TWI637182B - Inspection device for electronic components, inspection method for electronic components, and inspection program for electronic components - Google Patents

Abstract

An object of the present invention is to carry a high-speed transfer by holding a plurality of electronic components in a lightweight holding member.

An inspection device for an electronic component or an inspection method for an electronic component, characterized in that the electronic component is inspected based on an output signal output from an electronic component to which an inspection signal is input, comprising: a holding member that holds the electronic component; a connection member that inputs the inspection signal to the electronic component; and a lower connection member that detects the output signal output from the electronic component; and the holding member is disposed in a state in which the electronic component is held during inspection The upper connecting member is between the lower connecting member and the lower connecting member.

Description

Inspection device for electronic components, inspection method for electronic components, and inspection program for electronic components

The invention relates to an inspection device for an electronic component and a method for inspecting an electronic component.

In the electronic component inspection apparatus, the electronic component is inspected based on an output signal output from the electronic component in accordance with the input of the inspection signal. In the electronic component inspection apparatus, for example, a signal output from an inspection member (insertion or the like) electrically connected to an output terminal of the electronic component is detected, and the electronic component is inspected.

Patent Document 1 discloses a technique for an electronic component testing device (inspection device) in which an insert that is electrically connected to a terminal of a component to be tested (electronic component) is moved in advance to increase the operating rate of the inspection. Test the electronic parts and then test (check) the electronic parts being tested.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2010/004844

However, in the technique disclosed in Patent Document 1, a transport device (for example, a tray) including a plurality of inserts is required. Therefore, the transport device is increased in size, and it is difficult to transport electronic components at high speed. Further, in the technique disclosed in Patent Document 1, in order to perform inspection, a plurality of inserts are electrically connected in a state in which a plurality of electronic components are electrically connected to each other, so that electrons exist. The condition of the electrical connection of the part is scratched.

Further, in the technique disclosed in Patent Document 1, when a plurality of electronic components are simultaneously inspected, a plurality of inserts are required, and thus the cost of the inspection apparatus increases.

In view of the above, an object of the present invention is to provide an electronic component inspection apparatus, an electronic component inspection method, or a test method for holding an electronic component that can be transported at a high speed while holding a plurality of electronic components.

According to an aspect of the present invention, an inspection apparatus for an electronic component is provided, which is characterized in that the electronic component is inspected based on an output signal output from an electronic component to which an inspection signal is input, and includes: a holding member that holds the above An electronic component; an upper connecting member that inputs the inspection signal to the electronic component; and a lower connecting member that detects the output signal output from the electronic component; and the holding member maintains the electronic component during inspection The state is disposed between the upper connecting member and the lower connecting member.

Further, there may be a return signal path that returns an output signal detected by the lower connection member and outputs the output signal from the upper connection member to which the inspection signal is input.

Further, the holding member may include a plurality of mounting portions including a plurality of lever members and arranged in a lattice shape, and the plurality of electronic components may be placed on the plurality of mounting portions.

Each of the plurality of mounting portions may have a quadrangular shape or an opening having a substantially quadrangular shape having no corner portions, and a support piece may be provided on the fourth opening of the opening, and the support piece supports the electronic component.

The holding member may have a through hole on the outer side of the mounting portion, and the above The return signal path passes through the through opening of the holding member.

The inspection unit may also check whether the operation of the electronic component is normal, whether it is abnormal, or whether there is a warning of an abnormality by comparing the input inspection signal with the detected output signal.

The upper connecting member may further include an imaging unit that detects a position of the lower connecting member, wherein the lower connecting member is disposed based on a result of imaging by the imaging unit, and the holding member is positioned according to the lower connecting member disposed And placed at the desired position of the lower connecting member.

The lower connecting member may be fixed to the suction cup table of the probe device, and when the holding member is placed on the lower connecting member, the plurality of electronic components are fixed to the suction cup through the openings of the plurality of mounting portions. The lower connecting member of the stage is in electrical contact.

The lower connecting member may be fixed to the chuck table by a state in which the probe device is aligned with the chuck table.

According to another aspect of the present invention, a method for inspecting an electronic component is provided, which is characterized in that the electronic component is inspected based on an output signal output from an electronic component to which an inspection signal is input, and includes the following steps: a holding step A holding member including a plurality of mounting portions arranged in a lattice shape, wherein the plurality of electronic components are held by the plurality of mounting portions, and an arrangement step of electrically connecting the holding members holding the electronic components to the holding member a lower connection member; a signal input step of inputting the inspection signal from the upper surface of the holding member using the upper connecting member; and a signal detecting step using the lower connecting member in which the holding member is disposed, The output signal outputted from the electronic component is detected; the signal transmission step is electrically connected to the lower portion by using the holding member a connection portion of the upper connection member of the connection member transmits the output signal detected by the lower connection member; and an inspection step of inspecting the electronic component based on the transmitted output signal.

Moreover, it may be a program for causing a computer to execute the above inspection method.

According to the inspection apparatus of the electronic component of the present invention, the inspection method of the electronic component, or the program of the inspection method, a plurality of electronic components can be held at a high speed by holding the lightweight holding member.

10‧‧‧ Keeping components

10a‧‧‧ rod members

11P‧‧‧Loading Department

12‧‧‧ openings

12s‧‧‧Support tablets

12sc‧‧‧Support tablets

12sd‧‧‧Support tablets

13‧‧‧through

14‧‧‧through

20‧‧‧Upper connecting member

20b‧‧‧ board

21‧‧‧Connecting Department

22T‧‧‧Connecting Department

30‧‧‧Lower connecting member

30b‧‧‧ board (wiring department)

30b1‧‧‧ wiring

30c‧‧‧ board support components

31‧‧‧Connecting Department

31t‧‧‧Connecting pins

40‧‧‧Sucker table

41‧‧‧Support Department

50‧‧‧Photography Department

60‧‧‧Tester

70‧‧‧Transportation Department

80‧‧ ‧ Custody Department

90‧‧‧Control Department

100‧‧‧Inspection device for electronic parts

101‧‧‧Probe

110‧‧‧Lighting elements

Lt‧‧‧ optical signal

PKG‧‧‧Electronic Parts

PKGi‧‧‧Detection Department

SO‧‧‧ signal line

SI‧‧‧ signal line

TMa‧‧‧ connection terminal

TMb‧‧‧ connection terminal

TMc‧‧‧ connection terminal

Fig. 1 is an explanatory view for explaining an inspection procedure of an inspection apparatus for an electronic component according to the embodiment.

Fig. 2 is an explanatory diagram for explaining an inspection procedure of another inspection apparatus.

(a) and (b) are explanatory views for explaining an example of an electronic component inspected by the inspection apparatus for an electronic component according to the embodiment.

4(a) and 4(b) are plan views for explaining another example of the electronic component inspected by the inspection apparatus for an electronic component of the embodiment.

(a) and (b) are plan views of essential parts for explaining another example of the electronic component inspected by the inspection apparatus for an electronic component of the embodiment.

Fig. 6 is a schematic configuration diagram for explaining an outline of an inspection apparatus for an electronic component according to the embodiment.

Fig. 7 is a view showing an example of the arrangement of the holding members of the embodiment.

Fig. 8 is a view showing an example of the arrangement of the holding members of the embodiment.

Fig. 9 is a view showing an example of the configuration of an electronic component inspection apparatus according to the embodiment.

Fig. 10 is a view showing another example of the configuration of the electronic component inspection apparatus of the embodiment; Figure.

(a) and (b) are explanatory views for explaining an example of a holding member of the inspection device for an electronic component according to the embodiment.

(a) and (b) are explanatory views for explaining another example of the holding member of the inspection device for an electronic component according to the embodiment.

Fig. 13 is a plan view showing an example of a connecting portion of an inspection device for an electronic component according to the embodiment.

FIG. 14 is an explanatory view for explaining an example of a wiring portion of the inspection device for an electronic component according to the embodiment.

15(a) and 15(b) are views for explaining the flow of an inspection device and a signal of the electronic component of the embodiment.

Fig. 16 is a view for explaining the flow of an inspection device and a signal of the electronic component of the embodiment.

The present invention will be described with reference to the accompanying drawings, using an inspection apparatus for an electronic component of a non-limiting exemplary embodiment. In the apparatus for inspecting an electronic component according to the present embodiment, the device other than the inspection device for the electronic component described below is required to check the operation state of the electronic component based on a signal input from the electronic component (normal, abnormal, or Anyone (device, machine, unit, system, etc.) can use any one of the signs of abnormality.

In the following description, the same or corresponding reference numerals will be given to the same or corresponding components, and the description of the same or equivalent parts will be omitted. Further, the drawings are not intended to indicate the relationship between the devices, the components, or the members unless otherwise specified. Therefore, the specific correlation can be determined by the manufacturer in accordance with the following non-limiting embodiments.

[check procedure]

First, an inspection program using the inspection apparatus for an electronic component according to the present embodiment will be described with reference to Fig. 1 . Further, for comparison, another example of the inspection program will be described with reference to Fig. 2 . Here, FIG. 1 is an explanatory view for explaining an inspection program using the inspection apparatus for an electronic component of the embodiment. Fig. 2 is an explanatory diagram for explaining an inspection procedure of another inspection apparatus.

As shown in FIG. 1, in the inspection program, first, in the step Stp1-1, an electronic component (PKG in the drawing) to be inspected is manufactured before the inspection. In Figs. 3 to 5, an example of an electronic component to be inspected is shown. Here, FIG. 3(a), FIG. 4(a), and FIG. 5(a) are side views of the electronic component. 3(b), 4(b) and 5(b) are bottom views of the electronic components. Further, the electronic component shown in FIGS. 3 to 5 is an example, and the electronic component that can be used in the inspection program of the electronic component inspection apparatus of the present embodiment is not limited to those shown in FIG. 3, FIG. 4 or FIG.

The electronic component PKG of FIGS. 3 to 5 includes a terminal for outputting an electrical signal (hereinafter referred to as a "connection terminal") on the bottom surface side of the electronic component PKG. As shown in FIG. 3(b), the electronic component PKG may include a substantially flat-shaped connection terminal TMa on the outer edge of the bottom surface thereof. As shown in FIG. 4(b), the electronic component PKG may include a substantially hemispherical connection terminal TMb on the bottom surface thereof. As shown in FIG. 5(b), the electronic component PKG may include a substantially rectangular parallelepiped connection terminal TMc on the outer periphery of the bottom surface.

After manufacturing the above electronic component PKG, the inspection procedure shown in FIG. 1 carries the electronic component PKG in step Stp1-2A. Here, as shown in the right diagram of FIG. 6, the inspection program holds the plurality of electronic components PKG while using the holding member 10 of the present embodiment, and carries the holding member 10 into the chuck table 40 in the prober 101.

At this time, the inspection program is arranged in the overall schematic view on the right side of FIG. 6 and the enlarged view on the suction tray 40 on the left side, and the plurality of electronic components PKG that have been carried in are held in the holding member 10 in the present embodiment. Between the upper connecting member 20 and the lower connecting member 30.

Further, the inspection program is placed in the step Stp1-2B of Fig. 1 to arrange the lower connecting member 30 at the position where the inspection is performed. Specifically, as shown in FIG. 6, the inspection procedure is in the above step Stp1- Before the lower connecting member 30 is aligned with the chuck table 40 before 2A, it is fixed to the chuck table 40, and thereafter, the holding member 10 is placed on the lower connecting member 30. That is, the inspection program mounts the holding member 10 on the lower connecting member 30, and electrically connects the electronic component PKG held by the holding member 10 to the lower connecting member 30.

Then, the inspection program checks the electronic component PKG in step Stp1-3 of FIG. Specifically, as shown in the overall schematic view on the right side of FIG. 6, the inspection program causes the support portion 41 supporting the chuck table 40 to rise in the contact direction.

By raising the support portion 41 supporting the chuck table 40 in the contact direction, the electronic component PKG, the lower connecting member 30, and the upper connecting member 20 held by the holding member 10 can be electrically connected.

At this time, the chuck table 40 is a conductive member, and when placed on the chuck table 40, the bottom portion of the lower connecting member 30 is in contact with the chuck table 40 to be an insulating member.

The connection member 30 that has been placed on the lower portion of the suction cup table 40 is in a state in which the self-suction tray table 40 is electrically floated.

Further, depending on the inspection content, the bottom portion of the lower connecting member 30 may be a conductive member, and the lower connecting member 30 may be electrically connected to the chuck table 40.

In this state, the inspection program uses the test machine 60 to inspect a plurality of electronic parts PKG. After the inspection, the inspection program cuts the electrical connection of the electronic component PKG, the lower connection member 30, and the upper connection member 20 by lowering the support portion 41 in the release direction.

In the inspection for confirming the operation of the electronic component PKG, the probe device 101 is connected to the testing machine 60 by abutting the probe (for example, 31t of FIG. 7) against the electronic component PKG for energization. The tester 60 performs an inspection based on an output signal output from the electronic part PKG.

The prober 101 can use the position alignment mechanism of the support portion 41 to perform alignment in units of several micrometers by the rotation of the chuck table 40 and the movement in the xy plane. Thereby, by performing the alignment of the chuck table 40 and the lower connecting member 30 once, the stepping function of the prober 101 can be used to accurately and quickly perform the plurality of electrical parts on the holding member 10. The position of the PKG is aligned.

Thereafter, the inspection program stores the holding member 10 holding the inspected electronic component PKG in step Stp1-4 of FIG. Specifically, as shown in FIG. 6 , the inspection program may store a plurality of holding members 10 (electronic components) by stacking the storage unit 80 .

Furthermore, the inspection program may include a program for transferring a plurality of electronic components to a subsequent step using a holding member that holds a plurality of electronic components after inspection. Further, the inspection program may classify the electronic components in a specific order based on the inspection results obtained by the inspection. Further, the inspection program may also suspend or interrupt the inspection procedure based on the inspection result obtained by the inspection.

On the other hand, in the other inspection program shown in FIG. 2, first, the electronic component manufactured in step Stp2-1 is placed on the transport tray, and the electronic component is transported (step Stp2-2). Next, in another inspection program, in step Stp2-3, a plurality of electronic components are respectively placed on the inspection tray (for example, a plurality of inserts) immediately before the inspection. In this case, in another inspection program, the connection terminals of the plurality of electronic components are electrically connected to the inspection tray (plurality of the plurality of inserts), so that the electrical connection portion of the electronic component is scratched. The situation. Further, since it is necessary to provide a transport device (for example, a tray) having a plurality of inserts, the transport device is increased in size, and it is difficult to transport the electronic component PKG at a high speed. In the other inspection procedure, since the transportation time of the electronic component PKG is longer than that of the inspection program (FIG. 1) of the present embodiment, the total time required for the inspection of the electronic component PKG increases.

Then, in another inspection procedure, in step Stp2-4, the electronic parts are inspected. Here, in another inspection program, a plurality of electronic components electrically connected to, for example, a plurality of inserts are respectively disposed on the test bench. Therefore, in another inspection procedure, it is necessary to position each electronic component as compared with the inspection procedure of the present embodiment (Fig. 1), and the time required for positioning increases.

In addition, another inspection procedure is performed in steps Stp2-5 and Stp2-6, and steps and steps are performed. In the reverse process of Stp2-3 and Step Stp2-2, the plurality of electronic components after the inspection are replaced with the transfer tray, and then transferred to the subsequent steps.

As described above, the inspection program (Fig. 1) of the present embodiment can convey the electronic component PKG at a higher speed than the other inspection program (Fig. 2). In other words, the inspection program (FIG. 1) of the present embodiment divides the holding member 10 and the lower connecting member 30, and holds the plurality of electronic components PKG in the lightweight holding member 10 and transports them. Therefore, the electronic component PKG can be transported at high speed. .

Further, since the inspection program (Fig. 1) of the present embodiment does not require a plurality of expensive inserts, the cost of the inspection program (the manufacturing cost of the inspection apparatus) can be reduced. Further, in the inspection program (FIG. 1) of the present embodiment, a plurality of electronic components can be carried by the lightweight holding member, and a plurality of electronic components can be held during the inspection, so that the transporting device can be miniaturized and simplified, and the electronic components can be shortened. The transfer time of PKG, as a result, can shorten the total time required for inspection of electronic parts PKG, and increase the number of inspections of electronic parts per unit time.

[Summary of inspection equipment for electronic parts]

(summary of composition)

Next, an outline of an inspection apparatus for an electronic component according to the present embodiment will be described. Here, a package test (inspection of a packaged semiconductor element) using the inspection apparatus 100 for an electronic component of the present embodiment will be described. As shown in FIG. 6, the inspection apparatus 100 for an electronic component according to the present embodiment includes a prober 101 and a testing machine 60.

The probe device 101 further includes a holding member 10, an upper connecting member 20, a lower connecting member 30, a chuck table 40, an imaging unit 50, a transport unit 70, a storage unit 80, and a control unit 90.

The holding member 10 holds the electronic component PKG. The upper connecting member 20 inputs an inspection signal to the electronic component PKG. The lower connecting member 30 detects an output signal output from the electronic component PKG.

The chuck table 40 includes a device and a lifting device fixed by adsorption or mechanical construction Holding part 41). The imaging unit 50 detects a position of the connection member 30 disposed at the lower portion of the suction cup table 40. After the suction unit 40 and the lower connecting member 30 are aligned with each other using the imaging unit 50, the lower connecting member 30 is fixed to the chuck table 40.

The conveying unit 70 conveys the holding member 10 to the lower connecting member 30 disposed on the suction cup table 40. In the present embodiment, the transport unit 70 moves (transports) the holding member 10 while holding the plurality of electronic components in the holding member 10, for example, sandwiching a part of the holding member 10.

The control unit 90 controls each part of the inspection device 100 for electronic components. The control unit 90 realizes alignment of the lower connecting member 30 and the chuck table 40 based on the result of the imaging by the imaging unit 50, and controls the alignment. Moreover, the control unit 90 controls the entire prober 101 such as the elevation of the support unit 41.

The control unit 90 can control the operation of the electronic component inspection apparatus 100 by using a program (control program, application, etc.) that is stored in advance (for example, internal memory). Moreover, the control unit 90 can also control the operation of the electronic component inspection apparatus 100 based on information input from the outside of the electronic component inspection apparatus 100. Furthermore, the control unit 90 may include an arithmetic processing unit including a CPU (Central Processing Unit) and a memory of a known technique.

The tester 60 checks the electronic components based on the detected output signals.

(summary of action)

In the inspection of the electronic component inspection apparatus 100 of the present embodiment, first, the lower connection member 30 is placed at a specific position on the chuck table 40 that faces the upper connection member 20 based on the result of the imaging by the imaging unit 50. At this time, the inspection device 100 for an electronic component fixes the disposed lower connecting member 30 by means of a device that is fixed by suction or mechanical construction of the chuck table 40. Thereby, the positional alignment of the plurality of electrical components PKG on the holding member 10 can be accurately and quickly performed by using the stepping function of the prober 101 by performing the alignment of the chuck table 40 and the lower connecting member 30 once. .

Next, the electronic component inspection apparatus 100 conveys the holding member 10 using the conveyance unit 70, and mounts it on the lower connection member 30. Then, the electronic component inspection apparatus 100 raises the chuck table 40 by using the lifting device, and electrically connects the electronic component PKG, the lower connecting member 30, and the upper connecting member 20.

Thereafter, the electronic component inspection apparatus 100 inputs the inspection signal to the electronic component PKG using the upper connection member 20, and detects the output signal using the lower connection member 30.

Further, the electronic component inspection apparatus 100 uses the tester 60 to inspect the electronic component based on the detected output signal. Here, the electronic component inspection apparatus 100 may employ a method of causing the chuck table 40 to be lifted and lowered a plurality of times, thereby using the upper connecting member 20 to sequentially inspect any one of the plurality of electronic components held by the holding member 10. .

Further, after the inspection, the electronic component inspection apparatus 100 of the present embodiment carries out the holding member 10 holding the plurality of electronic components after inspection, for example, by using the conveyance unit 70. Thereafter, the electronic component inspection apparatus 100 uses the storage unit 80 to store the holding member 10 that has been carried out.

According to the above description, the electronic component inspection apparatus 100 can input an inspection signal to an electronic component and detect a signal output from the electronic component, thereby sequentially inspecting a plurality of electronic components.

[Details of configuration and composition of inspection devices for electronic components]

Next, the details of the arrangement and configuration of the electronic component inspection apparatus according to the present embodiment will be described with reference to FIGS. 7 to 10.

7 and 8 are views showing the arrangement of the holding members 10 between the lower connecting member 30 and the upper connecting member 20. FIG. 9 and FIG. 10 are views showing an example of the configuration of the electronic component inspection apparatus 100 of the present embodiment.

(Details of configuration)

As shown in FIG. 7, the conveyance unit 70 conveys the holding member 10 in which the plurality of electronic components PKG are held, and is disposed on the lower connection member 30 of the suction cup table 40. the result, As shown in FIG. 8, the connection pin 31t (probe pin) of the connection portion 31 of the lower connection member 30 is electrically connected to the connection terminal of the electronic component PKG (for example, refer to TMa of FIG. 3 to TMc of FIG. 5).

In the present embodiment, the holding member 10 and the lower connecting member 30 are divided, and the plurality of electronic components PKG are held by the lightweight holding member 10 and transported. Thereby, the holding member 10 can be conveyed at high speed. Further, the holding member 10 can simultaneously convey a plurality of electronic parts PKG. Moreover, each of the electronic components PKG held by the holding member 10 is conveyed without being displaced by its own weight, and is placed on the lower connecting member 30. As shown in FIG. 7, the connection terminal of the electronic component PKG is conveyed by the opening 12 of the holding member 10, and does not contact with the holding member 10 etc. during conveyance. Further, as shown in FIG. 8, the electronic component PKG is in contact with the connection pin 31t when placed on the lower connection member 30. Therefore, the electronic component PKG can be conveyed without damaging the connection terminal of the electronic component PKG.

Next, the support portion 41 is raised in the contact direction from the state of FIG. 8, and the holding member 10 and the lower connecting member 30 are brought into contact with the upper connecting member 20. As a result, as shown in FIG. 9, the electronic component PKG can be inspected in the state of the electronic component inspection apparatus 100 of the present embodiment.

As described above, in the present embodiment, the holding member 10 is separated from the lower connecting member 30, and the holding member 10 is configured to have no mother plate or metal portion. Further, the holding member 10 has a frame structure of a plurality of openings 12 (through holes). Thereby, the holding member 10 is made lighter, and the electronic component PKG can be conveyed at high speed. Further, the contact portion between the electronic component PKG and the holding member 10 is minimized to prevent damage of the electronic component PKG due to friction during transportation.

(Details of composition)

The configuration of the electronic component inspection apparatus 100 of the present embodiment will be described. The electronic component inspection apparatus 100 includes: a holding member 10 that holds the electronic component PKG; an upper connection member 20 that inputs an inspection signal to the electronic component PKG; and a lower connection member 30, It detects the output signal from the output of the electronic part PKG. The inspection device 100 for electronic parts is fixed to the suction table 40 that supports the lower connection member 30. The upper connecting member 20 includes a connecting portion 21 and a plate 20b. The holding member 10 is a tray-shaped member having a frame structure. In Fig. 9, a lever member 10a that holds the electronic component PKG is shown. The center of the rod member 10a is open. The lower connecting member 30 includes a connecting portion (socket base) 31, a plate 30b, and a plate supporting member 30c. The lower connecting member 30 is sucked to the chuck table 40 using a suction cup mechanism or mechanically fixed.

In the electronic component inspection apparatus 100 of the present embodiment, a return signal path 22T is provided, and the return signal path 22T returns an output signal detected by the lower connection member 30, and is input with an inspection signal. The upper connecting member 20 is output.

The inspection device 100 for an electronic component according to the present embodiment uses the upper connection member 20 to inject an inspection signal (optical signal Lt) into the detection portion PKGi of the electronic component PKG. Further, the electronic component inspection apparatus 100 detects the output signal output from the electronic component PKG on which the inspection signal is incident, using the lower connection member 30. Further, the electronic component inspection apparatus 100 transmits the output signal detected by the lower connection member 30 to the upper connection member 20 via the return signal path 22T. Furthermore, the electronic component inspection apparatus 100 may be configured to input or detect an electrical signal from the upper surface of the electronic component PKG using the upper connection member 20.

Specifically, in the present embodiment, the electronic component inspection apparatus 100 inputs an inspection signal (optical signal Lt) from above the electronic component PKG. Moreover, the electronic component inspection apparatus 100 electrically connects the connection pin 31t of the connection portion 31 of the lower connection member 30 to the connection terminal of the electronic component PKG (for example, TMa of FIG. 3 to TMc of FIG. 5), thereby self-electronic parts. The output signal is detected below the PKG. The return signal path 22T passes through the through opening (opening) of the holding member 10, and is electrically connected to the lower connecting member 30, thereby returning the output signal detected by the lower connecting member 30, and inputting the upper portion of the inspection signal from the upper portion thereof. The connecting member 20 outputs.

Thereby, the electronic component inspection apparatus 100 of the present embodiment compares the input inspection signal with the detected output signal, thereby checking the electronic component PKG. Electronic parts The inspection apparatus 100 checks, for example, whether the operation of the electronic component PKG is normal, whether it is abnormal, or whether there is a warning of an abnormality based on the detected output signal.

Further, in the inspection apparatus 100 for an electronic component according to the present embodiment, the holding member 10 holding the electronic component PKG is disposed between the upper connecting member 20 and the lower connecting member 30 at the time of inspection (Stp1-3 of FIG. 1). Further, in the inspection apparatus 100 for an electronic component according to the present embodiment, the electronic component PKG held by the holding member 10 is electrically connected to the lower connection member 30 at the time of inspection (Stp1-3 of FIG. 1). That is, in the inspection apparatus 100 for an electronic component of the present embodiment, a plurality of electronic components can be simultaneously carried into the test stand using the holding member 10, and the plurality of electronic components can be held by the holding member 10 at the time of inspection. Further, in the inspection apparatus 100 for an electronic component according to the present embodiment, a plurality of electronic components held by the holding member 10 can be electrically connected to the lower connection member 30 at the same time.

Further, according to the electronic component inspection apparatus 100 of the present embodiment, the signal output from the electronic component PKG for the signal input to the electronic component PKG to be inspected from the test machine 60 side can be transmitted back to the test machine 60 side. That is, in the case where the inspection signal is input and output between the electronic component PKG and the testing machine 60 in the electronic component inspection apparatus 100, the input and output of signals can be performed from the tester 60 side. According to this, for example, when the inspection target is a light imaging device, the signal output from the optical imaging device for the optical signal input to the optical imaging device from the side of the test machine 60 can be transmitted back to the test machine 60 side. Thereby, signal processing can be performed in the test machine 60, and the inspection result is given.

Since the chuck table 40 shown in Fig. 6 is formed of metal, the chuck table 40 cannot be configured to have an electrical signal or an optical signal. Therefore, in the present embodiment, the electronic component inspection apparatus 100 is provided with a return signal transmitted from the electronic component PKG to the side of the test machine 60 by the optical signal input to the electronic component PKG from the test machine 60 side. The signal path 22T can be connected to the test machine 60 using the existing probe meter 101. Thereby, the electronic component PKG can be inspected using the existing prober 100 and the tester 60.

Thereby, the inspection apparatus 100 for an electronic component according to the present embodiment is, for example, image-sensed When the electronic component PKG is inspected, the pixel signal (electrical signal) converted by the photoelectric conversion element (PKGi) input with the light Lt is inspected, and each pixel of the image sensor can be inspected. action. Further, the inspection apparatus 100 for an electronic component according to the present embodiment is not identical to the same surface, for example, such as a CMOS (Complementary Metal Oxide Semiconductor) sensor or a POP (Package on Package). In the electronic component having the structure of the input/output terminal, by using the present embodiment, the electronic component can be inspected without restricting the path connected to the input/output terminal.

As shown in FIG. 10, the electronic component inspection apparatus 100 can also input an inspection signal (not shown) from the upper connection member 20 to the upper surface of the electronic component PKG. In the example of Fig. 10, the return signal path 22T of the upper connecting member 20 is used, and the output signal output from the electronic component PKG is also detected from the upper surface of the electronic component PKG. That is, in the electronic component inspection apparatus 100, the signal output from the electronic component PKG for the optical signal input to the electronic component PKG from the test machine 60 side can be transmitted back to the test machine 60 side via the return signal path 22T. . Thereby, the electronic component PKG can be inspected using the existing prober 100 and the tester 60. The other parts of the electronic component inspection apparatus 100 of FIG. 10 are the same as those of FIG. 9, and thus the description thereof is omitted.

[Example of holding member]

Next, an example of the holding member 10 of the electronic component inspection apparatus 100 of the present embodiment will be described with reference to Figs. 11 and 12 . Here, FIGS. 11(a), 11(b), 12(a), and 12(b) show an example of the holding member 10.

Further, the holding member 10 of the present embodiment is not limited to those shown in FIGS. 11 and 12. In other words, the holding member 10 of the present embodiment can be appropriately changed depending on the specifications (shape, size, weight, and the like) of the electronic component to be held. Further, although an example in which the holding member 10 in which nine electronic components are held in three rows and three rows is shown in FIG. 11, the number of electronic components that can be held by the holding member of the present embodiment is not limited. That is, the holding member of the embodiment can also In order to hold 16 electronic components in 4 rows and 4 rows or 12 electronic components in 4 rows and 3 rows, etc.

As shown in Fig. 11 (a), the holding member 10 includes a plurality of placing members 11P which are arranged in a lattice shape in a plurality of rod members 10a. Here, the plurality of mounting portions 11P are respectively placed on a plurality of electronic components. In the present embodiment, the placing portion 11P has an opening 12 having a substantially quadrangular shape, a circular shape, or an elliptical shape without a corner portion. Further, the placing portion 11P is provided with a support piece 12s at four turns of the opening 12. That is, the holding member 10 holds the electronic component PKG by supporting the four turns of the electronic component PKG by the support piece 12s. Further, the shape of the opening 12 (the arrangement of the plurality of lever members 10a) can be appropriately changed in accordance with the electronic component to be held.

As shown in FIG. 11( a ), the holding member 10 includes a plurality of through holes 13 adjacent to the placing portion 11P in a direction perpendicular to the longitudinal direction of the plurality of lever members 10 a. A return signal path 22T of the upper connecting member 20 is inserted into the through hole 13. That is, the return signal path 22T of the upper connecting member 20 penetrates the through hole 13 of the holding member 10 and is electrically connected to the lower connecting member 30.

Further, the shape and number of the through holes 13 can be appropriately changed in accordance with the return signal path 22T of the upper connecting member 20. As shown in Fig. 11 (b), the holding member 10 may be configured to have a plurality of through-holes 13 adjacent to the mounting portion 11P in a direction perpendicular to the longitudinal direction of the plurality of rod members 10a, for example, and further Each of the rod members 10a includes an opening portion 14. Here, the other portions of the holding member 10 are the same as those in the case of FIG. 11(a), and thus the description thereof will be omitted.

As shown in Fig. 12 (a), the holding member 10 has a fan-shaped support piece 12sc at four turns of the opening 12 of the mounting portion 11P. That is, the holding member 10 holds the electronic component by supporting the electronic component with the support piece 12sc. Furthermore, the other portions of the holding member 10 are the same as those in the case of Fig. 11(a), and thus the description thereof will be omitted.

As shown in Fig. 12 (b), the holding member 10 may have a fan-shaped support piece 12sc at four turns of the opening 12 of the mounting portion 11P, and further include a support piece 12sd on four sides. Again, keep the structure The other parts of the piece 10 are the same as those in the case of Fig. 12 (a), and therefore the description is omitted.

[Example of lower connecting member]

An example of the lower connecting member 30 of the electronic component inspection apparatus 100 of the present embodiment will be described with reference to Figs. 13 and 14 . Here, Fig. 13 is a plan view for explaining an example of the connecting portion 31 of the lower connecting member 30 of the present embodiment. Fig. 14 is a plan view showing an example of the wiring portion 30b of the lower connecting member 30 of the embodiment. 13 and FIG. 14 are examples of the lower connecting member 30 corresponding to the holding member 10 having the two types of openings in the above-described FIG. 11(a).

As shown in FIG. 13, the connecting portion 31 of the lower connecting member 30 includes a plurality of connecting pins 31t. Here, as shown in FIGS. 13 and 14, the plurality of connection pins 31t are electrically connected to the electronic component PKG (connection terminal), and detect an output signal of the electronic component PKG. That is, a plurality of connection pins 31t are selectively disposed at positions electrically connected to the connection terminals of the electronic component PKG. The connection portion 31 of the lower connection member 30 may be configured such that a plurality of connection pins 31t are inserted and removed according to the arrangement of the connection terminals (TMa to FIG. 3, TMc) of the electronic component.

Further, the connecting portion 31 of the lower connecting member 30 of the present embodiment is not limited to that shown in FIG. In other words, the connection portion 31 of the lower connection member 30 of the present embodiment can be based on the specifications (shape, arrangement of the connection terminals, etc.) of the electronic component PKG to be held and the specifications of the upper connection member 20 (the arrangement of the return signal path 22T, etc.) And change it as appropriate.

As shown in FIG. 14, the wiring portion 30b of the lower connecting member 30 includes a plurality of wirings 30b1. Here, the plurality of wires 30b1 electrically connect the plurality of connection pins 31t of the connection portion 31 and the return signal path 22T of the upper connection member 20.

Further, the wiring portion 30b of the lower connecting member 30 of the present embodiment is not limited to that shown in FIG. In other words, the wiring portion 30b of the lower connecting member 30 of the present embodiment can be based on the specifications (shape, arrangement of the connecting terminals, etc.) of the electronic component to be held and the specifications of the upper connecting member 20 (the arrangement of the return signal path 22T, etc.). Change as appropriate.

The lower connecting member 30 of the present embodiment is configured by laminating the connecting portion 31 and the wiring portion 30b. Further, the lower connecting member 30 is disposed at a specific position of the chuck table 40 at the time of inspection. Here, the electronic component inspection apparatus 100 can also perform positioning of the lower connection member 30 by photographing the position of the lower connection member 30. Further, the electronic component inspection apparatus 100 may arrange the lower connection member 30 at a specific position by using a mechanical structure (for example, a rail mechanism or a pin fitting) such as suction (for example, a vacuum suction cup) or a guide.

[Flow of signals]

Finally, the flow of the electronic component inspection apparatus 100 and the signal of the present embodiment will be described with reference to Figs. 15 and 16 . Figs. 15 and 16 are views for explaining an example of the flow of the electronic component inspection apparatus 100 and the signal of the embodiment.

In the prior art electronic component inspection apparatus, when the input signal pin and the output signal pin of the electronic component are disposed on one side of the electronic component and are connected to the signal pin by the test socket for accommodating the electronic component Only the single-sided contact of the electronic component is electrically connected to the inspection device of the electronic component, whereby the input/output signal is supplied to the inspection device of the electronic component via the electronic component. In the case of inspection by the prober, the upper connecting member 20 can be easily electrically connected by arranging the signal terminals of the electronic component face up.

On the other hand, in the electronic component to be inspected by the inspection apparatus 100 for an electronic component according to the present embodiment, there are a CIS (CMOS Image Sensor, a complementary MOS image sensor) or a CCD (Charge Coupled Device). In the case of receiving the optical signal as usual, the input surface of the optical signal and the signal terminal surface (the surface of the electronic component where the connection terminal exists (the back surface of the electronic component)) is on the opposite side. Since the signal cannot be passed through the chuck table 40 of the prober 101, the signal cannot be taken from the signal terminal surface side to the chuck table 40 side for inspection, and it is necessary to check the output signal from the optical signal input surface for inspection. The method.

Therefore, in the electronic component inspection apparatus 100 of the present embodiment, the return signal path 22T is provided, and the return signal path 22T returns the output signal detected by the lower connection member 30, and the input signal is input thereto. The signal is connected to the upper connecting member 20 output. borrow Therefore, the electronic component inspection apparatus 100 of the present embodiment can realize bidirectional exchange of signals.

Referring to Figs. 15 and 16, a signal input from the side of the test machine 60 to the electronic component inspection apparatus 100 and a signal outputted to the test machine 60 side using the return signal path 22T will be described.

The signal returned by the optical signal of the inspection apparatus 100 input to the electronic component from the self-luminous element 110 using the return signal path 22T is outputted to the tester 60 side through the signal line SO, as shown in Fig. 15(a).

In Fig. 15(b), the optical signal of the inspection device 100 input to the electronic component from the self-luminous element 110 and the signal input through the signal line SI from the test machine 60 side are shown using the signal transmission signal returned by the return signal path 22T. The case where the line SO is output to the side of the test machine 60.

In Fig. 16, a case where a signal returned by the signal line SI from the side of the test machine 60 is returned to the signal side by the signal line SO to the side of the test machine 60 by using the signal transmitted back by the return signal path 22T or the like. In Fig. 16, the connection terminals for inputting and outputting signals are shown on both sides of the electronic component PKG, and signals can be input and output on both sides of the electronic component PKG.

Here, for ease of explanation, a signal from one direction is illustrated, but a bidirectional signal of input and output may be switched on the time axis, or a plurality of input pins and output pins may be mixed. status.

As described above, in the electronic component inspection apparatus 100 of the present embodiment, the holding member 10 can be made lighter by separating the holding member 10 from the lower connection member 30. Thereby, the plurality of electronic components PKG can be transported at a high speed while being held by the holding member 10. Thereby, the transfer time of the electronic component PKG can be shortened. Moreover, by the stepping operation of the prober 101, the time for aligning a plurality of electronic components can be shortened. As a result, the number of inspection processes of electronic parts per unit time can be increased.

Moreover, according to the inspection apparatus for an electronic component or the method of inspecting an electronic component according to the embodiment of the present invention, a plurality of electronic components can be carried by the holding member holding the electronic component, and a plurality of electronic components can be held during the inspection, so that it is not expensive. Multiple inserts. Therefore, according to the inspection apparatus for an electronic component or the inspection method of the electronic component according to the embodiment of the present invention, the manufacturing cost of the inspection apparatus can be reduced. Moreover, according to the inspection apparatus for an electronic component or the method of inspecting an electronic component according to the embodiment of the present invention, the holding member does not need to be processed with high precision, and the cost of the holding member can be greatly reduced. Further, according to the inspection apparatus for an electronic component or the method of inspecting an electronic component according to the embodiment of the present invention, a plurality of electronic components can be carried by using a lightweight holding member, and a plurality of electronic components can be held during inspection, so that the transporting device can be carried out. Miniaturization and simplification.

Further, according to the inspection apparatus for an electronic component or the method of inspecting an electronic component according to the present embodiment, the holding member (the mounting portion) and the lower connecting member can be easily changed depending on the shape of the electronic component, the number of the connection terminals, and the like. Department), thus improving the versatility of the device. Specifically, according to the inspection apparatus for an electronic component or the method of inspecting an electronic component according to the embodiment of the present invention, the holding member can be easily changed according to the type of the electronic component, and the lower connecting member 30 can be easily changed according to the type of the electronic component. The pin 31t is connected. As a result, according to the inspection apparatus for an electronic component or the inspection method of the electronic component of the present embodiment, the apparatus and method can be easily shared even when examining different types of electronic components.

Furthermore, the functions of the electronic component inspection apparatus 100 of the present embodiment can be realized by the control unit 90 executing a program for causing a computer to execute the above-described inspection method. The program can also be stored in a recording medium that can be read by a computer. Furthermore, for the recording medium, a floppy disk (FD), a CD-ROM (Compact Disk-Read Only Memory), a CD-R (Compact Disk Recordable), a DVD (Digital Versatile Disk) can be used. , digital versatile discs and other computer-readable media, and semiconductor memory such as flash memory, RAM (Random Access Memory), ROM (Read Only Memory), Memory card, HDD (Hard Disc Drive) and other computer readers. Moreover, the electronic component inspection can also be performed by mounting the above program on the inspection device 100 for electronic components. The functions of the device 100 are checked.

The present invention has been described above with reference to the embodiments, but the present invention is not limited to the above-described embodiments, and various changes and modifications may be made without departing from the scope of the appended claims.

For example, the inspection apparatus for an electronic component of the present invention can be versatile by changing the shape of the mounting portion of the holding member in accordance with the size and shape of the electronic component to be conveyed. Specifically, in the case of transporting electronic devices of different shapes, it is only necessary to change the size and shape of the frame of the holding member in accordance with the shape of the electronic device, and the versatility is high. Since the holding member has a frame structure, even if the size and shape of the frame of the holding member are changed, as described above, when the holding member is placed on the lower connecting member, the connection between the electronic device and the lower connecting member is made. Contact, and achieve electrical connection.

Claims (10)

An inspection device for an electronic component, characterized in that it is an inspection device for inspecting an electronic component of the electronic component based on an output signal output from an electronic component to which an inspection signal is input; the inspection device for the electronic component includes: a holding member And holding the electronic component; the upper connecting member inputs the inspection signal to the electronic component; and the lower connecting member detects the output signal output from the electronic component; and the holding member maintains the above when inspecting The state of the electronic component is disposed between the upper connecting member and the lower connecting member. An inspection device for an electronic component according to claim 1, further comprising a return signal path, the return signal path returning an output signal detected by the lower connecting member, and self-inputting the above-mentioned inspection signal Upper connecting member output. The inspection apparatus for an electronic component according to claim 1 or 2, wherein the holding member has a plurality of mounting portions including a plurality of lever members and arranged in a lattice shape, and the plurality of mounting portions are placed on the plurality of mounting portions Electronic parts. The inspection device for an electronic component according to claim 3, wherein each of the plurality of mounting portions has a quadrangular shape or an opening having a substantially quadrangular shape having no corner portion, and a support piece is provided on the fourth opening of the opening, and the support piece supports The above electronic parts. The inspection device for an electronic component according to claim 3, wherein the holding member has a through hole on the outer side of the mounting portion, and the return signal path is penetrated through the through hole of the holding member. An inspection device for an electronic component of claim 4, which further comprises a test machine, the test The machine compares the input inspection signal with the detected output signal to check whether the operation of the electronic component is normal, whether it is abnormal, or whether there is a warning of an abnormality. The inspection device for an electronic component according to claim 4, wherein the lower connecting member is fixed to the suction table of the probe device, and when the holding member is placed on the lower connecting member, the opening of the plurality of mounting portions is A plurality of electronic components are in electrical contact with a connecting member fixed to the lower portion of the suction cup table. The inspection apparatus for an electronic component according to claim 7, wherein the lower connecting member is fixed to the chuck table by a state in which the probe device is aligned with the chuck table. A method for inspecting an electronic component, characterized in that it is an inspection method for an electronic component of the electronic component based on an output signal output from an electronic component to which an inspection signal is input; the inspection method of the electronic component includes: a holding step, A plurality of the electronic components are held by the plurality of mounting portions, and the plurality of electronic components are held by the plurality of mounting portions. The disposing step electrically connects the holding members holding the electronic components to the lower portions a signal input step of inputting the inspection signal from the upper surface of the holding member using the upper connecting member; and a signal detecting step using the lower connecting member in which the holding member is disposed, The output signal of the electronic component output is detected; and the signal transmission step is configured to transmit the output signal detected by the lower connection member by using a connection portion that is electrically connected to the upper connection member of the lower connection member through the holding member; and An inspection step of inspecting the electronic component based on the output signal transmitted. An electronic component inspection program for causing a computer to perform an inspection method for an electronic component as claimed in claim 9.