WO2002067000A1

WO2002067000A1 - Insert for electronic component test device

Info

Publication number: WO2002067000A1
Application number: PCT/JP2001/001237
Authority: WO
Inventors: Noboru Saito
Original assignee: Advantest Corporation
Priority date: 2001-02-21
Filing date: 2001-02-21
Publication date: 2002-08-29

Abstract

An insert for electronic part test device, comprising a latch part moving between a position for covering and holding the upper surface of a tested electronic component stored in the insert and a position for moving away from the upper surface of the tested electronic component and a latch arm part rotatably supporting the latch part on an insert main body, wherein the tip of the latch part and the rotating center of the latch arm part are disposed generally on the same vertical line as viewed from the side of the insert, and the latch part and the rotating center of the latch arm part are offset as viewed from the horizontal plane of the insert.

Description

Akitoda insert for electronic parts test equipment Technical field

The present invention relates to an electronic component test apparatus for testing electronic components (hereinafter, also simply referred to as ICs) such as semiconductor integrated circuit elements, and a tray and an insert used for the same. The present invention relates to an insert, tray, and electronic component testing apparatus which is excellent in positioning accuracy of an IC under test to a contact portion and excellent in versatility of components.

Background art

In an electronic component tester called a handler, a large number of ICs stored in a tray are transported into the tester, and each IC is brought into electrical contact with a test head. Have the main unit (hereinafter also referred to as a tester) perform the test. When the test is completed, each IC is taken out of the test head and placed on a tray according to the test result, thereby sorting the products into non-defective and defective products.

Conventional electronic component testing equipment includes a tray for storing ICs before testing and ICs that have been tested (hereinafter, also referred to as a custom tray), and a tray that is circulated and transported inside the electronic component testing equipment. (Hereinafter, also referred to as a test tray). In this type of electronic component test equipment, ICs are replaced between the waste tray and the test tray before and after the test. In a test process of performing a test by bringing an IC into contact with a test head, the IC is pressed against a test head while being mounted on a test tray.

The test tray of a conventional electronic component tester is equipped with, for example, 64 IC mounters called inserts. The insert 16 is attached to the insert body as shown in Fig. 27. It has lever plates 162 that approach and depart. The lever plate 16 2 is mechanically connected to a latch 16 3 for holding the IC (preventing it from popping out). In this state, the latch 163 is closed as shown in the upper diagram of FIG. To prevent IC from jumping out during transport. On the other hand, when the lever plate 162 is pressed down from the outside, the latch 163 opens as shown in the lower diagram of FIG.

By the way, the contact part of the test head is made up of a plurality of contact pins that can be protruded and retracted by springs. When testing a ball grid array (BGA) type IC, the tip is A conical recess is formed in accordance with the ball-shaped input / output terminal.

In the conventional electronic component test equipment, the position of the IC under test and the contact bin were aligned using the outer shape of the package mold of the IC. However, the chip size package (CSP: Chip Size Package) In ICs, the dimensional accuracy of the package mold is extremely rough, and the positional accuracy between the outer peripheral shape and the solder balls is not necessarily guaranteed. For this reason, if positioning is performed on the outer periphery of the IC package mold, the solder ball will be pressed in a state shifted from the contact pin, and the sharp tip of the contact pin may damage the solder ball. there were.

Therefore, the present inventors have developed a device in which the position is determined not by the package mold but by the solder ball itself. This not only prevents the solder balls from being damaged, but also allows the insert to be shared even if the external shape is different, as long as the arrangement matrix of the solder balls is the same.

However, for example, when two types of ICs with different external shapes as shown in Fig. 28 and the same arrangement matrix of solder balls are mounted on one type of insert, it is difficult to hold by the above-mentioned latch 163. Become.

That is, if the IC is positioned with respect to the insert 16 by the solder ball, the height of the solder ball itself is extremely small, so that even a small vibration causes the IC to come off the guide. Therefore, the vertical clearance z between the latch 163 and the IC needs to be as small as possible. To achieve this, the tip of the latch 163 shown in FIG.

However, when the tip of the latch 163 is extended, the opening / closing amount X when the latch 163 is opened is reduced as shown in the lower diagram of the figure, and the outer shape is large as shown in FIG. IC and small IC cannot be held on the same Absent.

However, if the rotation angle of the latch 163, that is, the pushing amount of the lever plate 162 is increased, the opening / closing amount X of the latch 163 is also increased, but the pushing amount of the lever plate 162 is determined by the test of the handler. It is difficult to increase due to process constraints. In addition, the opening / closing amount X of the latch 163 increases even if the rotation center of the latch 163 is moved downward in the figure, but if the rotation center of the latch 163 is shifted downward, the insert itself is lowered. It may interfere with other mechanisms during transportation to the test process etc.

On the other hand, when testing a ball grid array (BGA) type IC, as shown in FIG. 29, the contact portion of the test head 104 appears and disappears due to a spring (not shown). It consists of a plurality of contact pins 51 provided as possible, and the tip of the contact pin 51 is a ball-shaped input / output terminal (hereinafter, also referred to as a solder ball HB) of the IC under test as shown in part B of FIG. A conical concave portion 5 la corresponding to the above is formed. In the conventional electronic component test apparatus, the position of the IC to be tested and the contact pins 51 are aligned using the outer peripheral shape of the IC package mold PM. However, in IC such as a chip size package (CSP), the dimensional accuracy of the package mold PM is extremely rough, and the positional accuracy between the outer peripheral shape and the solder ball HB is not necessarily guaranteed. Therefore, when positioning is performed on the outer periphery of the IC package 4 PM; PM, the solder ball HB is pressed in a state of being shifted with respect to the contact pin 51 as shown in the C section of FIG. Then, the sharp tip of the contact bin 51 may damage the solder pole HB.

In addition, even if the outer shape of the package mold PM is precisely dimensioned, if the outer shape is used for positioning, even if the solder ball HB has the same matrix, the outer shape will be smaller. If they are different, it will be necessary to replace even the test tray insert, which will increase the test cost.

Also, in order to avoid damage to the solder balls HB due to the contact pins 51 even for ICs other than chip-size package ICs, before pressing the IC under test to the contact pins 51 of the test head. Then, release the IC under test at the socket, and once Since the positioning was performed, there was a problem that the index time of the IC test apparatus became long. Disclosure of the invention

A first object of the present invention is to provide an insert, a tray, and an electronic component test apparatus that are excellent in holding an electronic device under test.

A second object of the present invention is to provide an insert for an electronic component testing apparatus which is excellent in positioning accuracy of an IC under test to a contact portion and excellent in versatility of components.

(1-1) In order to achieve the first object, according to a first aspect of the present invention, a tray on which an electronic component under test is mounted and which is routed inside an electronic component test apparatus is provided so as to be finely movable. It is an insert that can be

A latch unit that moves between a position where the electronic device under test accommodated in the insert is held over the upper surface of the electronic device under test and a position where the electronic device is retracted from the upper surface of the electronic device under test; A tip end of the latch portion and a rotation center of the latch arm portion are disposed on substantially the same vertical line in a side view of the insert,

An insert is provided in which the latch portion and the center of rotation of the latch arm portion are offset from each other in a plan view of the insert.

At this time, although not particularly limited, it is more preferable to have an elastic body that urges the latch arm in a direction in which the latch portion moves to the holding position.

In the insert of the present invention, when holding and releasing the electronic device under test, the latch portion and the rotation center of the latch arm portion are arranged on substantially the same straight line in a side view, so that the rotation angle of the latch arm portion is reduced. Even if it is small, the opening / closing amount (difference between the holding position and the retracted position) of the leading end of the latch portion geometrically increases. Thus, also _c can be the size of the package one Jimorudo is mounted different electronic components on the same insert, in the insert of the present invention, since the rotation center of the latch portion and the latch arm is Ofusedzuto in plan view However, the latch arm does not hinder the insertion and removal of electronic components into and out of the insert. Although not particularly limited in the above invention, the point of force of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, via a lever plate provided on the insert body. Thus, the external force acts on the force point (see FIGS. 6 and 11), or alternatively, the force point of the latch arm is provided on the opposite side of the rotation center of the latch arm to the latch. Alternatively, a configuration may be adopted in which an external force acts directly on the force point (see FIG. 12).

(1-2) In order to achieve the first object, according to a second aspect of the present invention, a tray on which an electronic component under test is mounted and which is routed in an electronic component test apparatus is provided so as to be finely movable. Insert that can be

A guide core movably provided with respect to the insert body, on which the electronic component under test is mounted;

A latch portion that moves between a position that covers the upper surface of the electronic component under test stored in the insert and a position that retracts from the upper surface of the electronic device under test; and a latch that rotatably supports the latch portion on the insert body. An insert comprising: a latch mechanism having an arm; and an interlocking mechanism for interlocking the movement of the guide core with respect to the insert body and the movement of the latch.

At this time, it is preferable that, after separating the guide core from the insert main body, the drive mechanism moves the latch portion to the retreat position. Further, it is preferable that the linkage mechanism moves the latch portion to a holding position, and then causes the guide core to approach the insert body.

In the insert of the present invention, when the electronic component is held and released by the latch mechanism, the guide core on which the electronic component is mounted is also moved toward and away from the insert body.

That is, when mounting electronic components, the latch part is moved to the retracted position, the electronic components are mounted with the guide core moved to the separated position, and then the latch is moved to the holding position. Move the guide core closer to the insert body. That is, at least when the latch is closed, the guide core is at the separated position, so that even if the thickness of the electronic component is different, the latch does not interfere with the electronic component.

When removing electronic components, the latch part is in the holding position and the guide core is in the approaching position. In the state above, first move the guide core away from the insert body, and then move the latch part to the retracted position. That is, since the guide core is at the separated position at least when the latch portion is opened, the latch portion does not interfere with the electronic component even if the thickness of the electronic component is different.

Thus, according to the insert of the present invention, electronic components having different package mold thicknesses can be mounted on the same insert.

(1-3) The electronic component under test applied in the present invention is not particularly limited, and includes all types of electronic components. In particular, the terminal of the electronic component under test is a ball-shaped terminal. The effect is particularly remarkable when applied to ball grid array type ICs. At this time, the insert of the present invention preferably has a guide for contacting and positioning the terminal of the electronic component under test.

In this way, instead of positioning the package mold of the electronic device under test, the terminal itself pressed against the contact portion is directly positioned by the guide, thereby positioning the terminal of the electronic device under test with respect to the contact portion. Accuracy is remarkably improved, and terminal damage can be prevented.

In addition, if the arrangement matrix of the terminals of the electronic components under test is common, the insert can be shared even if the package mold shape is different, and it takes time for setup work such as production and replacement of special parts. Cost can be reduced.

As long as this type of guide has a function of contacting and positioning the terminal of the electronic component under test, its shape, set position, number, material, etc. are not particularly limited. Is included.

For example, the guide may be a hole into which a ball-shaped terminal of a ball grid array type IC is fitted. In this case, all the ball terminals may be provided with holes to be fitted respectively, or some of the ball terminals may be provided with holes to be fitted respectively. Further, in addition to the means for fitting one ball-shaped terminal into one hole, one end of one ball-shaped terminal and one end of another ball-shaped terminal are fitted into one hole. It can also be done. The “hole” mentioned here is intended to include not only a through-hole penetrating the guide core but also a concave portion not penetrating the guide core.

(1-4) In order to achieve the first object, according to a third aspect of the present invention, There is provided a tray for carrying the electronic device under test into the contact portion of the test head of the slave component test apparatus and carrying the electronic component under test, the tray having the insert.

(1-5) In order to achieve the first object, according to a fourth aspect of the present invention, a test is performed by pressing a terminal of an electronic component under test against a contact portion of a test head. An electronic component test apparatus is provided, which has the above tray.

(2-1) In order to achieve the second object, according to a fifth aspect of the present invention, a tray on which an electronic component under test is mounted and which is routed inside the electronic component test apparatus is provided so as to be finely movable. It's an incredible

An insert is provided which has a first guide for contacting and positioning a terminal of the electronic component under test, and having a guide core movably provided with respect to the insert body.

In the insert of the present invention, the terminal itself pressed against the contact portion is directly positioned by the first guide, not the package mold of the electronic device under test. The positioning accuracy of the terminals is remarkably improved, and damage to the terminals can be prevented.

In this case, the first guide for positioning the terminal of the electronic device under test is formed on the guide core provided so as to be finely movable with respect to the insert main body. If there is a mounting error between the two, it can be absorbed by the fine movement of the guide core.

As a result, the step of correcting the position of the electronic component under test before pressing it against the contact portion becomes unnecessary, and the index time of the electronic component test apparatus can be reduced.

In addition, if the arrangement matrix of the terminals of the electronic components under test is common, the insert can be shared even if the package mold shape is different, and the cost required for setup work time such as production and replacement of dedicated parts is reduced. Can be reduced.

Furthermore, even when the arrangement matrices of the electronic components under test are different, it is sufficient to replace only the guide core, and the insert body can be shared, so that the cost required for manufacturing the dedicated components can be reduced. (2-2) Although not particularly limited in the above invention, the guide core may include a second guide for positioning the electronic component test apparatus with a carrier for picking up the electronic component under test. More preferred.

By using the second guide to position the electronic component test device with the pic carrier, the tray body and insert body can be used when placing the electronic device under test on the tray and removing the electronic device under test from the tray. Regardless of the positional relationship (position error) between the pickup carrier and the pickup carrier, the positional accuracy between the peak carrier and the guide core can be ensured. Therefore, if the electronic device under test is accurately held by the pickup transporter, the electronic device under test can be mounted at the correct position on the guide core.c Also, the electronic device under test can be mounted accurately on the guide core. If this is done, it can be accurately held by the pick-up transfer device, and the electronic device under test can be transferred to the mounting destination with high accuracy.

(2-3) Although not particularly limited in the above invention, it is more preferable that the guide core has a third guide for positioning the test head of the electronic component test apparatus with a contact portion.

By using the third guide to position the test head against the contact part, when pressing the terminals of the electronic component under test against the contact part, the positional relationship between the tray body or insert body and the contact part ( Regardless of the position error), the positional accuracy between the contact portion and the guide core can be ensured. As a result, the terminal of the electronic component under test is correctly pressed against the contact portion, thereby preventing damage to the terminal and the like.

(2-4) Although not particularly limited in the above invention, it is more preferable that the second guide and the third guide are constituted by a common hole or pin.

(2-5) The electronic component under test applied in the present invention is not particularly limited, and includes all types of electronic components. In particular, a so-called ball grid array in which the terminals of the electronic component under test are ball-shaped terminals When applied to the mold IC its effect is also particularly significant _c, a first guide in the present invention, as long as it has a function of positioning them in contact with the terminals of the device under test, the shape, the set position The number, material, etc. are not particularly limited, and include all.

For example, as a first guide, the ball-shaped terminals of a ball grid array IC Can be mentioned. In this case, all the ball-shaped terminals may be provided with holes for fitting each, or some of the pole-shaped terminals may be provided with holes for fitting. Furthermore, in addition to the means for fitting one ball-shaped terminal into one hole, one hole may be fitted with one end of one ball-shaped terminal and one end of another ball-shaped terminal. it can. The “hole” mentioned here is intended to include not only a through hole penetrating the guide core but also a concave portion not penetrating the guide core.

(2-6) In order to achieve the second object, according to a sixth aspect of the present invention, an electronic component under test is loaded into a contact portion of a test head of an electronic component test apparatus. A tray for carrying the same is provided, the tray having the insert.

(2-7) Further, in order to achieve the second object, according to a seventh aspect of the present invention, an electronic component for performing a test by pressing a terminal of an electronic component under test against a contact portion of a test head. An electronic component test apparatus having the above-mentioned tray is provided.

In this case, before mounting the electronic component under test on the tray, the electronic device further includes a precisor that corrects a position of the electronic component under test, wherein the precisor contacts a terminal of the electronic component under test and contacts the terminal. A fourth guide for positioning; and, when positioning the electronic component under test by the fourth guide, guiding a portion other than the terminal of the electronic component under test to connect the terminal of the electronic component under test to the terminal. More preferably, a fifth guide that matches the fourth guide is provided.

Further, in this case, it is more preferable that the precisor has a sixth guide for positioning with the transfer device for picking up the device under test.

The customer tray on which the electronic components under test are mounted often differs in the number and mounting pitch depending on the user, but the electronic components under test mounted on the customer tray are transported inside the electronic component test equipment. It is necessary to change the pitch when changing to a new tray. The precisor of the present invention is preferable for use in this kind of pitch change and other attitude corrections of the electronic device under test.

In particular, according to the present invention, when the electronic component under test is placed on the presizer, first, a portion other than the terminal is guided by the fifth guide, and the terminal of the electronic component is connected to the fourth guide. Match. As a result, the position of the electronic component transferred to the precisor is accurately determined, and if the electronic component with the position accuracy thus secured is held by the peak transfer machine using the sixth guide, the holding of the electronic component is maintained. Position accuracy will increase.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention,

FIG. 2 is a flow chart of a tray showing a method of handling the electronic component under test in the electronic component test apparatus of FIG.

FIG. 3 is a perspective view showing the structure of the IC stocking force of the electronic component test apparatus of FIG. 1, FIG. 4 is a perspective view showing a scrap tray used in the electronic component test apparatus of FIG. 1, and FIG. 5 is the electronic component of FIG. Partially exploded perspective view showing a test tray used in a test apparatus,

FIG. 6 is an exploded perspective view showing an embodiment of the insert of the present invention,

FIG. 7 is a plan view of the insert shown in FIG. 6,

Fig. 8 is a sectional view along the line VIII-VIII in Fig. 7 (latch closed),

Fig. 9 is a cross-sectional view (latch open) along the line VII I-VI II in Fig. 7.

FIG. 10 is a sectional view showing the structure of the pusher, insert, socket guide and contact pin in the test board of FIG. 1,

FIG. 11 is an exploded perspective view showing another embodiment of the insert of the present invention,

FIG. 12 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 13 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 14A to FIG. FIG. 13 is a cross-sectional view taken along the line XIV-XIV of FIG.

FIG. 15 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 16 is an exploded perspective view showing still another embodiment of the insert of the present invention, and FIG. Sectional view along the line XVII-XVII,

FIG. 18 is a cross-sectional view in which the XVI II portion of FIG. 17 is enlarged.

FIG. 19 is a perspective view of an essential part for explaining a method of replacing electronic components in the electronic component test apparatus of FIG. 1,

FIG. 20 is a sectional view showing the structure of the pusher, insert, socket guide and contact pin in the test head of FIG. 1, FIG. 21 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 22 is a cross-sectional view taken along the line XXII-XXII of FIG. 21,

FIG. 23 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 24 is a sectional view taken along line XXIV-XXIV of FIG. 23,

FIG. 25A is a perspective view showing another embodiment of the guide core according to the present invention,

FIG. 25B is a cross-sectional view taken along the line XXVB-XXVB of FIG. 25A,

FIG. 26A is a perspective view showing still another embodiment of the guide core according to the present invention, FIG. 26B is a sectional view taken along the line XXVIB-XXVIB of FIG. 26A,

FIG. 27 is a cross-sectional view showing a conventional insert.

FIG. 28 is a side view showing a general ball grid array type IC.

FIG. 29 is a perspective view showing a general contact pin (socket).

FIG. 30 is a cross-sectional view of a principal part showing a contact state between an IC ball terminal and a contact focus. BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 2 is a diagram for understanding a method of handling electronic devices under test (hereinafter, also simply referred to as ICs or ICs) in the electronic device testing apparatus of the present embodiment. There is also a part in which the members arranged in are shown in plan. Therefore, its mechanical (three-dimensional) structure will be explained with reference to Fig. 1¾.

[First Embodiment]

The electronic component test apparatus 1 of the present embodiment tests (inspects) whether or not an IC under test is properly operated in a state where a high or low temperature stress is applied to the IC under test or in a state where no temperature stress is applied. This is a device that classifies ICs according to the test results. An operation test with or without temperature stress is performed on a tray on which a large number of ICs to be tested are mounted (hereinafter referred to as “cassettes”). The test IC is mounted on the test tray TST (see Fig. 5) which is transported inside the electronic component test equipment 1 from Fig. 4).

For this reason, as shown in FIGS. 1 and 2, the electronic component test apparatus 1 of the present embodiment stores ICs to be tested from now on, and classifies and stores tested ICs. An IC storage unit 2000, a port unit 300 for sending an IC under test sent from the IC storage unit 200 into the chamber unit 100, and a chamber unit 100 including a test head. And an unloader unit 400 that classifies and extracts tested ICs that have been tested in the chamber unit 100.

I C storage unit 2 0 0

The IC storage unit 200 stores the pre-test IC stocker 201 for storing the IC under test before the test, and the tested IC storage capacity 202 for storing the ICs under test classified according to the test results. Are provided.

As shown in FIG. 3, the pre-test IC stock force 201 and the tested IC stocker 202 intrude from the frame-shaped tray support frame 203 and the lower portion of the tray support frame 203. And an elevator 204 capable of ascending and descending upward. On the tray support frame 203, a plurality of waste trays KST are stacked and supported, and only the stacked waste trays KST are moved up and down by the elevator 204.

The pre-test IC stocker 201 holds the stack of trays KST containing the ICs to be tested, while the tested IC stocker 202 holds the test tray. The customer tray KST, in which the IC under test has been appropriately classified, is stored in a stacked state.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the number of the pre-test IC stocker 201 and the number of the tested IC stocker 202 are different. The number can be appropriately set as needed.

In the example shown in FIGS. 1 and 2, two stoker STK-Bs are provided in the pre-test stoker 201, and two empty stokers STK-E to be sent to the unloader unit 400 are provided next to the stoker 201. Tested IC stoker 202 is provided with eight stoker STK-1, STK-2,…, STK-8 so that they can be sorted into up to eight categories according to test results and stored. In other words, besides the good and bad products, the products are classified into high-quality products, medium-speed products, low-speed products, and defective products that require retesting.

Loader section 3 0 0 The above-described waste tray KST is mounted on the window 300 of the loader unit 300 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. It is carried from below 0 5. Then, in the loader section 300, the IC under test loaded in the waste tray KST is once transferred to a preciser 305 by the XY transfer device 304, where the IC under test is loaded. After correcting the mutual positions, the IC under test transferred to the precisor 305 is again transferred to the test tray TS stopped at the loader section 300 by using the XY transfer device 304. Transship.

As shown in Fig. 1, the IC transport device 304 that transfers the IC under test from the waste tray KST to the test tray TST includes two rails 301 mounted on the upper part of the device board 105, as shown in Fig. 1. The movable arm 302, which can reciprocate between the test tray TST and the waste tray KST by using the two rails 301 (this direction is defined as the Y direction), and the movable arm 302, And a movable head 303 that can be moved in the X direction along the movable arm 302.

A suction head (detailed illustration is omitted) is mounted on the movable head 303 of the XY transfer device 304 in a downward direction, and the suction head removes air. By moving while aspirating, the IC under test is sucked from the waste tray KST, and the IC under test is transferred to the test tray TST. For example, about eight such suction heads are mounted on the movable head 303, and eight ICs to be tested can be transferred to the test tray TST at a time.

Chamber section 1 0 0

In the above-described test tray T S, the I C under test is loaded in the loader unit 300 and then sent to the chamber unit 100, and each I C under test is tested while being mounted on the test tray T ST.

The chamber section 100 is provided with a constant temperature chamber 101 for applying a desired high or low temperature thermal stress to the IC under test loaded on the test tray TST, and a state in which the thermal stress is applied to the constant temperature chamber 101. The IC under test in contact with the test head 104 is brought into contact with the test chamber 102 and the heat removal tank 100 that removes the applied thermal stress from the IC under test tested in the test chamber 102 It consists of three. In the heat removal tank 103, when the high temperature is applied in the constant temperature bath 101, the IC under test is cooled by blowing air to return it to room temperature. If is applied, heat the IC under test with warm air or heat and cool it to a temperature that does not cause condensation. Then, the heat-removed IC under test is carried out to the unloader section 400.

As shown in FIG. 1, the constant temperature bath 101 and the heat removal bath 103 of the chamber section 100 are arranged so as to protrude above the test chamber 102. In addition, thermostat 1

As shown conceptually in FIG. 2, a vertical transfer device is provided at 01, and a plurality of test trays TST are supported by this vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby period, high or low temperature thermal stress is applied to the IC under test.

In the test chamber 102, a test head 104 is arranged at the center thereof, and a test tray TST is carried on the test head 104, and an input / output terminal HB of the IC under test is connected. The test is performed by making electrical contact with the contact bin 51 of the test head 104. On the other hand, the test tray T ST after the test is completed

After the heat is removed at step 3, the temperature of the IC is returned to room temperature, and then discharged to the unloader section 400.

In addition, an apparatus substrate 105 is inserted in front of the constant temperature bath 101 and the heat removal tank 103 as shown in FIG. 1, and a test tray transport device 108 is mounted on the apparatus substrate 105. It is installed. The test tray TS discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 receives an unloader unit 400 and a loader unit 300 through the test tray TS. Is returned to the thermostat 101.

FIG. 5 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment.

In the test tray TST, a plurality of bars 13 are provided in parallel at equal intervals on a rectangular frame 12, and sides 12 aJ of the frame 12 facing both sides of the bars 13 and the bars 13 are provided. A plurality of mounting pieces 14 are formed so as to protrude at equal intervals. An insert storage portion 15 is constituted by the space between these holes 13 and between the bar 13 and the side 12a, and the two mounting pieces 14. Each insert storage part 15 is designed to receive one insert 16, and this insert 16 is floating on two mounting pieces 14 using fasteners 17 (fine movement possible). State). For this purpose, holes 16 for attachment to the attachment pieces 14 are formed at both ends of the insert 16 respectively. For example, about 16 × 4 inserts 16 are attached to one test tray TST.

Each of the inserts 16 has the same shape and the same dimensions. Each of the inserts 16 has an IC storage section 19 in which an IC to be tested is stored. The details will be described later.

Here, the IC under test connected to the test head 104 at a time is, for example, every four columns if the IC under test is arranged in 4 rows × 16 columns as shown in FIG. At this time, four rows of ICs under test are tested simultaneously. In other words, in the first test, 16 ICs to be tested arranged every four rows from the first row are connected to the contact pins 51 of the test head 104, and the second test is performed. In the test, the test tray TST is moved by one row, and the ICs under test arranged in every fourth row from the second row are tested in the same manner. This test is repeated four times to test all the ICs under test (so-called 16 simultaneous measurements). The results of this test, for example, the identification number assigned to the test tray TST, _c is Adoresu in the storage determined by the number of the IC allocated inside the test tray TST

A guide hole 191 (a guide according to the present invention) having an opening as shown in FIG. 7 is formed in the IC housing portion 19, and the guide hole 1991 is formed in the IC under test. Some are formed corresponding to the positions of the solder balls HB of the ball grid array type IC. C Even if the size of the outer peripheral surface of the package mold is slightly different, the array matrix of the solder balls HB of the IC under test A small gap S is formed on the bottom surface of the IC housing portion 19 so that the solder ball HB can smoothly fit into the guide hole 19 1 without any obstacle as long as .

Incidentally, the guide hole 19 1 shown in the figure is configured as one opening so that only the outermost solder ball HB of the solder balls HB of the BGA type IC is fitted. The guide can take various forms other than the above. For example, many guide holes are provided in the IC so that all the solder balls HB of the BGA type IC fit. A through hole may be provided on the bottom of the housing portion 19 so that the contact pin 51 can contact all the solder balls HB from below. Also, a guide hole 191, in which, for example, only two rows of solder balls HB from the outside of the BGA type IC solder balls HB are fitted, is provided on the bottom surface of the IC housing portion 19, and other solder balls HB are provided. An opening may be formed at the center of the bottom surface of the IC housing portion 19 so that the contact pin 51 can also be brought into contact.

In particular, the insert 16 of the present embodiment has a launch mechanism including the latch 163, the coil panel 1664, and the pin 165 shown in FIG. The latch 163 of this latch mechanism has a latch 1613a formed at one end, a latch arm 1663d is connected to the latch 1613a, and a power point 1663c is provided on the latch arm 1663d. Have been. In addition, a through hole serving as a rotation center 163b is formed in the launch arm 1613d between the launch 163a and the point of force 163c, and a pin 1665 is provided here. By being inserted, the latch 1613 is rotatably supported by the insert body 161.

As shown in FIG. 8, the latch portion 1663a of the latch 163 covers a top surface of the IC mounted in the IC housing portion 19 to prevent the IC from jumping out (hereinafter referred to as a holding position or closing position). ) And a position where the IC can be retracted from the top of the IC as shown in Fig. 9 and the IC can be inserted and removed (hereinafter also referred to as a retracted position or an open position). ing.

On the other hand, the power point 16 3 c of the arm portion 16 3 d comes into contact with a lever plate 16 2, which will be described later, and an external force is applied from the power point 16 3 c as the lever plate 16 2 moves up and down. Is input, which causes the latch 163 to open.

In the latch mechanism of the present embodiment, when viewed from the side of the insert 16 shown in FIG. 8, the tip of the latch 162a and the rotation center 1663b of the latch arm 1663d are substantially aligned. They are arranged on the same vertical line. Thus, even when the lever plate 162 moves up and down by about 1.5 mm, the opening / closing movement amount D of the tip of the latch portion 1663a shown in FIG. 8 increases. Further, in the latch mechanism of the present embodiment, in a plan view of the insert 16 shown in FIG. 7, the latch arm 1613 d is located at a position offset from the latch 163 a, that is, the IC housing 19. It is provided in. As a result, the IC can be moved in and out of the IC housing 19 without any interference. Wear. The coil panel 164 interposed between the other end of the latch arm 16 d and the insert body 16 1 is used when the external force from the lever plate 16 2 is not acting. 3 is an elastic body for maintaining the holding position shown in FIG. 8, and when the test tray TST is being conveyed or the like, the IC is held by the latch portion 163a to prevent the IC from jumping out. .

The lever plate 16 2 provided on the insert 16 is urged to the raised position shown in FIG. 8 by the coil panel 16 6 provided between the insert body 16 1 and the lever plate 16 2. By engaging the convex portion 162a formed on the insert main body 61 with the concave portion 1661a formed on the insert main body 61, the upper limit of the ascending position is regulated.

Fig. 10 shows the structure of the socket 50 having the pusher 30, the insert 16 (test tray TST side), the socket guide 40, and the contact pin 51 in the test head 104 of the same electronic component test apparatus. The pusher 30 is provided on the upper side of the test head 104, and moves up and down in the Z-axis direction by a Z-axis driving device (for example, a fluid pressure cylinder) not shown. The pushers 30 are attached to the Z-axis drive device according to the interval of the ICs to be tested at one time (in the above-described test tray, 16 rows of 4 rows and 4 rows in total). .

In the center of the pusher 30, a presser 31 for pressing the IC under test is formed, and on both sides thereof, guides 20 to be inserted into a guide hole 20 of an insert 16 and a guide bush 41 of a socket guide 40 described later. Dobin 32 is provided. A stopper guide 33 is provided between the presser 31 and the guide pin 32 to regulate the lower limit when the pusher 30 is lowered by the Z-axis driving means. By contacting the stopper guide 33 with the stopper surface 42 (only one side is shown) of the socket guide 40, the lower limit position of the pusher to be pressed with an appropriate pressure that does not destroy the IC under test is determined.

The insert 16 is attached to the test tray TST using the fastener 17 as described with reference to FIG. 5, and the guide bin 32 and the pusher 30 described above are provided on both sides thereof. A guide hole 20 into which the guide bush 41 of the socket guide 40 is inserted from above and below is formed. Under pusher 30 In the descending state, the upper half of the guide hole 20 on the left side of the figure is a small-diameter hole in which the guide bin 32 of the pusher 30 is inserted and positioning is performed, and the lower half is the guide bush 40 of the socket guide 40. It is a large-diameter hole into which 1 is inserted for positioning. Incidentally, the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted.

On the other hand, on both sides of the socket guide 40 fixed to the test head 104, two guide bins 32 of the pusher 30 are inserted, and between the two guide bins 32, A guide bush 41 for positioning is provided, and the left side of the guide push 41 also performs positioning with the insert 16. A socket 50 having a plurality of contact bins 51 is fixed to a lower side of the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown). Therefore, even if the IC under test is pressed, the contact pins 51 are retracted to the upper surface of the socket 50, and even if the IC under test is pressed with a slight inclination, the contact bins 51 are attached to all the ball terminals HB. You can make contact.

Unloader section 4 0 0

The unloader section 400 is also provided with X—Y transfer apparatuses 400 and 404 having the same structure as the X—Y transfer apparatus 304 provided in the loader section 300. The tested ICs are transferred from the test tray TST carried out to the unloader section 400 to the waste tray KST by the devices 404 and 404.

As shown in FIG. 1, the device board 105 of the unloader unit 400 is arranged such that the waste tray KST carried to the unloader unit 400 faces the upper surface of the device board: I05. Two pairs of windows 406 and 406 are provided.

Although not shown, a lifting table for raising and lowering the tray KST is provided under each window 406, and the tested IC under test is provided here. After loading the refilled waste tray KST, it descends and transfers this full tray to the tray transfer arm 205.

Incidentally, in the electronic component test apparatus 1 of the present embodiment, Although there are a maximum of eight types, only a maximum of four power trays KST can be placed in the window section 400 of the door opening section 400. Therefore, the categories that can be sorted in real time are limited to four categories. Generally, non-defective products are classified into three categories: high-speed response element, medium-speed response element, and low-speed response element. Some categories, such as things, do not belong to these categories.

As described above, when an IC under test that is classified into one of the categories other than the category one assigned to the four waste mats KST arranged in the window part 400 of the unloader part 400 occurs, One customer tray KST is returned to the IC storage unit 200 from the unloader unit 400, and a custom tray KST to store the newly generated IC under test of category 1 is unopened instead. It is sufficient to transfer the data to the header section 400 and store the IC under test. However, if the replacement of the waste tray K ST is performed during the sorting operation, the sorting operation must be stopped during that time, and there is a problem that the throughput is reduced. For this reason, in the electronic component test apparatus 1 of the present embodiment, a buffer section 405 is provided between the test tray TST of the unloader section 400 and the window section 406, and this buffer section 405 is rarely provided. We temporarily store ICs under test in categories that only generate the test.

For example, the buffer section 405 has a capacity capable of storing about 20 to 30 ICs under test, and the category of the IC stored in each IC storage position of the buffer section 405 is stored. A memory is provided, and the category and position of the IC under test temporarily stored in the buffer and buffer section 405 are stored for each IC under test. Then, during the sorting operation or when the buffer section 405 is full, the customer tray KST of the category to which the IC under test belongs in the buffer section 405 is called from the IC storage section 200, Put it in the waste tray KST. At this time, the IC under test temporarily deposited in the buffer section 405 may cover a plurality of categories, but in such a case, when calling the customer tray KST, a plurality of customer trays KS are unregistered at one time. It can be called to the window section 400 of the mouth section section 400. Next, the operation of the insert 16 will be described mainly with reference to FIGS. 8 and 9. For example, a case where an IC mounted on a test tray TST is taken out using an XY transfer device 304 will be described as an example. FIG. 8 shows a state in which the IC under test is mounted on the test tray TST. In this state, when the suction head of the XY transfer device 304 approaches each insert 16, one of the suction heads is obtained. The lever plate 16 2 is pushed down by the part. Along with this, the power point 163c of the arm 163d is also pushed down, and the arm 163d rotates clockwise about the rotation center 163b in the figure. In this example, it is about 20 °.

This state is shown in FIG. 9, but the latch section 1663a moves to a position completely retracted from the upper surface of the IC, whereby the IC can be held by the suction head. Note that Fig. 8 shows an IC with a large device size and an IC with a small device size. As shown in Fig. 8, as long as the arrangement matrix of the solder balls HB is the same, the size of the package is the same. However, even if they are different, they can be completely held by the latch part 163a of this example.

FIGS. 11 and 12 show a modification of the first embodiment. In the insert 16 shown in FIG. 11, the elastic body interposed between the radial section 16 3 d and the insert body 16 1 is a wound spring 16 4, which is used as the rotation center 16 3 It is attached to b. The insert shown in FIG. 12 has a configuration in which the lever plate 162 is omitted and the force point 1663c of the arm portion 1663d is directly pressed down. The other configuration is the same as that of FIG. 6 described above, and thus the same reference numerals are given and the detailed description is omitted.

[Second embodiment]

According to the insert 16 of the above-described first embodiment, as shown in FIG. 8, both the IC having a large device size and the IC having a small device size can be mounted on the same insert 16. In addition, since the clearance between the tip of the latch portion 163a and the upper surface of the IC can be reduced as much as possible, even if the positioning is performed by the solder ball HB, it does not deviate from the guide hole 191.

However, in the insert of the first embodiment described above, if an attempt is made to mount a thick IC and a thin IC on the same insert, the thick IC is used. There is a risk that the tip of the latch part 163a may interfere with the IC when placed. Although interference can be avoided by using the clearance between the latch portion and the top surface of the IC when a thick IC is mounted as a reference, the clearance increases when a thin IC is mounted, and the solder ball HB becomes a guide hole. 9 May deviate from 1.

In the second embodiment described below, ICs mainly having different thicknesses can be mounted on the same insert. As shown in FIG. 13, in the present embodiment, a guide core 1667 is mounted on the insert body 161 at the center of the insert 16 via pins 1-0. This pin 170 is attached at both ends to the insert body 16 1, and contacts the flange 1 67 1 of the guide core 16 7 as shown in the cross-sectional views of FIG. The guide core 167 is prevented from coming off, and the guide core 167 is three-dimensionally finely movable with respect to the insert body 161 and is provided in a so-called floating state.

A guide hole 1 71 (a guide according to the present invention) formed of an opening is formed in the guide core 1 67, and the guide hole 1 Ί 1 is used for soldering a ball grid lay type IC which is an IC under test. It is formed corresponding to the position of the ball HB. Even if the outer surface of the package mold is slightly different, as long as the arrangement matrix of the solder balls HB of the IC under test is the same, the solder balls HB can be smoothly inserted into these guide holes 17 1 without any obstacle. The bottom surface of the guide core 167 is formed relatively wide so that it can be fitted into the boss.

By the way, the guide hole 17 1 shown in the figure is formed as one opening so that only the outermost solder ball HB of the solder ball HB of the BGA type IC fits. As with the guide hole 191 of the first embodiment described above, the guide according to the present invention may take various other forms.

Further, the guide core 1667 is provided with two guide holes 1672 into which the suction head guide bins of the XY transfer device 304 described above are fitted. When the feed bin fits into the guide hole 1 6 7 2 of the guide core 16 7, the suction head and the guide core 1 6 7 are directly connected regardless of the position error of the insert body 16 1 or the test tray TST itself. Will be aligned.

The guide hole 1667 of the guide core 1667 has a socket from below. Guide pins (not shown) can also be fitted.

Since the latch mechanism 16 3 has the same configuration as that of the first embodiment described above, the same reference numerals are given and the detailed description is omitted. However, in the present embodiment, the lever plate 16 2 Two pins 169 are mounted, and the flange 167 1 of the guide core 167 is mounted on the pins 169 as shown in FIGS. 14A to 14D. Between the guide core 1667 and the insert body 161, a coil spring 1668 that pushes the guide core 1667 downward in FIGS. 14 to 14D is interposed. The relationship between the vertical movement of the lever plate 16 2, the vertical movement of the guide core 16 7, and the opening and closing movement of the latch mechanism 16 3 is determined by Become.

First, when no external force is acting on the insert 16, the lever plate 16 2 rises with respect to the insert body 16 1, as shown in FIG. 14A. 3 is the closed position, and the guide core 16 7 is set to the raised position by the pin 16 9. At this time, the clearance H1 between the launch portion 1663a and the bottom surface of the guide core 1667 becomes the smallest. For example, by setting the thickness of the thinnest IC to H1, a thicker IC can be obtained. Also, the latch section 163a can be reliably maintained in the closed state, and the displacement of the IC can be prevented.

FIGS. 148 to 14D show a state in which the lever plate 162 gradually descends from the state of FIG. 14A. First, since the clearance of H2 is set between the lever plate 162 and the power point 163c of the radial section 163d, the lever plate 162 has only H2. Until it descends, the latch mechanism 163 does not operate. On the other hand, since the guide core 1667 is supported by the pin 1669, when the lever plate 162 moves down by H2, the guide core 1667 also moves down by H2. FIG. 14B shows a state in which the lever rate 16 2 has dropped by H 2. In this state, the clearance between the latch 163a and the bottom surface of the guide core 1667 is H1 + H2 from the initial H1.

When the lever plate 16 2 further descends, the power point 16 3 c of the arm portion is pushed down, and the latch portion 16 3 a starts to open. The guide core 167 also continues to descend to a position where the pin 169 is at the same height as the pin 170. This state is illustrated Shown in 14C.

As shown in FIG. 14D, when the lever plate 16 2 is lowered to the lower limit position, the latch 16 3 a is completely opened, and the IC can be taken out. The guide core 167 is supported by the pin 1Ί0 and does not descend any further.

The operation when the IC is mounted is reversed. As described above, according to the insert 16 of the present embodiment, when the IC is taken out, the guide core 167 descends and a clearance is formed between the IC and the latch portion 163a. The latch part 1663a starts to open, and conversely, when mounting the IC, the guide core 1667 starts to rise after the latch part 1663a closes and moves to the position where it covers the top surface of the IC. However, the latch portion 16a does not interfere from the side of the IC, and the same insert 16 can be used even for ICs having different thicknesses.

The specific structure of the guide core 161 according to the present invention is not limited to that shown in FIG. 13 at all, and various other forms are conceivable. For example, in another embodiment shown in FIG. 15, a pin 169 is press-fitted into a guide core 167, and a long hole 162 b is formed in a lever plate 162.

[Third embodiment]

As shown in FIGS. 16 and 17, at the center of the insert 16, a guide core 161 is attached to the insert body via a pin 1613. This pin 16 13 only contacts the flange 16 1 4 of the guide core 16 1 as shown in the cross-sectional view of Fig. 17 to prevent the guide core 16 1 from coming off. The core 16 1 is three-dimensionally movable with respect to the insert body. It is provided in a so-called floating state.

The guide core 16 1 is formed with a guide hole 16 1 2 (first guide according to the present invention) having an opening as shown in FIG. It is formed corresponding to the position of the solder ball HB of the ball grid array type IC which is the IC under test. Even if the outer peripheral surface of the package mold PM has a slightly different size, the solder balls HB will not fit into the guide holes 1612 as long as the arrangement matrix of the solder balls HB of the IC under test is the same. To fit smoothly without any obstacles In addition, a slight gap S is formed on the bottom surface of the guide core 16 1.

By the way, the guide hole 1612 shown in the figure is formed as one opening so that only the outermost solder ball HB of the 60 type 1C solder balls HB is fitted. However, the first guide of the present invention may take various forms other than the above. In another embodiment shown in FIGS. 25A and 25B, a guide hole 1612 into which all the solder balls HB of the BGA type IC are fitted is provided on the bottom surface of the guide core 161, This is an example in which a through hole is provided so that the contact pin 51 can contact the solder pole HB from below.

In another embodiment shown in FIGS. 26A and 26B, a guide hole 161 into which only two rows of solder balls HB from the outside among the solder balls HB of the BGA type IC fit. 2a is provided on the bottom of the guide core 161, and an opening 161-2b is formed at the center of the bottom of the guide core 161, so that the contact bin 51 can contact other solder balls HB. This is an example of forming.

In addition, the guide core 161 has two guide holes 1611 (the second guide and the third guide according to the present invention) into which the above-mentioned guide pins 3001 of the suction head 307 are fitted. The guide hole of the suction head 307 is a guide hole of the guide core 161 as shown by the two-dot chain line in FIG. When mated with 11, the suction head 307 and the guide core 161 are directly aligned regardless of the position error of the insert body or the test tray itself. It should be noted that the guide hole 52 of the socket (see FIG. 19 or FIG. 20) can be fitted into the guide hole 1611 of the guide core 1611 from below. That is, the guide hole 1611 also constitutes the third guide according to the present invention. The specific structure of the guide core 161 according to the present invention is not limited to the one shown in FIG. 16 at all, and various other forms are conceivable.

Another embodiment shown in FIGS. 21 and 22 does not use the pin 16 13, but instead forms a flexible hook 16 15 on the guide core 16 1, The hook 16 15 is engaged with the insert body. Also in this example, the guide core 16 1 is three-dimensionally finely movable with respect to the insert body. It is provided in a so-called floating state. In the other embodiments shown in FIGS. 23 and 24, a pin 1616 is used instead of the pin 1613, and in this example, the pin 1616 is also used. By taking the dimensions into consideration, the guide core 16 1 is three-dimensionally movable with respect to the insert body. It is provided in a so-called floating state.

Figure 20 shows the structure of socket 50 having pusher 30, insert 16 (test tray TST side), socket guide 40 and contact pin 51 in test head 104 of the same electronic component testing apparatus. The pusher 30 is provided on the upper side of the test head 104, and moves up and down in the Z-axis direction by a Z-axis driving device (for example, a fluid pressure cylinder) not shown. The pushers 30 are attached to the Z-axis drive device according to the interval of the ICs to be tested at one time (in the above-described test tray, 16 rows of 4 rows and 4 rows in total). .

At the center of the pusher 30, a presser 31 for pressing the IC under test is formed, and on both sides thereof, a guide hole 20 of an insert 16 and a guide bush 41 of a socket guide 40 described later are inserted. Guide bins 32 are provided. Further, a stopper guide 33 is provided between the presser 31 and the guide bin 32 to regulate the lower limit when the pusher 30 is lowered by the Z-axis driving means. By contacting the stopper guide 33 with the stopper surface 42 (only one side is shown) of the socket guide 40, the lower limit position of the pusher pressed with an appropriate pressure that does not destroy the IC under test is determined.

The insert 16 is attached to the test tray TST using the fastener 17 as described with reference to FIG. 5, and the guide bin 32 and the pusher 30 described above are provided on both sides thereof. The guide bush 41 of the socket guide 40 is formed with a guide hole 20 into which the guide bush 41 is inserted up and down, and then inserted. When the pusher 30 is lowered, the upper half of the guide hole 20 on the left side of the figure is a small-diameter hole into which the guide pin 32 of the pusher 30 is inserted and positioning is performed, and the lower half is a socket guide. The guide bush 41 of the guide 40 is inserted into a large-diameter hole for positioning. Incidentally, the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted. On the other hand, two guide bins 32 of the pusher 30 are inserted on both sides of the socket guide: fixed to the test head 104, between the two guide bins 32. A guide bush 41 is provided for positioning by using the guide bush 41. The guide bush 41 on the left side also performs positioning with the insert 16. A socket 50 having a plurality of connection bins 51 is fixed to the lower side of the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown). Therefore, even if the IC under test is pressed, the contact bin 51 retreats to the upper surface of the socket 50, while even if the IC under test is pressed with a slight inclination, the contact pins 51 are connected to all the ball terminals HB. Can be contacted. At the tip of the contact pin 51, a substantially conical recess 51a for accommodating the solder ball HB of the ball grid array type IC is formed (see FIG. 28).

In addition, the socket 50 is provided with a guide bin 52 that fits into the guide hole 16 1 1 of the guide core 16 1 mounted in a floating state on the insert 16, and the pusher 30 descends. When the insert 16 is also lowered, the guide core 16 1 is positioned by the guide pin 52 irrespective of the presence or absence of a position error of the insert 16, and thereby the ball terminal HB of the IC and the contact bin 51 are connected. Positioning can be performed accurately.

Next, the operation will be described mainly with reference to FIG.

First, the waste tray KS, which is full of ICs before the test, is transported from the IC stocker 201 to the window 300 of the mouth portion 300, where the XY transport device 304 is used. It can be reloaded into Precisor 3 05 by 8 pieces. When mounted on the waste tray KST, the position of the IC is extremely rough, and the suction 307 of the XY transfer device 304 sucks this and drops it into the precisor 305. In the precisor 305, the rough position of the IC is determined relatively accurately by the concave portion 310 corresponding to the outer shape of the package of the IC, and the bottom surface of the concave portion 305 is formed. The opening 305 formed in the hole guides the ball terminal HB of the IC, so that the position of the IC terminal with respect to the processor 305 is accurately determined.

Next, the IC positioned by using the same XY transfer device 304 is sucked. When the guide head 3 0 7 1 of the suction head 3 0 7 and the guide hole 3 ′ 0 5 3 of the presizer 3 0 5 are fitted, the suction head 3 0 7 and the presizer 3 0 5 Since the positional relationship between and is accurately determined, the IC is accurately attracted to the attracting head 307.

In this state, the movable arm 3002 and the movable head 303 of the XY transfer device 304 are operated to transfer the IC to one of the test trays TST16. Then, by lowering the suction head 307 and fitting the guide bin 307 into the guide hole 161 of the guide core 161 of the insert 166, the suction head 307 is formed. Align the 7 with the guide core 16 1 and release the IC in this state. Thereby, in IC, the ball terminal HB is engaged with the guide hole 1612 of the guide core 161.

When IC is transported to all the inserts 16, the test tray T ST is transported to the test process in the chamber 100. In this test process, the IC under test is mounted on the test tray TST shown in Fig. 5, and more specifically, each IC under test is dropped into the guide core 161 of the insert 16 in the same figure. It is conveyed to the upper part of the test head 104 in the inserted state.

When the test tray TST stops at the test head 104, the Z-axis drive device starts to operate, and one pusher 30 shown in FIG. 20 descends so as to correspond to one insert. Then, the two guide pins 32 and 32 of the pusher 30 pass through the guide holes 20 and 20 of the insert 16 respectively, and are further connected to the guide bushes 41 and 41 of the socket guide 40. Fit. Then, the guide bin 52 provided in the socket 50 is fitted into the guide hole 1611 of the guide core 16 1 c. Here, the test head 104 (that is, the electronic component tester 1 The socket 16 and the socket guide 40 fixed to the insert 16 and the socket 30 have some positional error, but the guide bin 32 on the left side of the pusher 30 has the insert 1 By fitting into the small diameter hole of the guide hole 20 of 6, the position of the pusher 30 and the insert 16 is adjusted, and as a result, the presser 31 of the pusher 30 moves the IC under test at an appropriate position. Can be imposed.

In addition, the large-diameter hole of the guide hole 20 on the left side of the insert 16 is the socket guide 40 By fitting into the guide bush 41 on the left side of the above, the position of the insert 16 and the socket guide 40 are adjusted, thereby increasing the positional accuracy between the IC under test and the contact pin 51.

In particular, in this embodiment and other modifications, as shown in FIG. 20, the solder ball HB of the IC under test is positioned by the guide hole 16 1 2 of the guide core 16 1 of the insert 16, and In addition, since the guide core 16 1 and the socket are positioned by the guide pin 52 and the guide hole 16 11, the positioning between the solder ball HB and the contact pin 51 can be realized with high accuracy. .

As described above, since the positional accuracy between the solder ball HB of the IC under test and the contact bin 51 is sufficiently obtained, the pusher guide 33 is pushed without any other alignment until the stopper guide 33 contacts the stopper surface 42. 30 is further lowered, and the IC under test is brought into contact with the contact pin 51 by the presser 31. While still in this state, perform the specified test.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

Claims

Scope of word blue

1. An insert that can be finely movably mounted on a tray that mounts the electronic component under test and moves inside the electronic component tester,

A latch portion that moves between a position where the electronic device under test accommodated in the insert is held over the upper surface of the electronic device under test and a position where the electronic device is retracted from the upper surface of the electronic device under test; A latch arm for rotatably supporting the insert, wherein a tip of the latch and a rotation center of the latch arm are arranged on substantially the same vertical line in a side view of the insert,

An insert in which the latch portion and the rotation center of the latch arm portion are offset from each other in a plan view of the insert.

2. The insert according to claim 1, further comprising an elastic body that urges the latch arm in a direction in which the latch portion moves to the holding position.

3. The power point of the latch arm portion is provided on the opposite side of the latch portion with respect to the center of rotation of the latch arm portion, and an external force is applied to the power point via a lever plate provided on the insert body. 2. The insert according to claim 1, wherein

4. The insert according to claim 1, wherein a power point of the latch arm is provided on a side opposite to the latch portion with respect to a rotation center of the latch worm, and an external force acts directly on the power point.

5. An insert that can be finely mounted on a tray that mounts the electronic component under test and moves inside the electronic component tester,

A latch unit that moves between a position where the electronic device under test accommodated in the insert is held over the upper surface of the electronic device under test and a position where the electronic device is retracted from the upper surface of the electronic device under test; A latch mechanism having a latch arm for supporting the latch;

An interlocking mechanism for interlocking movement of the guide core with respect to the insert body and movement of the latch portion.

6. The insert according to claim 5, wherein the interlocking mechanism moves the latch portion to a retracted position after separating the guide core from the insert main body.

7. The insert according to claim 5, wherein the interlocking mechanism causes the guide core to approach the insert body after moving the latch portion to the holding position.

8. The insert according to claim 1, wherein the terminal of the electronic component under test is a ball-shaped terminal.

9. The insert according to claim 1, further comprising a guide for contacting and positioning a terminal of the electronic component under test.

10. The insert according to claim 9, wherein the guide is a hole into which the ball-shaped terminal is fitted.

11. A tray for carrying an electronic device under test into a contact portion of a test head of an electronic component test apparatus and carrying out the electronic device under test, the tray having the insert according to claim 1.

12. An electronic component test apparatus for performing a test by pressing a terminal of an electronic component under test against a contact portion of a test head, wherein the electronic component has a tray according to claim 11.

1 3. An insert that is mounted on a tray that mounts the electronic component under test and moves around the inside of the electronic component tester, and that is finely movable.

An insert having a first guide that contacts and positions a terminal of the electronic component under test, and a guide core that is provided to be finely movable with respect to the insert body.

14. The insert according to claim 13, wherein the guide core has a second guide for positioning the electronic component test apparatus with a transporter for picking up the electronic component under test. 14.

15. The insert according to claim 13, wherein the guide core has a third guide for positioning the guide core with a contact part of a test head of the electronic component test apparatus.

16. The insert according to claim 14, wherein the guide core has a third guide for positioning the guide core with a contact portion of a test head of the electronic component test apparatus.

17. The second guide and the third guide are common holes or pins An insert according to claim 16.

18. The insert according to claim 1, wherein the terminal of the electronic component under test is a ball-shaped terminal.

19. The insert according to claim 18, wherein the first guide is a hole into which the ball-shaped terminal fits.

20. A tray having an insert according to claim 13, which is a tray for carrying an electronic device under test to a contact portion of a test head of an electronic component test apparatus and carrying out the electronic device under test.

21. An electronic component testing apparatus for performing a test by pressing a terminal of an electronic component under test against a contact portion of a test head, wherein the electronic component has a tray according to claim 20.

22. Before mounting the electronic device under test on the tray, the electronic device under test further includes a precisor for correcting the position of the electronic device under test,

The precisor is

A fourth guide for contacting and positioning a terminal of the electronic component under test, and a fourth guide for positioning the electronic component under test by the fourth guide, except for the terminal of the electronic component under test. 22. The electronic component test apparatus according to claim 21, further comprising: a fifth guide that guides a portion to match a terminal of the electronic component under test with the fourth guide.

23. The electronic component test apparatus according to claim 22, wherein the precisor has a sixth guide for positioning the electronic component under test with a transporter for picking up the electronic component under test.