JPH04277665A - Socket of semiconductor ic device - Google Patents

Abstract

PURPOSE:To suppress a noise such as voltage fluctuation due to an inductance component generated on a contact shoe of an IC socket in order to test under an electrically stable environment by arranging stable ground potential near an IC. CONSTITUTION:A socket of a semiconductor IC device in the title has a conductor 111 having grounding potential for mounting one end of a decoupling capacitor on the mounting side while a contact shoe 112 of a power supply pin has a shape for mounting the decoupling capacitor.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a semiconductor integrated circuit device (
Hereinafter referred to as IC. ) regarding sockets.

0002

[Prior Art] Generally, in the electrical characteristic test of IC,
An IC socket is used to establish electrical contact between a test device (hereinafter referred to as a tester) and an IC.

FIG. 4 shows a cross-sectional view of a conventional IC socket mounted on a test board of a tester, in which a FLAT package IC is mounted. An IC socket 402 mounted on a test board 401 connects a holding plate 405 to a socket stand 403 with a shaft 407, and connects both with a stopper 40.
It is configured to be fixed at 4. IC406 is
When the IC is placed on the contact 408 in the socket stand and the presser plate 405 is closed in this state, the convex portion of the presser plate 405 presses the IC lead and connects it to the contactor 408 . contact 408
One end is inserted into a through hole in the test board 401 to connect the contact and the tester. In Figure 3(a),
A conventional contact is shown.

The signal path between the IC and the tester has an inductance component, and the operating current when the IC operates causes voltage fluctuations at the power supply pin of the IC due to this inductance component. When testing an IC, a decoupling capacitor is inserted between the power supply line and the ground of the tester in order to absorb the fluctuations in the power supply voltage mentioned above.

[0005] With the current IC socket, it is impossible to install a decoupling capacitor inside the socket.
A decoupling capacitor 408 is installed on the back side of the test board in FIG. 4 between the ground pattern 410 on the test board and one end of the contact of the IC socket.

[0006]

[Problems to be Solved by the Invention] In the above-mentioned conventional IC socket, it is impossible to attach a decoupling capacitor to the tip of the contact on the IC side due to its structure, and there is a need for a stable ground area near the IC. Since there is no decoupling capacitor, even if it is possible to attach a decoupling capacitor to the contact, it is impossible to connect a stable ground to the opposite terminal.

However, the contacts of the IC socket have an inductance of 10 to 15 nH, and voltage fluctuations due to this inductance component cannot be avoided. That is, in the conventional socket, the IC is tested in a state where noise is included due to voltage fluctuations occurring at the power supply pin due to the inductance component included in the contact.

An object of the present invention is to provide a socket for a semiconductor integrated circuit device that suppresses noise caused by inductance components and allows testing in an electrically stable environment.

[0009]

[Means for Solving the Problems] The IC socket of the present invention has a conductive potential having a ground potential for attaching one end of a decoupling capacitor to the IC mounting side of the IC socket, and a contact for the power pin of the IC. has a shape for attaching a decoupling capacitor.

0010

Embodiment FIG. 1 shows a first embodiment of the present invention. FIG. 1 is a sectional view when an IC socket of the present invention is mounted on a test board of a tester, and a FLAT package IC is mounted thereon. The IC socket 102 mounted on the test board 101 has a structure in which a holding plate 105 is connected to a socket stand 103 with a shaft 107, and both are fixed with a stopper 104. The IC 106 is placed on the contact 108 in the socket base 103, and when the press plate 105 is closed in this state, the convex portion of the press plate 105 presses the lead of the IC 106 to establish connection with the contact 108. One end of the contactor 108 is inserted into a through hole in the test board to connect the contactor with a test signal from the test.

A conductor 111 is placed very close to the contact 108 and connected to the ground pattern 110 on the test board 101 to provide a stable ground potential. Further, among the leads of the IC 106, a power pin contact 112 is used for the power pin. FIG. 3(b) shows a power supply pin contact according to the first embodiment of the present invention. The difference from the conventional contactor is that the terminal for attaching the decoupling capacitor 302 is located behind the IC contact portion 301.

The decoupling capacitor 109 can be attached between the dedicated terminal for attaching the decoupling capacitor of the above-mentioned power supply pin contact and the conductor 109 having a ground potential.

FIG. 2 shows a second embodiment of the invention. 1st
In this embodiment, the conductor 111 was placed outside the electrode 108, but in this example, the conductor 211 was placed inside the electrode 208, and the ground pattern 2 of the test board 201
10, and connect the decoupling capacitor 209 here.
Install the ground side of the The contact for the power pin is also shown in Figure 3 (
As shown in c), a shape for attaching a decoupling capacitor is provided inside the IC contact portion 301.

[0014]

As explained above, the IC socket of the present invention has a conductor inside the IC socket, and by connecting this conductor to the ground pattern on the test board, a stable ground potential can be provided to the IC. Voltage fluctuations due to inductance components that occur in the IC socket contacts can be minimized by being able to place them nearby, and by using contacts with a special shape that allows easy attachment of decoupling capacitors to the power pins of the IC socket contacts. noise such as I
It is possible to test in an electrically stable environment with a decoupling capacitor inserted near the power supply pin of C.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an IC socket showing a first embodiment of the present invention.

FIG. 2 is a sectional view of an IC socket showing a second embodiment of the present invention.

FIG. 3 is a diagram showing a contactor used in an IC socket.

FIG. 4 is a sectional view of a conventional IC socket.

[Explanation of symbols]

101, 201, 401 test board 102,
202,402 IC socket 103,203,
403 Socket stand 104, 204, 404
Stopper 105, 205, 405 Holding plate 106, 206, 406 IC 107, 207, 407 Shaft 108, 20
8,408 Contactor 109,209,409
Decoupling capacitor 110, 210, 410
Ground pattern 111, 211 Conductor 112, 212 Power pin contact 301
IC contact part

Claims (1)

[Claims] 1. A conductor having a ground potential near the contact, and a terminal having a convex shape for attaching a decoupling capacitor to the contact connected to a power supply pin of a semiconductor integrated circuit device. socket for semiconductor integrated circuit devices.