WO2004095545A3 - Wafer carrier having improved processing characteristics - Google Patents

Wafer carrier having improved processing characteristics Download PDF

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Publication number
WO2004095545A3
WO2004095545A3 PCT/US2004/006847 US2004006847W WO2004095545A3 WO 2004095545 A3 WO2004095545 A3 WO 2004095545A3 US 2004006847 W US2004006847 W US 2004006847W WO 2004095545 A3 WO2004095545 A3 WO 2004095545A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer carrier
processing characteristics
improved processing
cradle
silicon carbide
Prior art date
Application number
PCT/US2004/006847
Other languages
French (fr)
Other versions
WO2004095545A2 (en
WO2004095545A8 (en
Inventor
Richard F Buckley
Andrew G Haerle
Han C Chang
Original Assignee
Saint Gobain Ceramics
Richard F Buckley
Andrew G Haerle
Han C Chang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics, Richard F Buckley, Andrew G Haerle, Han C Chang filed Critical Saint Gobain Ceramics
Priority to JP2005518892A priority Critical patent/JP2006521689A/en
Priority to EP04718089A priority patent/EP1609171A2/en
Publication of WO2004095545A2 publication Critical patent/WO2004095545A2/en
Publication of WO2004095545A3 publication Critical patent/WO2004095545A3/en
Publication of WO2004095545A8 publication Critical patent/WO2004095545A8/en
Priority to HK06109939A priority patent/HK1089561A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A wafer carrier for supporting a plurality of wafers, including a plurality of slots provided in a cradle, the cradle being formed of silicon carbide and having an oxide layer overlying the silicon carbide.
PCT/US2004/006847 2003-03-28 2004-03-05 Wafer carrier having improved processing characteristics WO2004095545A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005518892A JP2006521689A (en) 2003-03-28 2004-03-05 Wafer carrier with improved processing characteristics
EP04718089A EP1609171A2 (en) 2003-03-28 2004-03-05 Wafer carrier having improved processing characteristics
HK06109939A HK1089561A1 (en) 2003-03-28 2006-09-07 Wafer carrier having improved processing characteristics

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/402,915 US20040188319A1 (en) 2003-03-28 2003-03-28 Wafer carrier having improved processing characteristics
US10/402,915 2003-03-28

Publications (3)

Publication Number Publication Date
WO2004095545A2 WO2004095545A2 (en) 2004-11-04
WO2004095545A3 true WO2004095545A3 (en) 2005-05-12
WO2004095545A8 WO2004095545A8 (en) 2005-12-08

Family

ID=32989844

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/006847 WO2004095545A2 (en) 2003-03-28 2004-03-05 Wafer carrier having improved processing characteristics

Country Status (8)

Country Link
US (1) US20040188319A1 (en)
EP (1) EP1609171A2 (en)
JP (2) JP2006521689A (en)
KR (1) KR100755196B1 (en)
CN (1) CN100390927C (en)
HK (1) HK1089561A1 (en)
TW (1) TWI288454B (en)
WO (1) WO2004095545A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101146742B (en) * 2005-03-30 2013-05-01 揖斐电株式会社 Silicon carbide-containing particle, method of manufacturing a silicon carbide-based sintered object, silicon carbide-based sintered object, and filter
CN101928934B (en) * 2009-06-18 2012-11-28 中芯国际集成电路制造(上海)有限公司 Method for improving uniformity of high-temperature oxide of wafer
CN103151289B (en) * 2011-12-07 2015-11-25 无锡华润华晶微电子有限公司 Brilliant boat, brilliant boat transfer device and comprise its wafer transfer system
JP5991284B2 (en) * 2013-08-23 2016-09-14 信越半導体株式会社 Heat treatment method for silicon wafer
CN103681416A (en) * 2013-11-29 2014-03-26 上海华力微电子有限公司 Method for monitoring thickness of polycrystalline silicon furnace tube wafers
CN104269351B (en) * 2014-09-30 2017-02-22 上海华力微电子有限公司 Method for overcoming stress defect of HCD silicon nitride sedimentation technology
US20180119278A1 (en) * 2015-04-13 2018-05-03 Kornmeyer Carbon-Group Gmbh Pecvd boat
JP7251458B2 (en) * 2019-12-05 2023-04-04 株式会社Sumco Silicon wafer manufacturing method

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US3634116A (en) * 1969-06-02 1972-01-11 Dow Corning Silicon-carbide-encased graphite articles and their production
GB1385730A (en) * 1971-07-07 1975-02-26 Siemens Ag Apparatus for diffusing dopants into semiconductor wafers
US3923156A (en) * 1974-04-29 1975-12-02 Fluoroware Inc Wafer basket
US3998333A (en) * 1974-06-24 1976-12-21 Iwatsu Electric Co., Ltd. Carrier for processing semiconductor materials
JPS5285476A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Semiconductor wafer accommodating jig
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
JPS59191327A (en) * 1983-04-15 1984-10-30 Hitachi Ltd Heat-treatment jig
US4548159A (en) * 1984-07-06 1985-10-22 Anicon, Inc. Chemical vapor deposition wafer boat
JPS6142153A (en) * 1984-08-03 1986-02-28 Fujitsu Ltd Heat-resisting jig
JPS61213374A (en) * 1985-03-18 1986-09-22 Hitachi Micro Comput Eng Ltd Jig
JPS624337A (en) * 1985-07-01 1987-01-10 Toshiba Ceramics Co Ltd Semiconductor wafer supporting boat
US4653636A (en) * 1985-05-14 1987-03-31 Microglass, Inc. Wafer carrier and method
JPS63164312A (en) * 1986-12-26 1988-07-07 Toshiba Ceramics Co Ltd Silicon wafer treating jig
EP0308695A2 (en) * 1987-09-01 1989-03-29 Toshiba Ceramics Co., Ltd. A component for producing semi-conductor devices and process of producing it
JPH01302814A (en) * 1988-05-31 1989-12-06 Shin Etsu Handotai Co Ltd Semiconductor wafer retaining device
US4904515A (en) * 1985-11-22 1990-02-27 Toshiba Ceramics Company, Limited Heat-treatment member for semiconductor elements
JPH04287915A (en) * 1991-02-07 1992-10-13 Mitsubishi Electric Corp Wafer boat
JPH065530A (en) * 1992-06-17 1994-01-14 Toshiba Corp Heat treatment furnace boat
JPH06302532A (en) * 1993-04-13 1994-10-28 Japan Energy Corp Method of heat-treating compound semiconductor single-crystal wafer and wafer supporter used for the method
US5417767A (en) * 1993-12-28 1995-05-23 Stinson; Mark G. Wafer carrier
EP0713245A2 (en) * 1994-11-17 1996-05-22 Shin-Etsu Handotai Company Limited A heat treatment jig for semiconductor wafers and a method for treating a surface of the same
JPH10242254A (en) * 1997-02-21 1998-09-11 Ado Matsupu:Kk Jig for manufacture of semiconductor
WO2001095374A2 (en) * 2000-06-06 2001-12-13 Saint-Gobain Ceramics And Plastics, Inc. Slip resistant horizontal semiconductor wafer boat
EP1184355A1 (en) * 2000-02-15 2002-03-06 Toshiba Ceramics Co., Ltd. METHOD FOR MANUFACTURING Si-SiC MEMBER FOR SEMICONDUCTOR HEAT TREATMENT
EP1187189A1 (en) * 2000-02-10 2002-03-13 Shin-Etsu Handotai Co., Ltd Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat
US20030056391A1 (en) * 2001-09-18 2003-03-27 M .Fsi Ltd. Supporting fixture of substrate and drying method of substrate surface using the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981222A (en) * 1988-08-24 1991-01-01 Asq Boats, Inc. Wafer boat
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
US5443649A (en) * 1994-11-22 1995-08-22 Sibley; Thomas Silicon carbide carrier for wafer processing in vertical furnaces
US5702997A (en) * 1996-10-04 1997-12-30 Saint-Gobain/Norton Industrial Ceramics Corp. Process for making crack-free silicon carbide diffusion components
JP3362113B2 (en) * 1997-07-15 2003-01-07 日本碍子株式会社 Corrosion-resistant member, wafer mounting member, and method of manufacturing corrosion-resistant member
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
US6162543A (en) * 1998-12-11 2000-12-19 Saint-Gobain Industrial Ceramics, Inc. High purity siliconized silicon carbide having high thermal shock resistance
US6488497B1 (en) * 2001-07-12 2002-12-03 Saint-Gobain Ceramics & Plastics, Inc. Wafer boat with arcuate wafer support arms

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634116A (en) * 1969-06-02 1972-01-11 Dow Corning Silicon-carbide-encased graphite articles and their production
GB1385730A (en) * 1971-07-07 1975-02-26 Siemens Ag Apparatus for diffusing dopants into semiconductor wafers
US3923156A (en) * 1974-04-29 1975-12-02 Fluoroware Inc Wafer basket
US3998333A (en) * 1974-06-24 1976-12-21 Iwatsu Electric Co., Ltd. Carrier for processing semiconductor materials
JPS5285476A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Semiconductor wafer accommodating jig
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
US4355974B1 (en) * 1980-11-24 1988-10-18
JPS59191327A (en) * 1983-04-15 1984-10-30 Hitachi Ltd Heat-treatment jig
US4548159A (en) * 1984-07-06 1985-10-22 Anicon, Inc. Chemical vapor deposition wafer boat
JPS6142153A (en) * 1984-08-03 1986-02-28 Fujitsu Ltd Heat-resisting jig
JPS61213374A (en) * 1985-03-18 1986-09-22 Hitachi Micro Comput Eng Ltd Jig
US4653636A (en) * 1985-05-14 1987-03-31 Microglass, Inc. Wafer carrier and method
JPS624337A (en) * 1985-07-01 1987-01-10 Toshiba Ceramics Co Ltd Semiconductor wafer supporting boat
US4904515A (en) * 1985-11-22 1990-02-27 Toshiba Ceramics Company, Limited Heat-treatment member for semiconductor elements
JPS63164312A (en) * 1986-12-26 1988-07-07 Toshiba Ceramics Co Ltd Silicon wafer treating jig
EP0308695A2 (en) * 1987-09-01 1989-03-29 Toshiba Ceramics Co., Ltd. A component for producing semi-conductor devices and process of producing it
JPH01302814A (en) * 1988-05-31 1989-12-06 Shin Etsu Handotai Co Ltd Semiconductor wafer retaining device
JPH04287915A (en) * 1991-02-07 1992-10-13 Mitsubishi Electric Corp Wafer boat
JPH065530A (en) * 1992-06-17 1994-01-14 Toshiba Corp Heat treatment furnace boat
JPH06302532A (en) * 1993-04-13 1994-10-28 Japan Energy Corp Method of heat-treating compound semiconductor single-crystal wafer and wafer supporter used for the method
US5417767A (en) * 1993-12-28 1995-05-23 Stinson; Mark G. Wafer carrier
EP0713245A2 (en) * 1994-11-17 1996-05-22 Shin-Etsu Handotai Company Limited A heat treatment jig for semiconductor wafers and a method for treating a surface of the same
JPH10242254A (en) * 1997-02-21 1998-09-11 Ado Matsupu:Kk Jig for manufacture of semiconductor
EP1187189A1 (en) * 2000-02-10 2002-03-13 Shin-Etsu Handotai Co., Ltd Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat
EP1184355A1 (en) * 2000-02-15 2002-03-06 Toshiba Ceramics Co., Ltd. METHOD FOR MANUFACTURING Si-SiC MEMBER FOR SEMICONDUCTOR HEAT TREATMENT
WO2001095374A2 (en) * 2000-06-06 2001-12-13 Saint-Gobain Ceramics And Plastics, Inc. Slip resistant horizontal semiconductor wafer boat
US20030056391A1 (en) * 2001-09-18 2003-03-27 M .Fsi Ltd. Supporting fixture of substrate and drying method of substrate surface using the same

Non-Patent Citations (11)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 001, no. 146 (E - 068) 26 November 1977 (1977-11-26) *
PATENT ABSTRACTS OF JAPAN vol. 0090, no. 49 (E - 300) 2 March 1985 (1985-03-02) *
PATENT ABSTRACTS OF JAPAN vol. 0101, no. 97 (E - 418) 10 July 1986 (1986-07-10) *
PATENT ABSTRACTS OF JAPAN vol. 011, no. 171 (E - 512) 2 June 1987 (1987-06-02) *
PATENT ABSTRACTS OF JAPAN vol. 0110, no. 53 (C - 404) 19 February 1987 (1987-02-19) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 425 (E - 681) 10 November 1988 (1988-11-10) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 099 (E - 0893) 22 February 1990 (1990-02-22) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 097 (E - 1326) 25 February 1993 (1993-02-25) *
PATENT ABSTRACTS OF JAPAN vol. 0181, no. 99 (E - 1534) 7 April 1994 (1994-04-07) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 01 28 February 1995 (1995-02-28) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *

Also Published As

Publication number Publication date
WO2004095545A2 (en) 2004-11-04
KR20060002875A (en) 2006-01-09
EP1609171A2 (en) 2005-12-28
CN1765005A (en) 2006-04-26
TWI288454B (en) 2007-10-11
HK1089561A1 (en) 2006-12-01
US20040188319A1 (en) 2004-09-30
TW200425384A (en) 2004-11-16
JP2010103554A (en) 2010-05-06
KR100755196B1 (en) 2007-09-05
JP2006521689A (en) 2006-09-21
CN100390927C (en) 2008-05-28
WO2004095545A8 (en) 2005-12-08

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