JPH0339841U - - Google Patents
Info
- Publication number
- JPH0339841U JPH0339841U JP10092989U JP10092989U JPH0339841U JP H0339841 U JPH0339841 U JP H0339841U JP 10092989 U JP10092989 U JP 10092989U JP 10092989 U JP10092989 U JP 10092989U JP H0339841 U JPH0339841 U JP H0339841U
- Authority
- JP
- Japan
- Prior art keywords
- source electrode
- via hole
- electrode portion
- recess
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Description
第１図ａ〜ｆは、本考案の半導体装置の製造方
法の一実施例を説明するための、工程順に示した
素子断面図、第２図ａ〜ｄは、従来の技術による
一例を説明するための工程順に示した素子断面図
である。
１……基板、１ａ……凹部、２，２ａ，２ｂ…
…フオトレジスト、３……ソース電極、４……バ
イアホール、５……バイアホールメタル。
1A to 1F are cross-sectional views of elements shown in the order of steps to explain an embodiment of the method for manufacturing a semiconductor device of the present invention, and FIGS. 2A to 2D are sectional views of an element according to a conventional technique. FIG. 1...Substrate, 1a...Recess, 2, 2a, 2b...
...Photoresist, 3...Source electrode, 4...Via hole, 5...Via hole metal.
Claims (1)
体装置において、 ソース電極部が、素子の表面側の凹部に形成さ
れ、裏面側に前記ソース電極に達するバイアホー
ルを有することを特徴とする半導体装置。[Claims for Utility Model Registration] In a semiconductor device having a via hole structure in a source electrode portion, the source electrode portion is formed in a recess on the front side of the element and has a via hole reaching the source electrode on the back side. Characteristic semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10092989U JPH0339841U (en) | 1989-08-29 | 1989-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10092989U JPH0339841U (en) | 1989-08-29 | 1989-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339841U true JPH0339841U (en) | 1991-04-17 |
Family
ID=31649906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10092989U Pending JPH0339841U (en) | 1989-08-29 | 1989-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339841U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001311999A (en) * | 2000-04-28 | 2001-11-09 | Seed:Kk | Outdoor projector and usage of the same |
-
1989
- 1989-08-29 JP JP10092989U patent/JPH0339841U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001311999A (en) * | 2000-04-28 | 2001-11-09 | Seed:Kk | Outdoor projector and usage of the same |