KR101672858B1 - Device for joining the film to the lead material using a high-frequency induction - Google Patents

Device for joining the film to the lead material using a high-frequency induction Download PDF

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Publication number
KR101672858B1
KR101672858B1 KR1020150049450A KR20150049450A KR101672858B1 KR 101672858 B1 KR101672858 B1 KR 101672858B1 KR 1020150049450 A KR1020150049450 A KR 1020150049450A KR 20150049450 A KR20150049450 A KR 20150049450A KR 101672858 B1 KR101672858 B1 KR 101672858B1
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South Korea
Prior art keywords
film
lead material
fused
high frequency
frequency induction
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KR1020150049450A
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Korean (ko)
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KR20160120452A (en
Inventor
이원환
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(주)글로벌텍
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum fusing device for fusing a film to a lead material using a high frequency induction machine, and more particularly, to a device for fusing a film to a lead material in a non-contact manner using a high frequency induction machine.
For this purpose, a vacuum fusing device for fusing a film to a lead material using the high frequency induction machine of the present invention includes a film feeding and cutting unit for cutting the supplied first film and second film to a predetermined size, , A first film is fed to the upper end of the lead material heated by the high frequency induction machine and a second film is fed to the lower end of the lead material heated by the high frequency induction machine and the fused portion to melt and adhere the supplied first film and second film to the lead material, And a positioning member having a seating portion on which a lead material with a film welded thereon is seated at its end, wherein the positioning member includes a gentle fusion portion for fusing the lead material to which the film is fused by using a high frequency induction device, According to the result of the inspection by the inspection unit, the lead material having the fusion failure is discharged to the defective discharge unit, and defective fusion occurs Not lead materials that includes the discharge portions for discharging a normal discharge unit.

Description

[0001] The present invention relates to a device for joining a film to a lead material using a high frequency induction device,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum fusing device for fusing a film to a lead material using a high frequency induction machine, and more particularly, to a device for fusing a film to a lead material in a non-contact manner using a high frequency induction machine.

A variety of recognition techniques and structures are applied to the touch screen, which is an input device for recognizing a user's touch applied to a specific position on the display screen, such as a resistive film type, a capacitive type, and an ultrasonic type.

However, the electrostatic capacity type is not generally used because of a problem of static electricity malfunction, and the optical type is not used due to foreign substances such as dust. In general, a touch type touch screen is used.

Korean Patent Publication No. 2011-0045339 (a method of bonding plastic and glass touch panels to a flexible circuit board) is a method of bonding a surface of a touch screen portable terminal using an FPCB bonding method using a laser bonding machine. And performing bonding and bonding using a high-temperature high-pressure apparatus (autoclave) that performs pressing and heating after completion of the bonding.

Korean Patent Laid-Open No. 2011-0078247 (an anisotropic conductive film using a photocurable system, a bonding apparatus and a bonding method using the same) relates to an anisotropic conductive film, and more particularly to an anisotropic conductive film, Anisotropic conductive film using a light curing system that improves the reliability of the bonding operation and has a high curing speed instead of using limited heat and pressure when connecting an anisotropic conductive film used for mounting a flat panel display (FPD) such as an EL And a bonding method and a bonding method using the same.

Korean Unexamined Patent Publication No. 2011-0076050 (entitled " Anisotropic Conductive Film Bonding Method Using Photocuring System ") discloses a method of bonding an anisotropic conductive film containing a photopolymerization initiator capable of UV curing reaction between a glass panel and an adherend A step of irradiating a light source of a predetermined wavelength to a connection portion between the glass panel and the adherend to melt and adhere the anisotropic conductive film and pressing the connection portion to break the conductive ball of the anisotropic conductive film to have conductivity in the vertical direction A method of bonding an anisotropic conductive film using a photo-curing system is proposed.

In the conventional method of transferring heat in contact with the lead material by using a hot bar, a method of transferring heat to the lead material using a hot bar has been proposed, And the heat is transmitted to the close contact portion to heat the lead material.

When the film and the lead material are fused together by using the hot bar, there is a phenomenon that the lead material is shot when the heater is contacted, and a difference in temperature transfer time occurs due to a difference in contact area between the heater and the lead material Occurs.

A problem to be solved by the present invention is to propose a method of automatically fusing a film to a lead material.

Another problem to be solved by the present invention is to propose a method of fusing a film to a lead material in a non-contact manner.

Another problem to be solved by the present invention is to prevent heat from being transferred to an unnecessary section of the lead material by directly transmitting heat only to a region where the film is fused.

Another problem to be solved by the present invention is to propose a method for shortening the time required for the film to be welded to the lead material.

Another problem to be solved by the present invention is to prevent a deflection phenomenon of a bonded film when a lead material is transferred in a state where the film is fused to the lead material.

For this purpose, a vacuum fusing device for fusing a film to a lead material using the high frequency induction machine of the present invention includes a film feeding and cutting unit for cutting the supplied first film and second film to a predetermined size, , A first film is fed to the upper end of the lead material heated by the high frequency induction machine and a second film is fed to the lower end of the lead material heated by the high frequency induction machine and the fused portion to melt and adhere the supplied first film and second film to the lead material, And a positioning member having a seating portion on which a lead material with a film welded thereon is seated at its end, wherein the positioning member includes a gentle fusion portion for fusing the lead material to which the film is fused by using a high frequency induction device, According to the result of the inspection by the inspection unit, the lead material having the fusion failure is discharged to the defective discharge unit, and defective fusion occurs Not lead materials that includes the discharge portions for discharging a normal discharge unit.

In a device for fusing and bonding a film to a lead material by using the high frequency fusing device according to the present invention, the film can be fused to the lead material by using a high-frequency fusing device, thereby shortening the time for fusing. In addition, by removing bubbles existing between the lead material and the film, it is possible to reduce the defective rate of the product in which the film is welded to the lead material.

In addition, the heat is directly transferred only to the region where the film is fused, thereby preventing the heat from being transferred to unnecessary sections of the lead material.

When the lead material is fed in a state in which the film is adhered to the lead material, the lead material is fed in a state in which the lead material is seated in the seating portion of the seating member, thereby preventing the film from sagging. The occurrence can be blocked.

FIG. 1 is a flowchart illustrating a process of fusing a film to a lead material according to an embodiment of the present invention.
2 is a view showing a configuration of an apparatus for adhering a film to a lead material according to an embodiment of the present invention.
FIG. 3 shows a state in which a film is adhered to both sides of a lead material according to an embodiment of the present invention.
4 is a view showing a configuration of a film feeder and a cutter according to an embodiment of the present invention.
5 is a view showing the configuration of a fused portion according to an embodiment of the present invention.
6 is a view showing a configuration of bubble removing unit according to an embodiment of the present invention.
7 is a view showing a configuration of a fused-joint portion according to an embodiment of the present invention.
10 is a view showing a configuration of a testing member and a discharging member according to an embodiment of the present invention

BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and further aspects of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

FIG. 1 is a flowchart illustrating a process of fusing a film to a lead material according to an embodiment of the present invention. Hereinafter, a process of fusing a film to a lead material according to an embodiment of the present invention will be described in detail with reference to FIG.

In step S100, the lead material, the first film, and the second film are supplied using the tray. The supplied first film and second film are cut in a predetermined unit.

In step S110, the cut first film and the second film are bonded to the lead material using a high frequency induction machine. In this case, after the lead material is heated by a high-frequency induction machine, the lead material is melted and fused using a fusing device.

In step S120, the present invention removes the fused lead material and bubbles that have entered the film.

In step S130, the lead material from which bubbles have been removed and the film are fused together using a high frequency induction machine.

In step S140, the present invention removes a part of the film adhered to the lead material, which is required to be removed.

In step S150, the lead material to which the film is adhered is inspected using a vision camera (inspection camera).

In step S160, the lead material having the adhesion failure is discharged to the defective box, and the lead material having no adhesion failure is discharged to the normal box.

2 is a view showing a configuration of an apparatus for adhering a film to a lead material according to an embodiment of the present invention. Hereinafter, an apparatus for bonding a film to a lead material according to an embodiment of the present invention will be described with reference to FIG.

According to Fig. 2, the apparatus for adhering a film to a lead material includes a film feeding and cutting section, a lead material supplying section, a fused portion, a bubble removing portion, a fused portion, a film cutting portion, an inspection portion, and a discharge portion. Of course, other configurations than the above-described configuration may be included in the apparatus for bonding the film proposed in the present invention to the lead material.

The film feeding and cutting unit 200 receives a film from the outside and cuts the supplied film in units of a set size.

The lead material supply unit 300 receives a lead material from outside using a tray.

The fused portion 400 fuses the film to the upper and lower ends in a state in which the supplied lead material is heated using a high frequency induction machine. As described above, after the lead material is first heated, the film is fused to prevent the film from being bent in the fusing process.

The bubble removing unit 500 removes bubbles formed between the lead material and the film in a state where the film is fused to the upper and lower ends of the lead material.

The fused-fusion portion 600 fuses the film to the lead material by using a high-frequency induction machine in a state where bubbles generated between the lead material and the film are removed.

The film cut portion 700 removes a portion of the film that is required to be removed from the lead material in which the cooled film is fused.

The inspection unit 800 inspects whether or not the lead material to which the film is fused is defective by using a vision camera.

The discharging unit 900 discharges the products, which have not been inspected by the inspection unit, to the non-defective box and discharge the defective products to the defective box.

FIG. 3 shows a state in which a film is adhered to both sides of a lead material according to an embodiment of the present invention. As shown in FIG. 3, a film is adhered to each of the upper and lower surfaces of the lead material, and bubbles are not generated between the lead material and the film. As described above, when bubbles are formed between the lead material and the film, a performance error of the product may occur at the time of use. Therefore, no bubbles should be formed between the lead material and the film.

4 is a view showing a configuration of a film feeder and a cutter according to an embodiment of the present invention. Hereinafter, a configuration of the film feeding and cutting unit according to an embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 4, the film feed and cut section includes a first film supply section, a first film adsorption section, a first film cut support section, a first film cut section, a second film supply section, a second film adsorption section, 2 film cuts. Of course, other configurations other than the above-described configuration may be included in the film feed and cut section proposed in the present invention.

The first film supplying unit 210 sucks the first film supplied from the outside using the first film sucking unit 220 and seats the first film on the cutting table. The first film seated on the cutting table presses and fixes the upper surface of the first film using a holding member.

In order to cut the first film to a predetermined size while being fixed by the cutting table and the holding member, the first film cut support portion 230 formed in a direction opposite to the direction in which the first film cut portion is formed is raised, The film cut support portion 230 is brought into close contact with the film cut support portion 230.

Thereafter, the first film is cut by a predetermined length unit by using the first film cut portion 240.

The second film supply unit 250 adsorbs the second film supplied from the outside using the second film adsorption unit 260 and seats the second film on the cutting table. The second film seated on the cutting table presses and fixes the upper surface of the second film by using a holding member.

The second film cutting support portion 270 formed in a direction opposite to the direction in which the second film cut portion is formed is cut in order to cut the second film to a predetermined size while being fixed by the cutting table and the holding member, The film cut support portion 270 is brought into close contact with the film cut support portion 270.

Thereafter, the second film is cut by a predetermined length unit by using the second film cut portion 280.

5 is a view showing the configuration of a fused portion according to an embodiment of the present invention. Hereinafter, the configuration of the fused portion according to one embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 5, the welding portion includes a mounting portion, a pressing portion, a fusing high-frequency induction machine, and a control portion. Of course, other configurations other than the above-described configuration may be included in the fused portion proposed by the present invention.

The fused high frequency induction machine 430 induces a high frequency using the supplied current, and the lead material is heated by the induced high frequency. In the state where the lead material is heated, the seating part 410, on which the second film conveyed by the second film conveying part is conveyed, moves to a position where the lead material is positioned, and at the upper end, The pressing portion 420 that adsorbs one film moves to the point where the lead material is located. The first film and the second film move to the point where the heated lead material is located, and the fusion process is performed.

In addition, the pressing portion 420 and the seating portion 410 of the present invention can maintain a set temperature higher than room temperature, instead of maintaining the room temperature state.

A control unit (not shown) controls the amount and time of the current supplied to the welding fusion high frequency induction unit. That is, the high frequency induction unit induces a high frequency of a predetermined magnitude according to a control command to the control unit.

6 is a view showing a configuration of bubble removing unit according to an embodiment of the present invention. Hereinafter, the configuration of bubble removing unit according to an embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 6, the bubble removing portion includes a seat portion. Of course, other configurations than the above-described configuration can be included in the bubble removing unit proposed in the present invention.

In the seating part 510, a lead material to which the first film and the second film are fused is seated. The upper end of the seating part 510 is formed of an elastic member having an elastic force. For example, the elastic member may be formed of silicon.

When the lead material is seated in the seating portion 510, the pressing portion 520 presses the lead material at the top. The pressing portion 520 is also made of an elastic member in the same manner as the seating portion.

The bubble formed between the lead material and the film is removed by pressing the lead material seated on the seating portion. As described above, the present invention performs a bubble removing process to remove bubbles formed between the lead material and the film.

7 is a view showing a configuration of a fused-joint portion according to an embodiment of the present invention. Hereinafter, the configuration of the vacuum fused portion according to the embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 7, the fused and bonded portion includes a seating member, a fixed pressing portion, an inductive high frequency induction unit, and a control unit. Of course, other configurations than the above-described configuration may be included in the true fused portion proposed in the present invention.

The seating member 610 has the lead material from which the bubbles are removed.

The fixed pressing portion 620 presses and fixes the lead material seated on the seating portion to prevent the film material from moving due to shrinkage or the like during high frequency induction. The upper surface of the seat portion and the lower surface of the fixed pressing portion are preferably made of a material having an elastic force.

Thereafter, when the lead material is pressed and fixed by the fixed pressing portion, the true high frequency induction machine 630 induces (generates) a high frequency by using the supplied current. The lead material is heated by the induced high frequency, whereby the first film and the second film are fused to both ends of the lead material. In the present invention, the coil for inducing the high frequency is located at the lower end of the seat portion, but the present invention is not limited thereto. That is, the coil for inducing the high frequency may be positioned at the lower end of the seat portion or the upper end of the stationary portion. Of course, it is preferable that the central axis of the coil is on an extension of the central axis of the film adhered to the lead material. The controller 640 controls the magnitude and time of the high frequency generated by the high frequency induction generator.

Fig. 8 is a view showing the shape of a seating member constituting a vacuum fused portion according to the present invention. Fig. Hereinafter, the shape of the seating member constituting the vacuum fused portion according to the present invention will be described in detail with reference to FIG.

The seating member 610 is formed in a cross shape, and a seating portion 610-1 in which a lead material is seated is formed at the end of the cross shape. The cross-shaped seating member rotates about its center.

The seat portion 610-1 has a "┳" shape, and the ━ portion has a groove with a lower end so that the lead material having the film welded thereon is seated. In the ┃ portion, the film is not fused The remainder of the lead material is located and has a perforated shape with the bottom open. That is, only the portion of the lead material to which the film is fused and the side edge portion of the lead material are seated on the seating portion 610-1. In this way, only the corresponding portion of the lead material to which the film is welded is heated by the seating portion 610-1 having a metal material.

As shown in FIG. 8, the high frequency induction portion of the high-frequency induction machine is positioned at the top of the lead material to which the film is fused among the grooves formed in the seating portion 610-1.

When the lead material to which the film seated on the seating portion 610-1 is fused is welded to the lead material by the high frequency induction machine 630, the seating member 610 rotates about the center. Of course, the lead material with which the film seated on the seating portion is fused is cooled while rotating.

In this way, the lead material to which the film is fused and adhered is conveyed to the film cut section in a state where the lead material is seated on the seating section.

In the case where the lead material which is conventionally fused with the film is not transferred to the film cut portion without being seated on the seat portion, a sagging phenomenon occurs in the wing portion of the film in a heated state. Pin holes are generated in the lead material in which the film is fused by the sagging phenomenon in the wing portion of the film.

FIG. 9 shows an example in which a pinhole is generated in a lead material in which a film is fused and adhered due to deflection phenomenon occurring in a wing portion of a conventional film.

However, according to the present invention, the lead material in which the film in a heated state is fused is placed on the seating portion 610-1 of the seating member 610 and transferred to the film cutting portion to prevent the sagging phenomenon occurring in the wing portion of the film .

10 is a view showing a configuration of an inspection unit and a discharge unit according to an embodiment of the present invention. Hereinafter, the configuration of the inspection unit and the discharge unit according to the embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 10, the inspection unit and the discharge unit include a lead material transfer unit, a lead material table, a camera, a good discharge unit, and a defective discharge unit. Of course, other configurations than the above-described configuration may be included in the inspection member and the discharge member proposed in the present invention.

The lead material transfer unit 810 transfers the lead material fused with the film to the lead material table 820. [

The lead material table 820 seats the introduced lead introduction, and the camera 830 captures an image of the lead material and the film seated on the lead material table.

The photographed image is supplied to the controller, and the controller checks whether the film is normally fused to the lead material from the supplied image. The control unit controls the lead material to be transferred to the good discharge unit 910 if the film is normally fused to the lead material and controls to transfer the lead material to the defective discharge unit 920 if the film is not normally fused to the lead material.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the scope of the present invention .

200: film supply and cutting unit 300: lead material supply unit
400: fused portion 500: bubble removal
600: Jeun fusing part 700: Film cutting part
800: Inspection section 900:
210: first film supply part 220: first film absorption part
230: first film cutting support part 240: first film cutting part
250: second film supply unit 260: second film absorption unit
270: second film cutting support part 280: second film cutting part
510: seat part 520: pressing part
610: seat assembly 620: stationary pressing portion
630: an induction high frequency induction machine 640:
810: Lead material transfer device 820: Lead material table
830: camera 840: good output unit
850: Poor discharge unit

Claims (5)

A film feeding and cutting unit for cutting the supplied first film and second film to a predetermined size;
A lead material supply unit for supplying a lead material;
Wherein the first film is supplied to the upper end of the lead material heated by the high frequency induction machine and the second film is supplied to the lower end of the lead material, and the first film and the second film are fused to the lead material;
And a mounting member having a mounting portion on which a lead material with a film welded thereon is mounted. The lead material to which the film is fused is fused and bonded using a high frequency induction machine,
A vacuum fused portion for cooling the fused and bonded lead material, the first film and the second film in a seated state;
And a film cutting unit for removing an unnecessary portion of the film fused to the electrode lead cooled by the vacuum fused portion,
The fused-
A seating member on which the lead material to which the film is welded is seated;
A fixed pressing portion for pressing and fixing the first film seated on the seating member;
And an affine high frequency induction unit for inducing a high frequency in a state where the fixed pressing portion fixes and presses the first film to fuse the first film and the second film to the lead material secondarily,
The end portion of the seating member is formed in a shape of '┳', and a groove at the lower end thereof is formed so that a lead material to which a film is fused can be seated in a portion '━', and a film is not fused Wherein the remainder of the lead material is located on the lead material, and a part of the lower part of the lead material is open.
The film forming apparatus according to claim 1,
A first film supply unit for supplying the first film;
A first film adsorption unit for adsorbing the supplied first film and placing it on a cutting table;
A first film cutting unit for cutting the first film seated on the cutting table to a predetermined size;
A second film supply unit for supplying the second film;
A second film adsorption unit for adsorbing the supplied second film and placing it on a cutting table;
And a second film cutting unit for cutting the second film seated on the cutting table to a predetermined size.
The welding apparatus according to claim 1,
And a second film cut at the film feeding and cutting section is received and placed at the upper end and has a relatively higher temperature than normal temperature;
A fixing part having a temperature higher than a normal temperature by being transported and adsorbed by the first film cut at the film feeding and cutting part;
And a fused high frequency inductor for heating the lead material supplied from the lead material supply unit using a high frequency,
Wherein the seat portion is moved to the upper portion to fuse the second film to the lead material heated by the welding high frequency induction machine,
Wherein the fixing portion is moved to the lower side in order to fuse the first film to the lead material heated by the fusing high frequency induction machine, and the film is fused to the lead material by using the high frequency induction machine.
The method according to claim 1,
And a bubble removing unit for removing bubbles formed between the fused film and the lead material,
A seating part on which a lead material on which the first film and the second film are fused is seated;
And a pressing part for pressing the lead material seated on the seating part, the pressing part being made of a material having an elastic force, wherein the film is fused to the lead material by using the high frequency induction machine.
delete
KR1020150049450A 2015-04-08 2015-04-08 Device for joining the film to the lead material using a high-frequency induction KR101672858B1 (en)

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KR1020150049450A KR101672858B1 (en) 2015-04-08 2015-04-08 Device for joining the film to the lead material using a high-frequency induction

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Application Number Priority Date Filing Date Title
KR1020150049450A KR101672858B1 (en) 2015-04-08 2015-04-08 Device for joining the film to the lead material using a high-frequency induction

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KR101672858B1 true KR101672858B1 (en) 2016-11-04

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100936740B1 (en) * 2009-08-31 2010-01-15 (주)일신테크 Method using the heating adhesive tape

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100377920B1 (en) * 2001-03-28 2003-03-29 주식회사 에스에프에이 The method of electrode tab with sealing tape and the device thereof
KR20090128721A (en) * 2008-06-11 2009-12-16 삼성코닝정밀유리 주식회사 Laminating system for film
KR20120005071A (en) * 2010-07-08 2012-01-16 허성종 High frequency heating adhesive apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100936740B1 (en) * 2009-08-31 2010-01-15 (주)일신테크 Method using the heating adhesive tape

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