JP2017163550A - 異なる種類の撮像装置を有するモノリシックカメラアレイを用いた画像の撮像および処理 - Google Patents
異なる種類の撮像装置を有するモノリシックカメラアレイを用いた画像の撮像および処理 Download PDFInfo
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- JP2017163550A JP2017163550A JP2017062561A JP2017062561A JP2017163550A JP 2017163550 A JP2017163550 A JP 2017163550A JP 2017062561 A JP2017062561 A JP 2017062561A JP 2017062561 A JP2017062561 A JP 2017062561A JP 2017163550 A JP2017163550 A JP 2017163550A
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Abstract
【解決手段】各撮像装置は、複数の画素を含む。複数の撮像装置は、第1の画像特性を有する第1の撮像装置および第2の画像特性を有する第2の撮像装置を含む。複数の撮像装置により生成された画像は、各撮像装置により撮像された画像と比べて向上した画像を得るように処理される。各撮像装置は、ウェハレベルオプティクス(WLO)技術を用いて作製された光学素子と関連付けられてもよい。
【選択図】なし
Description
本出願は、2008年5月20日に出願された「Monolithic Integrated Array of Heterogeneous Image Sensors」という発明の名称の米国特許出願第61/054,694号の優先権を主張するものであり、その全体が参照により本明細書に援用される。
本発明は、複数の異なる種類の撮像装置を含む画像センサに関し、より詳細には、カスタムフィルタ、センサおよび様々な構成の光学系を有する複数のウェハレベル撮像装置を備える画像センサに関する。
画像センサは、カメラおよび他の撮像機器において画像を撮像するために用いられる。通常の撮像機器において、光は、撮像機器の一端における開口(アパーチャ)を介して侵入し、レンズのような光学素子により画像センサへ向けられる。多くの撮像機器において、1または複数の光学素子の層は、画像センサに集光するために開口と画像センサとの間に配置される。画像センサは、光学素子を介して受光した光から信号を生成する画素からなる。一般に用いられる画像センサは、CCD(電荷結合素子)画像センサおよびCMOS(相補型金属酸化半導体)センサを含む。
図1は、本実施形態に係る、撮像装置1A〜NMを備えるカメラアレイ100の平面図である。カメラアレイ100は、複数の撮像装置1A〜NMを含むように、半導体チップ上に作製される。各撮像装置1A〜NMは、複数の画素(例えば、0.32メガピクセル)を含んでもよい。一実施形態において、撮像装置1A〜NMは、図1に示すように、格子形式で配置される。他の実施形態において、撮像装置は、非格子形式で配置される。例えば、撮像装置は、円形パターン、ジグザグパターンまたは散乱パターンで配置されてもよい。
一実施形態において、カメラアレイは、ウェハレベルオプティクス(WLO)技術を用いている。WLO技術は、ガラスウェハ上に光学素子をモールドし、その後に、撮像装置を有する光学素子を直接的にモノリシックの統合モジュールにパッケージ化する。WLO処理は、他の処理と共に、ダイヤモンド−チューンド(diamond−turned)モールドを用いてガラス基板上に各プラスチックレンズ素子を作製する工程を含んでもよい。
図4は、一実施形態に係る、撮像システム400を示す機能ブロック図である。画像化システム400は、他の構成要素と共に、カメラアレイ410と、画像処理パイプラインモジュール420と、コントローラ440と、を含んでもよい。カメラアレイ410は、上述の図1および2を参照して詳細を説明したように、2以上の撮像装置を含む。画像412は、カメラアレイ410における2以上の撮像装置により撮像される。
一実施形態において、超解像度モジュール526は、撮像装置540により撮像された低解像度画像を処理することによって、高解像度合成画像を生成する。合成画像全体の画像品質は、個々の撮像装置のいずれか1つにより撮像された画像よりも高い。すなわち、個々の撮像装置が相乗的に動作すると、サブサンプリングなしであっても、スペクトルの狭い部分を撮像する個々の撮像装置の能力を用いて、高品質画像にそれぞれ寄与する。超解像度に関連付けられた画像情報は、以下のように表現されてもよい。
CMOS撮像装置のスペクトル応答は、通常、650nmから800nmにわたる近赤外線領域では非常に良く、800nmから1000nmの領域では十分に良い。近赤外線撮像装置は彩度情報を有していないが、近赤外線撮像装置が相対的にノイズフリーであるため、このスペクトル領域における情報は、低い照明条件において有益である。よって、近赤外線撮像装置は、低い照明条件下でのカラー画像のノイズ除去のために用いられる。
自動露出(AE)アルゴリズムは、撮像されるシーンに対する適切な露出を得るために重要となる。AEアルゴリズムの設計は、撮像された画像のダイナミックレンジに影響を及ぼす。AEアルゴリズムは、要求された画像が、カメラアレイの感度範囲のリニア領域の範囲内にあることを許容する露出値を算出する。リニア領域は、この領域内で優れた信号対ノイズ比が得られるため好ましい。露出値が非常に低い場合、写真は、アンダー飽和となり、一方で、露出値が非常に高い場合、写真は、オーバー飽和となる。従来のカメラにおいて、反復処理は、測定された写真輝度と、閾値を下回る予め規定された輝度との差を低減するために必要とされる。この反復処理は、収束に長い時間が要求され、容認できないシャッター遅延をもたらす場合がある。
一実施形態において、複数のスペクトル画像は、複数の撮像装置により描画され、シーンにおける対象物の区分け、または認識を容易にする。スペクトル反射率はほとんどの実世界の対象物においてスムーズに変化するため、スペクトル反射率は、複数のカラーフィルタを有する撮像装置を用いて複数のスペクトル次元におけるシーンを撮像することにより、および主成分分析(Principal Components Analysis:PCA)を用いて撮像された画像を解析することにより、推定されてもよい。
一実施形態において、カメラアレイにおける撮像装置のサブセットは、望遠レンズを含む。撮像装置のサブセットは、非望遠レンズを有する撮像装置と同様な他の画像化特性を有していてもよい。この撮像装置のサブセットからの画像は、組み合わされ、超解像度望遠レンズを形成するために超解像度処理される。他の実施形態において、カメラアレイは、異なるズーム倍率を提供する2以上の倍率のレンズが装備された2以上の撮像装置のサブセットを含む。
一実施形態において、カメラアレイは、高フレーム画像シーケンスを生成する。カメラアレイにおける撮像装置は、撮像画像とは独立して動作されうる。従来の画像センサと比べて、カメラアレイは、フレームレートをN倍に上げた(Nは撮像装置の数)画像を撮像してもよい。さらに、各撮像装置に対するフレームピリオドは、低光状況下での動作を向上させるように重複してもよい。解像度を増加させるために、撮像装置のサブセットは、高解像度の画像を作成するために、同期された手法で動作してもよい。この場合、最大フレームレートは、同期された手法において動作された撮像装置の数により低減される。高速ビデオフレームレートは、通常ビデオレートでのスローモーションビデオ再生を可能にする。
一実施形態において、複数の撮像装置は、シーンにおける対象物との距離の推定に用いられる。画像における各点との距離についての情報が、画像成分のxおよびy座標における範囲と共に、カメラアレイにおいて取得できるため、画像成分の大きさは、求められうる。さらに、物理的なアイテムの絶対的な大きさおよび形状が、他の参照情報なしに測定されうる。例えば、足の画像を撮ることができ、得られた情報は、適切な靴のサイズの正確な推定に用いられてもよい。
画像化システム400により処理される画像は、フラッシュ装置またはハードディスクのような記憶装置上の画像データの保存前または保存と共に、プレビューされてもよい。一実施形態において、画像またはビデオデータは、当初カメラアレイにより撮像された、十分なライトフィールドデータセットおよび他の有益な画像情報を含む。他の従来のフィルムフォーマットもまた、用いられうるであろう。記憶された画像またはビデオは、再生されてもよく、様々な有線または無線通信方法で他の装置へ転送されてもよい。
Claims (33)
- 半導体基板上に複数のセンサ素子を含んで作製されたカメラアレイであって、
前記半導体基板の第1の位置において作製され、少なくとも2つの第1の画像センサ素子を含む第1の撮像装置と、
前記半導体基板の第2の位置において作製され、前記第1の画像センサ素子と重複しない少なくとも2つの第2の画像センサ素子を含む第2の撮像装置と、を備えるカメラアレイ。 - 前記第1の撮像装置は、第1の画像特性を有し、前記第2の撮像装置は、前記第1の画像特性とは異なる第2の画像特性を有する、請求項1に記載のカメラアレイ。
- 前記第1の撮像装置は、第1の光スペクトルを透過する第1の光学フィルタを含み、前記第2の撮像装置は、第2の光スペクトルを透過する第2の光学フィルタを含む、請求項2に記載のカメラアレイ。
- 光学素子をさらに備え、
前記光学素子は、
前記第1の撮像装置に前記第1の光スペクトルで焦点を合わせる第1の構成を有する第1のレンズ素子と、
前記第2の撮像装置に前記第2の光スペクトルで焦点を合わせる第2の構成を有する第2のレンズ素子と、を備える請求項3に記載のカメラアレイ。 - ウェハレベルオプティクス(WLO)技術を用いて前記半導体基板上に作製された光学素子をさらに備える請求項1に記載のカメラアレイ。
- 前記第1の撮像装置は、第1の視野を占める第1の画像を生成し、前記第2の撮像装置は、第2の視野を占める第2の画像を生成し、前記第2の視野は、前記第1の視野に対するセンサ素子の大きさ以下の距離でシフトした請求項1に記載のカメラアレイ。
- 前記第1の画像特性は、前記第1の撮像装置の大きさ、前記第1の撮像装置に含まれるセンサ素子の種類、前記第1の撮像装置の形状、前記第1の撮像装置と関連付けられたフィルタ、前記第1の撮像装置の露出時間、前記第1の撮像装置と関連付けられた開口サイズ、前記第1の撮像装置と関連付けられた光学素子の構成、前記第1の撮像装置のゲイン、前記第1の撮像装置の解像度、および前記第1の撮像装置の動作時間のうち少なくとも1つを含む、請求項2に記載のカメラアレイ。
- 前記第1の撮像装置は、画像に対する色成分を生成し、前記第2の撮像装置は、画像に対する近赤外線成分を生成する、請求項1に記載のカメラアレイ。
- 前記第1の撮像装置は、第1の時間において第1の画像を撮像するように動作され、前記第2の撮像装置は、第2の時間において第2の画像を撮像するように動作される、請求項1に記載のカメラアレイ。
- 画像を生成する撮像機器であって、
半導体基板上に複数のセンサ素子を含んで作製され、前記半導体基板上の第1の撮像装置の第1の群および前記半導体基板上の第2の撮像装置の第2の群を含むカメラアレイであって、前記第1の撮像装置および前記第2の撮像装置それぞれは、複数の画像センサ素子を含み、前記第1の撮像装置それぞれは、第1の画像特性を有し、前記第2の撮像装置それぞれは、第2の画像特性を有する、カメラアレイと、
前記カメラアレイに接続され、第1の撮像装置により撮像された第1の画像および第2の撮像装置により撮像された第2の画像を受信し、前記第1の画像および前記第2の画像に基づいて合成画像を生成する、画像処理モジュールと、を備える撮像機器。 - 少なくとも1つの前記第1の撮像装置は、第2の視野に対してシフトされた第1の視野を、センサ素子の大きさ以下の距離で撮像し、前記第2の視野は、前記第1の撮像装置のうち他の撮像装置により撮像される、請求項10に記載の撮像機器。
- 前記画像処理モジュールは、前記第1の画像及び前記第2の画像で、前記第1の画像又は前記第2の画像の解像度よりも高い解像度を有する合成画像を得る超解像度処理を行う、請求項10に記載の撮像機器。
- 前記第1の撮像装置の前記第1の群は、第1の光スペクトルを透過する第1の光学フィルタを含み、前記第2の撮像装置の前記第2の群は、第2の光スペクトルを透過する第2の光学フィルタを含む、請求項10に記載の撮像機器。
- 前記カメラアレイは、ウェハレベルオプティクス(WLO)技術を用いて作製された複数の光学素子を備え、各光学素子は、前記第1の撮像装置および前記第2の撮像装置それぞれで集光する、請求項10に記載の撮像機器。
- 前記カメラアレイは、
第1の光スペクトルを透過する第1のフィルタと、
前記第1の撮像装置で前記第1の光スペクトルに焦点を合わせるように構成される第1の光学素子セットと、
第2の光スペクトルを透過する第2のフィルタと、
前記第2の撮像装置で前記第2の光スペクトルに焦点を合わせるように構成され、前記第1の光学素子セットとは異なる構成を有する、第2の光学素子セットと、を備える、請求項10に記載の撮像機器。 - 前記第1の撮像装置は、前記第1の画像に対する色成分を生成し、前記第2の撮像装置は、前記第2の画像に対する近赤外線成分を生成する、請求項10に記載の撮像機器。
- 前記カメラアレイにおいて撮像装置により撮像される画像は、前記カメラアレイにおいて他の撮像装置により撮像される画像からサブセンサ素子の距離で空間的にシフトされる、請求項10に記載の撮像機器。
- 前記カメラアレイにおける撮像装置の総数は、16個以上、36個以下である、請求項10に記載の撮像機器。
- 前記画像処理モジュールは、撮像装置の視野における差異によって生じる視差を検出および補償するモジュールを含む、請求項10に記載の撮像機器。
- 前記画像処理モジュールは、少なくとも校正データに基づいて、前記撮像装置の物理アドレスから論理アドレスへマッピングするアドレス変換モジュールをさらに備える、請求項19に記載の撮像機器。
- 前記第1の撮像装置は、フィルタを備え、前記第2の撮像装置は、フィルタを備えない、請求項10に記載の撮像機器。
- 前記カメラアレイは、緑フィルタを有する4個の撮像装置と、近赤外線フィルタまたはフィルタを有さない4個の撮像装置と、赤フィルタを有する4個の撮像装置と、青フィルタを有する4個の撮像装置と、を備える、請求項10に記載の撮像機器。
- 前記カメラアレイは、緑フィルタを有する9個の撮像装置と、近赤外線フィルタまたはフィルタを有さない8個の撮像装置と、赤フィルタを有する4個の撮像装置と、青フィルタを有する4個の撮像装置と、を備える、請求項10に記載の撮像機器。
- 前記第1の撮像装置は、近赤外線フィルタを含み、前記第2の撮像装置は、カラーフィルタを含み、前記第1の撮像装置により生成された第1の画像は、ノイズが低減されたカラー画像を生成するために、前記第2の撮像装置により生成された第2の画像と結合する、請求項10に記載の撮像機器。
- 前記第1の撮像装置は、赤、緑および青の光スペクトルのうちの1つを受光するフィルタを含み、前記第2の撮像装置の前記第2の群は、赤、緑および青の光スペクトルのうちの1つから、波長の所定量でシフトされた光スペクトルを受光するフィルタを含む、請求項10に記載の撮像機器。
- 画像を生成する方法であって、
半導体基板の第1の位置上に形成された第1の撮像装置における第1の画像を撮像するステップであって、前記第1の撮像装置は、複数のセンサ素子を含む、ステップと、
前記半導体基板の第2の位置上に形成された第2の撮像装置における第2の画像を撮像するステップであって、前記第2の撮像装置は、複数のセンサ素子を含む、ステップと、
第3の画像を得るために前記第1の画像および前記第2の画像を処理するステップと、を備える方法。 - 前記第1の撮像装置は、第1の画像特性を有し、前記第2の撮像装置は、前記第1の画像特性とは異なる第2の画像特性を有する、請求項26に記載の方法。
- 前記第1の画像は、第1の色の単色画像であり、前記第2の画像は、第2の色の単色画像である、請求項27に記載の方法。
- 第1の色に対応する第1の光スペクトルを透過するように構成される第1のレンズ素子により前記第1の撮像装置に集光するステップと、
第2の色に対応する第2の光スペクトルを透過するように構成される第2のレンズ素子により前記第2の撮像装置に集光するステップと、をさらに備える、請求項27に記載の方法。 - 前記第1の画像は、第1の露出レベルで撮像され、前記第2の画像は、前記第1の露出レベルよりも高い第2の露出レベルで撮像される、請求項26に記載の方法。
- 前記第1の画像および前記第2の画像を処理するステップは、前記第1の画像および前記第2の画像を超解像度処理するステップを備える、請求項26に記載の方法。
- 前記第1の画像および前記第2の画像を処理するステップは、前記第1の画像および前記第2の画像を結合するステップを備える、請求項26に記載の方法。
- 前記第1の画像および前記第2の画像を処理するステップは、パノラマ画像を生成するために前記第1の画像および前記第2の画像をステッチするステップを備える、請求項26に記載の方法。
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