GB859848A - Improvements in or relating to the formation of conductors on insulating supports - Google Patents

Improvements in or relating to the formation of conductors on insulating supports

Info

Publication number
GB859848A
GB859848A GB1319356A GB1319356A GB859848A GB 859848 A GB859848 A GB 859848A GB 1319356 A GB1319356 A GB 1319356A GB 1319356 A GB1319356 A GB 1319356A GB 859848 A GB859848 A GB 859848A
Authority
GB
United Kingdom
Prior art keywords
powder
insulating support
conductors
layer
april
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1319356A
Inventor
Herbert Edward Holman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMI Ltd
Electrical and Musical Industries Ltd
Original Assignee
EMI Ltd
Electrical and Musical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EMI Ltd, Electrical and Musical Industries Ltd filed Critical EMI Ltd
Priority to GB1319356A priority Critical patent/GB859848A/en
Publication of GB859848A publication Critical patent/GB859848A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

859,848. Printed circuits. ELECTRIC & MUSICAL INDUSTRIES Ltd. April 30, 1957 [April 30, 1956], No. 13193/56. Drawings to Specification. Class 93. [Also in Group XXXVI] - A method of forming conductors on an insulating support such as the material sold under the Registered Trade Mark "Paxolin" provided with a thin layer of an adhesive substance such as an elastomeric bonding resin comprises applying to said adhesive substance a thin layer of a finely divided metallic powder, e.g. bronze powder, applying to those areas of said layer of metallic powder between the positions of the required conductors a resist of insulating material such as shellac, wax, gum, or a bituminous compound or mixture which can be applied by silk screen printing, electrolytically depositing a conducting material, e.g. copper, on the exposed areas of the metal powder layer, and subsequently removing the resist and the metal powder thereunder, e.g. by immersion in a bath of solvent such as acetone which also penetrates the powder and softens and removes the adhesive. The insulating support may initially have holes drilled in it so that the inner walls of these holes may be coated in the same way as the surface. After washing, the conductor may be consolidated on the insulating support by heat and presssure.
GB1319356A 1956-04-30 1956-04-30 Improvements in or relating to the formation of conductors on insulating supports Expired GB859848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1319356A GB859848A (en) 1956-04-30 1956-04-30 Improvements in or relating to the formation of conductors on insulating supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1319356A GB859848A (en) 1956-04-30 1956-04-30 Improvements in or relating to the formation of conductors on insulating supports

Publications (1)

Publication Number Publication Date
GB859848A true GB859848A (en) 1961-01-25

Family

ID=10018539

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1319356A Expired GB859848A (en) 1956-04-30 1956-04-30 Improvements in or relating to the formation of conductors on insulating supports

Country Status (1)

Country Link
GB (1) GB859848A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996319A2 (en) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996319A2 (en) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards
EP0996319A3 (en) * 1998-10-19 2002-02-20 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards
US6548153B2 (en) 1998-10-19 2003-04-15 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards

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