GB1054670A - - Google Patents

Info

Publication number
GB1054670A
GB1054670A GB1054670DA GB1054670A GB 1054670 A GB1054670 A GB 1054670A GB 1054670D A GB1054670D A GB 1054670DA GB 1054670 A GB1054670 A GB 1054670A
Authority
GB
United Kingdom
Prior art keywords
strips
terminal areas
substrate
july
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of GB1054670A publication Critical patent/GB1054670A/en
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

1,054,670. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. July 30, 1965 [July 31, 1964], No. 30315/64. Heading H1K. A method of encapsulating a semi-conductor device having a substrate 1 with discrete electrical terminal areas 2 on a major surface thereof, includes the steps of placing the substrate within a larger frame 3 having inwardly extending electrically conducting strips 4 each of which terminates over a different one of the terminal areas, directly bonding the end of each strip to the corresponding terminal area, providing a sealing enclosure wholly around the substrate so that the strips extend through the enclosure, and removing the frame from the strips. The terminal areas 2 are composed of a mixed film of vapour-phase deposited goldchromium expanded on a protective layer of silicon dioxide, and the strips 4, which are bonded to the terminal areas by microwelding, thermocompression bonding, brazing or soldering, are made of an alloy of cobalt, iron and nickel. The sealing enclosure may comprise ceramic caps 12, 13 each having a solder glass coating 14 on its rim by means of which the caps are sealed together. Alternatively the device may be potted in a suitable moulded material through which the strips extend.
GB1054670D 1964-07-31 Active GB1054670A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3031564 1964-07-31

Publications (1)

Publication Number Publication Date
GB1054670A true GB1054670A (en)

Family

ID=10305709

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1054670D Active GB1054670A (en) 1964-07-31

Country Status (2)

Country Link
DE (1) DE1514768B2 (en)
GB (1) GB1054670A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909480A1 (en) * 1968-03-01 1970-01-15 Gen Electric Semiconductor component and method for its manufacture

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2840973A1 (en) * 1978-09-20 1980-03-27 Siemens Ag METHOD FOR PRODUCING TESTABLE SEMICONDUCTOR MINIATURE HOUSING IN TAPE SHAPE

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909480A1 (en) * 1968-03-01 1970-01-15 Gen Electric Semiconductor component and method for its manufacture

Also Published As

Publication number Publication date
DE1514768B2 (en) 1972-05-10
DE1514768A1 (en) 1969-07-24

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