WO2010146840A1

WO2010146840A1 - Substrate transfer device

Info

Publication number: WO2010146840A1
Application number: PCT/JP2010/003978
Authority: WO
Inventors: 相澤真也; 中尾裕利; 吾郷健二; 浅石隆; 南展史; 中村伸悟
Original assignee: 株式会社アルバック
Priority date: 2009-06-15
Filing date: 2010-06-15
Publication date: 2010-12-23
Also published as: JPWO2010146840A1; CN102460674A; KR20120023701A

Abstract

Provided is a substrate transfer device wherein the thickness of a mechanism portion to linearly move a substrate can be reduced. The substrate transfer device is comprised of a drive portion (2), a pair of common arms (11a, 11b) coupled to the drive portion (2), a pair of operation arms (12a, 12b) coupled to the common arms, a carrier (14), and a conversion mechanism portion (13). The conversion mechanism portion (13) converts rotational movements of the arms to a linear movement of the carrier (14). The conversion mechanism portion (13) is comprised of a pair of shaft members (131a, 131b) and ring portions (42a, 42b) formed in the tips of the operation arms (12a, 12b). The ring portion rotates about the shaft member. Gear portions (50a, 50b) are formed on the outer peripheral surfaces of the ring portions, and are engaged with each other to rotate the ring portions in conjunction with each other. Bearing members (60a, 60b) are disposed between the ring portions and the shaft portions. The bearing portions and the gear portions are arranged so as to be opposed to each other in the radial directions of the shaft members.

Description

Substrate transfer device

The present invention relates to a substrate transfer apparatus for transferring a substrate to be processed such as a semiconductor substrate or a glass substrate.

Recently, a multi-chamber type vacuum processing apparatus in which a plurality of processing chambers are arranged around a transfer chamber is known. This type of vacuum processing apparatus is provided with a substrate transfer device for automatically loading and unloading a substrate from the transfer chamber to each processing chamber.

Patent Document 1 listed below describes a robot that transports a substrate in a vacuum chamber. This robot has a pair of two arms connected to each other, supports a carrier on which one object to be transported is supported by the pair of arms, and transports the object to be transported by simultaneously driving the pair of arms. Further, the robot includes a rotation restraining mechanism unit including gears respectively coupled to one end on the carrier side of a pair of arms supporting the carrier as means for linearly moving the carrier.

In recent years, multi-chamber type vacuum processing apparatuses tend to narrow an opening for transporting a substrate between a transport chamber and a processing chamber for the purpose of improving exhaust efficiency in the processing chamber and reducing temperature change in the processing chamber. There is. For this reason, it is necessary to reduce the thickness of the front end portion of the substrate transfer apparatus that passes through the opening. Therefore, the robot is designed to reduce the thickness of the rotation restraint mechanism by providing a single stage bearing for supporting the gears.

JP 2000-317877 A (paragraph [0021], FIG. 3)

However, in the robot described in Patent Document 1, the gears and the bearings that support the gears are arranged so as to be stacked in the axial direction thereof, so that there is a limitation in thinning the rotation restraint mechanism. There's a problem.

In view of the circumstances as described above, an object of the present invention is to provide a substrate transport device that can reduce the thickness of a mechanism portion for linearly moving a substrate.

In order to achieve the above object, a substrate transport apparatus according to an aspect of the present invention is a substrate transport apparatus that transports a substrate, and includes a drive unit, a pair of first arms, and a pair of second arms, A carrier and a conversion mechanism are provided.
Each of the pair of first arms has a first end connected to the drive unit, and a second end located on the opposite side of the first end.
A pair of second arms, a third end rotatably attached to the second end of the first arm, and an outer peripheral surface located on the opposite side of the third end; And a fourth end portion including an annular ring portion in which a gear portion is formed. The fourth end of the pair of second arms is engaged with each other via the gear portion.
The carrier supports the substrate.
The conversion mechanism is disposed between the fourth end of the second arm and the carrier, and converts the rotational motion of the first and second arms into a linear motion of the carrier. The conversion mechanism includes a main body and a bearing member. The main body has a coupling surface coupled to the carrier and a pair of shaft portions inserted through the ring portions. The bearing member is mounted between the outer peripheral surface of the shaft portion and the inner peripheral surface of the ring portion, and is aligned with the gear portion in the radial direction of the shaft portion.

It is the perspective view seen from the upper side of the board | substrate conveyance apparatus which concerns on embodiment of this invention. It is the perspective view seen from the downward side of the said board | substrate conveyance apparatus. It is a bottom view around the conversion mechanism part of the substrate transport apparatus. It is a perspective view around the conversion mechanism part of the said board | substrate conveyance apparatus. It is sectional drawing of the conversion mechanism part of the said board | substrate conveyance apparatus. It is a schematic sectional drawing of the principal part of the vacuum processing apparatus provided with the said board | substrate conveyance apparatus.

A substrate transport apparatus according to an embodiment of the present invention is a substrate transport apparatus that transports a substrate, and includes a drive unit, a pair of first arms, a pair of second arms, a carrier, and a conversion mechanism. It comprises.
Each of the pair of first arms has a first end connected to the drive unit, and a second end located on the opposite side of the first end.
A pair of second arms, a third end rotatably attached to the second end of the first arm, and an outer peripheral surface located on the opposite side of the third end; And a fourth end portion including an annular ring portion in which a gear portion is formed. The fourth end of the pair of second arms is engaged with each other via the gear portion.
The carrier supports the substrate.
The conversion mechanism is disposed between the fourth end of the second arm and the carrier, and converts the rotational motion of the first and second arms into a linear motion of the carrier. The conversion mechanism includes a main body and a bearing member. The main body has a coupling surface coupled to the carrier and a pair of shaft portions inserted through the ring portions. The bearing member is mounted between the outer peripheral surface of the shaft portion and the inner peripheral surface of the ring portion, and is aligned with the gear portion in the radial direction of the shaft portion.

In the conversion mechanism, the shaft portion of the main body constitutes the rotation shaft of each ring portion. The pair of ring portions are engaged with each other via a gear portion formed on the outer peripheral surface thereof, and the inner peripheral surface of each ring portion is supported by the shaft portion via a bearing member. By this conversion mechanism, the rotational motions of the first and second arms by the drive unit are converted into the linear motion of the carrier.
In the substrate transport apparatus, the gear portion and the bearing member constituting the conversion mechanism are arranged to face each other in the radial direction of the shaft portion. Therefore, when the axial direction of the shaft portion of the conversion mechanism is the thickness direction, the thickness of the conversion mechanism can be reduced as compared with the case where the gear portion and the bearing member are arranged so as to be stacked in the thickness direction. Thereby, the conversion mechanism can be thinned.

The second arm may include a first member and a second member. The first member is connected to the first arm and has the third end. The second member is attached to the first member and has the fourth end.
Thereby, each said ring part can be comprised as a part of said conversion mechanism, and the assembly property of the board | substrate conveyance apparatus provided with the thin conversion mechanism can be improved.

In one embodiment of the present invention, when the axial direction of the shaft portion is the thickness direction, the thickness of the conversion mechanism is equal to or less than the thickness of the first member. Further, the thickness of the first member on the fourth end side is smaller than the thickness of the third end of the first member.
Thus, the conversion mechanism or the tip region of the second arm including the conversion mechanism can be configured to be thinner than the third end side.

Furthermore, in one embodiment of the present invention, the main body includes a first surface parallel to the rotation direction of the first and second arms, and a second surface positioned below the first surface. Have each. In this case, the pair of shaft portions and the coupling surface are formed on the second surface. Thereby, it becomes possible to suppress an increase in the thickness of the conversion mechanism including the carrier.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[overall structure]
1 and 2 are perspective views showing a substrate transfer apparatus according to an embodiment of the present invention. Here, FIG. 1 is a perspective view of the substrate transfer apparatus 1 as viewed from above, and FIG. 2 is a perspective view of the substrate transfer apparatus 1 as viewed from below. In FIG. 2, the carrier is not shown. In the figure, the x axis and the y axis are horizontal axes orthogonal to each other, and the xy plane corresponds to a horizontal plane. The z axis is a vertical axis orthogonal to the x axis and the y axis.

The substrate transfer apparatus 1 according to the present embodiment is configured as a substrate transfer apparatus having a first transfer robot 10 and a second transfer robot 20. The first transfer robot 10 mainly includes a pair of

common arms

11a and 11b (first arm), a pair of

first operating arms

12a and 12b (second arm), a conversion mechanism unit 13, and a carrier. 14. The second transfer robot 20 mainly includes a pair of

common arms

11a and 11b, a pair of

second operating arms

22a and 22b (second arms), a conversion mechanism unit 23, and a carrier 24. Yes.

The substrate transfer apparatus 1 is installed inside a transfer chamber in a multi-chamber type vacuum processing apparatus, for example. The vacuum processing apparatus has a plurality of vacuum processing chambers around the transfer chamber. These vacuum processing chambers include various processing chambers such as a load / unload chamber for loading and / or unloading a substrate, a film forming chamber (a sputtering chamber, a CVD chamber, etc.), and a heat treatment chamber. The substrate transfer apparatus 1 is for delivering a substrate between a plurality of vacuum processing chambers in the evacuated transfer chamber, and is installed, for example, at the bottom (in the xy plane) of the transfer chamber.

The substrate transport apparatus 1 has a drive unit 2 having a drive shaft 21 as shown in FIG. The drive unit 2 is installed outside the transfer chamber, and typically includes an electric motor, a cylinder device, and the like. The drive shaft 21 passes through the bottom of the transfer chamber in an airtight manner in the z-axis direction and is connected to the

base end portions

111a and 111b (first end portions) of the

common arms

11a and 11b. The

base end portions

111a and 111b are arranged so as to overlap each other as illustrated. As shown in FIG. 2, the drive shaft 21 has first and

second drive shafts

21a and 21b arranged concentrically. The first drive shaft 21a is connected to the base end portion 111a, and the second The drive shaft 21b is connected to the base end portion 111b. The drive unit 2 rotates the

common arms

11a and 11b in the xy plane, or vertically moves in the z-axis direction.

The

common arms

11a and 11b are made of a metal material such as an aluminum alloy, for example.

Connecters

3a and 3b are attached to the other end portions (second end portions) of the

common arms

11a and 11b, respectively. The

couplers

3a and 3b have first

rotary shafts

31a and 31b that rotatably support the

first operating arms

12a and 12b in the xy plane, and

second operating arms

22a and 22b that can rotate in the xy plane. And second

rotating shafts

32a and 32b to be supported.

The first and

second operating arms

12a, 12b, 22a, 22b are made of a metal material such as an aluminum alloy, for example. The

first operating arms

12a and 12b include

end portions

121a and 121b (third end portions) connected to the first

rotating shafts

31a and 31b, and

end portions

122a and 122b (connected to the conversion mechanism portion 13). A fourth end). The conversion mechanism unit 13 converts the rotational motion of the

common arms

11a and 11b and the

first operating arms

12a and 12b in the xy plane into a linear motion of the carrier 14 in the xy plane. The carrier 14 has a support surface 14a on which a glass substrate, a semiconductor substrate or the like is placed, and enters a vacuum processing chamber (not shown) to deliver the substrate.

Similarly, the

second operating arms

22a and 22b include end portions 221a and 221b (third end portions) connected to the second

rotating shafts

32a and 32b, and an end portion 222a connected to the conversion mechanism portion 23. , 222b (fourth end). The conversion mechanism unit 23 converts the rotational motion of the

common arms

11a and 11b and the

second operating arms

22a and 22b in the xy plane into a linear motion of the carrier 24 in the xy plane. The carrier 24 has a support surface 24a on which a glass substrate, a semiconductor substrate or the like is placed, and enters a vacuum processing chamber (not shown) to deliver the substrate. The

carriers

14 and 24 are made of, for example, a metal material such as an aluminum alloy, and the shape thereof is not limited to the illustrated one.

The

conversion mechanism sections

13 and 23 have the same configuration. Hereinafter, details of the conversion mechanism unit 13 and its peripheral configuration will be described. In the following description, for the sake of convenience, the first transfer robot 10 is simply referred to as the transfer robot 10, and the

first operation arms

12a and 12b are simply referred to as the

operation arms

12a and 12b.

[Peripheral structure of conversion mechanism]
3 to 5 show the configuration of the conversion mechanism unit 13. 3 is a bottom view of the transfer robot 10 as viewed from below, FIG. 4 is a perspective view of the conversion mechanism 13 as viewed from below, and FIG. 5 is a view of the conversion mechanism 13 as viewed from the x-axis direction. FIG. In FIGS. 3 and 4, the carrier is not shown.

As shown in FIGS. 3 and 4, each of the operating

arms

12a and 12b includes a combination of

main arm members

30a and 30b (first member) and

auxiliary arm members

40a and 40b (second member). Has been. The

main arm members

30a and 30b are provided with mounting

holes

301a and 301b for assembling the

auxiliary arm members

40a and 40b at the end opposite to the

ends

121a and 121b.

Further,

step portions

302a and 302b are formed on the lower surfaces of the

main arm members

30a and 30b, respectively. As a result, as shown in FIGS. 1 and 2, the

main arm members

30a and 30b have a thickness (z-axis direction) between the

common arms

11a and 11b and the conversion mechanism 13 side with the stepped

portions

302a and 302b as a boundary. However, the conversion mechanism 13 side is formed thinner than the

common arms

11a and 11b. Moreover, the rigidity of the

main arm members

30a and 30b can be ensured by increasing the thickness of the

common arms

11a and 11b.

The

auxiliary arm members

40a and 40b constitute

second end portions

122a and 122b of the operating

arms

12a and 12b, respectively, and as shown in FIG. 5,

plate portions

41a and 41b and

annular ring portions

42a and 42b. Have. The

plate portions

41a and 41b have a rectangular shape formed in parallel to the xy plane, and are inserted through the mounting

holes

301a and 301b of the

main arm members

30a and 30b. The

plate portions

41a and 41b are slidable with respect to the mounting

holes

301a and 301b, and can be fixed at a predetermined position by a plurality of fasteners S1 (FIG. 1).

On the other hand, the

ring portions

42 a and 42 b constitute a part of the conversion mechanism portion 13 and connect the

main arm members

30 a and 30 b to the conversion mechanism portion 13. Details of the conversion mechanism unit 13 will be described below.

As shown in FIG. 5, the conversion mechanism section 13 includes a metal main body 130 including a pedestal section 133 and a pair of

shaft members

131a and 131b. The pair of

shaft members

131 a and 131 b are attached to the lower surface side of the pedestal portion 133.

The base portion 133 of the main body 130 has a coupling surface 134 coupled to the carrier 14 as shown in FIG. The pedestal portion 133 has a thin region formed on the lower surface thereof via the step portion 133 s, and the lower surface of the thin region serves as a coupling surface 134. The coupling surface 134 is joined to the upper surface of the base of the carrier 14 via a plurality of fasteners S2 (FIG. 1).

The height (depth) of the stepped portion 133s is set to be equal to the thickness of the base portion of the carrier 14. Further, the thickness of the thin region of the pedestal part 133 constituting the coupling surface 134 is set to be equal to or less than the thickness of the substrate supported by the carrier 14.

The

shaft members

131a and 131b are each formed in a cylindrical shape having the same diameter. The

shaft members

131a and 131b pass through the

ring portions

42a and 42b of the

auxiliary arm members

40a and 40b, and are fixed to the pedestal portion 133 via the

fasteners

132a and 132b.

Bearing members

60a and 60b are mounted between the outer peripheral surfaces of the

shaft members

131a and 131b and the inner peripheral surfaces of the

ring portions

42a and 42b, respectively, and

auxiliary arm members

40a and 40b are provided around the

shaft members

131a and 131b. It can be turned.

The bearing

members

60a and 60b are each composed of a single bearing component. The type of the bearing component is not particularly limited, but in this embodiment, a two-point support type bearing component is used. Examples of this type of bearing component include angular bearings (angular ball bearings), bearing components including vacuum grease as a lubricant, and the like. A four-point support bearing part may be employed. The bearing

members

60a and 60b are provided between a peripheral edge portion 42c that protrudes radially inward from the upper ends of the

ring portions

42a and 42b and a step portion 131s that protrudes radially outward from the outer peripheral surface of the

shaft members

131a and 131b. It is fixed with respect to the main body 130 so as to be sandwiched.

On the other hand,

gear portions

50a and 50b are provided on the outer peripheral surfaces of the

ring portions

42a and 42b, respectively. The

gear portions

50a and 50b are engaged with each other, whereby the

ring portions

42a and 42b rotate around the

shaft members

131a and 131b in conjunction with each other. That is, the

ring portions

42a and 42b rotate around the

shaft members

131a and 131b at the same rotation angle at the same time.

In the present embodiment, the

gear portions

50a and 50b are constituted by annular gear parts respectively mounted on the outer peripheral surfaces of the

ring portions

42a and 42b. As the

gear parts

50a and 50b, for example, gear parts excellent in wear resistance subjected to vacuum quenching can be used. The

gear portions

50a and 50b may be directly formed on the outer peripheral surfaces of the

ring portions

42a and 42b. The

gear portions

50a and 50b are connected to the

ring portions

42a and 42b together with the

support plates

70a and 70b by a plurality of

fasteners

71a and 71b for attaching the

annular support plates

70a and 70b to the lower surfaces of the

ring portions

42a and 42b. Fixed. The lower surfaces of the

support plates

70a and 70b belong to the same plane as the lower surfaces of the

auxiliary arm members

40a and 40b.

As shown in FIG. 5, the bearing

members

60a and 60b and the

gear portions

50a and 50b are juxtaposed so as to face each other in the radial direction of the

shaft members

131a and 131b with the

ring portions

42a and 42b interposed therebetween. . In particular, in the present embodiment, the bearing

members

60a and 60b and the

gear portions

50a and 50b are respectively arranged on the inner peripheral side and the outer peripheral side of the

ring portions

42a and 42b so as to be located on the same plane. Thereby, compared with the structure arrange | positioned so that these bearing members and gear parts may be piled up in the axial direction of a shaft member, it becomes possible to restrain the thickness dimension of the conversion mechanism part 13 small.

In the conversion mechanism portion 13 configured as described above, the operating

arms

12a and 12b are configured so that the common arm is rotated by rotating the

ring portions

42a and 42b of the

auxiliary arm members

40a and 40b around the

shaft members

131a and 131b. It follows the rotational movement of 11a, 11b. At this time, since the

ring portions

42a and 42b are engaged with each other via the

gear portions

50a and 50b, the

ring portions

42a and 42b rotate in synchronization with each other and in the reverse direction. As a result, the carrier 14 is linearly moved in the xy plane without rotating around the z axis.

The first transfer robot 10 is configured as described above. Further, the second transfer robot 20 is configured similarly to the first transfer robot 10. Next, a typical operation of the substrate transport apparatus 1 of the present embodiment configured as described above will be described.

[Operation of substrate transfer device]
The drive unit 2 linearly moves the

carriers

14 and 24 by rotating the first and

second drive shafts

21a and 21b constituting the drive shaft 21 in opposite directions. That is, in the state shown in FIG. 1, when the drive shaft 21a is rotated clockwise and the drive shaft 21b is rotated counterclockwise as viewed from above, the

carriers

14 and 24 move in the (−x) direction, respectively. . Conversely, when the drive shaft 21a is rotated counterclockwise and the drive shaft 21b is rotated clockwise as viewed from above, the

carriers

14 and 24 move in the (+ x) direction, respectively.

On the other hand, the drive unit 2 rotates the first and

second drive shafts

21a and 21b in the same direction, thereby turning the first and

second transfer robots

10 and 20 around the z-axis. Further, the drive unit 2 moves the first and

second transfer robots

10 and 20 up and down by extending and contracting the first and

second drive shafts

21a and 21b in the z-axis direction.

As described above, the

carriers

14 and 24 are moved to an arbitrary spatial position. Accordingly, the substrate can be accurately transported from a predetermined transport position to another transport position using the

carriers

14 and 24.

Here, in the board | substrate conveyance apparatus 1 of this embodiment, the

gear parts

50a and 50b and the

bearing members

60a and 60b which comprise the

conversion mechanism parts

13 and 23 are opposed to the radial direction of the

shaft members

131a and 131b, respectively. Has been placed. Therefore, compared to a configuration in which the gear portion and the bearing member are stacked in the z-axis direction, the thickness of the

conversion mechanism portions

13 and 23 can be reduced, and the

conversion mechanism portions

13 and 23 can be thinned. It becomes possible. As shown in FIG. 5, the thickness of the

conversion mechanism portions

13 and 23 can be suppressed to be equal to or less than the thickness (T) of the distal end portion of the

main arm members

30 a and 30 b to which the

auxiliary arm members

40 a and 40 b are attached.

In the substrate transfer apparatus 1 of the present embodiment, the operating

arms

12a and 12b (22a and 22b) are composed of two members, the main arm member 30 and the auxiliary arm member 40. Thereby, the

ring parts

42a and 42b of the

auxiliary arm members

40a and 40b can be configured as a part of the

conversion mechanism parts

13 and 23, and the assemblability of the substrate transfer apparatus 1 including the thin conversion mechanism can be improved.

In the substrate transfer apparatus 1 according to the present embodiment, the

end portions

122a and 122b (222a and 222b) of the

operation arms

12a and 12b (22a and 22b) have thicknesses from the

end portions

121a and 121b (221a and 221b). Is also formed thin. Thereby, the front-end | tip area | region of the action |

operation arms

12a and 12b (22a, 22b) containing the conversion mechanism part 13 (23) can be comprised thinner than the

edge part

121a, 121b (221a, 221b) side.

Furthermore, in the substrate transfer apparatus 1 of the present embodiment, the carrier 14 (24) is coupled to the lower surface side of the pedestal part 133 of the conversion mechanism part 13 (23). Thereby, compared with the case where the carrier 14 (24) is combined with the upper surface side of the pedestal part 133, the thickness of the carrier 14 (24) including the thickness of the substrate is suppressed below the thickness of the conversion mechanism part 13 (23). It becomes possible.

As described above, according to the present embodiment, the tip regions of the operating

arms

12a and 12b (22a and 22b) can be configured to be thin. Thereby, an opening for transferring the substrate between the transfer chamber and the vacuum processing chamber can be formed narrow, and a highly productive vacuum processing apparatus can be configured.

FIG. 6 is a schematic cross-sectional view of the main part showing an example of the configuration of the substrate processing apparatus provided with the substrate transfer apparatus 1. The illustrated vacuum processing apparatus 8 includes a transfer chamber 80, a vacuum processing chamber 81, and a gate valve 82 that connects them. The substrate transfer apparatus 1 is installed inside the transfer chamber 80. The vacuum processing chamber 81 has an opening 81w for carrying the substrate W in and out of the transfer chamber 80, and the gate valve 82 has a valve body (not shown) for opening and closing the opening 81w. In the illustrated example, the gate valve 82 opens the opening 81w, and the carrier 14 of the substrate transport apparatus 1 enters the vacuum processing chamber 81 and carries the substrate W therein.

As shown in FIG. 6, according to the substrate transfer apparatus 1 of the present embodiment, since the conversion mechanism unit 13 can be made thinner than before, the height of the opening 81 w can be made smaller than before. For example, according to this embodiment, the thickness of the conversion mechanism unit 13 can be suppressed to 14 mm or less. In this case, the height dimension of the opening 81w can be set in the range of 25 mm to 30 mm.

Further, in the substrate transfer apparatus 1 of the present embodiment, the tip regions of the operating

arms

12a and 12b are formed to have a thickness dimension equivalent to that of the conversion mechanism unit 13. As a result, as shown in FIG. 6, the tip regions of the operating

arms

12 a and 12 b can enter the vacuum processing chamber 81, and the workability of carrying in and carrying out the substrate W can be improved.

The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.

For example, in the above embodiment, the substrate transfer apparatus 1 including the first transfer robot 10 and the second transfer robot 20 has been described as an example. However, the substrate transfer apparatus not including the second transfer robot is also described. The present invention is applicable.

In the above embodiment, the drive unit 2 having the first and

second drive shafts

21a and 21b arranged concentrically has been described as an example. However, both drive shafts are arranged non-concentrically. A biaxial drive unit may be employed. In this case, each base end portion of the pair of common arms is connected to the corresponding drive shaft.

DESCRIPTION OF SYMBOLS 1 ... Substrate transfer apparatus 2 ... Drive part 8 ...

Vacuum processing apparatus

10, 20 ...

Transfer robot

11a, 11b ...

Common arm

12a, 12b, 22a, 22b ...

Actuating arm

13, 23 ...

Conversion mechanism part

13, 24 ... Carrier

30a, 30b ...

main arm members

40a, 40b ...

auxiliary arm members

42a, 42b ...

ring portions

50a, 50b ...

gear portions

60a, 60b ... bearing members 80 ... transfer chamber 81 ... vacuum processing chamber 81w ... opening 82 ... gate valve 130 ...

Body

131a, 131b ... Shaft member 134 ... Bonding surface W ... Board

Claims

A substrate transfer device for transferring a substrate,
A drive unit;
A pair of first arms each having a first end connected to the drive unit and a second end located on the opposite side of the first end;
A third end portion rotatably attached to the second end portion of the first arm and an annular shape located on the opposite side of the third end portion and having a gear portion formed on an outer peripheral surface A pair of second arms each having a fourth end portion including a ring portion, and the fourth end portions engage with each other via the gear portion,
A carrier for supporting the substrate;
A conversion mechanism that is disposed between the fourth end of the second arm and the carrier, and converts the rotational motion of the first and second arms into a linear motion of the carrier, wherein the carrier A main body having a coupling surface coupled to the ring portion and a pair of shaft portions inserted through the ring portions, and mounted between an outer peripheral surface of the shaft portion and an inner peripheral surface of the ring portion, A substrate transport apparatus comprising: a conversion mechanism including a bearing member aligned with the gear portion in the radial direction.
The substrate transfer apparatus according to claim 1,
The second arm is
A first member coupled to the first arm and having the third end;
And a second member attached to the first member and having the fourth end.
The substrate transfer apparatus according to claim 2,
The conversion mechanism has a thickness direction in an axial direction of the shaft portion,
The thickness of the conversion mechanism is equal to or less than the thickness of the first member.
It is a board | substrate conveyance apparatus of Claim 3, Comprising:
The thickness of the 4th edge part side of the said 1st member is smaller than the thickness of the said 3rd edge part of the said 1st member.
It is a board | substrate conveyance apparatus of Claim 4, Comprising:
The main body has a first surface parallel to the rotation direction of the first and second arms, and a second surface located below the first surface, respectively.
The pair of shaft portions and the coupling surface are each formed on the second surface.