JPH0535589B2 - - Google Patents
Info
- Publication number
- JPH0535589B2 JPH0535589B2 JP60136441A JP13644185A JPH0535589B2 JP H0535589 B2 JPH0535589 B2 JP H0535589B2 JP 60136441 A JP60136441 A JP 60136441A JP 13644185 A JP13644185 A JP 13644185A JP H0535589 B2 JPH0535589 B2 JP H0535589B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- wiring pattern
- connection
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 239000011888 foil Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、可撓性プリント基板の電気的接続構
造に関し、特には、他の回路基板との相互接続部
分を対面させた状態で半田接続するような接続態
様に採用して自動半田処理等を好適に達成可能な
可撓性プリント基板に於ける接続構造の改良に関
する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to an electrical connection structure of a flexible printed circuit board, and in particular, to solder connection with the interconnection portion of a flexible printed circuit board facing each other. The present invention relates to an improvement in a connection structure for a flexible printed circuit board that can suitably achieve automatic soldering and the like by adopting such a connection mode.
「従来の技術」
可撓性プリント基板と他の回路基板とを半田に
より電気的に接続する為の一手法としては、第5
図に概念的に示すように、一般には適当な樹脂性
絶縁フイルムからなる可撓性ベース部材2Aに接
着剤6を介して銅箔等の導電箔で形成される所要
の回路配線パターン3を被着し、該回路配線パタ
ーン3の接続部分3Dを除く他の領域に接着剤5
を使用するか又は使用することなくカバーフイル
ム材、絶縁コート若しくはその他レジスト材等の
薄い表面保護部材4を設けた可撓性プリント基板
1Aを用意し、このような構造の基板1Aの上記
接続部分3Dを他の回路基板8の回路配線パター
ン10に於ける対応接続部分10Aと対面させる
ように両基板1A及び8を接着剤12で係合し、
上記両接続部分3D、10Aの双方又は少なくと
もそのいずれか一方に予め設けた予備半田を例え
ば可撓性プリント基板1A側に配置した適当な熱
源で溶融することにより、両回路配線パターン
3、10を半田14で接続するように構成する場
合がある。同図に於いて、その他、9は回路基板
8のベース部材、11は該ベース部材9と回路配
線パターン10との被着用接着剤を示す。"Prior art" As a method for electrically connecting a flexible printed circuit board and another circuit board by soldering, the fifth
As conceptually shown in the figure, a flexible base member 2A made of a suitable resin insulating film is generally covered with a required circuit wiring pattern 3 made of a conductive foil such as copper foil via an adhesive 6. The adhesive 5 is applied to other areas of the circuit wiring pattern 3 except for the connecting portion 3D.
A flexible printed circuit board 1A is provided with a thin surface protection member 4 such as a cover film material, an insulating coat, or other resist material, with or without the use of Both boards 1A and 8 are engaged with adhesive 12 so that 3D faces the corresponding connection part 10A in the circuit wiring pattern 10 of the other circuit board 8,
Both circuit wiring patterns 3 and 10 are melted by melting the preliminary solder provided in advance on both or at least one of the connection portions 3D and 10A using an appropriate heat source placed on the flexible printed circuit board 1A side, for example. In some cases, the connection may be made using solder 14. In the figure, reference numeral 9 indicates a base member of the circuit board 8, and reference numeral 11 indicates an adhesive to which the base member 9 and the circuit wiring pattern 10 are attached.
「発明が解決しようとする問題点」
半田接続による上記接続構造に於いて、両回路
基板1A及び8の対面接続部分3D、10Aは、
半田14で接続されるが、一方の接続部分10A
に対する可撓性プリント基板1Aの接続部分3D
は、表面保護部材4及び接着剤5、12の厚さ相
当分、離間した位置に配置されること、また両接
続部分3D、10Aは略密閉された状態となつて
半田接続に伴なう発生ガスの逃げ場がない等の
為、予備半田の溶融による半田14の接続不良率
が高く、更に、接続良否の判別並びに接続不良個
所の修正などは極めて困難であり、この為半田接
続構造の信頼性を欠く虞があつた。また、斯かる
半田による対面接続構造では、接続すべき両ラン
ド間が50μm以上離れると半田フイレツトの形成
が困難となるので、リフロー又はデイツプソルダ
ー若しくはフローソルダー等の簡易な自動半田処
理の採用を望むことも構造上不可能であつて接続
コストの低減化を図ることが困難であるという難
点がある。"Problems to be Solved by the Invention" In the above connection structure using solder connection, the facing connection parts 3D and 10A of both circuit boards 1A and 8 are as follows:
It is connected with solder 14, but one connection part 10A
Connecting portion 3D of flexible printed circuit board 1A to
are arranged at positions separated by a distance corresponding to the thickness of the surface protection member 4 and adhesives 5 and 12, and both connection parts 3D and 10A are in a substantially sealed state to prevent occurrences due to solder connections. Since there is no place for the gas to escape, there is a high rate of failure in the connection of the solder 14 due to melting of the preliminary solder.Furthermore, it is extremely difficult to determine whether the connection is good or bad and to correct the failure of the connection, which reduces the reliability of the solder connection structure. There was a risk that it would be lacking. In addition, in such a face-to-face connection structure using solder, if the two lands to be connected are separated by 50 μm or more, it becomes difficult to form a solder fillet, so it is desirable to use a simple automatic soldering process such as reflow, dip solder, or flow solder. However, it is structurally impossible and it is difficult to reduce the connection cost.
「問題点を解決するための手段」
本発明は、上記に鑑み、導電箔からなる所要の
回路配線パターンを可撓性ベース部材及び表面保
護部材間に絶縁下に介装するように構成した可撓
性プリント基板と他の回路基板との両接続部分を
対面配置させて半田接続するような接続構造の場
合、上記他の回路基板に形成された回路配線パタ
ーン部分と半田接続すべき上記回路配線パターン
の所要部分を上記可撓性ベース部材及び表面保護
部材の開孔により露出させる半田接続用アクセス
ホールを形成し、該アクセスホールでの露出部分
に前記他の回路基板の回路配線パターン部分と近
接乃至は接触する方向の曲げ部分を形成すべく構
成することにより、既述の諸問題を好適に解消す
るようにした可撓性プリント基板の接続構造を提
供するものである。このような半田接続用アクセ
ス構造を備えた可撓性プリント基板によれば、両
回路基板の接続部分を略接触状態で配装可能であ
つて、簡易高能率な自動半田処理手段を介して電
気的機械的に強固安定な信頼性の高い半田接続構
造を低コストに実施できることとなる。"Means for Solving the Problems" In view of the above, the present invention provides a flexible base member in which a required circuit wiring pattern made of conductive foil is interposed between a flexible base member and a surface protection member while being insulated. In the case of a connection structure in which both the connection parts of the flexible printed board and another circuit board are placed facing each other and are connected by solder, the above-mentioned circuit wiring to be connected by solder to the circuit wiring pattern part formed on the above-mentioned other circuit board. An access hole for solder connection is formed in which a required portion of the pattern is exposed through the opening in the flexible base member and the surface protection member, and the exposed portion of the access hole is adjacent to the circuit wiring pattern portion of the other circuit board. The present invention provides a connection structure for flexible printed circuit boards that suitably solves the above-mentioned problems by forming a bent portion in the direction of contact. According to a flexible printed circuit board equipped with such an access structure for solder connection, it is possible to arrange the connecting parts of both circuit boards in a substantially contacting state, and electrical connection can be made through a simple and highly efficient automatic soldering process means. A mechanically strong, stable and highly reliable solder connection structure can be realized at low cost.
「実施例」
第1図及び第2図中、1は本発明の一実施例に
従つて構成された可撓性プリント基板であり、2
は既述と同様なベース部材、3は該ベース部材2
上に被着形成される銅箔等の導電箔からなる所要
の回路配線パターン、4は同じく前記同等の表面
保護部材を示し、5及び6はそれら構成部材間の
接着剤であつて、斯くして回路配線パターン3は
可撓性ベース部材2と表面保護部材4との間に介
装された構造となる。そして、この実施例の場
合、回路配線パターン3の接続部分はベース部材
2及び表面保護部材4の双方の対応部分を開放し
て構成された半田接続用アクセスホール7を横断
して露出すると共に第2図の如く下方に膨出する
曲げ部分3Aを備えるように構成されている。こ
のような曲げ部分は、第1図のような直線状個所
に形成できる他、第3図の如く例えば接続部分を
従前のようなランド状に形成した上、一対の長溝
状透孔3Cを設けて鍔状に加工する際又はその後
に部分3Bに曲げ処理を施すように構成すること
も可能である。"Embodiment" In FIGS. 1 and 2, 1 is a flexible printed circuit board constructed according to an embodiment of the present invention, and 2
3 is the same base member as described above, and 3 is the base member 2.
A required circuit wiring pattern made of conductive foil such as copper foil is deposited thereon, 4 also represents the equivalent surface protection member, and 5 and 6 are adhesives between these constituent members. The circuit wiring pattern 3 is interposed between the flexible base member 2 and the surface protection member 4. In the case of this embodiment, the connection portion of the circuit wiring pattern 3 is exposed across the access hole 7 for solder connection, which is formed by opening the corresponding portions of both the base member 2 and the surface protection member 4. As shown in FIG. 2, it is configured to include a bent portion 3A that bulges downward. Such a bent part can be formed in a straight line as shown in Fig. 1, or, for example, as shown in Fig. 3, the connecting part can be formed into a land shape as before, and a pair of long groove-shaped through holes 3C are provided. It is also possible to perform a bending process on the portion 3B during or after processing it into a flange shape.
第4図は上記構成の可撓性プリント基板1と他
のフレキシブル又は硬質の回路基板8とを半田接
続した状態を示し、第5図と同一符号はそれらと
同一構成要素を表わし、図の如く両回路基板1及
び8の接続部分を位置合わせして接着剤12で接
合すると、回路基板8の接続部分10Aに対して
可撓性プリント基板1側の接続曲げ部分3A又は
3Bは可及的に近接対向配置されるか又は図示の
ように両者が対面接触するような状態となるの
で、上記開放アクセスホール7に露出した両接続
部分に適宜半田13を十分量付着させるような態
様で、発生ガス等を好適に放散させながら機械
的・電気的に強固安定な半田接続構造をリフロ
ー、デイツプ手段或いはフローソルダー等の自動
半田処理法で迅速に達成可能となる。 FIG. 4 shows a state in which the flexible printed circuit board 1 having the above structure and another flexible or rigid circuit board 8 are connected by soldering, and the same reference numerals as in FIG. 5 represent the same components, as shown in the figure. When the connecting portions of both circuit boards 1 and 8 are aligned and bonded with adhesive 12, the connecting bent portion 3A or 3B on the flexible printed circuit board 1 side is bent as much as possible with respect to the connecting portion 10A of the circuit board 8. Since they are arranged close to each other or in a state where they are in face-to-face contact as shown in the figure, the generated gas is applied in such a manner that a sufficient amount of solder 13 is properly attached to both the connecting parts exposed in the open access hole 7. A mechanically and electrically strong and stable solder connection structure can be quickly achieved by an automatic soldering process such as reflow, dip means, or flow solder while dissipating the solder in a suitable manner.
「発明の効果」
本発明に係る可撓性プリント基板の接続構造に
よれば、上記の如き構成を備えるので、少なくと
も次のような効果を奏する。"Effects of the Invention" Since the flexible printed circuit board connection structure according to the present invention has the above-described configuration, at least the following effects can be achieved.
(1) 開放構造の半田アクセスホールを有するの
で、半田接続の際、発生ガス等を好適に開放さ
せながら機械的及び電気的に強固安定な半田接
続構造をリフロー、デイツプ手段或いはフロー
ソルダー等の自動半田処理法で迅速に達成でき
る。(1) Since the solder access hole has an open structure, it allows the generated gas to be appropriately released during solder connection, while creating a mechanically and electrically strong and stable solder connection structure using automatic reflow, dip means, or flow solder. This can be quickly achieved using the soldering method.
(2) 従つて、相手方回路基板と電気的且つ機械的
に強固安定な信頼性の高い半田接続構造を構成
できる。(2) Therefore, it is possible to construct a highly reliable solder connection structure that is electrically and mechanically strong and stable with the mating circuit board.
(3) 接続部分を横断露出させ得る開放アクセスホ
ールを具備するので、最適な自動半田処理法の
採用により高能率な半田接続を行える。(3) Since it is equipped with an open access hole that allows cross-exposure of the connection part, highly efficient solder connections can be made by adopting the optimal automatic soldering process.
(4) 半田接続の良否判別を視認等で簡便に処理で
きる。(4) It is possible to easily determine the quality of solder connections by visual inspection, etc.
(5) 半田接続の修正・補修も容易であつて、接続
良品率の実質的な向上化を望める。(5) Correcting and repairing solder connections is easy, and a substantial improvement in the rate of good connections can be expected.
(6) 両回路基板の接続部分を可及的に近接させる
か又は接触状態に配置できるので、それら接続
部分に対する半田濡れ処理若しくはメツキ等の
接続低抵抗化処理を軽減乃至は省略できる。(6) Since the connecting portions of both circuit boards can be placed as close as possible or in contact with each other, it is possible to reduce or omit connection resistance reduction treatments such as solder wetting or plating for these connecting portions.
(7) 半田接続構造の低コスト化に寄与する。(7) Contributes to cost reduction of solder connection structure.
第1図は、本発明の一実施例による接続構造を
備えた可撓性プリント基板の概念的な要部拡大平
面構成図、第2図は、その概念的な要部拡大断面
構成図、第3図は、接続部分の他の例に従つた概
念的な平面構成図、第4図は、第1図の可撓性プ
リント基板と他の回路基板との半田接続構造を示
す概念的な断面構成図、そして、第5図は、従来
の対向半田接続構造の同様な断面構成図である。
1……可撓性プリント基板、2……可撓性ベー
ス部材、3……回路配線パターン、3A、3B…
…曲げ部分、4……表面保護部材、5、6……接
着剤、7……アクセスホール、8……他の回路基
板、9……ベース部材、10……回路配線パター
ン、10A……接続部分、11、12……接着
剤、13、14……接続用半田。
FIG. 1 is a conceptual enlarged plan view of the main parts of a flexible printed circuit board equipped with a connection structure according to an embodiment of the present invention, and FIG. 2 is a conceptual enlarged cross-sectional view of the main parts thereof. FIG. 3 is a conceptual planar configuration diagram according to another example of the connection part, and FIG. 4 is a conceptual cross-sectional view showing a solder connection structure between the flexible printed circuit board of FIG. 1 and another circuit board. FIG. 5 is a similar cross-sectional configuration diagram of a conventional opposing solder connection structure. 1...Flexible printed circuit board, 2...Flexible base member, 3...Circuit wiring pattern, 3A, 3B...
...Bending portion, 4...Surface protection member, 5, 6...Adhesive, 7...Access hole, 8...Other circuit board, 9...Base member, 10...Circuit wiring pattern, 10A...Connection Parts 11, 12...Adhesive, 13, 14...Solder for connection.
Claims (1)
撓性ベース部材及び表面保護部材間に絶縁下に介
装するように構成した可撓性プリント基板に於い
て、他の回路基板に形成された回路配線パターン
部分と半田接続すべき上記回路配線パターンの所
要部分全面を露出させる半田接続用アクセスホー
ルを備え、該アクセスホールを横断する上記回路
配線パターンの露出部分に前記他の回路基板の回
路配線パターン部分と近接乃至は接触する方向の
曲げ部分を具備すべく構成したことを特徴とする
可撓性プリント基板の接続構造。1. In a flexible printed circuit board configured such that a required circuit wiring pattern made of conductive foil is interposed between a flexible base member and a surface protection member under insulation, a circuit formed on another circuit board A solder connection access hole is provided that exposes the entire surface of a required portion of the circuit wiring pattern to be soldered connected to the wiring pattern portion, and the circuit wiring pattern of the other circuit board is provided in the exposed portion of the circuit wiring pattern that crosses the access hole. 1. A connection structure for a flexible printed circuit board, characterized in that it is configured to include a bent portion in a direction that is close to or in contact with the other portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13644185A JPS61294889A (en) | 1985-06-22 | 1985-06-22 | Connection structure of flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13644185A JPS61294889A (en) | 1985-06-22 | 1985-06-22 | Connection structure of flexible printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61294889A JPS61294889A (en) | 1986-12-25 |
JPH0535589B2 true JPH0535589B2 (en) | 1993-05-26 |
Family
ID=15175189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13644185A Granted JPS61294889A (en) | 1985-06-22 | 1985-06-22 | Connection structure of flexible printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61294889A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012146353A (en) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | Flexible wiring board, connection structure of wiring board and method of manufacturing thereof |
JP2019121774A (en) * | 2017-12-28 | 2019-07-22 | 株式会社フジクラ | Wiring board with metal piece and manufacturing method of the same |
WO2019159463A1 (en) * | 2018-02-19 | 2019-08-22 | 日本メクトロン株式会社 | Substrate connection structure and substrate connection structure manufacturing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315057B2 (en) * | 1973-03-24 | 1978-05-22 | ||
JPS56142693A (en) * | 1980-04-09 | 1981-11-07 | Sharp Kk | Method of connecting printed board |
JPS597393A (en) * | 1982-07-05 | 1984-01-14 | セイコーエプソン株式会社 | Display |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315057U (en) * | 1976-07-20 | 1978-02-08 |
-
1985
- 1985-06-22 JP JP13644185A patent/JPS61294889A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315057B2 (en) * | 1973-03-24 | 1978-05-22 | ||
JPS56142693A (en) * | 1980-04-09 | 1981-11-07 | Sharp Kk | Method of connecting printed board |
JPS597393A (en) * | 1982-07-05 | 1984-01-14 | セイコーエプソン株式会社 | Display |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012146353A (en) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | Flexible wiring board, connection structure of wiring board and method of manufacturing thereof |
JP2019121774A (en) * | 2017-12-28 | 2019-07-22 | 株式会社フジクラ | Wiring board with metal piece and manufacturing method of the same |
WO2019167602A1 (en) * | 2017-12-28 | 2019-09-06 | 株式会社フジクラ | Wiring board including metal piece and method for manufacturing wiring board including metal piece |
WO2019159463A1 (en) * | 2018-02-19 | 2019-08-22 | 日本メクトロン株式会社 | Substrate connection structure and substrate connection structure manufacturing method |
JP2019145624A (en) * | 2018-02-19 | 2019-08-29 | 日本メクトロン株式会社 | Substrate connection structure and method for manufacturing substrate connection structure |
Also Published As
Publication number | Publication date |
---|---|
JPS61294889A (en) | 1986-12-25 |
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