
  • a heat dissipating housing made of a ceramic material or a thermally conductive insulating polymer composite material and having a through hole at a top or near top portion and a region away from the top portion;
  • One or more light emitting modules each including a substrate and an LED unit formed on the substrate, the substrate being disposed on a top portion of the heat dissipation housing and/or a region near the top, thereby being on top of the heat dissipation housing A thermal gradient is formed between the regions remote from the top.
  • the flow medium such as air or an inert gas can form a circulating flow path through the through hole formed in the heat dissipation housing, which helps to transfer heat from the top of the heat dissipation housing to other areas, thereby improving Cooling efficiency.
  • the ceramic material is a normal temperature infrared ceramic radiation material.
  • the outer surface of the heat dissipation housing is coated with a normal temperature infrared ceramic radiation material or graphite.
  • the normal temperature infrared ceramic radiation material is selected from at least one of the following materials: magnesium oxide, aluminum oxide, calcium oxide, titanium oxide, silicon oxide, chromium oxide, iron oxide, manganese oxide, Zirconium oxide, cerium oxide, cordierite, mullite, boron carbide, silicon carbide, titanium carbide, molybdenum carbide, tungsten carbide, zirconium carbide, niobium carbide, boron nitride, aluminum nitride, silicon nitride, zirconium nitride, Titanium nitride, titanium silicide, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.
  • the through hole is circumferentially opened on a side wall away from the top portion around a central axis of the heat dissipation housing.
  • the substrate is a ceramic substrate, an aluminum substrate or a flexible circuit board.
  • the LED unit is an LED dies formed on the substrate by a bonding process or a flip chip process on a board.
  • the LED unit is an LED unit formed on the substrate by soldering.
  • the light emitting module further includes a reflective film covering the substrate and exposing the LED unit.
  • the light emitting module further comprising an LED driving power source located inside the heat dissipation housing and electrically connected to the light emitting module.
  • LED wick further comprising an infrared radiation fiber material filled in the inner cavity of the heat dissipation housing.
  • Still another object of the present invention is to provide an LED bulb which has the advantages of a structural unit and a high heat dissipation capability.
  • a base that is coupled to the base to form a cavity
  • LED wick including:
  • a heat dissipating housing made of a ceramic material or a thermally conductive insulating polymer composite material and fixed to the joint portion of the lamp cover and the lamp cap, the top portion of the heat dissipating housing or the region near the top and the region away from the top portion are opened Hole;
  • One or more light emitting modules each including a substrate and an LED unit formed on the substrate, the substrate being disposed at a top of the heat dissipating housing and/or near a top portion so as to be on top of the heat dissipating housing Forming a thermal gradient with a region remote from the top;
  • An LED driving power source is located inside or inside the heat dissipation housing and is electrically connected to the light source module.
  • the surface of the lamp is coated with a normal temperature infrared ceramic radiation material.
  • Figure 1 is an exploded perspective view of an LED bulb according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the LED bulb shown in FIG. 1.
  • FIG. 3 is an exploded perspective view of an LED bulb according to another embodiment of the present invention.
  • 4 is a schematic view of an illuminator in the LED bulb shown in FIG. 3.
  • FIG. 5 is a cross-sectional view of an LED bulb in accordance with another embodiment of the present invention. List of reference numbers:
  • semiconductor wafer means halfway unless otherwise stated.
  • semiconductor wafer or die refers to such a single circuit
  • packaged chip refers to a semiconductor wafer. After the packaged physical structure, in a typical such physical structure, the semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • LED unit refers to a unit comprising an electroluminescent material, examples of which include, but are not limited to, P-N junction inorganic semiconductor LEDs and organic LEDs (OLED and polymer LEDs (PLED)).
  • the P-N junction inorganic semiconductor LEDs can have different structural forms including, for example, but not limited to, LED dies and LED cells.
  • LED die refers to a semiconductor wafer having a PN structure and having electroluminescence capability
  • LED monomer refers to a physical structure formed by encapsulating a die, in a typical such physics In the structure, the die is mounted, for example, on a bracket and encapsulated with a sealing material.
  • wiring refers to conductive patterns disposed on an insulating surface for electrical connection between components, including but not limited to traces and holes (eg pads, Component holes, fastening holes, metallized holes, etc.).
  • traces and holes eg pads, Component holes, fastening holes, metallized holes, etc.
  • thermo radiation refers to the phenomenon that an object radiates electromagnetic waves due to its temperature.
  • thermal conduction refers to the way heat is transferred from a higher temperature part to a lower temperature part in a solid.
  • thermal convection refers to the phenomenon in which heat is transferred from one place to another by the flow of the medium.
  • ceramic material generally refers to non-metallic inorganic materials that require high temperature treatment or densification, including but not limited to silicates, oxides, carbides, nitrides, sulfides, borides, and the like.
  • thermally conductive insulating polymer composite material refers to a polymer material which has a high thermal conductivity by forming a thermally conductive network chain inside a metal or inorganic filler filled with a high thermal conductivity.
  • the thermally conductive insulating polymer composite material includes, for example, but not limited to, a polypropylene material to which alumina is added, a polycarbonate to which alumina, silicon carbide, and cerium oxide are added, and an acrylonitrile-butadiene-styrene terpolymer.
  • thermally insulating polymer composites can be found in Li Li et al., "Study of the polycarbonate and polycarbonate alloy thermally insulating polymer material” ( “Heat Treatment of Materials” August 2007, Vol. 28, No.4, pp51-54) and Li Shui et al., “Application of Alumina in Thermal Conductive Insulating Polymer Composites”("PlasticAdditives", 2008, No. 3, ppl4-16), these documents It is included in this specification by way of full reference.
  • the term “infrared radiation material” refers to a material that is engineered to absorb heat and emit a large amount of infrared light, which has a high emissivity.
  • infrared radiation materials include, for example, but are not limited to, graphite and room temperature infrared ceramic radiation materials.
  • the room temperature infrared ceramic radiation material includes, for example but not limited to, at least one of the following materials: magnesium oxide, aluminum oxide, calcium oxide, titanium oxide, silicon oxide, chromium oxide, iron oxide, manganese oxide, zirconium oxide, cerium oxide.
  • cordierite, mullite boron carbide, silicon carbide, titanium carbide, molybdenum carbide, tungsten carbide, zirconium carbide, tantalum carbide, boron nitride, aluminum nitride, silicon nitride, zirconium nitride, titanium nitride, silicidation Titanium, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.
  • an infrared radiation material below the PN junction temperature of the set LED unit (for example, a temperature value in the range of 50-80 degrees Celsius), infrared radiation The material still has a high emissivity (eg greater than or equal to 70%).
  • Electrodes and “coupling” are to be understood to include situations in which electrical energy or electrical signals are transmitted directly between two units, or in the case of indirect transmission of electrical or electrical signals via one or more third units.
  • Drive Power or “LED Drive Power” means an “electronic control device” between an alternating current (AC) or direct current (DC) power source connected to the outside of the luminaire and an LED as a light source to provide the LEDs with the required Current or voltage (eg constant current, constant voltage or constant power, etc.).
  • AC alternating current
  • DC direct current
  • One or more components in the drive power source are implemented in the form of a wafer or packaged chip, and the components in the form of a wafer or packaged chip in the drive power source are hereinafter referred to as "drive controllers".
  • the driving power source can be implemented in a modular structure, for example, comprising a printed circuit board and one or more components disposed on the printed circuit board and electrically connected together by wiring, examples of which include However, it is not limited to LED driver controller chips, rectifier chips, resistors, capacitors, diodes, transistors, and turns.
  • circuits for implementing other functions such as a dimming control circuit, a sensing circuit, a power factor correction circuit, an intelligent lighting control circuit, a communication circuit, and a protection circuit, may also be integrated in the driving power source.
  • circuits can be integrated in the same way as the drive controller Within the semiconductor wafer or packaged chip, or these circuits may be provided separately in the form of a semiconductor wafer or packaged chip, or some or all of these circuits may be combined and provided in the form of a semiconductor wafer or packaged chip.
  • object A is placed on object B
  • object B should be broadly understood to mean that object A is placed directly on the surface of object B, or that object A is placed on the surface of other objects that are in contact with object B.
  • Figure 1 is an exploded perspective view of an LED bulb according to an embodiment of the present invention.
  • 2 is a schematic cross-sectional view of the LED bulb shown in FIG. 1.
  • the LED bulb 1 mainly includes a lamp army 10, a lamp cap 20, and an LED wick 30 having an integrated light source module and an LED driving power source.
  • the lamp 10 can be coupled to the base 20 to form a cavity for receiving the LED wick 30.
  • the lamp cover 10 is made of a glass material, the production process of an ordinary incandescent lamp can be used to fix the lower portion thereof to the inner surface of the lamp cap 20.
  • the lampshade 10 can be made of a transparent or translucent material (such as glass or plastic), and the inner or outer surface can be sanded in order to make the light softer and more evenly diverge toward the space.
  • a layer of infrared radiation material may be formed on the inner/outer surface of the globe 10, for example by electrostatic spraying or vacuum spraying, which enhances on the one hand.
  • the heat dissipation capability of the Lights 10 also suppresses or eliminates the glare effect of the LEDs.
  • the base 20 provides an interface for the LED wick 30 to be electrically coupled to an external power source, such as various DC or AC power sources, for example in the form of a threaded or rotary bayonet similar to conventional incandescent and energy efficient lamps.
  • an external power source such as various DC or AC power sources, for example in the form of a threaded or rotary bayonet similar to conventional incandescent and energy efficient lamps.
  • the end portion 210 of the cap 20 is made of a conductive material such as metal, and at least a portion of the side wall 220 is made of a metal material, so that the metal material of the end portion 210 and the side wall 220 can be made.
  • Area as a first electrode connection region and a second electrode connection region.
  • An insulating portion 230 (made, for example, of an insulating material such as plastic) is located between the end portion 210 and the side wall 220 to separate the two electrode connection regions.
  • a common illumination line generally includes two wires of a live wire and a neutral wire.
  • the end portion 210 and the side wall 220 may serve as the first and second electrode connection regions through the lamp holder in consideration of the safety of use (not drawn The electrodes of the output are connected to the live and neutral wires, respectively.
  • the metal material for the side wall 220 may be a copper-based alloy containing at least one of the following elements: zinc, aluminum, lead, tin, manganese, nickel, iron, and silicon.
  • the use of the above copper-based alloy can improve the corrosion resistance, so that the service life of the lamp cap is matched with the working life of the LED light source, and the above copper-based alloy can also improve the processing performance.
  • the side walls 220 are entirely composed of a metal material. Further, as shown in Figs. 1 and 2, the outer surface of the side wall 220 is provided with a thread.
  • the LED wick 30 includes a heat dissipation housing 310, a light source module 320, and an LED driving power source 330.
  • the upper end of the heat dissipation housing 310 is narrowed and cylindrical, and its surface is provided with a light source module 320 which will be further described below.
  • the internal space of the heat dissipation housing 310 is divided into two by the partition 311, and the lower half thereof is adapted to accommodate the LED driving power source 330.
  • the lower end of the heat sink housing 310 can be secured to the bottom of the base 20 by means of an adhesive such as glue or epoxy.
  • the lower end of the heat dissipation housing 310 is formed at a position close to the opening of the lamp cap 20 to accommodate the open end of the lamp cover 10.
  • the lamp cover 10, the lamp cap 20 and the heat dissipation housing 310 can be assembled into a state as shown in FIG. Adhesives such as cement hold the three together. Further, as shown in Figures 1 and 2, the outer surface of the heat dissipation housing 310 includes a plurality of ribs to increase the heat dissipation area.
  • the output leads 333A and 333B of the LED driving power source 330 extend upward in the heat dissipation housing 310 to the top of the heat dissipation housing and are electrically connected to the light source module 320.
  • the heat dissipating housing 310 may be entirely composed of an insulating and thermally conductive material (for example, ceramic or thermally conductive insulating polymer composite material), but it is also feasible and beneficial to form only a part of the insulating and thermally conductive material (for example, when a small amount of insulating and thermally conductive material is used, the heat can be satisfied.
  • the entire outer surface of the heat dissipation housing 310 may be covered with an infrared radiation material (for example, a normal temperature infrared ceramic radiation material such as silicon carbide).
  • the heat dissipation housing 310 may be entirely composed of an infrared radiation material.
  • the heat sink housing 310 may only be partially constructed of infrared radiation material.
  • the inner cavity of the heat dissipation housing 310 may be filled with an infrared radiation fiber material to further improve heat dissipation capability.
  • a through hole 312 is defined in a side wall of the heat dissipation housing 310 near the top (that is, a side surface of the columnar upper end), and at the same time, a sidewall of the heat dissipation housing that is far from the top is opened.
  • a plurality of through holes 312 and 313 are uniformly formed on the side wall around the central axis of the heat dissipation housing 310.
  • the LED bulb 1 is generally inverted (ie, the cap 20 is above and the cap 10 is below) such that the position of the through hole 313 is higher than the position of the through hole 312, thus entering the heat sink from the through hole 312.
  • the flow medium for example, air or inert gas
  • the flow medium inside the 310 is heated near the top portion and then rises up to the periphery of the through hole 313, and then flows out through the through hole 313 to the heat dissipation case 310 and further flows into the heat dissipation case 310 through the through hole 312, thereby forming The path through which the medium circulates.
  • the heat generated by the light source module 320 is carried along the top of the discrete thermal housing 310, which increases the heat dissipation capability of the heat sink housing.
  • the through hole 312 can also be formed on the top of the heat dissipating casing, or at the same time on the top and the side wall near the top, and can also form a path through which the medium circulates.
  • the light source module 320 includes a substrate 321 and an LED unit 322.
  • the light source module 320 includes a plurality of substrates 321, which are disposed on the outer surface of the upper end of the heat dissipation housing 310, such as the top surface and the side surface of the upper end. .
  • the heat generated by the LED unit 322 can be transferred to the heat dissipation housing 310 via the substrate 321 .
  • the substrate 321 may be made of an insulating heat conductive material (for example, a ceramic material or a thermally conductive insulating polymer composite material) or an infrared radiation material (for example, silicon carbide) having both insulating and heat conducting properties, or a printed circuit board material such as an aluminum substrate.
  • a flexible circuit board can also be used.
  • a substrate made of a ceramic material can be produced by a die pressing method, and the substrate produced by this method is thick (e.g., 1.5 - 3 mm) and has a high hardness.
  • the substrate 321 may be bonded to the outer surface of the heat dissipation housing 310 by means of a thermal conductive adhesive.
  • the LED units 322 are in the form of a die which are disposed on the surface of the substrate 321 by adhesion to form better heat conduction between the LED unit 322 and the substrate 321.
  • the wiring layer on the surface of the substrate contains a plurality of pads and traces.
  • the LED unit 322 is directly connected to the pads by wires such as gold wires, silver wires or alloy wires to form a series of LEDs.
  • the LED die can be connected to the wiring via a bonding process.
  • the groups of LEDs between different substrates can be connected together in series or in parallel by means of wiring or leads.
  • the LED unit 322 may be adhered to the surface of the substrate 321 with epoxy or silica gel mixed with phosphor, or a fluorescent layer may be coated on the surface of the LED unit 322, and then Epoxy or silica gel is bonded to the surface of the substrate 321.
  • the LED unit 322 in the form of a die is directly connected to the wiring layer by the bonding process in the embodiment shown in FIGS. 1 and 2, the on-board flip chip (FCOB) process can also be utilized.
  • the LED die is electrically connected to the wiring layer.
  • the LED unit 322 can also be in the form of an LED unit in which the LED unit can be electrically connected to the wiring layer on the surface of the substrate by soldering.
  • the light source module 320 may further include a high-reflection film (not shown) covering the surface of the substrate 321 and exposing the LED unit 322 such that the light emitted by the LED unit 322 toward the substrate 321 is reflected.
  • a high-reflection film (not shown) covering the surface of the substrate 321 and exposing the LED unit 322 such that the light emitted by the LED unit 322 toward the substrate 321 is reflected.
  • the LED driving power source 330 is disposed in the lower half of the inner cavity of the heat dissipation housing 310.
  • the LED driving power source 330 includes a printed circuit board 331, one or more components disposed on the printed circuit board and electrically connected together through the wiring thereon, and a pair disposed on the lower surface of the printed circuit board 331.
  • the input leads 332A and 332B and a pair of output leads 333A and 333B provided on the upper surface of the printed circuit board 331.
  • the printed circuit board 331 of the LED driving power source 330 can be fixed to the lower half of the inner cavity of the heat dissipation housing 310 by means of an adhesive such as cement, silicone or epoxy.
  • the input leads 332A and 332B are electrically connected to a first electrode region of the cap (e.g., an end of the cap made of a conductive material) and a second electrode region (e.g., a portion of the cap side made of a conductive material). As shown in FIG. 1, the input lead 332B is folded back upward after extending downward for a period of time. Therefore, when the lamp arm 10, the lamp cap 20 and the heat dissipating case 310 are assembled together, the input lead 322B can extend out of the heat dissipating case 310 and be embedded in the gap between the ridges of the outer surface of the heat dissipating case and abut against the lamp cap 20.
  • the inner side surface is for electrical connection to the second electrode area.
  • the LED driving power source 330 can supply a suitable current or voltage to the light source module 320 in various driving modes such as constant voltage power supply, constant current power supply, and constant voltage constant current power supply. According to the external power supply mode, the LED driving power source 330 can adopt various topology circuits, including but not limited to non-isolated buck topology circuit structure, flyback topology circuit structure, and half bridge LLC topology circuit structure. Wait.
  • FIG. 3 is an exploded perspective view of an LED bulb according to another embodiment of the present invention.
  • the main difference of this embodiment is the structure of the light source module 320 as compared with the embodiment shown above with reference to Figs. To avoid redundancy, the following focuses on aspects that differ from the embodiment shown in Figures 1 and 2.
  • the LED bulb 1 also includes a lamp cover 10, a lamp cap 20, and an LED wick 30.
  • the lamp army 10 and the lamp cap 20 can employ the various features described above that are secured together to form a cavity that can accommodate the LED wick 30.
  • the LED wick 30 also includes a heat dissipation housing 310, a light source module 320, and an LED driving power source 330.
  • the lower end of the heat dissipation housing 310 may be fixed to the bottom of the base 20 by means of an adhesive such as glue or epoxy, which forms a gap at the opening close to the base 20 to accommodate the open end of the cover 10, thus
  • an adhesive such as glue or epoxy
  • through holes 312 and 313 are respectively formed in the top of the heat dissipation case 310 and the side walls of the heat dissipation case which are far from the top.
  • a plurality of through holes 313 are uniformly formed on the side walls around the central axis of the heat dissipation housing 310.
  • the light source module 320 is disposed at the top of the heat dissipation housing 310, and the LED driving power source 330 is disposed at a lower portion of the inner cavity of the heat dissipation housing 310.
  • the light source module 320 includes a substrate 321 and an illuminant 322Ao that will be described in detail with reference to FIG. 4.
  • the substrate 321 is bonded to the top of the heat dissipation housing 310, for example, by means of a thermal paste.
  • a wiring layer 3211 is formed on the substrate 321, and the illuminant 322A is electrically connected to the wiring layer 3211.
  • the output leads 333A and 333B of the LED driving power source 330 can be electrically connected to the wiring layer 3211 on the substrate 321 through the through holes 314A, 314B at the top of the heat dissipation housing 310, thereby supplying power to the illuminator 323.
  • a via hole 3212 is formed in the substrate 321 at a position corresponding to the through hole 312 to enable the medium to flow into the heat dissipation case 310.
  • 4 is a schematic view of an illuminator in the LED bulb of FIG. 3.
  • the illuminant 322A includes an LED unit 322, a frame 323, and a metal carrier 324.
  • Metal carrier 324 includes a first pattern region 3241 and a second pattern region 3242.
  • the first pattern region 3241 functions as an electrode region including a plurality of discrete cells that are not in communication with each other and with the second pattern region 3242 as an electrical connection region between the LED unit 322 and the wiring layer 3221 on the substrate 321 .
  • the region of the first pattern region 3241 extending from the frame 324 is electrically connected to the wiring layer 3211 on the surface of the substrate 321, so as to be connected to the LED driving power source 330 located inside the heat dissipation housing 310 via the wiring 3211 layer.
  • the LED units 322 are in the form of a die which are fixed to the second pattern region 3242 by, for example, a die bonding process.
  • the thermal resistance between the LED unit 322 and the second pattern region 324 due to the good thermal conductivity of the metal. It is close to zero, so the heat generated by the former can be efficiently transmitted to the substrate 321.
  • the frame 323 is made of an insulating material which is fixed to the metal carrier 324 by, for example, an injection molding process, and surrounds the LED unit 322 therein. Since the first and second pattern regions 3241 and 3242 are both fixed to the frame 323, their relative positional relationship is fixed. Referring to Fig. 4, the LED units 322 are interconnected by a line 325 and connected to the first pattern area 3241.
  • an electronic paste pattern (for example, silver paste) may be printed on the surface of the substrate 321 , the pattern corresponding to the wiring layer 3211 and the area in contact with the first and second pattern regions 3241, 3242 (hereinafter also referred to as For the contact area). Then, by high-temperature sintering, a wiring layer 3211 and a contact region are formed on the surface of the substrate. Finally, the first and second pattern regions of the metal carrier 324 are fixed to the contact regions on the surface of the substrate 321 by heat fusion.
  • the metal plate 324 is made of a material such as copper or aluminum.
  • a metal layer having a lower melting point for example, tin
  • LED units 322 are here connected together in a hybrid manner, other forms of connection such as series, parallel or cross arrays may be employed.
  • the substrate in the light source module 320 can be omitted.
  • the wavelength change can be achieved by utilizing the photoluminescence effect of the fluorescent material.
  • the silica gel of the mixed phosphor for example, yttrium aluminum garnet (YAG) phosphor
  • YAG yttrium aluminum garnet
  • the LED driving power source is disposed inside the heat dissipating casing as a constituent unit of the LED wick, such an arrangement is not essential.
  • the LED driving power source can be disposed in the lamp cap as a separate component from the LED wick.
  • Figure 5 is a cross-sectional view showing an LED bulb according to another embodiment of the present invention.
  • the main difference of this embodiment is the manner in which the LED driving power source 330 is disposed, as compared with the embodiment shown in Figs. 1 and 2 described above.
  • the following focuses on aspects different from the embodiment shown in Figs.
  • the LED bulb 1 includes a lamp body 10, a lamp cap 20, and an LED wick 30 located in a cavity defined by the lamp cover 10 and the lamp cap 20.
  • the LED wick 30 herein does not include the LED driving power source 330.
  • the lower end of the heat dissipation housing 310 can be fixed to the inner side of the base 20 by means of an adhesive such as glue or epoxy.
  • the LED driving power source 330 is disposed in the base 20 and below the heat dissipation housing 310.
  • the LED driving power source 330 includes a printed circuit board 331, a component disposed on the printed circuit board 331, a pair of input leads 332A and 332B disposed on the lower surface of the printed circuit board 331, and a pair disposed on the printed circuit.
  • Output leads 333A and 333B on the upper surface of the board 331.
  • the side surface of the printed circuit board 331 is fixed to the inner side surface of the base 20.
  • the fixing of the printed circuit board 331 can be achieved by applying and curing an adhesive such as cement, silicone or epoxy on the side of the printed circuit board 331 or the inner side of the lamp cap.
  • the printed circuit board may be otherwise fixed to the inside of the lamp cap.
  • the substrate can be fixed to the bottom of the base by means of an adhesive or a screw.
  • the input leads 332A and 332B are in the form of wires, wherein the input leads 332A extend downwardly to electrically connect with the first electrode region of the cap 20 (eg, the end of the cap made of a conductive material).
  • the input lead 332B extends downward from the printed circuit board 331 and then folds back up against the inner side of the base to electrically connect with the second electrode area of the base (e.g., the portion of the base on which the side of the base is made of a conductive material).
  • the output leads 333A and 333B are electrically connected to the wiring layer on the substrate 321 through the through holes 314 at the top of the heat dissipation case 310. While some aspects of the present invention have been shown and described, it will be appreciated by those skilled in the art that Equivalent content is limited.

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Abstract

一种LED球泡灯（1），包括：灯罩（10）；灯头（20），其与所述灯罩（10）接合在一起以形成空腔；LED灯芯（30），包括：散热壳体（310）,其由陶瓷材料或导热绝缘高分子复合材料制成并且固定于所述灯罩（10）与灯头（20）的接合部分，所述散热壳体（310）的顶部或靠近顶部的区域以及远离所述顶部的区域开设通孔（312，313）；以及一个或多个发光模块（320）,每个包括基板（321）和形成于所述基板（321）上的LED单元（322）,所述基板（321）被设置在所述散热壳体（310）的顶部和/或靠近顶部的区域，从而在散热壳体（310）的顶部与远离所述顶部的区域之间形成热梯度；LED驱动电源（330），其位于所述散热壳体（310）内部或灯头（20）内部并且与所述发光模块（320）电气连接。

Description

LED灯芯和包含其的 LED球泡灯 技术领域
本发明涉及半导体照明技术， 特别涉及将散热器和光源模块集成 在一起的 LED灯芯以及包含该 LED灯芯的 LED球泡灯。 背景技术
发光二极管 （LED )作为一种新型的光源， 具有节能、 环保、 寿 命长、 体积小等特点， 正在被广泛应用于照明领域的各个方面。 LED 是一种能够将电能转换为可见光的固态半导体器件， 其基本结构一般 包括带引线的支架、 设置在支架上的半导体晶片以及将该晶片四周密 封起来的封装材料（例如荧光硅胶或环氧树脂） 。 上述半导体晶片包 含有 P-N结构， 当电流通过时， 电子被推向 P区， 在 P区里电子与空 穴复合， 然后以光子的形式发出能量， 而光的波长则由形成 P-N结构 的材料决定。
LED在工作过程中， 仅有一部分电能被转换为光能， 其余部分都 转换成为热能， 从而导致 LED的温度升高， 这是其性能劣化和失效的 主要原因。 在大功率 LED照明装置中， 如何高效、 及时地将 LED产 生的热量散发到照明装置外部的问题显得尤为突出。
美国德克萨斯州的 Nuventix公司最近研发了一种称为 Synjet®的 射流器， 该装置内部包括一个隔膜， 当该隔膜振动时， 气流产生于装 置内部并且通过喷嘴向散热器快速喷射。 喷射的气流带动周围的空气 一起到达散热器附近，从而以很高的热交换效率将散热器的热量带走。 有关 SynJet®射流器的进一步描述例如可参见 John Stanley Booth等人 于 2008年 10月 16日提交的题为 "带多个 LED和合成喷射热管理系 统的灯具"的美国专利申请 No. 12/288144,该专利申请作为参考文献， 以全文引用的方式包含在本申请中。
但是需要指出的是， 上述主动散热方式需要提供额外的能量驱动 散热装置工作， 而且导致高昂的制造成本和复杂的灯具结构。 发明内容
本发明的一个目的是提供一种 LED灯芯， 其具有结构筒单、 散热 能力强的优点。
按照本发明一个实施例的 LED灯芯包括：
散热壳体， 其由陶瓷材料或导热绝缘高分子复合材料制成并且在 顶部或靠近顶部的区域以及远离所述顶部的区域开设通孔； 以及
一个或多个发光模块， 每个包括基板和形成于所述基板上的 LED 单元， 所述基板被设置在所述散热壳体的顶部和 /或靠近顶部的区域， 从而在散热壳体的顶部与远离所述顶部的区域之间形成热梯度。
在上述实施例中， 诸如空气或惰性气体之类的流动介质可以通过 开设在散热壳体上的通孔形成循环流动的路径， 有助于将散热壳体顶 部的热量转移到其它区域， 从而提高散热效率。
优选地， 在上述 LED灯芯中， 所述陶瓷材料为常温红外陶瓷辐射 材料。
优选地， 在上述 LED灯芯中， 所述散热壳体的外表面上涂覆常温 红外陶瓷辐射材料或石墨。
优选地， 在上述 LED灯芯中， 所述常温红外陶瓷辐射材料选自下 列材料中的至少一种： 氧化镁、 氧化铝、 氧化钙、 氧化钛、 氧化硅、 氧化铬、 氧化铁、 氧化锰、 氧化锆、 氧化钡、 堇青石、 莫来石、 碳化 硼、 碳化硅、 碳化钛、 碳化钼、 碳化钨、 碳化锆、 碳化钽、 氮化硼、 氮化铝、 氮化硅、 氮化锆、 氮化钛、 硅化钛、 硅化钼、 硅化钨、 硼化 钛、 硼化锆和硼化铬。
优选地， 在上述 LED灯芯中， 所述通孔围绕所述散热壳体的中心 轴均勾地开设在远离所述顶部的侧壁上。
优选地， 在上述 LED灯芯中， 所述基板为陶瓷基板、 铝基板或柔 性电路板。
优选地， 在上述 LED灯芯中， 所述 LED单元为 LED管芯， 其通 过绑定工艺或板上倒装芯片工艺形成于所述基板上。
优选地， 在上述 LED灯芯中， 所述 LED单元为 LED单体， 其通 过焊接方式形成于所述基板上。
优选地， 在上述 LED灯芯中， 所述发光模块进一步包含反射膜， 其覆盖在所述基板上并且使所述 LED单元露出。 优选地， 在上述 LED灯芯中， 进一步包括 LED驱动电源， 其位 于所述散热壳体内部并且与所述发光模块电气连接。
优选地， 在上述 LED灯芯中， 进一步包括填充在所述散热壳体内 腔的红外辐射纤维材料。
本发明的还有一个目的是提供一种 LED球泡灯，其具有结构筒单、 散热能力强的优点。
按照本发明一个实施例的 LED球泡灯包括：
灯軍；
灯头， 其与所述灯头接合在一起以形成空腔；
LED灯芯， 包括：
散热壳体， 其由陶瓷材料或导热绝缘高分子复合材料制成并 且固定于所述灯罩与灯头的接合部分，所述散热壳体的顶部或靠近 顶部的区域以及远离所述顶部的区域开设通孔； 以及
一个或多个发光模块， 每个包括基板和形成于所述基板上的 LED单元， 所述基板被设置在所述散热壳体的顶部和 /或靠近顶部 的区域，从而在散热壳体的顶部与远离所述顶部的区域之间形成热 梯度；
LED驱动电源， 其位于所述散热壳体内部或灯头内部并且与所述 光源模块电气连接。
优选地， 在上述 LED球泡灯中， 所述灯軍表面涂覆常温红外陶瓷 辐射材料。 附图说明
本发明的上述和 /或其它方面和优点将通过以下结合附图的各个方 面的描述变得更加清晰和更容易理解， 附图中相同或相似的单元采用 相同的标号表示， 附图包括：
图 1为按照本发明一个实施例的 LED球泡灯的分解示意图。
图 2为图 1所示 LED球泡灯的剖面示意图。
图 3为按照本发明另一个实施例的 LED球泡灯的分解示意图。 图 4为图 3所示 LED球泡灯中的发光体的示意图。
图 5为按照本发明另一个实施例的 LED球泡灯的剖面示意图。 附图标号列表：
1 LED球泡灯灯
10 灯軍
20 灯头
210端部
220 侧壁
230 绝缘部分
310散热壳体
311 隔板
312、 313 通孔
314、 314A、 314B 贯通孔
320 光源模块
321 基板
3211 布线层
3212 过孔
322 LED单元
322A 发光体
323 框架
324 金属载板
3241 第一图案区域
3242 第二图案区域
325 引线
330 LED驱动电源
331 印刷电路板
332A、 332B 输入引线
333A, 333B 输出引线 具体实施方式
下面参照其中图示了本发明示意性实施例的附图更为全面地说明 本发明。 但本发明可以按不同形式来实现， 而不应解读为仅限于本文 给出的各实施例。
在本说明书中， 除非特别说明， 术语 "半导体晶圆" 指的是在半 导体材料（例如硅、 砷化镓等）上形成的多个独立的单个电路， "半 导体晶片" 或 "晶片 （die ) " 指的是这种单个电路， 而 "封装芯片" 指的是半导体晶片经过封装后的物理结构，在典型的这种物理结构中， 半导体晶片例如被安装在支架上并且用密封材料封装。
术语 "LED单元" 指的是包含电致发光材料的单元， 这种单元的 例子包括但不限于 P-N结无机半导体 LED和有机 LED ( OLED和聚 合物 LED ( PLED ) ) 。
P-N结无机半导体 LED可以具有不同的结构形式， 例如包括但不 限于 LED管芯和 LED单体。 其中， "LED管芯" 指的是包含有 P-N 结构的、 具有电致发光能力的半导体晶片， 而 "LED单体" 指的是将 管芯封装后形成的物理结构， 在典型的这种物理结构中， 管芯例如被 安装在支架上并且用密封材料封装。
术语 "布线" 、 "布线图案" 和 "布线层" 指的是在绝缘表面上 布置的用于元器件间电气连接的导电图案， 包括但不限于走线（ trace ) 和孔（如焊盘、 元件孔、 紧固孔和金属化孔等） 。
术语 "热辐射" 指的是物体由于具有温度而辐射电磁波的现象。 术语 "热传导" 指的是热量在固体中从温度较高的部分传送到温 度较低的部分的传递方式。
术语 "热对流" 指的是热量借助介质的流动， 由空间的一处传递 至另一处的现象。
术语 "陶瓷材料" 泛指需高温处理或致密化的非金属无机材料， 包括但不限于硅酸盐、 氧化物、 碳化物、 氮化物、 硫化物、 硼化物等。
术语 "导热绝缘高分子复合材料"指的是这样的高分子材料， 通 过填充高导热性的金属或无机填料在其内部形成导热网链， 从而具备 高的导热系数。 导热绝缘高分子复合材料例如包括但不限于添加氧化 铝的聚丙烯材料、 添加氧化铝、 碳化硅和氧化铋的聚碳酸酯和丙烯腈- 丁二烯-苯乙烯三元共聚物等。 有关导热绝缘高分子复合材料的具体描 述可参见李丽等人的论文 "聚碳酸酯及聚碳酸酯合金导热绝缘高分子 材料的研究" (《材料热处理学报》 2007年 8月， Vol. 28, No.4, pp51-54 ) 和李水等人的论文"氧化铝在导热绝缘高分子复合材料中的应用" (《塑 料助剂》 2008年第 3期， ppl4-16 ) ， 这些文献以全文引用的方式包含 在本说明书中。 术语 "红外辐射材料" 指的是在工程上能够吸收热量而发射大量 红外线的材料， 其具有较高的发射率。 红外辐射材料的例子例如包括 但不限于石墨和常温红外陶瓷辐射材料。 进一步地， 常温红外陶瓷辐 射材料例如包括但不限于下列材料中的至少一种： 氧化镁、 氧化铝、 氧化钙、 氧化钛、 氧化硅、 氧化铬、 氧化铁、 氧化锰、 氧化锆、 氧化 钡、 堇青石、 莫来石、 碳化硼、 碳化硅、 碳化钛、 碳化鉬、 碳化钨、 碳化锆、 碳化钽、 氮化硼、 氮化铝、 氮化硅、 氮化锆、 氮化钛、 硅化 钛、 硅化钼、 硅化钨、 硼化钛、 硼化锆和硼化铬。 有关红外陶瓷辐射 材料的详细描述可参见李红涛和刘建学等人的论文 "高效红外辐射陶 瓷的研究现状及应用" （ 《现代技术陶瓷》 2005年第 2期 （总第 104 期）， pp24-26 )和王黔平等人的论文 "高辐射红外陶瓷材料的研究进 展及应用" （ 《陶瓷学报》 2011年第 3期） ， 这些文献以全文引用的 方式包含在本说明书中。
在本发明中， 比较好的是将下列准则作为选用红外辐射材料的其 中一个考虑因素： 在设定的 LED单元的 P-N结温度（例如 50-80摄氏 度范围内的一个温度值） 以下， 红外辐射材料仍然具有较高的发射率 (例如大于或等于 70% ) 。
"电气连接" 和 "耦合，， 应当理解为包括在两个单元之间直接传 送电能量或电信号的情形， 或者经过一个或多个第三单元间接传送电 能量或电信号的情形。
"驱动电源" 或 "LED驱动电源" 指的是连接在照明装置外部的 交流（AC )或直流（DC ) 电源与作为光源的 LED之间的 "电子控制 装置" ， 用于为 LED提供所需的电流或电压（例如恒定电流、 恒定电 压或恒定功率等） 。 驱动电源中的一个或多个部件以晶片或封装芯片 的形式实现， 以下将驱动电源中以晶片或封装芯片的形式实现的部件 称为 "驱动控制器" 。 在具体的实施方案中， 驱动电源可以模块化的 结构实现， 例如其包含印刷电路板和一个或多个布置在印刷电路板上 并通过布线电气连接在一起的元器件， 这些元器件的例子包括但不限 于 LED驱动控制器芯片、 整流芯片、 电阻器、 电容器、 二极管、 三极 管和线圏等。 可选地， 在驱动电源中还可以集成实现其它功能的电路， 例如调光控制电路、 传感电路、 功率因数校正电路、 智能照明控制电 路、 通信电路和保护电路等。 这些电路可以与驱动控制器集成在同一 半导体晶片或封装芯片内， 或者这些电路可以单独地以半导体晶片或 封装芯片的形式提供， 或者这些电路中的一些或全部可以组合在一起 并以半导体晶片或封装芯片的形式提供。
诸如 "包含" 和 "包括" 之类的用语表示除了具有在说明书和权 利要求书中有直接和明确表述的单元和步骤以外， 本发明的技术方案 也不排除具有未被直接或明确表述的其它单元和步骤的情形。
诸如 "第一" 、 "第二" 、 "第三" 和 "第四" 之类的用语并不 表示单元在时间、 空间、 大小等方面的顺序而仅仅是作区分各单元之 用。
诸如 "物体 A设置在物体 B上" 之类的用语应该广义地理解为将 物体 A直接放置在物体 B的表面，或者将物体 A放置在与物体 B有接 触的其它物体的表面。 以下借助附图描述本发明的实施例。
图 1为按照本发明一个实施例的 LED球泡灯的分解示意图。 图 2 为图 1所示 LED球泡灯的剖面示意图。
按照本实施例的 LED球泡灯 1主要包括灯軍 10、 灯头 20和集成 光源模块和 LED驱动电源的 LED灯芯 30。 参见图 1和 2， 灯軍 10可 与灯头 20接合在一起，从而形成容纳 LED灯芯 30的空腔。 当灯罩 10 由玻璃材料制成时， 可以采用普通白炽灯的生产工艺， 将其下部固定 于灯头 20的内表面。
灯罩 10可采用透明或半透明材料（例如玻璃或塑料）制成， 为了 使光线更柔和、 更均勾地向空间发散， 其内表面或外表面可进行磨砂 处理。 可选地， 可以例如通过静电喷涂或真空喷镀工艺， 在灯罩 10的 内 /外表面形成红外辐射材料层（例如包括但不限于石墨或常温红外陶 瓷材料等）， 这种处理一方面增强了灯軍 10的散热能力， 另外也抑制 或消除了 LED的眩光效应。
灯头 20为 LED灯芯 30提供了与外部电源（例如各种直流电源或 交流电源） 电气连接的接口， 其例如可采用与普通白炽灯和节能灯类 似的螺紋状旋接口或旋转卡口等形式。 参见图 1和 2, 灯头 20的端部 210由诸如金属之类的导电材料制成，侧壁 220的至少一部分由金属材 料制成， 因此可以将端部 210和侧壁 220的金属材料制成的区域作为 第一电极连接区和第二电极连接区。绝缘部分 230 (例如由塑料之类的 绝缘材料制成）位于端部 210与侧壁 220之间以将这两个电极连接区 隔开。 普通的照明线路一般包含火线和零线两根电线， 在本实施例中， 考虑到使用的安全性， 端部 210和侧壁 220作为第一和第二电极连接 区可以经灯座（未画出） 的电极被分别连接至火线和零线。
在本实施例中， 用于侧壁 220的金属材料可以采用包含下列至少 一种元素的铜基合金： 锌、 铝、 铅、 锡、 锰、 镍、 铁和硅。 采用上述 铜基合金可以提高耐腐蚀能力，从而使得灯头的使用寿命与 LED光源 的工作寿命匹配， 此外上述铜基合金也可改善加工性能。 为了扩大散 热面积， 比较好的是使侧壁 220全部由金属材料构成。 此外， 如图 1 和 2所示， 侧壁 220的外表面开设有螺紋。
在本实施例中， LED灯芯 30包括散热壳体 310、 光源模块 320和 LED驱动电源 330。
参见图 1和 2，散热壳体 310的上端收窄并且呈柱状，其表面设置 有下面将要作进一步描述的光源模块 320。 如图 2所示， 散热壳体 310 的内部空间由隔板 311—分为二，其中的下半部分适于容纳 LED驱动 电源 330。 散热壳体 310的下端可借助粘合剂 （例如胶泥或环氧树脂） 固定于灯头 20的底部。 参见图 2， 散热壳体 310的下端在靠近灯头 20 的开口处形成可容纳灯罩 10开口端的空隙，可以通过将灯罩 10、灯头 20和散热壳体 310装配成如图 2所示的状态并借助胶泥之类的粘合剂 将三者固定在一起。 此外， 如图 1和 2所示， 散热壳体 310的外表面 包含多条凸条以增加散热面积。 LED驱动电源 330的输出引线 333A 和 333B在散热壳体 310内向上延伸至散热壳体的顶部并且与光源模块 320电气连接。
散热壳体 310可全部由绝缘导热材料（例如陶瓷或导热绝缘高分 子复合材料）构成， 但是仅仅一部分由绝缘导热材料构成也是可行的 和有益的 （例如当采用少量绝缘导热材料就能够满足将热量传导给红 外辐射材料的需求并且需要降低材料成本时） 。 另外， 散热壳体 310 的整个外表面可以覆盖红外辐射材料（例如诸如碳化硅之类的常温红 外陶瓷辐射材料） 。 可选地， 也可以仅在散热壳体 310的一部分表面 覆盖红外辐射材料。 如果红外辐射材料同时具有较好的绝缘导热性能 (例如碳化硅材料）， 则散热壳体 310可以全部由红外辐射材料构成。 或者可选地， 散热壳体 310可以仅仅一部分由红外辐射材料构成。 可选地， 散热壳体 310的内腔可以填充红外辐射纤维材料以进一 步提高散热能力。
如图 1和 2所示， 在散热壳体 310靠近顶部的侧壁 （也即柱状上 端的侧面）开设有通孔 312， 与此同时， 在与顶部相距较远的散热壳体 侧壁上开设有通孔 313。优选地， 多个通孔 312和 313均围绕散热壳体 310的中心轴均匀地开设在侧壁上。 在 LED球泡灯 1工作时， 安装在 散热壳体 310上部的光源模块 320所产生的热量导致在顶部与开设通 孔 313的侧壁之间形成热梯度。 在实际使用时， LED球泡灯 1一般是 倒置的 （也即灯头 20在上而灯罩 10在下） ， 使得通孔 313的位置高 于通孔 312的位置， 因此从通孔 312进入散热壳体 310内部的流动介 质 （例如空气或惰性气体）在顶部附近被加热后将上升至通孔 313周 围， 随后经通孔 313流出散热壳体 310并且进而经通孔 312流入散热 壳体 310， 从而形成介质循环流动的路径。 在该循环流动过程中， 光源 模块 320产生的热量被带离散热壳体 310的顶部， 这提高了散热壳体 的散热能力。
需要指出的是， 通孔 312也可以开设在散热壳体的顶部， 或者同 时开设在顶部和靠近顶部的侧壁上， 同样也可形成介质循环流动的路 径。
光源模块 320包括基板 321和 LED单元 322。 在本实施例中， 为 了实现大角度发光，如图 1和 2所示，光源模块 320包括多块基板 321， 它们被设置在散热壳体 310上端的外表面， 例如上端的顶表面和侧表 面。 LED单元 322产生的热量可以经基板 321传递至散热壳体 310。 基板 321可以采用绝缘导热材料（例如陶瓷材料或导热绝缘高分子复 合材料等）或兼具绝缘导热能力的红外辐射材料（例如碳化硅）制成， 也可以采用铝基板之类的印刷电路板材料制成， 还可以采用柔性电路 板。 优选地， 可以采用模具压制法来制作陶瓷材料构成的基板， 这种 方法制造的基板较厚（例如 1.5-3mm )并且硬度高。 在本实施例中， 基板 321可以借助导热胶粘合到散热壳体 310的外表面。
在本实施例中， LED单元 322采用管芯形式， 它们通过粘附方式 设置在基板 321的表面上以在 LED单元 322与基板 321之间形成较好 的热传导。 另一方面， 位于基板表面上的布线层包含多个焊盘和走线， LED单元 322通过引线（例如金丝、 银丝或合金丝）直接连接至焊盘 以形成串联的 LED组。 在本实施例中， 可以利用绑定工艺实现 LED 管芯经引线到布线的连接。 此外， 不同基板之间的 LED组可以借助布 线或引线， 以串联或并联的形式连接在一起。
如果需要调整 LED单元 322的发光波长，可以用混合荧光粉的环 氧树脂或硅胶将 LED单元 322粘附在基板 321的表面上，或者在 LED 单元 322的表面涂覆荧光层， 再将其借助环氧树脂或硅胶粘合到基板 321的表面上。
值得指出的是， 虽然在图 1和 2所示的实施例中利用绑定工艺将 管芯形式的 LED单元 322直接连接到布线层上，但是也可以利用在板 上倒装芯片（FCOB )工艺将 LED管芯与布线层电气连接。此外， LED 单元 322也可以采用 LED单体的形式，此时可以通过焊接方式将 LED 单元电气连接到基板表面的布线层。
可选地， 光源模块 320还可以包含一层高反射膜（未画出） ， 其 覆盖在基板 321表面并且使 LED单元 322露出， 使得 LED单元 322 射向基板 321的光线被反射出去。
如图 2所示， LED驱动电源 330被设置在散热壳体 310内腔的下 半部分。 在本实施例中， LED驱动电源 330包含印刷电路板 331、 一 个或多个布置在印刷电路板上并通过其上的布线电气连接在一起的元 器件、 一对设置在印刷电路板 331下表面的输入引线 332A和 332B以 及一对设置在印刷电路板 331上表面的输出引线 333A和 333B。 可以 借助胶泥、硅胶或环氧树脂之类的粘合剂将 LED驱动电源 330的印刷 电路板 331 固定于散热壳体 310内腔的下半部分。 输入引线 332A和 332B分别与灯头的第一电极区 （例如灯头的由导电材料构成的端部） 和第二电极区 （例如灯头侧面由导电材料构成的部分） 电气连接。 如 图 1所示， 输入引线 332B在向下延伸一段后向上折返。 因此当将灯軍 10、 灯头 20和散热壳体 310装配在一起时， 输入引线 322B可伸出散 热壳体 310后嵌入散热壳体外表面的凸条之间的间隙内并且抵靠住灯 头 20的内侧表面以实现与第二电极区的电气连接。 由于剖取角度的关 系， 输入引线 322B未在图 2所示剖面图中示出。 如图 2所示， 输出引 线 333A和 333B穿过散热壳体 310顶部的贯通孔 314与基板 321上的 布线层电气连接。 LED驱动电源 330可以多种驱动方式（例如恒压供电、 恒流供电 和恒压恒流供电等方式） 向光源模块 320提供合适的电流或电压。 根 据外部供电的方式， LED驱动电源 330可采用各种拓朴架构的电路， 例如包括但不限于非隔离降压型拓朴电路结构、 反激式拓朴电路结构 和半桥 LLC拓朴电路结构等。有关驱动电源电路的详细描述可参见人 民邮电出版社 2011年 5月第 1版的 《LED照明驱动电源与灯具设计》 一书， 该出版物以全文引用方式包含在本说明书中。 图 3为按照本发明另一个实施例的 LED球泡灯的分解示意图。 与上述借助图 1和 2所示的实施例相比， 本实施例的主要不同之 处在于光源模块 320的结构。 为避免赘述， 以下重点描述与图 1和 2 所示实施例不同的方面。
按照本实施例的 LED球泡灯 1同样包括灯罩 10、灯头 20和 LED 灯芯 30。 灯軍 10和灯头 20可采用上面描述的各种特征， 它们固定在 一起从而形成可容纳 LED灯芯 30的空腔。 在本实施例中， LED灯芯 30也包括散热壳体 310、 光源模块 320和 LED驱动电源 330。
参见图 3，散热壳体 310的下端可借助粘合剂（例如胶泥或环氧树 脂） 固定于灯头 20的底部， 其在靠近灯头 20的开口处形成可容纳灯 罩 10开口端的空隙， 因此如上述实施例那样， 可借助胶泥之类的粘合 剂将灯軍 10、 灯头 20和散热壳体 310固定在一起。
如图 3所示， 在散热壳体 310的顶部和与顶部相距较远的散热壳 体侧壁上分别开设有通孔 312和 313。优选地， 多个通孔 313围绕散热 壳体 310的中心轴均匀地开设在侧壁上。
在本实施例中 ,光源模块 320被设置在散热壳体 310的顶部， LED 驱动电源 330则设置在散热壳体 310内腔的下部。
光源模块 320 包括基板 321 和将借助图 4作详细描述的发光体 322Ao 基板 321例如借助导热胶粘合在散热壳体 310的顶部。 参见图 3, 在基板 321上形成有布线层 3211 , 发光体 322A与该布线层 3211 电气连接。 另一方面， LED驱动电源 330的输出引线 333A和 333B可 穿过散热壳体 310顶部的贯通孔 314A、 314B与基板 321上的布线层 3211电气连接， 从而向发光体 323供电。 此外， 在基板 321上与通孔 312相应的位置上开设过孔 3212以使介质能够流入散热壳体 310。 图 4为图 3所示 LED球泡灯中的发光体的示意图。
参见图 4，发光体 322A包括 LED单元 322、框架 323和金属载板 324。 金属载板 324包括第一图案区域 3241和第二图案区域 3242。 第 一图案区域 3241用作电极区域，其包含多个相互之间以及与第二图案 区域 3242均不连通的分立小区以作为 LED单元 322与基板 321上的 布线层 3221的电气连接区。 结合图 3和 4可见， 第一图案区域 3241 从框架 324延伸出来的区域与基板 321表面上的布线层 3211电气连接， 从而经布线 3211 层连接至位于散热壳体 310 内部的 LED驱动电源 330ο 如图 4所示， LED单元 322采用管芯形式， 它们例如通过固晶工 艺被固定在第二图案区域 3242上， 由于金属良好的导热性能， LED单 元 322与第二图案区域 324之间的热阻接近于零， 因此前者产生的热 量可以高效率地传递给基板 321。框架 323由绝缘材料制成，其例如通 过注压工艺与金属载板 324固定在一起，并且将 LED单元 322包围其 中。 由于第一和第二图案区域 3241和 3242都被固定在框架 323上， 因此它们的相对位置关系得以固定。 参见图 4, LED单元 322通过引 线 325实现它们相互间的互连以及与第一图案区域 3241的连接。
在本实施例中， 可以先在基板 321 的表面印刷电子浆料图案 （例 如银浆），该图案对应于布线层 3211以及与第一和第二图案区域 3241、 3242接触的区域（以下又称为接触区） 。 然后通过高温烧结， 在基板 表面形成布线层 3211以及接触区。最后将金属载板 324的第一和第二 图案区域通过热熔合的方式固定到基板 321表面的接触区。 在本实施 例中， 金属栽板 324采用铜、 铝等材料制成， 优选地， 可以在第一和 笫二图案区域与基板 321接触的表面上形成一层熔点较低的金属层（例 如锡） 以有利于热熔合。
值得指出的是， 虽然 LED单元 322这里以混联方式连接在一起， 但是也可以采用诸如串联、 并联或交叉阵列之类的其它连接形式。
还需要指出的是， 在本实施例中， 光源模块 320 中的基板可以省 略。 此时， 可以考虑在散热壳体 310的顶部形成与 LED驱动电源 330 电气连接的布线层， 并且例如利用上述热熔合工艺将金属载板 324直 接固定于散热壳体 310的顶部。
当 LED单元的发光波长与实际需要的照明光线颜色有偏差时，可 以利用荧光材料的光致发光效应实现波长的改变。 具体而言， 可以用 混合荧光粉（例如钇铝石榴石 （YAG ) 荧光粉） 的硅胶覆盖或包围住 LED单元 322， 或者在 LED单元 322的表面涂覆荧光粉， 然后再用硅 胶覆盖或包围住 LED单元 322。 由于框架 323的设置， 硅胶的流动受 到限制而仅分布在 LED单元 322的周围。 需要指出的是， 虽然在上述实施例中， LED 驱动电源作为 LED 灯芯的组成单元被设置在散热壳体内部，但是这种布置并非是必需的。 在下面将要描述的实施例中， LED驱动电源可作为独立于 LED灯芯 的部件被设置在灯头内。
图 5为按照本发明另一个实施例的 LED球泡灯的剖面示意图。 与上述借助图 1和 2所示的实施例相比， 本实施例的主要不同之 处在于 LED驱动电源 330的设置方式。 为避免赘述， 以下重点描述与 图 1和 2所示实施例不同的方面。
按照本实施例的 LED球泡灯 1包括灯軍 10、 灯头 20和位于由灯 罩 10和灯头 20所限定的空腔内的 LED灯芯 30。但是与前述实施例不 同， 这里的 LED灯芯 30不包括 LED驱动电源 330。
如图 5所示， 散热壳体 310的下端可借助粘合剂 （例如胶泥或环 氧树脂） 固定于灯头 20内侧面， LED驱动电源 330被设置在灯头 20 内并且位于散热壳体 310的下方。 在本实施例中， LED驱动电源 330 包含印刷电路板 331、设置在印刷电路板 331上的元器件、一对设置在 印刷电路板 331下表面的输入引线 332A和 332B以及一对设置在印刷 电路板 331上表面的输出引线 333A和 333B。
如图 5所示， 印刷电路板 331的侧面固定于灯头 20的内侧面。 通 过在印刷电路板 331侧面或灯头内侧面涂覆胶泥、 硅胶或环氧树脂之 类的粘合剂并且使其固化， 可实现印刷电路板 331 的固定。 需要指出 的是， 除了上述布置以外， 印刷电路板也可以采用其它方式固定于灯 头的内部。 例如可以借助粘合剂或螺钉将基板固定在灯头的底部。
参见图 5， 在本实施例中， 输入引线 332A和 332B采用导线的形 式， 其中输入引线 332A向下延伸与灯头 20的第一电极区 （例如灯头 的由导电材料构成的端部）电气连接， 而输入引线 332B自印刷电路板 331 向下延伸一段后向上折返并抵靠住灯头内侧面以与灯头的第二电 极区 （例如灯头侧面由导电材料构成的部分） 实现电气连接。 另一方 面， 输出引线 333A和 333B穿过散热壳体 310顶部的贯通孔 314与基 板 321上的布线层电气连接。 虽然已经展现和讨论了本发明的一些方面， 但是本领域内的技术 人员应该意识到： 可以在不背离本发明原理和精神的条件下对上述方 面进行改变， 因此本发明的范围将由权利要求以及等同的内容所限定。

Claims

权利要求项数
1. 一种 LED灯芯， 包括：
散热壳体， 其由陶瓷材料或导热绝缘高分子复合材料制成并且在 顶部或靠近顶部的区域以及远离所述顶部的区域开设通孔； 以及
一个或多个发光模块， 每个包括基板和形成于所述基板上的 LED 单元， 所述基板被设置在所述散热壳体的顶部和 /或靠近顶部的区域， 从而在散热壳体的顶部与远离所述顶部的区域之间形成热梯度。
2. 如权利要求 1所述的 LED灯芯， 其中， 所述陶瓷材料为常温 红外陶瓷辐射材料。
3. 如权利要求 1所述的 LED灯芯， 其中， 所述散热壳体的外表 面上涂覆常温红外陶瓷辐射材料或石墨。
4. 如权利要求 1所述的 LED灯芯， 其中， 所述通孔围绕所述散 热壳体的中心轴均匀地开设在远离所述顶部的侧壁上。
5. 如权利要求 1所述的 LED灯芯， 其中， 所述基板为陶瓷基板、 铝基板或柔性电路板。
6. 如权利要求 1所述的 LED灯芯， 其中， 所述发光模块进一步 包含反射膜， 其覆盖在所述基板上并且使所述 LED单元露出。
7. 如权利要求 1所述的 LED灯芯， 其中， 进一步包括 LED驱动 电源， 其位于所述散热壳体内部并且与所述发光模块电气连接。
8. 如权利要求 1所述的 LED灯芯， 其中， 进一步包括填充在所 述散热壳体内腔的红外辐射纤维材料。
9. 一种 LED球泡灯， 包括：
灯罩；
灯头， 其与所述灯头接合在一起以形成空腔；
LED灯芯， 包括：
散热壳体， 其由陶瓷材料或导热绝缘高分子复合材料制成并 且固定于所述灯罩与灯头的接合部分，所述散热壳体的顶部或靠近 顶部的区域以及远离所述顶部的区域开设通孔； 以及
一个或多个发光模块， 每个包括基板和形成于所述基板上的 LED单元， 所述基板被设置在所述散热壳体的顶部和 /或靠近顶部 的区域，从而在散热壳体的顶部与远离所述顶部的区域之间形成热 梯度；
LED驱动电源， 其位于所述散热壳体内部或灯头内部并且与所述 光源模块电气连接。
10. 如权利要求 9所述的 LED球泡灯， 其中， 所述灯軍表面涂覆 常温红外陶瓷辐射材料。
PCT/CN2014/078113 2013-05-23 2014-05-22 Led灯芯和包含其的led球泡灯 WO2014187335A1 (zh)

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CN108799866A (zh) * 2018-08-24 2018-11-13 德清鼎辉照明有限公司 一种球泡灯
CN108826037A (zh) * 2018-08-24 2018-11-16 德清鼎辉照明有限公司 球泡灯
CN108870114A (zh) * 2018-08-24 2018-11-23 德清鼎辉照明有限公司 一种内置led贴片的球泡灯
CN108954035A (zh) * 2018-08-24 2018-12-07 德清鼎辉照明有限公司 Led灯芯
CN108980649A (zh) * 2018-08-24 2018-12-11 德清鼎辉照明有限公司 Led贴片灯芯
WO2019192957A1 (en) 2018-04-03 2019-10-10 Signify Holding B.V. Heat dissipating unit for lamps, and lamps using the same

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CN108870114A (zh) * 2018-08-24 2018-11-23 德清鼎辉照明有限公司 一种内置led贴片的球泡灯
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