JP2012195317A - Lamp and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently dissipate heat generated at a semiconductor light emitting element.SOLUTION: The lamp includes a case 110, and a board 310 for mounting LEDs 321. The case 110 is formed of a first case 200, and a second case 400. The board 310 is mounted on the second case 400. The second case 400 is made by plastically deforming an elongated metal plate, and the second case 400 is made of a material having a thermal conductivity larger than that of the board 310.

Description

  The present invention relates to a lamp and a lighting device using a semiconductor light emitting element such as a light emitting diode (LED).

  In recent years, semiconductor light emitting devices such as LEDs have been used in various lamps as highly efficient and space-saving light sources.

  An LED lamp using such an LED includes an LED module (light emitting module), and the LED module is configured by sealing an LED mounted on a substrate with a resin. As LED lamps, there are straight tube type LED lamps (straight tube type LED lamps) and light bulb type fluorescent lamps (bulb type LED lamps). In any lamp, a plurality of LEDs are arranged on a substrate. A configured LED module is used. For example, Patent Document 1 discloses a conventional straight-tube LED lamp.

JP 2009-043447 A

  By the way, the LED has a problem that the light output decreases as the temperature of the LED increases, and the lifetime is shortened. Therefore, a measure for heat dissipation is important even in a straight tube type LED lamp using LEDs.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a lamp and an illumination device that can efficiently dissipate heat generated in a semiconductor light emitting element.

  In order to achieve the above object, a lamp according to one embodiment of the present invention is a lamp that irradiates light, and is a long base and a base on which a semiconductor light emitting element is mounted. The casing is composed of a first casing and a second casing extending along the longitudinal direction of the casing, the base is placed on the second casing, and the first casing is the first casing. The second casing is made of a metal, and the second casing is made of a material having a thermal conductivity larger than the thermal conductivity of the base. The body has a concave portion into which an end portion in the short direction of the first casing is fitted.

  Moreover, the lamp | ramp which concerns on 1 aspect of this invention WHEREIN: The said recessed part is good also as being formed by bending a part of said 2nd housing inside the said housing.

  Moreover, the lamp | ramp which concerns on 1 aspect of this invention WHEREIN: The said recessed part is good also as being formed along the longitudinal direction of a said 2nd housing | casing.

  Further, in the lamp according to one aspect of the present invention, the concave portion is provided on both sides in the short direction of the second housing, and one end portion in the short direction of the first housing is provided. The relationship of w1 <w2 may be satisfied, where w1 is the distance from the other end and w2 is the distance between the two recesses of the second housing.

  In the lamp according to one aspect of the present invention, the second casing may be made of aluminum.

  Moreover, the lamp | ramp which concerns on 1 aspect of this invention WHEREIN: The said 1st housing | casing is good also as having translucency.

  Moreover, the lamp | ramp which concerns on 1 aspect of this invention WHEREIN: A said 2nd housing | casing has a plane part extended along the said longitudinal direction, The said base may be mounted in the said plane part.

  In the lamp according to one embodiment of the present invention, the light emitting element may include a cavity and a light emitting diode mounted in the cavity.

  An illumination device according to one embodiment of the present invention includes any one of the lamps described above.

  According to the present invention, heat generated in a semiconductor light emitting device can be efficiently radiated.

FIG. 1 is a perspective view showing an appearance of a lamp according to the first embodiment. FIG. 2 is a perspective view of the housing according to the first embodiment. FIG. 3 is a cross-sectional view of the lamp according to the first embodiment. FIG. 4 is a perspective view of the second housing according to the first embodiment. FIG. 5 is a plan view of the LED module according to the first embodiment. FIG. 6 is a plan view showing a plurality of LED modules. FIG. 7 is a cross-sectional view of the first housing and the second housing. FIG. 8 is a diagram for explaining a process for integrating the first casing and the second casing. FIG. 9 is a perspective view illustrating a configuration of a lighting device according to the second embodiment. 10 is a cross-sectional view of a lamp according to Modification A. FIG. FIG. 11 is a perspective view of a second housing according to Modification B. FIG. FIG. 12 is a cross-sectional view of a housing according to Modification C. FIG. 13 is a view for explaining an LED module according to Modification D. FIG. 14 is a perspective view of an LED module according to Modification E. FIG. FIG. 15 is a view showing a cap pin according to Modification F. FIG. FIG. 16 is a diagram illustrating a configuration of a base according to Modification G. FIG. 17 is a cross-sectional view of the die along a plane perpendicular to the tube axis direction. FIG. 18 is a diagram showing a part of a cross section of the first casing along a plane perpendicular to the tube axis direction.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof may be omitted.

  It should be noted that the dimensions, materials, shapes, relative arrangements, and the like of the constituent elements exemplified in the embodiments are appropriately changed depending on the configuration of the apparatus to which the present invention is applied and various conditions. It is not limited to those examples. Moreover, the dimension of each component in each figure may differ from an actual dimension.

<First Embodiment>
FIG. 1 is a perspective view showing an appearance of a lamp 100 according to the first embodiment. In FIG. 1, a part of the housing 110 is cut away to show the inside of the lamp 100.

  In FIG. 1, the X, Y, and Z directions are orthogonal to each other. The X, Y, and Z directions shown in the following figures are also orthogonal to each other.

  With reference to FIG. 1, the lamp 100 includes a housing 110, two bases 201, a pair of base pins 202, and a plurality of LED modules 300. The lamp 100 is a lamp that emits light.

  First, the casing 110 according to the present embodiment will be briefly described.

  FIG. 2 is a perspective view of the housing 110 according to the first embodiment.

  FIG. 3 is a cross-sectional view of the lamp 100 according to the first embodiment. Specifically, FIG. 3 is a cross-sectional view of the lamp 100 along the YZ plane including the Y axis and the Z axis.

  With reference to FIGS. 1, 2, and 3, the housing 110 is a hollow housing (enclosure) for housing the LED module 300. The shape of the casing 110 is long. Openings are formed at both ends of the casing 110.

  The housing 110 is composed of a first housing 200 and a second housing 400. Each of the first casing 200 and the second casing 400 extends along the longitudinal direction of the casing 110. Hereinafter, the longitudinal direction of the casing 110 is also referred to as a casing longitudinal direction.

  The first casing 200 is made of a light-transmitting plastic. The first casing 200 is not limited to plastic, and may be made of acrylic, polycarbonate, glass, or the like.

  The shape of the first housing 200 is a shape in which the same shape (the shape shown in FIG. 3) continues from one end to the other end of the first housing 200 in the longitudinal direction. The shape of the second casing 400 is a shape in which the same shape (the shape shown in FIG. 3) continues from one end to the other end of the second casing 400 in the longitudinal direction.

  As shown in FIG. 3, the cross-sectional shape of the first casing 200 is a substantially elliptic arc shape. The thickness of the first casing 200 is, for example, 0.7 [mm].

  Moreover, it is preferable that the outer surface or inner surface of the first casing 200 is subjected to a diffusion treatment. Thereby, the light emitted from the LED module 300 can be diffused. Examples of the diffusion treatment include a method of applying silica, calcium carbonate, or the like to the inner surface of the first casing 200, a method of using a resin material such as polycarbonate in which a diffusion material is dispersed in the material of the first housing 200, and the like.

  FIG. 4 is a perspective view of the second casing 400 according to the first embodiment.

  Referring to FIGS. 3 and 4, second casing 400 has a convex portion 420. The convex portion 420 is a portion in which a part of the second casing 400 protrudes toward the inside of the casing 110. The convex part 420 of the second casing 400 has a flat plane part 421. That is, the flat surface portion 421 is a part of the convex portion 420. The plane part 421 extends along the longitudinal direction of the housing.

  A plurality of LED modules 300 are placed on the plane portion 421 in a straight line along the longitudinal direction of the housing. A plurality of LED modules 300 are fixed to the flat portion 421 with an adhesive material having high thermal conductivity.

  In addition, the board | substrate 310 of each LED module 300 may be fixed to the plane part 421 by the electroconductive screw member etc.

  Next, the LED module 300 will be described.

  FIG. 5 is a plan view of the LED module 300 according to the first embodiment. The LED module 300 is a COB type (Chip On Board) light emitting module. The LED module 300 is a line light source that emits light in a line shape (line shape).

  Referring to FIG. 5, LED module 300 includes a substrate 310 and a light emitting unit 320.

  The substrate 310 is a long rectangular substrate extending in the longitudinal direction of the housing.

  The substrate 310 is a ceramic substrate, for example. The ceramic substrate is made of alumina or translucent aluminum nitride.

  Note that the substrate 310 is not limited to a ceramic substrate, and may be a resin substrate, a glass substrate, a flexible flexible substrate, an aluminum substrate, or the like.

  Here, the length in the longitudinal direction of the substrate 310 is L1, and the length in the short direction is L2. In this case, L1 and L2 are defined by a relational expression of 10 ≦ L1 / L2, for example. That is, L1 is 10 times or more of L2.

  As an example, various sizes of the substrate 310 according to the present embodiment have a long side (length in the longitudinal direction) of 140 [mm], a short side (length in the short direction) of 5.5 to 7 [mm], The thickness is 1 [mm].

  A light emitting unit 320 that emits light is provided on the main surface of the substrate 310. Hereinafter, in this specification, the main surface of the substrate 310 is a surface on which the light emitting unit 320 is provided.

  Specifically, on the main surface of the substrate 310, the light emitting unit 320 is formed up to both end edges in the longitudinal direction of the substrate 310. That is, the light emitting unit 320 is formed without interruption from the end surface of one short side of the substrate 310 to the end surface of the other short side.

  The light emitting unit 320 includes a plurality of LEDs 321 and a sealing member 322.

  The plurality of LEDs 321 are linearly mounted on the main surface of the substrate 310 along the longitudinal direction of the substrate 310. In the present embodiment, as an example, 24 LEDs 321 are mounted on each substrate 310.

  The LED 321 is a bare chip that emits monochromatic visible light. Each LED 321 is bonded to the substrate 310 by a die attach material (die bond material). The LED 321 is, for example, a blue LED chip that emits blue light. The blue LED chip is a gallium nitride based semiconductor light emitting element having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material.

  The plurality of LEDs 321 included in the light emitting unit 320 are electrically connected in series by a wiring 330 described later formed on the surface of the substrate 310. Hereinafter, the plurality of LEDs 321 included in the light emitting unit 320 are collectively referred to as a light emitting unit LED group.

  Note that all of the plurality of LEDs 321 constituting the LED group in the light emitting unit may not be connected in series. For example, the 24 LEDs 321 constituting the LED group in the light emitting unit may be constituted by three sets of LED groups electrically connected in parallel. In this case, the eight LEDs 321 constituting each of the three sets of LED groups are electrically connected in series.

  The sealing member 322 collectively seals all the LEDs 321 mounted on one substrate 310. On the main surface of the substrate 310, the sealing member 322 is formed up to both end edges in the longitudinal direction of the substrate 310. That is, the sealing member 322 is formed without interruption from the end surface of one short side of the substrate 310 to the end surface of the other short side.

  The linear sealing member 322 (light emitting unit 320) is formed on a straight line passing through the center of the substrate 310 in the short direction. The sealing member 322 (light emitting unit 320) may be formed closer to one long side than a straight line passing through the center of the substrate 310 in the short direction.

  The shape of the sealing member 322 is a substantially semicircular dome shape whose section is convex upward. The sealing member 322 is a phosphor-containing resin containing a phosphor that is a wavelength converter. The sealing member 322 is a wavelength conversion layer that converts the wavelength of light from the LED 321.

  The wavelength conversion layer includes an optical wavelength converter for converting the wavelength of light. In the present embodiment, the sealing member 322 that is a wavelength conversion layer includes a phosphor as an optical wavelength converter.

  Therefore, the sealing member 322 is a phosphor layer containing phosphor fine particles that excite the light of the LED 321. Incidentally, yellow phosphor fine particles are used as the phosphor fine particles, and the phosphor-containing resin is constituted by dispersing this in a silicone resin.

  As an example, the yellow phosphor particles are YAG (yttrium, aluminum, garnet) phosphor materials. The yellow phosphor particles are not limited to YAG phosphor materials, and may be silicate phosphor materials, for example.

  As described above, the light emitting unit 320 includes the plurality of LEDs 321 as blue LED chips and the sealing member 322 containing yellow phosphor particles. Therefore, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light. As a result, white light is emitted from the light emitting unit 320 by the excited yellow light and the blue light of the blue LED chip.

  The LED module 300 further includes a wiring 330, an electrostatic protection element 340, two electrode terminals 350, and a wire 331.

  The wiring 330 is a metal wiring made of tungsten (W) or copper (Cu). The wiring 330 is patterned on the main surface of the substrate 310.

  Each of the two electrode terminals 350 is electrically connected to the wiring 330.

  The electrostatic protection element 340 is, for example, a Zener diode. The electrostatic protection element 340 prevents the LED 321 from being destroyed by the reverse polarity static electricity generated on the substrate 310. The electrostatic protection element 340 is electrically connected to the plurality of LEDs 321 by the wiring 330.

  The electrode terminal 350 is formed on the main surface of the substrate 310. The electrode terminal 350 is a power supply / reception unit (external connection terminal) for receiving DC power from an external power source and supplying DC power to the LED 321. The electrode terminal 350 is electrically connected to the wiring 330.

  For example, when a direct current is supplied from the electrode terminal 350 to the LED 321, the LED 321 emits light, and desired light is emitted from the LED 321.

  In the present embodiment, the two electrode terminals 350 are offset to one long side of the substrate 310 with the sealing member 322 as a reference.

  The wire 331 is an electric wire for electrically connecting the adjacent LED 321 and the wiring 330. The wire 331 is, for example, a gold wire. A p-side electrode and an n-side electrode for supplying current are formed on the upper surface of the LED 321. Each of the p-side electrode and the n-side electrode and the wiring 330 are wire-bonded by a wire 331.

  FIG. 6 is a plan view showing a plurality of LED modules 300.

  As described above, a plurality of LED modules 300 are placed on the plane portion 421 in a straight line along the longitudinal direction of the casing as shown in FIG.

  That is, the plurality of LED modules 300 are arranged in the housing 110. That is, the substrate 310 of the LED module 300 is a base on which the semiconductor light emitting element (LED 321) is mounted, which is disposed in the housing 110.

  Specifically, the plurality of LED modules 300 are placed on the flat surface 421 of the second casing 400. That is, the substrate 310 as a base is placed on the flat surface 421 of the second casing 400. That is, the substrate 310 as a base is placed (connected) on the second casing 400.

  In addition, as shown in FIG. 6, of the two adjacent LED modules 300, the electrode terminal 350 of one LED module 300 and the electrode terminal 350 of the other LED module 300 are electrically connected by the wiring 10. Is done.

  Thereby, the plurality of LEDs 321 in the plurality of LED modules 300 on the plane portion 421 are connected in series. The wiring 10 is made of a conductive member such as a lead wire made of a conductive wire with an insulating coating, for example.

  Next, the base will be described.

  Two bases 201 are provided at both ends of the casing 110. The shape of the base 201 is a shape that closes the opening of the housing 110.

  A pair of base pins 202 are fixed (provided) to the base 201. The base pin 202 is made of a conductive metal.

  In addition, a lighting circuit (not shown) for receiving power and causing the LEDs of the LED module 300 to emit light is installed inside or outside the lamp 100 using one or both of the two caps 201. The lighting circuit can be configured by a rectifier circuit including a diode bridge using four Zener diodes, for example.

  In the lamp 100 according to the present embodiment, power is supplied to the LED module 300 using one of the two caps 201 as an example. In this case, a lighting circuit (not shown) is provided in the one base 201. Also, in this case, the other base 201 of the two bases 201 is used for mounting on a lighting fixture.

  Further, in this case, the one base 201 receives power (AC power) used for light emission of the semiconductor light emitting element (LED 321) from the external commercial AC power source via the base pin 202. That is, AC power is supplied to the one base 201 from the outside. That is, the base pin 202 of the one base 201 is a pin for receiving the AC power from an external commercial AC power source.

  The lighting circuit is electrically connected to the plurality of LED modules 300 so that power can be supplied to the plurality of LED modules 300.

  In this case, the lighting circuit is electrically connected to the electrode terminal 350 of the LED module 300 placed at the location closest to the base 201 that accommodates the lighting circuit by wiring. Further, the lighting circuit is a wiring electrically connected to the electrode terminal 350 of the LED module 300 placed at the position farthest from the base 201 that accommodates the lighting circuit, and the second casing 400 has a longitudinal length. Wirings routed along the direction are connected.

  The power supply to the LED module 300 is not limited to one base, and both the two bases 201 may be used.

  Next, the casing 110 according to the present embodiment will be described in more detail.

  As described above, the casing 110 includes the first casing 200 and the second casing 400.

  The second casing 400 is obtained by plastically deforming a long metal plate into the shape shown in FIGS. 3 and 4 by pressing or the like. The second casing 400 is made of aluminum. The thickness of the second casing 400 is, for example, 0.3 to 1 [mm].

  With this configuration, the second casing 400 is configured to be elastically deformed. In particular, the region R10 of the second casing 400 of FIG. 3 is configured to be most elastically deformed. It is preferable that the thickness of the part of area | region R10 among the 2nd housings 400 is formed so that it may become thinner than the thickness of another part (for example, convex part 420). Thereby, the part of area | region R10 can be easily elastically deformed among the 2nd housings 400. FIG. Further, by increasing the thickness of the convex portion 420, the strength against deformation in the longitudinal direction of the second casing 400 can be increased, and the heat of the LED module 300 can be easily radiated to the second casing 400.

  The second casing 400 is not limited to aluminum, but may be other materials that can be plastically deformed by press working or the like.

  Moreover, the production | generation of the 2nd housing 400 is not limited to press work, The other process which can carry out the plastic deformation of the metal plate to the shape shown by FIG. 3 and FIG. 4 may be sufficient.

  Referring to FIGS. 3 and 4, second casing 400 has two bent portions 410. The bent portion 410 is a portion where each of two end portions in the short direction of the second casing 400 is bent inward of the casing 110.

  As described above, the first casing 200 is made of plastic. Therefore, the first casing 200 is configured to be elastically deformed.

  As shown in FIGS. 2 and 3, the two end portions 210 in the short direction of the first casing 200 are fitted into the recesses of the two bent portions 410 of the second casing 400, respectively. That is, the end portion 210 in the short direction of the first casing 200 is fitted to the bent portion 410 of the second casing 400.

  In other words, the casing 110 is configured such that the first casing 200 and the first casing 200 are connected to the first casing 200 with the first casing 200 and the second casing 400 in the shorter direction. 2 housings 400 are integrated.

  In addition, the shape of the end part in each edge part 210 is a substantially circular arc shape. Moreover, the shape of the endmost part in each bending part 410 is a substantially circular arc shape.

  Thereby, the force required to be applied to the first casing 200 can be reduced when the first casing 200 and the second casing 400 are integrated.

  Further, as described above, the substrate 310 on which the light emitting unit 320 is provided is placed (connected) on the planar portion 421 of the second casing 400. In other words, the first casing 200 is disposed on the light irradiation side from the semiconductor light emitting element (LED 321) rather than the second casing 400.

  The second casing 400 is made of a material having a thermal conductivity larger than that of the substrate 310 as a base. For example, the second casing 400 is made of aluminum having a thermal conductivity of 237 [W / m · K].

  For example, when the substrate 310 is made of alumina ceramic, the thermal conductivity of the substrate 310 is 32 [W / m · K]. For example, when the substrate 310 is made of alumina nitride ceramic, the thermal conductivity of the substrate 310 is 150 [W / m · K].

  Thus, the 2nd housing 400 is comprised with the material of thermal conductivity larger than the thermal conductivity of the board | substrate 310 as a base. Therefore, heat generated when the light emitting unit 320 emits light is efficiently transmitted to the second casing 400 via the substrate 310.

  The second casing 400 is obtained by plastically deforming a long metal plate into the shape shown in FIGS. 3 and 4. Therefore, the area of the outer surface of the second casing 400 that is in contact with the outside air can be increased as much as possible.

  Therefore, heat at the time of light emission of the LED 321 included in the light emitting unit 320 can be efficiently radiated to the atmosphere outside the housing 110. That is, the heat generated in the semiconductor light emitting element (LED 321) can be efficiently radiated.

  Therefore, it is possible to suppress a decrease in light emission efficiency and a decrease in lifetime of the LED 321 due to a temperature rise.

  Here, as shown in FIG. 3, the inner diameter of the casing 110 is d1. In addition, the height from the bottom of the inner surface of the second casing 400 on the side opposite to the light irradiation side from the LED 321 to the end in the short direction of the second casing 400 is h1.

  In this case, d1 and h1 are defined by Expression 1 as the following relational expression.

  h1 ≦ (d1) / 2 (Formula 1)

  From Equation 1, that is, d1 is at least twice h1.

  Here, the luminous intensity distribution of the light emitted from the LED 321 in the light emitting unit 320 has a Lambertian light distribution that is proportional to the cosine (cos α) of the angle (α) formed with the optical axis of the LED 321.

  Therefore, the 1/2 beam angle of the light emitted from the LED 321 is approximately 120 degrees. The 1/2 beam angle is defined as an angle that is twice the angle formed by the direction and the optical axis, with the direction being a light intensity that is 1/2 the maximum light intensity of light emitted from the light emitting surface.

  Here, the optical axis is an axis that virtually connects the position of the strongest light and the position of the light source among the emitted light. For example, the axis indicating the light distribution of the LED 321 is the optical axis of the LED 321.

  The edge of the second casing 400 in the short direction and the height of the protrusion 420 are configured so as not to fall within the range of the 1/2 beam angle of the light emitted from the LED 321. That is, the end of the second casing 400 in the short direction is provided in a region outside the range of the 1/2 beam angle of the light emitted from the LED 321 as the semiconductor light emitting element. In other words, the height of the convex portion 420 is defined such that the end portion of the second casing 400 in the short direction is provided in a region outside the range of the 1/2 beam angle of the light emitted from the LED 321.

  With this configuration, the total luminous flux emitted from the lamp 100 can be sufficiently secured.

  Next, a process for integrating the first casing 200 and the second casing 400 according to the present embodiment will be described.

  FIG. 7 is a cross-sectional view of the first casing 200 and the second casing 400 along the YZ plane when the first casing 200 and the second casing 400 are not integrated.

  With reference to FIG. 7, here, the distance between one end 210 of the first casing 200 and the other end 210 of the first casing 200 is defined as w1. Further, the distance between the concave portion of one bent portion 410 of the second casing 400 and the concave portion of the other bent portion 410 of the second casing 400 is defined as w2.

  In this case, the first casing 200 and the second casing 400 are formed so that w1 <w2 is satisfied.

  In addition, it is not limited above, The 1st housing 200 and the 2nd housing 400 may be formed so that w1 = w2 may be satisfy | filled.

  FIG. 8 is a diagram for explaining a process when the first casing 200 and the second casing 400 are integrated. The process for integrating the first casing 200 and the second casing 400 is a process for assembling the casing 110.

  FIGS. 8A to 8C are cross-sectional views of the first casing 200 and the second casing 400 along the YZ plane.

  First, as shown in FIG. 8A, the two end portions 210 of the first casing 200 are in contact with the two bent portions 410 in a state where the bottom surface of the second casing 400 is fixed to a work table or the like. Let

  Then, as shown in FIG. 8A, the first casing 200 is pressed toward the second casing 400 while the two end portions 210 are in contact with the two bent portions 410, respectively. In this case, as shown in FIG. 8B, the end portions 210 of the first casing 200 and the vicinity of the end portions 210 are elastically deformed toward the outside of the first casing 200.

  Further, as shown in FIG. 8B, at the same time as the first casing 200 is elastically deformed, each bent portion 410 in the second casing 400 and the vicinity of each bent portion 410 are in the direction inside the second casing 400. Elastically deforms toward

  As described above, the shape of the endmost portion in each end portion 210 and the shape of the endmost portion in each bent portion 410 are substantially arc shapes. Therefore, the area of the part where the end portion 210 and the bent portion 410 are in contact can be reduced. As a result, the first casing 200 and the second casing 400 can be easily elastically deformed by the stress generated by pressing the first casing 200 in a state where the end portion 210 and the bent portion 410 are in contact with each other.

  As shown in FIG. 8B, when the first housing 200 and the second housing 400 are elastically deformed and the first housing 200 is pressed toward the second housing 400, the first housing 200 and the second housing 200 are pressed. The stress applied to the casing 400 is released, and the first casing 200 and the second casing 400 that have been elastically deformed return to their original states. When the first casing 200 and the second casing 400 that have been elastically deformed return to their original states, a restoring force is generated in the first casing 200 and the second casing 400. As a result, as shown in FIG. 8C, each end portion 210 of the first casing 200 is fitted into the concave portion of each bent portion 410 of the second casing 400.

  Through the above steps, the first casing 200 and the second casing 400 are integrated by the restoring force generated in the first casing 200 and the second casing 400. That is, the housing 110 can be assembled by the above steps.

  As described above, the first casing 200 and the second casing 400 are configured to be elastically deformed. Therefore, the assembly of the housing 110 can be facilitated.

  Further, as described above, in a state where the first casing 200 and the second casing 400 are not integrated, the first casing 200 and the second casing 400 are formed so that w1 <w2 is satisfied.

  Therefore, in a state where the first casing 200 and the second casing 400 are integrated, stress is generated in the first casing 200 toward the inside of the casing 110, and the second casing 400 is directed toward the outside of the casing 110. Stress is generated. Therefore, each end 210 of the first housing 200 can be firmly fitted into the recess of each bent portion 410 of the second housing 400.

  In order to improve the adhesion and airtightness between the end portion 210 of the first casing 200 and the bent portion 410 of the second casing 400, an adhesive member or a resin sheet member is provided between the end portion 210 and the bent portion 410. May be sandwiched.

  As described above, according to the lamp 100 according to the first embodiment, the second casing 400 is made of a material having a thermal conductivity larger than the thermal conductivity of the substrate 310 as a base. Therefore, the heat at the time of light emission of LED321 contained in the light emission part 320 formed in the board | substrate 310 can be efficiently thermally radiated to the air | atmosphere outside the housing 110 through the 2nd housing 400. FIG. That is, the heat generated in the semiconductor light emitting element (LED 321) can be efficiently radiated.

  The second casing 400 on which the substrate 310 is placed is obtained by plastically deforming a long metal plate into the shape shown in FIGS. 3 and 4. Therefore, the shape of the long second casing 400 on which the substrate 310 is placed can be significantly reduced in weight compared with, for example, a cross-sectional shape that is substantially semicircular. As a result, the lamp 100 can be significantly reduced in weight.

  Further, the first casing 200 and the second casing 400 are configured to be elastically deformed. Therefore, the assembly of the housing 110 can be facilitated.

  In the present embodiment, both the first casing 200 and the second casing 400 are configured to be elastically deformed, but only one of the first casing 200 and the second casing 400 may be configured to be elastically deformed. Good.

  For example, it is assumed that the first casing 200 is configured not to be elastically deformed and the second casing 400 is configured to be elastically deformed. In this case, in the process for integrating the first casing 200 and the second casing 400, only the second casing 400 is elastically deformed, whereby the first casing 200 and the second casing 400 are integrated. .

  Further, the first casing 200 and the second casing 400 may be formed so that w1 = w2 is satisfied.

  In this case, in the process for integrating the first casing 200 and the second casing 400, the end 210 of the first casing 200 and the second casing are fixed with the bottom surface of the second casing 400 fixed to a work table or the like. The first casing 200 may be slid from one end in the long axis direction of the second casing 400 toward the other end so that the concave portion of the bent portion 410 of 400 is fitted. Also by this method, the 1st housing 200 and the 2nd housing 400 can be integrated easily. That is, the assembly of the housing 110 can be facilitated.

<Second Embodiment>
Next, a lighting device according to the second embodiment will be described.

  FIG. 9 is a perspective view showing a configuration of a lighting apparatus 600 according to the second embodiment.

  The lighting device 600 includes a lamp 60 and a lighting fixture 610.

  The lighting fixture 610 includes a pair of sockets 611, a fixture main body 612, and a circuit box (not shown).

  The pair of sockets 611 are electrically connected to the lamp 60. The pair of sockets 611 holds the lamp 60. A socket 611 is attached to the instrument main body 612.

  The inner surface 612a of the instrument main body 612 is a reflecting surface that reflects light emitted from the lamp 60 in a predetermined direction (for example, downward).

  The circuit box houses therein a lighting circuit that supplies power to the lamp 60 when the switch (not shown) is on and does not supply power when the switch is off.

  The lighting fixture 610 is attached to a ceiling or the like via a fixture.

  The lamp 60 is the lamp 100 according to the first embodiment described above.

<Other variations>
Next, modifications of the lamp according to the embodiment of the present invention described above will be described below. Each of the following modifications can also be applied to the lighting device according to the second embodiment.

<Modification A>
In the above-described embodiment, the end in the short direction of the substrate 310 is configured not to contact the second casing 400, but is not limited thereto. As shown in FIG. 10, in a state where the first casing 200 and the second casing 400 are integrated, both end portions in the short direction of the substrate 310 abut on the portion of the region R <b> 10 in the second casing 400. As described above, the width of the substrate 310 may be increased.

  With this configuration, the substrate 310 is sandwiched between two regions R10 of the second casing 400. Therefore, the substrate 310 (LED module 300) can be firmly fixed. In addition, with this configuration, it is possible to regulate the position where the second casing 400 sandwiches both ends of the substrate 310 in the short direction. Furthermore, the back surface of the substrate 310 can be pressed against the flat portion 421 by the upper surface of the end portion in the short direction of the substrate 310 being in contact with the bent portion 410.

<Modification B>
FIG. 11 is a perspective view of the second casing 400A according to Modification B. FIG.

  As shown in FIG. 11, the second casing 400 </ b> A has a plurality of notches 430 in the bent portion 410 of the second casing 400 and in the vicinity of the bent portion 410 compared to the second casing 400 of FIG. 4. Is different. Since the other configuration of second casing 400A is the same as that of second casing 400, detailed description will not be repeated.

  That is, the notch 430 is formed at the end of the second casing 400A in the short direction. With this configuration, the second casing 400A can be more elastically deformed than the second casing 400.

  The second casing 400A is used instead of the second casing 400 in the first embodiment.

  Therefore, the integration of the first casing 200 and the second casing 400A can be further facilitated. That is, the assembly of the housing 110 can be further facilitated.

<Modification C>
Although the second casing 400 is configured to have the convex portion 420, the second casing 400 may be configured not to include the convex portion 420.

  The lamp according to the modification example C is different from the lamp 100 in FIG. 1 in that a lamp body 110A is provided instead of the lamp body 110. Since the other configuration of the lamp according to Modification C is the same as that of lamp 100, detailed description will not be repeated.

  FIG. 12 is a cross-sectional view of a housing 110A according to Modification C.

  As shown in FIG. 12, the casing 110 </ b> A is different from the casing 110 of FIG. 3 in that it includes a second casing 400 </ b> A instead of the second casing 400. Since the structure of the other casing 110A is the same as that of the casing 110A, detailed description will not be repeated.

  The second casing 400A is different from the second casing 400 of FIG. 3 in that the convex portion 420 is not provided. Since the other configuration of second casing 400A is the same as that of second casing 400, detailed description will not be repeated.

  A plurality of LED modules 300 are placed on the inner bottom surface of the second casing 400A along the longitudinal direction of the second casing 400A. That is, a plurality of substrates 310 are placed on the bottom surface inside the second casing 400A along the longitudinal direction of the second casing 400A.

  Similar to the second casing 400, the height of the end portion in the short direction of the second casing 400A is configured not to fall within the range of the 1/2 beam angle of the light emitted from the LED 321. That is, the end portion of the second casing 400A in the short direction is provided in a region outside the range of the 1/2 beam angle of the light emitted from the LED 321 as the semiconductor light emitting element.

<Modification D>
In the above embodiment, the second casing 400 is configured to route the wiring, but the present invention is not limited to this configuration. For example, the wiring may be provided inside the substrate.

  The lamp according to Modification D is different from the lamp 100 of FIG. 1 in that a plurality of LED modules 300A are provided instead of the plurality of LED modules 300. Since the other configuration of the lamp according to Modification D is the same as that of lamp 100, detailed description will not be repeated.

  FIG. 13 is a diagram for explaining an LED module 300A according to Modification D.

  FIG. 13A is a plan view of the LED module 300A. FIG. 13A does not show the electrostatic protection element 340 or the like provided in the LED module 300A for the sake of simplification.

  FIG. 13B is a cross-sectional view of the LED module 300A. Specifically, FIG. 13B is a cross-sectional view of the LED module 300A along the line V-V ′ of FIG.

  13A and 13B, the LED module 300A includes a board 310A instead of the board 310, and two electrode terminals 360, as compared with the LED module 300 of FIG. Furthermore, it differs from the point provided. Since the other configuration of LED module 300A is the same as that of LED module 300, detailed description will not be repeated.

  The substrate 310A is a multilayer substrate configured by stacking a plurality of substrates. The substrate 310A is different from the substrate 310 in that two electrode terminals 360, two vias 361, and wirings 362 are formed. Since the other configuration of substrate 310A is the same as that of substrate 310, detailed description will not be repeated.

  The light emitting unit 320 formed on the main surface of the substrate 310A includes a plurality of LEDs 321 (not shown) and a sealing member 322 (not shown). The plurality of LEDs 321 included in the light emitting unit 320 are electrically connected in series by a wiring (not shown).

  As described above, the plurality of LEDs 321 included in the light emitting unit 320 are referred to as an LED group within the light emitting unit.

  Note that all of the plurality of LEDs 321 constituting the LED group in the light emitting unit may not be connected in series.

  The two LEDs 321 positioned at both ends of the plurality of LEDs 321 constituting the light emitting unit LED group are electrically connected to the two electrode terminals 350, respectively. That is, a plurality of LEDs 321 that are electrically connected are provided between the two electrode terminals 350.

  A wiring 362 is formed inside the substrate 310A. The wiring 362 is a wiring made of copper, for example.

  Two electrode terminals 360 are formed on the main surface of the substrate 310A. Two vias 361 are formed in each of the two electrode terminals 360. Each via 361 is electrically connected to the wiring 362.

  That is, the two electrode terminals 360 are electrically connected by the via 361 and the wiring 362.

  FIG. 13C is a plan view showing a plurality of LED modules 300A.

  As shown in FIG. 13C, the plurality of LED modules 300 </ b> A according to Modification D are arranged linearly along the longitudinal direction of the second casing 400 in the flat portion 421 of the second casing 400.

  Further, as shown in FIG. 13C, of the two adjacent LED modules 300A, the electrode terminal 350 of one LED module 300A and the electrode terminal 350 of the other LED module 300A are connected by the wiring 10. Electrically connected.

  In addition, among the two adjacent LED modules 300 </ b> A, the electrode terminal 360 of one LED module 300 </ b> A and the electrode terminal 360 of the other LED module 300 </ b> A are electrically connected by the wiring 10.

  In addition, among the plurality of LED modules 300A included in the lamp according to the modification D, the electrode terminals 350 and 360 of the LED module 300A placed at the position closest to the base 201 provided with the lighting circuit receive DC power. It is electrically connected to the lighting circuit to be supplied.

  With the above configuration, the plurality of LEDs 321 in the plurality of LED modules 300A are connected in series. Therefore, it can be set as the structure which can supply direct-current power to several LED321 in several LED module 300A.

  In addition, with the configuration in which the wiring 362 is provided inside the substrate 310A, in the lamp according to the modification D, it is not necessary to route the wiring in the second casing 400 as in the first embodiment. Therefore, the manufacturing process of the lamp according to Modification D can be simplified.

<Modification E>
In the above embodiment, the LED module 300 is a COB type (Chip On Board) in which the LED itself (bare chip) is directly mounted on the substrate 310.

  However, the LED module 300 is a package type in which an LED chip is mounted in a cavity molded with resin or the like, and the inside of the cavity is sealed with a phosphor-containing resin, that is, a surface mount type (SMD). May be.

  Such an SMD type LED module 300B according to Modification E of the present invention will be described below.

  14 is a perspective view of an LED module 300B according to Modification E. FIG.

  As shown in FIG. 14, in the LED module 300 </ b> B, a plurality of packages 390 are linearly mounted in a line on the surface of the substrate 310.

  The package 390 is made of resin or the like, and the LED 321 is mounted in the cavity. The mounted LED 321 is covered with a sealing member 322. The plurality of packages 390 are electrically connected to each other by a wiring pattern, a wire, or the like.

<Modification F>
In the above embodiment, the shape of the cap pin 202 is a straight line, but is not limited thereto.

  As shown in FIG. 15, the shape of the tip of the base pin 202 may be L-shaped. With this configuration, it is possible to make it difficult for the lamp having the cap pin 202 according to Modification F to be detached from the lighting fixture.

<Modification G>
In the said embodiment, it was set as the structure which receives electric power only by one base among two bases. In this case, the base 201 that does not accommodate the lighting circuit may have the following configuration.

  FIG. 16 is a diagram illustrating a configuration of a base 201 according to Modification G.

  As shown in FIG. 16, the base 201 according to Modification G is different from the base 201 of FIG. 1 in that it includes a base pin 202 b instead of a pair of base pins 202.

  The base pin 202b is a ground pin for grounding. The shape of one end of the cap pin 202b is, for example, a T-shape so as to be attached to a lighting fixture. For example, the other end of the cap pin 202b is electrically connected to a ground terminal (not shown) in the housing 110 via a wiring.

  As mentioned above, although the lamp | ramp and illuminating device of this invention were demonstrated based on embodiment, this invention is not limited to these embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in several embodiment arbitrarily in the range which does not deviate from the meaning of invention.

  For example, in the above embodiment, the plurality of LEDs 321 on the substrate 310 of the LED module 300 are collectively sealed by the common sealing member 322. However, each of the plurality of LEDs 321 may be individually sealed by another sealing member 322.

  Further, in the above-described embodiment, the single-sided feed type lamp that is fed from one end of the casing 110 has been described, but a double-end feeding type that is fed from both ends of the casing 110 may be used.

  Moreover, although LED was illustrated as a semiconductor light-emitting device in the said embodiment, a semiconductor laser and organic EL (Electro Luminescence) may be sufficient.

  Further, a member for dispersing external stress may be provided between the base and the casing 110.

  For example, as shown in FIG. 17, a plurality of ribs 250 may be provided between the base 201 and the housing 110. The rib 250 is made of, for example, a material that absorbs an external force (stress).

  FIG. 17 is a cross-sectional view of the base 201 along a plane perpendicular to the tube axis direction.

  With the configuration of FIG. 17, for example, when the lamp 100 is attached to a lighting fixture, even if stress is generated in the direction perpendicular to the tube axis direction with respect to the base 201, the stress transmitted to the housing 110 can be greatly reduced. it can. Therefore, for example, it is possible to suppress the occurrence of defects due to stress, such as damage to the housing 110 or the like.

  Moreover, the light irradiation side from the light emission part 320 among the inner surfaces of the 1st housing 200 is processed into the shape (for example, uneven shape) which can diffuse the light which the light emission part 320 emits like FIG. Also good.

  FIG. 18 is a diagram illustrating a part of a cross section of the first casing 200 along a plane perpendicular to the tube axis direction. 18 may be applied to the entire inner surface of the first housing 200. The shape shown in FIG.

  In the above embodiment, the substrate 310 having a rectangular cross-sectional shape is used. However, a polygonal substrate having a cross-sectional shape other than a square (rectangular) may be used. That is, the shape of the substrate 310 may be a triangular prism, a pentagonal prism, a hexagonal prism, or the like.

  Moreover, although the nozzle | cap | die 201 which concerns on the said embodiment was comprised from one integrated housing, it is not limited to this. The base according to the above embodiment may be composed of, for example, two housings having a semicircular cross section.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be widely used in lamps and lighting devices in which semiconductor light emitting elements such as LEDs are used.

10, 330, 362 Wiring 60, 100 Lamp 110, 110A Housing 200 First housing 201 Base 202, 202b Base pin 210 End 300, 300A, 300B LED module 310, 310A Substrate 320 Light emitting unit 321 LED
350, 360 Electrode terminals 400, 400A Second housing 410 Bent part 420 Convex part 421 Flat part 430 Notch part 600 Illuminating device

Claims (9)

A lamp that emits light,
A long frame,
A base disposed in the housing and mounted with a semiconductor light emitting element;
The housing is composed of a first housing and a second housing extending along the longitudinal direction of the housing,
The base is placed on the second housing,
The first casing is disposed on the light irradiation side of the second casing,
The second casing is made of metal,
The second casing is made of a material having a thermal conductivity larger than the thermal conductivity of the base,
The second housing has a recess into which an end portion in a short direction of the first casing is fitted. The lamp according to claim 1, wherein the recess is formed by bending a part of the second casing inward of the casing. The lamp according to claim 1, wherein the recess is formed along a longitudinal direction of the second housing. Two of the recesses are provided on both sides of the second casing in the short direction,
When the distance between one end and the other end in the short direction of the first casing is w1, and the distance between the two recesses of the second casing is w2,
The lamp according to any one of claims 1 to 3, which satisfies a relationship of w1 <w2. The lamp according to any one of claims 1 to 4, wherein the second casing is made of aluminum. The lamp according to any one of claims 1 to 5, wherein the first casing has translucency. The second housing has a flat portion extending along the longitudinal direction,
The lamp according to claim 1, wherein the base is placed on the flat portion. The light emitting element includes a cavity and a light emitting diode mounted in the cavity.
The lamp according to any one of claims 1 to 7. An illuminating device comprising the lamp according to claim 1.

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