JP2017175021A - Light-emitting module and illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module and the like in which the deformation of a wire sealed by a sealing member can be suppressed even when a plurality of light-emitting modules are disposed adjacently to each other.SOLUTION: A light-emitting module includes a substrate 10, a plurality of light-emitting elements 20 disposed linearly on the substrate 10, a wire 30 connected to each of the plurality of light-emitting elements 20, a sealing member 40 sealing the plurality of light-emitting elements 20 and the wire 30 and formed linearly in the arrangement direction of the light-emitting elements 20 to an edge of the substrate 10, and a bumper member 50 formed near the edge of the substrate 10. The amount of protrusion of the bumper member 50 protruding from the edge of the substrate 10 in a longitudinal direction of the sealing member 40 is more than or equal to the amount of protrusion of the sealing member 40 protruding from the edge of the substrate 10 in the longitudinal direction of the sealing member 40.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting module and a lighting device including the light emitting module.

  Semiconductor light-emitting elements such as light emitting diodes (LEDs) are widely used as light sources for various devices because of their high efficiency and long life. For example, the LED is used as an illumination light source such as a lamp or an illumination device, or as a backlight light source of a liquid crystal display device.

  In general, LEDs are unitized as LED modules and built in various devices. The LED module includes, for example, a substrate and one or more LEDs mounted on the substrate (for example, Patent Document 1).

JP 2011-176017 A

  As the LED module, a COB (Chip On Board) type configuration in which one or a plurality of LEDs (LED chips) is directly mounted on a substrate is known. The COB type LED module is, for example, a long substrate, a plurality of LED chips mounted linearly on the substrate along the longitudinal direction of the substrate, and a straight line so as to collectively seal the plurality of LED chips. And a sealing member formed in a shape. The LED chip mounted on the substrate is connected to a metal wiring formed on the substrate or an adjacent LED chip by a wire. The wire connected to the LED chip is sealed with a sealing member together with the LED chip. The sealing member is made of a translucent resin containing a phosphor, for example.

  When the light-emitting module configured in this way is incorporated into a lighting device, a plurality of light-emitting modules may be arranged adjacent to each other along the longitudinal direction of the substrate. In this case, in each light emitting module, the sealing member may be formed up to both end edges in the longitudinal direction of the substrate so that light is not interrupted between two adjacent light emitting modules.

  In the case of forming such a sealing member, for example, the material of the sealing member is applied to both end edges in the longitudinal direction of the substrate, but the sealing member formed in this way has a longitudinal end portion of the substrate. May protrude from the edge. For this reason, when a plurality of light emitting modules are arranged adjacent to each other along the longitudinal direction of the substrate, the sealing members of the respective light emitting modules come into contact with each other at the joint of the adjacent light emitting modules, and the sealing member generated at this time In some cases, the wire embedded in the sealing member may be deformed and disconnected due to the stress.

  The present invention has been made to solve such a problem, and even when a plurality of light emitting modules are arranged adjacent to each other, the wire sealed by the sealing member is suppressed from being deformed. An object of the present invention is to provide a light emitting module and a lighting device.

  In order to achieve the above object, one aspect of a light emitting module according to the present invention includes a substrate, a plurality of light emitting elements linearly arranged on the substrate, and wires connected to each of the plurality of light emitting elements. A sealing member that seals the plurality of light emitting elements and the wires, is formed in a straight line along an arrangement direction of the plurality of light emitting elements and extends to an edge of the substrate, and the end of the substrate A bumper member formed in the vicinity of the edge, and the protruding amount of the bumper member protruding in the longitudinal direction of the sealing member from the edge is protruded in the longitudinal direction of the sealing member from the edge. It is equal to or more than the protruding amount of the sealing member.

  In addition, an aspect of the lighting device according to the present invention includes a plurality of the light emitting modules, and the plurality of light emitting modules are arranged adjacent to each other along a longitudinal direction of the sealing member.

  ADVANTAGE OF THE INVENTION According to this invention, even if it is a case where a some light emitting module is arrange | positioned adjacently, it can suppress that the wire sealed by the sealing member deform | transforms.

Plan view of light-emitting module according to Embodiment 1 Sectional drawing of the light emitting module which concerns on Embodiment 1 in the II-II line of FIG. Schematic diagram for explaining a state when two conventional light emitting modules are arranged adjacent to each other FIG. 3B is an enlarged cross-sectional view of the connecting portion of the two light emitting modules. The schematic diagram for demonstrating a mode when two light emitting modules which concern on Embodiment 1 are arrange | positioned adjacently. External perspective view of lighting apparatus according to Embodiment 2 Partially enlarged sectional view of a light emitting module according to a modification

  Embodiments of the present invention will be described below. Note that each of the embodiments described below shows a preferred specific example of the present invention. Accordingly, the numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps (steps), order of steps, and the like shown in the following embodiments are merely examples and are intended to limit the present invention. is not. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Therefore, for example, the scales and the like do not necessarily match in each drawing. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, The overlapping description is abbreviate | omitted or simplified.

(Embodiment 1)
The configuration of the light emitting module 1 according to Embodiment 1 will be described with reference to FIGS. FIG. 1 is a plan view of a light emitting module 1 according to Embodiment 1. FIG. FIG. 2 is a cross-sectional view of the light emitting module 1 taken along the line II-II in FIG.

  As shown in FIG. 1, the light emitting module 1 includes a substrate 10, a light emitting element 20, a wire 30, a sealing member 40, and a bumper member 50. The light emitting module 1 in the present embodiment is a line light source that emits light in a line shape, and emits, for example, white light. The light emitting module 1 is a COB type LED module in which an LED chip is directly mounted on the substrate 10 as the light emitting element 20.

  Hereinafter, each component of the light emitting module 1 according to Embodiment 1 will be described in detail.

[substrate]
A substrate 10 shown in FIGS. 1 and 2 is a mounting substrate on which the light emitting element 20 is mounted. As the substrate 10, a ceramic substrate made of ceramic, a resin substrate based on resin, a metal base substrate based on metal, a glass substrate made of glass, or the like can be used.

  As the ceramic substrate, an alumina substrate made of alumina, an aluminum nitride substrate made of aluminum nitride, or the like can be used. As a resin resin substrate, for example, a glass epoxy substrate (CEM-3, FR-4, etc.) made of glass fiber and an epoxy resin, a substrate (FR-1 etc.) made of paper phenol or paper epoxy, or polyimide, etc. A flexible substrate having flexibility can be used. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, or a copper alloy substrate having an insulating film formed on the surface can be used. The substrate 10 is not limited to a rigid substrate and may be a flexible substrate.

  The substrate 10 is preferably a white substrate having a high light reflectance (for example, a light reflectance of 90% or more). By using the white substrate, the light emitted from the light emitting element 20 can be reflected on the surface of the substrate 10, so that the light extraction efficiency of the light emitting module 1 can be improved. In the present embodiment, a white polycrystalline ceramic substrate is used. More specifically, as the substrate 10, for example, a white polycrystalline alumina substrate (polycrystalline ceramic substrate) having a thickness of about 1 mm configured by firing alumina particles can be used. The ceramic substrate has a higher thermal conductivity than the resin substrate, and can efficiently dissipate heat generated by the light emitting element 20. Moreover, the ceramic substrate has little deterioration over time and is excellent in heat resistance.

  In the present embodiment, the substrate 10 is a long rectangular substrate. That is, the planar view shape of the substrate 10 is an elongated rectangle. The long substrate 10 has a length (long side length) in the longitudinal direction (long side) as L1, and a length in the short side direction (short side length) as L2. The aspect ratio (L1 / L2) of the substrate 10 is, for example, L1 / L2 ≧ 10. The shape of the substrate 10 is not limited to a long shape, and may be a square. Further, the shape of the substrate 10 is not limited to a rectangular shape.

  Although not shown, the substrate 10 is formed with metal wiring formed in a pattern having a predetermined shape in order to electrically connect the plurality of light emitting elements 20 to each other. For example, the metal wiring is formed between adjacent light emitting elements 20.

  The substrate 10 is provided with a pair of electrode terminals for receiving DC power for causing the light emitting element 20 to emit light from the outside of the light emitting module 1. The pair of electrode terminals are electrically connected to an external power supply device (power supply circuit) via, for example, a lead wire. The electric power received by the pair of electrode terminals is supplied to the light emitting element 20 through the metal wiring.

[Light emitting element]
As shown in FIGS. 1 and 2, the light emitting element 20 is disposed on the substrate 10. In the present embodiment, a plurality of light emitting elements 20 are used, and the plurality of light emitting elements 20 are linearly arranged on the main surface of the substrate 10. Specifically, the plurality of light emitting elements 20 are arranged in only one row along the longitudinal direction of the substrate 10. The plurality of light emitting elements 20 are arranged at the same pitch, and the distances between the adjacent light emitting elements 20 are all the same. Each light emitting element 20 is die-bonded to the substrate 10 with a die attach agent or the like. In the present embodiment, the light emitting element 20 is directly mounted on the substrate 10.

  Each light emitting element 20 is an example of a semiconductor light emitting element, and emits light with a predetermined power. In the present embodiment, each light emitting element 20 is a bare chip (LED chip) that emits monochromatic visible light, for example, a blue LED chip that emits blue light when energized. The blue LED chip has a single-sided electrode structure in which both the p-side electrode and the n-side electrode are formed on the upper surface of the nitride semiconductor layer formed on the sapphire substrate, for example, a gallium nitride system having a center wavelength of 440 nm to 470 nm The semiconductor light emitting element can be used.

  In the present embodiment, two adjacent light emitting elements 20 are electrically connected via a metal wiring (land) and a wire 30 formed between the two adjacent light emitting elements 20. This is not a limitation. For example, in the plurality of light emitting elements 20, two adjacent light emitting elements 20 may be directly connected by a wire 30. That is, two adjacent light emitting elements 20 may be wire-bonded by chip-to-chip.

[Wire]
As shown in FIGS. 1 and 2, the wire 30 is connected to each of the plurality of light emitting elements 20. In the present embodiment, a pair of wires 30 are connected to each light emitting element 20. For example, the wire 30 is connected to the light emitting element 20 and a metal wiring (not shown) formed on the substrate 10. That is, the light emitting element 20 and the metal wiring are wire-bonded by the wire 30, one end of the wire 30 is connected to the light emitting element 20, and the other end of the wire 30 is connected to the metal wiring. The wire 30 is a metal wire such as a gold wire, for example, and is provided so as to be stretched from the light emitting element 20 to the metal wiring using a capillary.

  The wire 30 is sealed with the sealing member 40. In the present embodiment, the wire 30 is entirely embedded in the sealing member 40, but a part of the wire 30 may be exposed from the sealing member 40.

  Further, all the wires 30 sealed by the sealing member 40 are provided in the same direction as the longitudinal direction of the sealing member 40. That is, all the wires 30 connected to the light emitting element 20 are provided so as to be positioned on a straight line when viewed in plan.

[Sealing member]
As shown in FIGS. 1 and 2, the sealing member 40 seals the plurality of light emitting elements 20 and the plurality of wires 30. That is, the sealing member 40 is formed on the substrate 10 so as to cover the plurality of light emitting elements 20 and the plurality of wires 30. The light emitting element 20 and the wire 30 can be protected by sealing the light emitting element 20 and the wire 30 with the sealing member 40.

  The sealing member 40 collectively seals the plurality of light emitting elements 20 arranged in a straight line. That is, the sealing member 40 is linearly formed on the main surface of the substrate 10 along the arrangement direction of the light emitting elements 20. In the present embodiment, the sealing member 40 is formed along the longitudinal direction of the substrate 10. Specifically, the sealing member 40 is formed from one of the two short sides of the substrate 10 to the other. That is, the sealing member 40 is formed to the vicinity of both end edges in the longitudinal direction of the substrate 10 and is continuously formed without interruption from one short side of the substrate 10 to the other short side.

  As shown in FIG. 2, the sealing member 40 is formed so as to protrude from the end edge (rectangular short side) of the substrate 10 in the longitudinal direction. The sealing member 40 does not necessarily protrude from the edge of the substrate 10, but when the sealing member 40 is formed, if the material of the sealing member 40 is applied to the end of the substrate 10, the sealing member 40 is sealed. Due to the viscosity of the material of the stop member 40 or the wettability of the substrate 10, the leading end of the material of the sealing member 40 hangs down along the side surface of the substrate 10 and turns downward from the main surface of the substrate 10. As a result, the sealing member 40 is formed so as to protrude from the edge of the substrate 10.

  The sealing member 40 is mainly made of a translucent material, but when the wavelength of light emitted from the light emitting element 20 needs to be converted to a predetermined wavelength, the sealing member 40 changes the wavelength of light emitted from the light emitting element 20. Includes wavelength conversion material for conversion. In this case, the sealing member 40 includes a phosphor as a wavelength conversion material, and functions as a wavelength conversion member that converts the wavelength (color) of light emitted from the light emitting element 20. The phosphor is excited by light emitted from the light emitting element 20 and emits light of a desired color (wavelength).

  As the translucent material constituting the sealing member 40, for example, a translucent insulating resin material such as a silicone resin, an epoxy resin, or a fluorine resin can be used. The translucent material is not necessarily limited to an organic material such as a resin material, and an inorganic material such as a low-melting glass or a sol-gel glass may be used.

  In the present embodiment, since the light emitting element 20 is a blue LED chip, in order to obtain white light, for example, an yttrium, aluminum, garnet (YAG) yellow phosphor can be used. Thereby, a part of blue light emitted from the blue LED chip is absorbed by the yellow phosphor and wavelength-converted to yellow light. That is, the yellow phosphor is excited by the blue light of the blue LED chip and emits yellow light. White light is generated as synthetic light in which yellow light from the yellow phosphor and blue light that is not absorbed by the yellow phosphor are mixed, and the white light is emitted from the sealing member 40.

  In order to improve color rendering properties, the sealing member 40 may further contain a red phosphor. The sealing member 40 may be dispersed with a light diffusing material such as silica in order to enhance light diffusibility, or a filler or the like in order to suppress sedimentation of the phosphor.

  The sealing member 40 in the present embodiment is a phosphor-containing resin in which a yellow phosphor is dispersed in a silicone resin as a translucent material. The sealing member 40 applies the material (phosphor-containing resin) of the sealing member 40 to the main surface of the substrate 10 with a dispenser so as to cover the light emitting elements 20 along the arrangement direction of the light emitting elements 20, and then cures. Can be formed. The sealing member 40 formed by coating in this way has a bowl shape, and the shape in a cross section perpendicular to the longitudinal direction of the sealing member 40 is, for example, a substantially semicircular shape.

[Bumper material]
As shown in FIGS. 1 and 2, a bumper member 50 is formed on the main surface of the substrate 10. The bumper member 50 is formed in the vicinity of the edge of the substrate 10. In the present embodiment, the bumper member 50 is formed near the rectangular short side of the substrate 10.

  The bumper member 50 functions as a cushioning material when another member collides with the longitudinal end portion of the sealing member 40, and the longitudinal end portion of the sealing member 40 collides with another member. prevent. Therefore, the amount of protrusion of the bumper member 50 protruding from the edge of the substrate 10 in the longitudinal direction of the sealing member 40 is the amount of protrusion of the sealing member 40 protruding from the edge of the substrate 10 in the longitudinal direction of the sealing member 40. It is equal or better. That is, as shown in FIG. 2, the tip of the bumper member 50 in the longitudinal direction of the sealing member 40 (longitudinal direction of the substrate 10) is the sealing member 40 in the longitudinal direction of the sealing member 40 (longitudinal direction of the substrate 10). It is located outside the tip of the. Note that the protruding amount of the sealing member 40 may be zero. That is, the position of the front end of the sealing member 40 in the longitudinal direction may be exactly the same as the position of the end edge (short side) of the substrate 10 in the longitudinal direction.

  In the present embodiment, the bumper member 50 is formed along the short side of the substrate 10 so as to overlap the end portion of the sealing member 40. That is, at the end of the substrate 10, the bumper member 50 and the sealing member 40 are formed to be substantially T-shaped in plan view. The bumper member 50 is formed on each of two opposing short sides of the substrate 10.

  The bumper member 50 is made of, for example, a transparent resin. Specifically, the bumper member 50 can use a translucent material constituting the sealing member 40 such as a silicone resin.

  The bumper member 50 may be made of the same material as the sealing member 40. For example, when the sealing member 40 is made of a phosphor-containing resin as in the present embodiment, the phosphor-containing resin may be used as the material of the bumper member 50. Similarly to the sealing member 40, the bumper member 50 can be formed by applying the material of the bumper member 50 to the main surface of the substrate 10 using a dispenser and then curing the material.

[Effects of light emitting module]
Next, the effect of the light emitting module 1 is demonstrated using FIGS. FIG. 3 is a schematic diagram for explaining a state in which two conventional light emitting modules 1X are arranged adjacent to each other. FIG. 4 is an enlarged cross-sectional view of a connecting portion of the two light emitting modules 1X in FIG. FIG. 5 is a schematic diagram for explaining a state in which two light emitting modules 1 according to Embodiment 1 are arranged adjacent to each other.

  The conventional light emitting module 1X shown in FIG. 3 differs from the light emitting module 1 of Embodiment 1 shown in FIG. 1 in that the concave portion 11 is not formed on the substrate 10, and the configuration other than the concave portion 11 is the same as that of the embodiment. The configuration is the same as that of the light emitting module 1 of the first embodiment.

  When the light emitting module 1 </ b> X as shown in FIG. 3 is incorporated in a lighting device or the like, a plurality of light emitting modules 1 </ b> X may be arranged adjacently along the longitudinal direction of the substrate 10. For this reason, the sealing member 40 may be formed to both end edges in the longitudinal direction of the substrate 10 so that light is not interrupted between the two adjacent light emitting modules 1X.

  In this case, the material of the sealing member 40 is applied linearly by the dispenser so as to cover the light emitting element 20 and the wire 30. However, when the material of the sealing member 40 is applied to both ends in the longitudinal direction of the substrate 10, the sealing is performed. Depending on the viscosity of the material of the member 40 or the wettability of the substrate 10, the material of the sealing member 40 may hang down from both longitudinal edges of the substrate 10. As a result, in the cured sealing member 40, the end in the longitudinal direction may protrude from the edge of the substrate 10.

  However, if the end portion of the sealing member 40 in the longitudinal direction protrudes from the edge of the substrate 10, the plurality of light emitting modules 1 </ b> X are adjacent to each other along the longitudinal direction of the substrate 10 as shown in FIG. 3B, as shown in FIG. 3B, the sealing members 40 of the respective light emitting modules 1X come into contact with each other at the joint (connecting portion) between the two adjacent light emitting modules 1X, as shown in FIG. The wire 30 embedded in the sealing member 40 may be deformed and disconnected due to the stress of the sealing member 40 generated at this time.

  In particular, when the plurality of light emitting modules 1X are made adjacent by sliding the plurality of light emitting modules 1X close to each other, if the end portion in the longitudinal direction of the sealing member 40 protrudes from the edge of the substrate 10, the two adjacent light emitting modules 1X are made adjacent. The sealing members 40 of the light emitting modules 1X are pressed against each other at the joint between the two light emitting modules 1X. As a result, when the wire 30 existing at the position closest to the joint of the light emitting module 1X (that is, the position closest to the edge in the longitudinal direction of the substrate 10) is deformed and disconnected by the pressing of the sealing member 40. There is.

  On the other hand, in the light emitting module 1 in the present embodiment, as shown in FIGS. 1 and 2, a bumper member 50 that protrudes outward from the sealing member 40 is formed in the vicinity of the edge of the substrate 10. Has been.

  Accordingly, as shown in FIG. 5A, even when the plurality of light emitting modules 1 are arranged adjacent to each other along the longitudinal direction of the substrate 10, as shown in FIG. At the joint of the two light emitting modules 1, the bumper members 50 of the light emitting modules 1 are in contact with each other without the sealing members 40 of the light emitting modules 1 being in contact with each other. Accordingly, the bumper member 50 can disperse the stress at the time of collision between two adjacent light emitting modules 1. As a result, the deformation of the wire 30 due to the stress generated when the sealing members 40 are directly pressed against each other can be suppressed, and the wire 30 can be prevented from being disconnected.

[Summary]
As described above, the light emitting module 1 according to the present embodiment includes the substrate 10, the plurality of light emitting elements 20 arranged linearly on the substrate 10, and the wires 30 connected to each of the plurality of light emitting elements 20. Further, the light emitting module 1 seals the plurality of light emitting elements 20 and the wires 30, and is a seal formed linearly along the arrangement direction of the plurality of light emitting elements 20 and to the edge of the substrate 10. A stop member 40 and a bumper member 50 formed in the vicinity of the edge of the substrate 10 are provided. In the light emitting module 1, the protruding amount of the bumper member 50 protruding in the longitudinal direction of the sealing member 40 from the edge of the substrate 10 is the sealing member protruding in the longitudinal direction of the sealing member 40 from the edge of the substrate 10. The amount of protrusion is equal to or greater than 40. That is, the bumper member 50 protrudes from the sealing member 40 in the longitudinal direction of the sealing member 40.

  Thereby, when a plurality of light emitting modules 1 are arranged adjacent to each other, stress at the time of collision (at the time of contact) between two adjacent light emitting modules 1 can be dispersed, so that the sealing member 40 is sealed. It is possible to suppress the wire 30 from being deformed by the stress of the sealing member 40.

  Moreover, in this Embodiment, the planar view shape of the board | substrate 10 is an elongate rectangle, and the edge of the board | substrate 10 is a rectangular short side. That is, the bumper member 50 is formed on the short side of the substrate 10.

  Accordingly, even when a plurality of light emitting modules 1 are arranged adjacent to each other along the longitudinal direction of the substrate 10, stress at the time of collision between the two adjacent light emitting modules 1 can be dispersed, so that the wire 30 is sealed. The deformation due to the stress of the member 40 can be suppressed.

  In the present embodiment, the sealing member 40 is formed from one of the two short sides of the substrate 10 to the other, and the bumper member 50 is formed on each of the two short sides.

  Thereby, even if other light emitting modules 1 are disposed adjacent to both sides of the light emitting module 1 in the longitudinal direction of the substrate 10, it is possible to suppress the wire 30 from being deformed by the stress of the sealing member 40.

  In the present embodiment, the bumper member 50 is formed along the short side of the substrate 10 so as to overlap the end of the sealing member 40.

  Thereby, since the collision surface (contact surface) of the bumper members 50 at the time of the collision between the two adjacent light emitting modules 1 can be increased, the stress at the time of the collision between the two adjacent light emitting modules 1 can be effectively dispersed. be able to. Therefore, the wire 30 can be further suppressed from being deformed by the stress of the sealing member 40.

  The bumper member 50 may be made of a transparent resin.

  Thereby, it can suppress affecting the light distribution characteristic of the light emitting module 1 by the bumper member 50. FIG. For example, even if the bumper member 50 is formed, a line light source can be realized.

  The bumper member 50 may be made of the same material as the sealing member 40.

  Thereby, since the bumper member 50 can be formed in the same process as the process of forming the sealing member 40, the bumper member 50 can be formed at low cost.

  Moreover, in this Embodiment, the sealing member 40 contains the wavelength conversion material which converts the wavelength of the light which the light emitting element 20 emits.

  Thereby, since the wavelength of the light which the light emitting element 20 emits can be converted into a desired wavelength, the light radiate | emitted from the sealing member 40 can be made into the light of a desired color. In the present embodiment, white light is emitted from the sealing member 40.

(Embodiment 2)
Next, the illuminating device 100 which concerns on Embodiment 2 is demonstrated using FIG. FIG. 6 is an external perspective view of lighting apparatus 100 according to Embodiment 2. FIG.

  As shown in FIG. 6, the lighting device 100 is, for example, a ceiling-mounted base light, and is, for example, a fixture main body 110 that is attached and fixed to a ceiling of a room with a hanging bolt or the like, and is fixed to the fixture main body 110. A light source unit 120.

  The instrument main body 110 is made of sheet metal, and is formed in a long and flat box shape by bending a metal plate. A rectangular opening 111 is provided on the lower surface of the instrument body 110.

  The light source unit 120 is detachably attached to the opening 111 of the instrument main body 110. The light source unit 120 is turned on by a power supply device (not shown) accommodated in the instrument main body 110. The power supply apparatus includes a power supply circuit that generates power for causing the light source unit 120 to emit light, and supplies the generated power to the light source unit 120. A power supply device is arrange | positioned inside the instrument main body 110, for example.

  The light source unit 120 includes a plurality of light emitting modules 1 and a long translucent cover 121 that covers the plurality of light emitting modules 1. The plurality of light emitting modules 1 are arranged adjacent to each other along the longitudinal direction of the sealing member 40 (longitudinal direction of the substrate 10). Specifically, it arrange | positions so that the short sides of the board | substrate 10 of two adjacent light emitting modules 1 may oppose. In the present embodiment, four light emitting modules 1 are used, but the present invention is not limited to this.

(Modification)
As described above, the light emitting module and the lighting device according to the present invention have been described based on the embodiments, but the present invention is not limited to the above embodiments.

  For example, in the first and second embodiments, the bumper member 50 is formed so as to overlap the end portion of the sealing member 40. However, the present invention is not limited to this, as in the bumper member 50A shown in FIG. The bumper members 50 </ b> A may be formed as a pair on the short side of the substrate 10 so as to sandwich the sealing member 40. Also in this case, since the stress at the time of collision of two adjacent light emitting modules 1 can be dispersed, the deformation of the wire 30 due to the stress of the sealing member 40 can be suppressed. Note that the bumper member 50A is not formed in a pair on each short side, but only one of the pair may be formed on each short side.

  In the first and second embodiments, the light emitting elements 20 are arranged in a single row, but may be in a plurality of rows. In this case, a plurality of sealing members 40 may be formed for each row of light emitting elements 20, and a plurality of recesses 11 may be formed corresponding to the number of sealing members 40.

  In the first and second embodiments, the light emitting module 1 is configured to emit white light by the blue LED chip and the yellow phosphor. However, the present invention is not limited to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used so as to emit white light by combining this with a blue LED chip.

  Moreover, in the said Embodiment 1, 2, you may use the LED chip which light-emits colors other than blue as an LED chip. For example, when using an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than that of a blue LED chip, a combination of phosphors that are mainly excited by ultraviolet light and emit light in three primary colors (red, green, and blue). Can be used.

  In the first and second embodiments, the phosphor is used as the wavelength conversion material. However, the present invention is not limited to this. For example, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, can be used as the wavelength conversion material.

  Moreover, in the said Embodiment 1, 2, it is good also as a structure which can color-tune the light emitting module 1. FIG.

  Moreover, although the said Embodiment 2 demonstrated the example which applies the light emitting module 1 to a base light, it is not limited to this. For example, the light emitting module 1 may be applied to a long illuminating device such as a straight tube lamp, or may be applied to an illuminating device such as a downlight, a spotlight, or a bulb lamp. Furthermore, it is also possible to use the light emitting module 1 for equipment other than lighting applications.

  Other forms obtained by subjecting each embodiment to various modifications conceived by those skilled in the art, and forms realized by arbitrarily combining the components and functions in the embodiment without departing from the spirit of the present invention. Are also included in the present invention.

DESCRIPTION OF SYMBOLS 1 Light emitting module 10 Board | substrate 20 Light emitting element 30 Wire 40 Sealing member 50, 50A Bumper member

Claims (9)

A substrate,
A plurality of light emitting elements arranged linearly on the substrate;
A wire connected to each of the plurality of light emitting elements;
A sealing member that seals the plurality of light emitting elements and the wires, is formed linearly along an arrangement direction of the plurality of light emitting elements, and extends to an edge of the substrate;
A bumper member formed in the vicinity of the edge of the substrate,
The protruding amount of the bumper member protruding in the longitudinal direction of the sealing member from the edge is equal to or more than the protruding amount of the sealing member protruding in the longitudinal direction of the sealing member from the edge. . The planar view shape of the substrate is an elongated rectangle,
The light emitting module according to claim 1, wherein the edge is a short side of the rectangle. The sealing member is formed from one of the two opposing short sides of the substrate to the other,
The light emitting module according to claim 2, wherein the bumper member is formed on each of the two short sides. The light emitting module according to claim 2, wherein the bumper member is formed along a short side of the substrate so as to overlap an end portion of the sealing member. The light emitting module according to claim 2, wherein a pair of the bumper members are formed on the short side of the substrate so as to sandwich the sealing member. The light emitting module according to claim 1, wherein the bumper member is made of a transparent resin. The light emitting module according to claim 1, wherein the bumper member is made of the same material as the sealing member. The light emitting module according to claim 1, wherein the sealing member includes a wavelength conversion material that converts a wavelength of light emitted from the light emitting element. A plurality of the light emitting modules according to any one of claims 1 to 8,
The plurality of light emitting modules are arranged adjacent to each other along a longitudinal direction of the sealing member.

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