JPS6150400B2 - - Google Patents
Info
- Publication number
- JPS6150400B2 JPS6150400B2 JP56014603A JP1460381A JPS6150400B2 JP S6150400 B2 JPS6150400 B2 JP S6150400B2 JP 56014603 A JP56014603 A JP 56014603A JP 1460381 A JP1460381 A JP 1460381A JP S6150400 B2 JPS6150400 B2 JP S6150400B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- printed circuit
- circuit board
- flexible printed
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は導体回路が絶縁フイルムで被覆され端
子部だけが露出され、この端子露出面に半田メツ
キまたは半田盛りされた硬質プリント基板と、フ
レキシブルプリント基板との接合法に関し、接合
の信頼性向上とプリント基板の組合わせ、配置を
多様化することを目的とするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of joining a flexible printed circuit board to a rigid printed circuit board in which a conductor circuit is covered with an insulating film and only the terminal portion is exposed, and the exposed surface of the terminal is plated or filled with solder. The purpose is to improve the reliability of bonding and to diversify the combinations and layouts of printed circuit boards.
上記のように導体回路を絶縁フイルムで被覆し
た硬質プリント基板Ａは、第１図および第２図に
示すように硬質絶縁材の基板１表面に導体回路２
と端子３が公知の手段でプリントされ、端子３以
外の導体回路２は絶縁性フイルムまたは絶縁性塗
料からなる絶縁被膜４で絶縁され、端子３は公知
のように半田メツキまたは半田盛りによる半田層
５が形成されている。 As shown in FIGS. 1 and 2, the rigid printed circuit board A having conductive circuits covered with an insulating film as described above has two conductive circuits on the surface of the hard insulating substrate 1.
and a terminal 3 are printed by a known method, the conductor circuit 2 other than the terminal 3 is insulated with an insulating coating 4 made of an insulating film or an insulating paint, and the terminal 3 is printed with a solder layer formed by solder plating or solder filling as is known. 5 is formed.
またフレキシブルプリント基板Ｂは、フイルム
等からなるフレキシブル基板６に導体回路７と端
子８がプリントされ、端子８以外の導体回路７は
フイルムまたは塗料からなる絶縁被膜９で被覆絶
縁され、端子８には半田メツキまたは半田盛りに
よる半田層１０が形成され、従来は硬質プリント
基板Ａの端子３上にフレキシブルプリント基板Ｂ
の端子８を重合し半田層５，１０を加熱溶融して
接合する。 Further, in the flexible printed circuit board B, a conductor circuit 7 and a terminal 8 are printed on a flexible substrate 6 made of a film or the like, and the conductor circuit 7 other than the terminal 8 is covered and insulated with an insulating coating 9 made of a film or paint. A solder layer 10 is formed by solder plating or solder filling, and conventionally a flexible printed circuit board B is formed on the terminal 3 of a rigid printed circuit board A.
The terminals 8 are polymerized and the solder layers 5 and 10 are heated and melted to join them.
しかし上記のような従来の方法では両基板Ａ，
Ｂの端子３，８を正確に重合する位置合わせが困
難である。また半田層５，１０の加熱はフレキシ
ブルプリント基板Ａの基板６を介して加熱するた
め熱伝導が悪く、半田の加熱溶融に時間を要し、
接着不良となり、、フレキシブル基板６が加熱に
より損失される欠点があり、しかも接合状態を目
視により確認することができないため、重合時の
位置ずれ、接着不良による不良品または故障の原
因となる。 However, in the conventional method as described above, both substrates A,
It is difficult to align the terminals 3 and 8 of B accurately so that they overlap. In addition, since the solder layers 5 and 10 are heated through the substrate 6 of the flexible printed circuit board A, heat conduction is poor, and it takes time to heat and melt the solder.
There is a drawback that the flexible substrate 6 is lost due to heating due to poor adhesion, and since the bonded state cannot be visually confirmed, it may cause positional deviation during polymerization and defective products or failures due to poor adhesion.
本発明は上記のような欠点を解消するもので、
その方法を添付図面第３図および第４図により詳
細に説明する。尚第１図、第２図と同一部分は同
符号で示す。 The present invention solves the above-mentioned drawbacks,
The method will be explained in detail with reference to FIGS. 3 and 4 of the accompanying drawings. The same parts as in FIGS. 1 and 2 are designated by the same reference numerals.
本発明においてはフレキシブルプリント基板Ｂ
の基板６の端子８部分に窓孔１１を設け、端子８
の表裏両面を露出させ露出した半田層１０および
端子８の中央に位置合せ用の貫通小孔１２を穿設
し、更に硬質プリント基板Ａの半田層５および端
子３にも位置合わせ小孔１３を穿設する。 In the present invention, flexible printed circuit board B
A window hole 11 is provided in the terminal 8 portion of the board 6, and the terminal 8
A small through hole 12 for alignment is formed in the center of the exposed solder layer 10 and the terminal 8 by exposing both the front and back sides of the hard printed circuit board A, and a small alignment hole 13 is also formed in the solder layer 5 and the terminal 3 of the hard printed circuit board A. to drill.
上記のように構成された硬質プリント基板Ａの
端子３上にフレキシブルプリント基板Ｂの窓孔１
１を外側とし、両基板の端子３，８の半田層５，
１０を対向させ、貫通小孔１２と小孔１３を合致
させて重合し、フレキシブルプリント基板Ｂの窓
孔１１から端子８に半田鏝を当て両基板の端子
３，８の半田層５，１０を加熱溶解して接合し、
必要があれば窓孔１１には絶縁性塗料を塗布して
端子８を絶縁保護する。 The window hole 1 of the flexible printed circuit board B is placed on the terminal 3 of the rigid printed circuit board A configured as described above.
1 is the outside, and the solder layer 5 of the terminals 3 and 8 of both boards is
10 are placed opposite each other, the through holes 12 and 13 are aligned, and the soldering iron is applied to the terminal 8 from the window hole 11 of the flexible printed circuit board B to bond the solder layers 5 and 10 of the terminals 3 and 8 of both boards. Heat melt and join.
If necessary, an insulating paint is applied to the window hole 11 to insulate and protect the terminal 8.
本発明は上記の通りフレキシブル基板に形成し
た窓孔１１により露出した端子８を直接加熱する
ので熱伝導が良く迅速確実に両端子を接合するこ
とができ接合不良が解消される。又フレキシブル
プリント基板Ｂの端子８に睾設した貫通孔１２
と、硬質プリント基板Ａの端子３に形成した位置
合せ用の小孔１３とは両端子の重合状態を目視に
より正確に確認できるので位置ずれが防止され、
接合不良、位置ずれ等による不良品、故障が防止
される。 In the present invention, as described above, the terminals 8 exposed through the window holes 11 formed in the flexible substrate are directly heated, so that heat conduction is good, and both terminals can be quickly and reliably bonded, thereby eliminating bonding defects. Also, a through hole 12 is provided in the terminal 8 of the flexible printed circuit board B.
The positioning holes 13 formed in the terminals 3 of the rigid printed circuit board A allow accurate visual confirmation of the overlapping state of both terminals, thereby preventing misalignment.
Defective products and failures due to poor bonding, misalignment, etc. are prevented.
尚位置合せのための小孔は硬質プリント基板Ａ
の小孔１３よりフレキシブルプリント基板Ｂの貫
通小孔１２を若干大きくした方が位置合せを容易
にすることがきる。又上記の位置合せの小孔はフ
レキシブルプリント基板Ｂの貫通小孔１２だけで
も良く、接合する端子の関係位置が目視で簡単に
確認できる点で便利である。 The small hole for positioning is on the hard printed circuit board A.
Positioning can be facilitated by making the small through hole 12 of the flexible printed circuit board B slightly larger than the small hole 13 of the flexible printed circuit board B. Further, the above-mentioned alignment small hole may be only the through hole 12 of the flexible printed circuit board B, which is convenient in that the relative positions of the terminals to be joined can be easily confirmed visually.
更に本発明のフレシキブルプリント基板Ｂの端
子８は表裏両面が露出しているので硬質プリント
基板Ａの同一端子に二つのフレキシブルプリント
基板Ｂの端子を重合して接着することが可能とな
り、プリント基板の組合せ、接合の多用化にも効
果がある。 Furthermore, since both the front and back sides of the terminal 8 of the flexible printed circuit board B of the present invention are exposed, it is possible to superimpose and bond the terminals of two flexible printed circuit boards B to the same terminal of the rigid printed circuit board A. It is also effective in increasing the number of combinations and connections.
添付図面第１図は従来の硬質プリント基板とフ
レキシブルプリント基板の平面図、第２図は第１
図プリント基板を接合した状態の縦断面図、第３
図は本発明方法のプリト基板の縦断面図、第４図
は同上プリント基板接合状態の縦断面図である。
Ａ…硬質プリント基板、Ｂ…フレキシブルプリ
ント基板、１，６…基板、２，７…導体回路、
３，８…端子、４，９…絶縁被覆、１１…窓孔、
１２…貫通小孔。
Attached drawings Figure 1 is a plan view of a conventional rigid printed circuit board and a flexible printed circuit board, and Figure 2 is a plan view of a conventional rigid printed circuit board and a flexible printed circuit board.
Figure 3: Vertical cross-sectional view of the printed circuit board bonded.
The figure is a vertical cross-sectional view of a printed circuit board according to the method of the present invention, and FIG. 4 is a vertical cross-sectional view of the printed circuit board bonded together. A... Rigid printed circuit board, B... Flexible printed circuit board, 1, 6... Board, 2, 7... Conductor circuit,
3, 8...terminal, 4,9...insulation coating, 11...window hole,
12... Small through hole.
Claims (1)
導体回路は絶縁フイルムで被覆されたプリント基
板と、絶縁フイルム上に導体回路を設け、端子部
以外の導体回路は絶縁フイルムで被覆されたフレ
キシブルプリント基板との接合において、フレキ
シブルプリント基板の基板端子部に窓孔を設けて
端子両面を露出させ、窓孔と反対側の端子に半田
層を設け、端子と上記半田層を貫通する小孔を端
子中央部に形成し、硬質基板の端子に設けた半田
層の中央部に位置合わせ用小孔を設け、上記窓孔
を外側とし両基板の半田層を対向させて上記小孔
により位置合わせをした後、フレキシブル基板の
窓孔を通じ、端子を直接加熱して半田付けするこ
とを特徴とする硬質プリント基板とフレキシブ
ル、プリント基板との接合法。 ２ フレキシブルプリント基板の端子および同端
子上の半田層を貫通する小孔を、硬質基板の端子
に設けた半田層の小孔よりも大きくしたことを特
徴とする特許請求の範囲第１項記載の硬質プリン
ト基板とフレキシブルプリント基板との接合法。[Scope of Claims] 1. A conductor circuit is provided on an insulating substrate, the conductor circuit other than the terminal portion is covered with an insulating film, and the conductor circuit is provided on the insulating film, and the conductor circuit other than the terminal portion is insulated. When bonding to a flexible printed circuit board covered with a film, a window hole is provided in the board terminal part of the flexible printed circuit board to expose both sides of the terminal, a solder layer is provided on the terminal opposite to the window hole, and the terminal and the solder layer are bonded together. A small hole passing through the terminal is formed in the center of the terminal, and a small alignment hole is formed in the center of the solder layer provided on the terminal of the hard board. A method of joining a rigid printed circuit board and a flexible printed circuit board, which is characterized by aligning with small holes and then directly heating and soldering the terminals through the window holes of the flexible circuit board. 2. The small hole penetrating the terminal of the flexible printed circuit board and the solder layer on the terminal is larger than the small hole of the solder layer provided in the terminal of the rigid board. A method for joining rigid printed circuit boards and flexible printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56014603A JPS57128995A (en) | 1981-02-02 | 1981-02-02 | Method of bonding hard printed board to flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56014603A JPS57128995A (en) | 1981-02-02 | 1981-02-02 | Method of bonding hard printed board to flexible printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57128995A JPS57128995A (en) | 1982-08-10 |
| JPS6150400B2 true JPS6150400B2 (en) | 1986-11-04 |
Family
ID=11865762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56014603A Granted JPS57128995A (en) | 1981-02-02 | 1981-02-02 | Method of bonding hard printed board to flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128995A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002169483A (en) * | 2000-12-04 | 2002-06-14 | Sony Corp | Display device, electronic appliance and method for manufacturing display device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248495A (en) * | 1985-04-25 | 1986-11-05 | 日本メクトロン株式会社 | Connection construction for flexible circuit board |
| JP2002050844A (en) * | 2000-08-07 | 2002-02-15 | Mitsumi Electric Co Ltd | Flexible printed board |
| JP2019033160A (en) * | 2017-08-07 | 2019-02-28 | 株式会社小糸製作所 | Circuit board and lighting fixture for vehicle |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106193A (en) * | 1980-12-24 | 1982-07-01 | Fujikura Ltd | Method of connecting flexible printed circuit to hard board printed circuit and connecting flexible printed circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844607Y2 (en) * | 1978-03-31 | 1983-10-08 | 日本メクトロン株式会社 | Connection structure between circuit boards |
-
1981
- 1981-02-02 JP JP56014603A patent/JPS57128995A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106193A (en) * | 1980-12-24 | 1982-07-01 | Fujikura Ltd | Method of connecting flexible printed circuit to hard board printed circuit and connecting flexible printed circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002169483A (en) * | 2000-12-04 | 2002-06-14 | Sony Corp | Display device, electronic appliance and method for manufacturing display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57128995A (en) | 1982-08-10 |
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