GB738575A - Improvements in or relating to printed circuits - Google Patents

Improvements in or relating to printed circuits

Info

Publication number
GB738575A
GB738575A GB3000851A GB3000851A GB738575A GB 738575 A GB738575 A GB 738575A GB 3000851 A GB3000851 A GB 3000851A GB 3000851 A GB3000851 A GB 3000851A GB 738575 A GB738575 A GB 738575A
Authority
GB
United Kingdom
Prior art keywords
circuit
thermosetting material
organdie
dec
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3000851A
Inventor
John Albert Leno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB3000851A priority Critical patent/GB738575A/en
Publication of GB738575A publication Critical patent/GB738575A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

738,575. Printed circuits. STANDARD TELEPHONES & CABLES, Ltd. Dec. 12, 1952 [Dec. 21, 1951], No. 30008/51. Addition to 718,811. Drawings to Specification. Class 36. The conductivity of part or all of the tracks of a circuit printed on organdie according to the method disclosed in the parent Specification is increased by depositing good-conducting metal thereon by electrodeposition. Where two parts of a circuit on the same or different sheets of organdie are required to be joined they may be brought into contact, the conducting metal then being deposited to make electrical connection between -the two parts. The circuit may be attached to the surface of a sheet of insulating material, or embedded between two sheets of insulating material by an adhesive, by the application of heat and pressure or by softening the surface of the insulation with a solvent and then laying on or pressing in the circuit. Alternatively the circuit may be laid in a mould, which may contain a layer of thermosetting material, and which is then filled with thermosetting material and subjected to heat and pressure to cure the thermosetting material as disclosed in Specification 738,265.
GB3000851A 1951-12-21 1951-12-21 Improvements in or relating to printed circuits Expired GB738575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3000851A GB738575A (en) 1951-12-21 1951-12-21 Improvements in or relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3000851A GB738575A (en) 1951-12-21 1951-12-21 Improvements in or relating to printed circuits

Publications (1)

Publication Number Publication Date
GB738575A true GB738575A (en) 1955-10-19

Family

ID=10300762

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3000851A Expired GB738575A (en) 1951-12-21 1951-12-21 Improvements in or relating to printed circuits

Country Status (1)

Country Link
GB (1) GB738575A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3007997A (en) * 1958-07-01 1961-11-07 Gen Electric Printed circuit board
US3053929A (en) * 1957-05-13 1962-09-11 Friedman Abraham Printed circuit
US3184830A (en) * 1961-08-01 1965-05-25 Weldon V Lane Multilayer printed circuit board fabrication technique
WO1996038025A1 (en) * 1995-05-26 1996-11-28 The Secretary Of State For Defence Composite materials
GB2315042A (en) * 1995-05-26 1998-01-21 Secr Defence Composite materials

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3053929A (en) * 1957-05-13 1962-09-11 Friedman Abraham Printed circuit
US3007997A (en) * 1958-07-01 1961-11-07 Gen Electric Printed circuit board
US3184830A (en) * 1961-08-01 1965-05-25 Weldon V Lane Multilayer printed circuit board fabrication technique
WO1996038025A1 (en) * 1995-05-26 1996-11-28 The Secretary Of State For Defence Composite materials
GB2315042A (en) * 1995-05-26 1998-01-21 Secr Defence Composite materials
AU706346B2 (en) * 1995-05-26 1999-06-17 Qinetiq Limited Composite materials
US5932496A (en) * 1995-05-26 1999-08-03 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Composite materials

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