JPH1022427A - Package for semiconductor device and manufacture therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the manufacture process of a semiconductor package and reduce the manufacturing cost by providing a conducting part which penetrates an adhesive layer in the thickness direction and electrically connects the wiring pattern and a heat sink formed in the package main body. SOLUTION: At the time of bonding a resin board 10 and a heat sink 20, the heat sink 20 and the resin board 10 are electrically connected at the same time. Therefore, on the surface of the heat sink 20 opposing the resin board 10, a conductive bump 22 with a sharp leading edge is formed. At the time of integrally bonding the resin board 10 and the heat sink 20, keeping an electrically insulating adhesive resin sheet 18a between, the conductive bump 22 penetrates the adhesive resin sheet 18a and the wiring pattern of the resin board 10 and the heat sink 20 are electrically connected through the conductive bump 22. Thus, a package is simply constituted and the connection between the semiconductor chip and the wiring pattern is facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device package having a heat sink and a method of manufacturing the same.

[0002]

2. Description of the Related Art PPGA (Plastic Pin Grid Array),
PBGA ((Plastic Ball Grid Array)) is a package for semiconductor devices that uses a resin substrate such as a printed circuit board on the package body. If a chip that generates a large amount of heat is mounted on it, heat dissipation from the package body is poor. Some products are provided with a heat sink provided on the outer surface of the package.

FIG. 6 is an enlarged sectional view showing a main part of a semiconductor device package with a heat sink using a resin substrate for a package body. Reference numeral 10 denotes a resin substrate constituting the body of the package, which is formed by laminating a plurality of plastic substrates. 12 is a wiring pattern, 14
Is a solder resist covering the wiring pattern 12 on the surface of the resin substrate 10, and 16 is a lead pin for external connection.
Reference numeral 20 denotes a metal heat sink bonded to the outer surface of the resin substrate 10 by the adhesive layer 18. An accommodation hole for accommodating the semiconductor chip 30 is opened at the center of the resin substrate 10, and the semiconductor chip 30 is mounted on the heat sink 20 by being joined with a conductive adhesive or the like.

The heat sink 20 is for promoting heat dissipation from the semiconductor chip 30, and the wiring pattern 12 of the resin substrate 10 and the heat sink 20 are usually electrically insulated and bonded by an adhesive layer 18. In some cases, the heat sink 20 is used as a ground layer or a power supply layer. In this case, it is necessary to electrically connect the wiring pattern 12 serving as a ground line or a power supply line to the heat sink 20.

FIG. 6 shows an example in which the heat sink 20 and the wiring pattern 12 are electrically connected by wire bonding. 32 is a bonding wire.
As another method of electrically connecting the heat sink 20 and the wiring pattern 12, the heat sink 2
After bonding the resin substrate 10 and the heat sink 20, a through-hole is formed through the resin substrate 10 and the heat sink 20. Heat sink 20
After bonding, a connection hole is provided from the resin substrate 10 side to the heat sink 20 by drilling, and the connection hole is filled with a conductive paste to electrically connect.

[0006]

FIG. 7 shows a conventional method for producing a semiconductor device package with a heat sink.
In this method, the resin substrate 10 provided with the pin mounting holes 17 for mounting the lead pins 16 is aligned with the heat sink 20, and integrated by pressure and heat via an adhesive resin sheet 18a such as a prepreg. In the case where the heat sink 20 is used as the ground layer or the power supply layer by the conventional method,
Since a wire bonding method or a method in which a through hole is provided in the resin substrate 10 and the heat sink 20 and plated through a hole is used, the method of providing a through hole and electrically connecting has a problem that a manufacturing process becomes complicated. In the case of the wire bonding method, in order to bond the heat sink 20 and the wiring pattern 12, a wiring pattern for bonding to the heat sink 20 is provided in addition to the wiring pattern for bonding to the semiconductor chip 30, and a region for wire bonding to the heat sink 20. However, there is a problem in that there are restrictions such as the need to secure

The present invention has been made to solve these problems, and an object of the present invention is to provide a semiconductor package with a heat sink having a resin substrate as a main body and using the heat sink as a ground layer or a power supply layer. It is an object of the present invention to provide a semiconductor package which simplifies a semiconductor package manufacturing process, effectively reduces the semiconductor package manufacturing cost, and facilitates wiring of the package, and a method of manufacturing the same.

[0008]

The present invention has the following arrangement to achieve the above object. That is, in a package for a semiconductor device in which a heat sink is integrally bonded to a package body via an adhesive layer, the heat sink is formed in the package body by penetrating the adhesive layer in a thickness direction of the adhesive layer. A conductive portion for electrically connecting a wiring pattern and the heat sink is provided. Also,
The conductive portion is formed by inserting a tip of a conductive bump having a sharp tip into the wiring pattern. Further, the conductive portion is formed by inserting a tip portion of a conductive bump having a sharp tip into the heat sink. Further, the conductive portion is formed by a conductive paste, plating, or solder filled in a connection hole provided through the adhesive layer. In a semiconductor device package in which a heat sink is integrally bonded to a package body via an adhesive, the wiring pattern exposed on the bonding surface of the package body with the heat sink and the heat sink are connected via a conductive adhesive. And electrically connected to each other.

In a method of manufacturing a package for a semiconductor device in which a heat sink is integrally bonded to a package body via an adhesive layer, a conductive material having a sharp tip formed on a surface of the heat sink facing the package body. A conductive bump is provided, and the package body and the heat sink are aligned with each other, and an adhesive resin sheet having electrical insulation is interposed between the package body and the heat sink. The wiring pattern is electrically connected to the heat sink by penetrating the adhesive resin sheet and making the tip of the conductive bump enter the wiring pattern formed on the package body. Further, in the method of manufacturing a package for a semiconductor device, wherein a heat sink is integrally bonded to the package body via an adhesive layer, a tip is sharply formed on a surface of the wiring pattern formed on the package body facing the heat sink. The package body and the heat sink are aligned with each other, and an adhesive resin sheet having electrical insulation is interposed between the package body and the heat sink. The wiring pattern and the heat sink are electrically connected by penetrating the adhesive resin sheet with a bump and making the tip of the conductive bump enter the heat sink. Also,
In a method of manufacturing a package for a semiconductor device in which a heat sink is integrally bonded to a package body via an adhesive layer, an adhesive layer is formed on a surface of the heat sink, and the adhesive layer is connected to the surface of the heat sink. After a connection hole is provided and a conductive portion is formed in the connection hole, the package body and the heat sink are aligned and bonded via the adhesive layer, and a wiring formed in the package body by the conductive portion. The pattern and the heat sink are electrically connected. Further, in the method for manufacturing a package for a semiconductor device in which a package body and a heat sink are integrally bonded by an adhesive, a conductive adhesive is applied to a surface of the heat sink,
The surface of the package body on which the wiring pattern is formed is covered with a protective coating by exposing the wiring pattern electrically connected to the heat sink, and the package body and the heat sink are aligned to apply the conductive adhesive. The wiring pattern formed on the package body and the heat sink are electrically connected to each other by bonding.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows a first embodiment of a method for manufacturing a semiconductor device package according to the present invention. FIG. 1A shows a resin substrate 10 constituting a package body.
2 shows a state in which a metal heat sink 20 is bonded via an adhesive resin sheet 18a having electrical insulation. The configurations of the resin substrate 10 and the heat sink 20 are the same as the resin substrate 10 and the heat sink 20 in the above-described conventional example. The semiconductor package of the embodiment is for PGA, and has a pin mounting hole 17 for mounting the lead pin 16 on the resin substrate 10.

The bonding method according to the present embodiment is characterized in that when the resin substrate 10 and the heat sink 20 are bonded, an electrical connection between the heat sink 20 and the resin substrate 10 is made at the same time. For this purpose, in the present embodiment, a conductive bump 22 having a pointed tip is formed on the surface of the heat sink 20 facing the resin substrate 10, and the conductive bump 22 is electrically connected to the resin substrate 10 with an adhesive resin sheet 18 a having electrical insulation. When the heat sink 20 is pressed and bonded together, the conductive bumps 22
Penetrates the adhesive resin sheet 18a, and the conductive bumps 22
The wiring pattern 12 of the resin substrate 10 and the heat sink 20 are electrically connected to each other via the substrate.

As the adhesive resin sheet 18a, a commonly used adhesive sheet such as a prepreg which is adhered by heating and pressing can be used. Since the conductive bumps 22 penetrate the adhesive resin sheet 18a and establish electrical continuity between the wiring pattern 12 and the heat sink 20, the tip shape is sharpened, and the adhesive resin sheet 18 is applied between the resin substrate 10 and the heat sink 20. When the pressure is applied, the leading end is hardly inserted into the wiring pattern 12 so that electrical conduction can be ensured. Thus, the conductive bumps 22 are formed on the adhesive resin sheet 1.
The height is set in consideration of the thickness of 8a.

FIG. 1B is a sectional view showing a state in which the resin substrate 10 and the heat sink 20 are bonded via the adhesive resin sheet 18a. The tip of the conductive bump 22 is pressed into the wiring pattern 12 of the resin substrate 10 and crushed, and the cross-sectional shape becomes trapezoidal. Reference numeral 22a denotes a conductive portion formed by the conductive bumps 22. Heat sink 20 and resin substrate 10
Means a conductive portion 22a formed by the conductive bump 22
Are electrically connected via The conductive bumps 22 are formed so as to have the same planar arrangement as the connection portion of the wiring pattern 12 of the resin substrate 10 electrically connected to the heat sink 20.

The conductive bumps 22 can be formed in an appropriate pattern on the heat sink 20 by a printing method using a conductive paste. A method for forming the conductive bump 22 having a sharp tip is described in, for example, Japanese Patent Application Laid-Open No. 6-3502.
The method described in No. 50 can be applied. After the conductive bumps 22 are formed, the resin substrate 10 and the heat sink 20 are bonded. When the adhesive resin sheet 18a is heated and bonded in a softened state, the conductive bumps 22 are easily formed. Adhesive resin sheet 18a
, And the electrical connection between the wiring pattern 12 and the heat sink 20 is ensured.

FIG. 2 shows a state in which a semiconductor chip 30 is mounted on a semiconductor device package with a heat sink obtained by the above method. Compared with the conventional configuration shown in FIG. 6, in the semiconductor device of this embodiment, a conductive portion 22a is formed inside the adhesive layer 18, and the heat sink 20 and the wiring pattern 12 of the resin substrate 10 are electrically connected via the conductive portion 22a. It is characterized by electrical conduction. The conductive portion 22a can be arbitrarily arranged and formed on the heat sink 20, and has an advantage that it can be easily aligned with the wiring pattern 12 provided on the resin substrate 10 and formed. Further, since the conductive portion 22 is provided inside the adhesive layer 18, there is an effect that the wire bonding between the semiconductor chip 30 and the wiring pattern 12 is not hindered.

FIG. 3 shows a second embodiment of the method for manufacturing a semiconductor device package. In this embodiment, contrary to the first embodiment, conductive bumps 22 are provided on the surface of the resin substrate 10, that is, on the portion of the wiring pattern 12 provided on the resin substrate 10 to be electrically connected to the heat sink 20. When the heat sink 20 and the resin substrate 10 are integrally bonded via the resin sheet 18a, the distal ends of the conductive bumps 22 are inserted into the heat sink 20 to be electrically connected.

The conductive bumps 22 provided on the resin substrate 10 are also formed in a shape having a sharp tip, similarly to the first embodiment, so that the tip does not easily enter the heat sink 20 when the resin substrate 10 and the heat sink 20 are bonded. . Conductive bump 2
2 can be formed in an arbitrary arrangement by a printing method using a conductive paste similarly to the first embodiment. Fig. 3 (b)
FIG. 5 is a cross-sectional view of a state where a resin substrate 10 and a heat sink 20 are integrally bonded in a second embodiment. Conductive bump 22
Has a trapezoidal cross-section at the tip, which is difficult to fit into the heat sink 20.

FIG. 4 shows a third embodiment of the method for manufacturing a semiconductor device package. In this embodiment, an adhesive resin sheet 18a is first adhered to the area of the surface of the heat sink 20 that adheres to the resin substrate 10, and the adhesive resin sheet 18a
Is provided with a connection hole communicating with the surface of the heat sink 20, and the connection hole is filled with a conductive paste (resin binder mixed with conductive particles) to form a conductive portion 24 (FIG. 4 (a)). ). The conductive portion 24 is formed in accordance with the position of the wiring pattern 12 electrically connected to the heat sink 20.
Instead of filling the conductive paste, a method of filling the connection holes with solder balls and forming the conductive portion 24 with solder, or a method of forming the conductive portion 24 by plating with copper, nickel, gold, or the like is possible. .

Next, the resin substrate 10 and the heat sink 20 are aligned and bonded together via the adhesive resin sheet 18a, and the conductive portion 24 electrically connects the heat sink 20 and the wiring pattern 12 of the resin substrate 10 to each other. By connecting, a semiconductor device package is obtained. In this case, in order to ensure electrical connection between the wiring pattern 12 and the heat sink 20, the surface of the conductive portion 24 may be formed in a bump shape slightly protruding from the surface of the adhesive resin sheet 18a.

FIG. 5 shows a fourth embodiment of the method for manufacturing a semiconductor device package. In this embodiment, a conductive adhesive 26 is applied to an area of the surface of the heat sink 20 that adheres to the resin substrate 10.
Only the portion electrically connected to the substrate is covered with a protective film such as a solder resist 14. Resin substrate 10 and heat sink 20
Are aligned, and the resin substrate 10 and the heat sink 20 are bonded via the conductive adhesive 26, so that the wiring pattern 12 of the resin substrate 10 and the heat sink 20 are electrically connected via the conductive adhesive 26. Connected.

In order to expose a portion of the wiring pattern 12 electrically connected to the heat sink 20 on the resin substrate 10 and cover it with the solder resist 14, the surface of the resin substrate 10 on which the wiring pattern 12 is formed is made of a photosensitive solder resist. And then expose and develop the photosensitive solder resist in a predetermined pattern. When the lead pins 16 are used as external connection terminals, the solder resist 14 is covered so as not to enter the pin mounting holes 17. When the resin substrate 10 and the heat sink 20 are bonded to each other with the conductive adhesive 26, the conductive adhesive 26 enters the opening from which the solder resist 14 has been removed, and the heat sink 2
0 and the wiring pattern 12 are electrically connected, and the heat sink 20 and the resin substrate 10 are bonded.

In the above embodiment, a product using a lead pin as an external connection terminal has been described. However, the external connection terminal is not limited to a lead pin, and can be similarly applied to a device using a ball bump such as PBGA. . In addition, the present invention can be applied to a case where a resin substrate such as a printed circuit board is used for a package body to obtain a suitable heat dissipation property and reduce manufacturing cost. It is also possible to apply to a semiconductor device package with a heat sink.

[0023]

According to the semiconductor device package of the present invention, as described above, the electrical connection between the heat sink and the resin substrate is determined by the adhesive layer for bonding the heat sink to the resin substrate. In addition, the package is simply configured, and the connection between the semiconductor chip and the wiring pattern can be easily performed. According to the method of manufacturing a semiconductor package according to the present invention, electrical connection between the heat sink and the wiring pattern of the resin substrate is easy, and the wiring pattern of the resin substrate is simultaneously formed only by the operation of bonding the resin substrate and the heat sink. The heat sink and the heat sink can be electrically connected to each other, so that the manufacturing process can be shortened and the manufacturing cost can be effectively reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a first embodiment of a method for manufacturing a semiconductor device package.

FIG. 2 is a cross-sectional view of a semiconductor device in which a semiconductor element is mounted on the semiconductor device package obtained in the first embodiment.

FIG. 3 is an explanatory view showing a second embodiment of a method for manufacturing a semiconductor device package.

FIG. 4 is an explanatory view showing a third embodiment of a method for manufacturing a semiconductor device package.

FIG. 5 is an explanatory view showing a fourth embodiment of a method for manufacturing a semiconductor device package.

FIG. 6 is a sectional view showing a configuration of a conventional example of a semiconductor device package.

FIG. 7 is an explanatory view showing a conventional method for manufacturing a semiconductor device package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Resin board 12 Wiring pattern 14 Solder resist 16 Lead pin 17 Pin mounting hole 18 Adhesive layer 18a Adhesive resin sheet 20 Heat sink 22 Conductive bump 22a Conductive part 24 Conductive part 26 Conductive adhesive 30 Semiconductor chip

Claims (9)

[Claims] 1. A semiconductor device package comprising a heat sink integrally bonded to a package body via an adhesive layer, wherein the package body is formed by penetrating the adhesive layer in the thickness direction. A semiconductor device package, comprising: a conductive portion that electrically connects the formed wiring pattern and the heat sink. 2. The semiconductor device package according to claim 1, wherein the conductive portion is formed by inserting a tip of a conductive bump having a sharp tip into the wiring pattern. 3. The semiconductor device package according to claim 1, wherein the conductive portion is formed by inserting a tip of a conductive bump having a sharp tip into the heat sink. 4. The semiconductor device according to claim 1, wherein the conductive portion is formed by a conductive paste, plating or solder filled in a connection hole provided through the adhesive layer. For package. 5. A semiconductor device package in which a heat sink is integrally bonded to a package body via an adhesive, wherein a wiring pattern exposed on a bonding surface of the package body with the heat sink is electrically conductively bonded to the heat sink. A package for a semiconductor device, wherein the package is electrically connected via an agent. 6. A method for manufacturing a package for a semiconductor device, wherein a heat sink is integrally bonded to a package main body via an adhesive layer, wherein a conductive tip having a sharp end formed on a surface of the heat sink facing the package main body. A conductive bump is provided, and the package body and the heat sink are aligned with each other, and an adhesive resin sheet having electrical insulation is interposed between the package body and the heat sink. A semiconductor, wherein the wiring pattern and the heat sink are electrically connected by penetrating the adhesive resin sheet and making a tip end of the conductive bump into a wiring pattern formed on the package body. Manufacturing method of device package. 7. A method for manufacturing a package for a semiconductor device, wherein a heat sink is integrally bonded to a package body via an adhesive layer, wherein a tip of a wiring pattern formed on the package body is opposed to a surface facing the heat sink. Providing sharply formed conductive bumps, aligning the package body and the heat sink, and pressing an adhesive resin sheet having electrical insulation between the package body and the heat sink to apply pressure, A semiconductor device for electrically connecting the wiring pattern and the heat sink by penetrating the adhesive resin sheet with the conductive bump and making a tip end of the conductive bump into the heat sink. Manufacturing method for packaging. 8. A method for manufacturing a package for a semiconductor device, wherein a heat sink is integrally bonded to a package body via an adhesive layer, wherein an adhesive layer is formed on a surface of the heat sink, and the heat sink is formed on the adhesive layer. After forming a conductive portion in the connection hole, the package body and the heat sink are aligned and bonded via the adhesive layer, and the package is formed by the conductive portion. A method for manufacturing a package for a semiconductor device, comprising: electrically connecting a wiring pattern formed on a main body to the heat sink. 9. A method of manufacturing a package for a semiconductor device, wherein a package body and a heat sink are integrally bonded by an adhesive, wherein a conductive adhesive is applied to a surface of the heat sink, and a wiring pattern of the package body is formed. By exposing the wiring pattern electrically connected to the heat sink and covering the formed surface with a protective coating, by aligning the package body and the heat sink and bonding them via the conductive adhesive, A method of manufacturing a package for a semiconductor device, comprising: electrically connecting a wiring pattern formed on the package body to the heat sink.