EP2653574A4 - Copper alloy and method for producing copper alloy - Google Patents
Copper alloy and method for producing copper alloyInfo
- Publication number
- EP2653574A4 EP2653574A4 EP11848127.4A EP11848127A EP2653574A4 EP 2653574 A4 EP2653574 A4 EP 2653574A4 EP 11848127 A EP11848127 A EP 11848127A EP 2653574 A4 EP2653574 A4 EP 2653574A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- producing
- producing copper
- alloy
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010276607 | 2010-12-13 | ||
PCT/JP2011/078786 WO2012081573A1 (en) | 2010-12-13 | 2011-12-13 | Copper alloy and method for producing copper alloy |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2653574A1 EP2653574A1 (en) | 2013-10-23 |
EP2653574A4 true EP2653574A4 (en) | 2014-09-10 |
EP2653574B1 EP2653574B1 (en) | 2017-05-31 |
Family
ID=46244672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11848127.4A Active EP2653574B1 (en) | 2010-12-13 | 2011-12-13 | Copper alloy and method for producing copper alloy |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130333812A1 (en) |
EP (1) | EP2653574B1 (en) |
JP (1) | JP5743165B2 (en) |
KR (1) | KR101576715B1 (en) |
CN (1) | CN103328665B (en) |
WO (1) | WO2012081573A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI515313B (en) * | 2010-12-13 | 2016-01-01 | 日本精線股份有限公司 | A copper alloy fine wire and copper alloy spring and a method of making the same |
KR102370860B1 (en) * | 2014-03-25 | 2022-03-07 | 후루카와 덴키 고교 가부시키가이샤 | Copper alloy sheet material, connector, and method for manufacturing copper alloy sheet material |
CN104532055A (en) * | 2014-11-21 | 2015-04-22 | 华南理工大学 | High nickel-content deformable aluminum white copper alloy material, and preparation method thereof |
CN104711451B (en) * | 2015-01-30 | 2017-04-12 | 湖南科技大学 | High temperature oxidation and heat resistant copper-nickel-based alloy |
EP3085799B1 (en) * | 2015-04-22 | 2018-01-17 | NGK Insulators, Ltd. | Copper alloy and method for manufacturing the same |
JP5925936B1 (en) * | 2015-04-22 | 2016-05-25 | 日本碍子株式会社 | Copper alloy |
CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
CN105088008A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Microalloyed copper alloy frame strip and manufacturing method thereof |
CN105316523A (en) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | Durable resistance alloy for milling machine regulator |
DE102016006824A1 (en) | 2016-06-03 | 2017-12-07 | Wieland-Werke Ag | Copper alloy and its uses |
EP3550044B1 (en) * | 2016-12-02 | 2021-03-24 | Furukawa Electric Co., Ltd. | Copper alloy wire rod and method for producing copper alloy wire rod |
EP3577247B1 (en) * | 2017-02-04 | 2022-09-14 | Materion Corporation | A process for producing copper-nickel-tin alloys |
JP6869119B2 (en) * | 2017-06-14 | 2021-05-12 | Dowaメタルテック株式会社 | Cu-Ni-Al-based copper alloy plate material, manufacturing method, and conductive spring member |
KR102450302B1 (en) * | 2017-06-22 | 2022-09-30 | 니폰 세이센 가부시키가이샤 | Copper alloy ultrafine wire for spring and manufacturing method thereof |
CN107653384A (en) * | 2017-08-31 | 2018-02-02 | 宋宏婷 | A kind of preparation method of in-situ preparation nickel aluminide enhancing Cu-base composites |
JP7202121B2 (en) * | 2018-09-27 | 2023-01-11 | Dowaメタルテック株式会社 | Cu-Ni-Al-based copper alloy plate material, manufacturing method thereof, and conductive spring member |
JP7181768B2 (en) * | 2018-11-13 | 2022-12-01 | Dowaメタルテック株式会社 | High Young's Modulus Cu--Ni--Al Copper Alloy Plate Material, Manufacturing Method Thereof, and Conductive Spring Member |
CN110551917B (en) * | 2019-09-29 | 2021-07-09 | 广东和润新材料股份有限公司 | High-conductivity corrosion-resistant copper strip and preparation method thereof |
JP7534883B2 (en) | 2020-07-29 | 2024-08-15 | Dowaメタルテック株式会社 | Cu-Ni-Al copper alloy sheet material, its manufacturing method and conductive spring member |
CN115094266B (en) * | 2022-07-05 | 2023-06-27 | 中南大学 | High-strength conductive elastic copper alloy and preparation method thereof |
CN116815009A (en) * | 2023-05-08 | 2023-09-29 | 大连理工大学 | Multi-component complex coherent precipitation strengthening Cu-Ni-Al-Cr-Ti high-temperature-resistant copper alloy and preparation method thereof |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2051127A (en) * | 1979-04-30 | 1981-01-14 | Delta Enfield Metals | Precipitation hardening copper alloys |
JPH02179839A (en) * | 1988-12-29 | 1990-07-12 | Kobe Steel Ltd | High strength copper alloy having excellent impact resistance |
JPH03126829A (en) * | 1989-10-06 | 1991-05-30 | Sumitomo Metal Mining Co Ltd | Non-pyrophoric copper alloy for tool |
JPH03173730A (en) * | 1989-12-01 | 1991-07-29 | Sumitomo Metal Mining Co Ltd | Nonpyrophoric copper alloy for tool |
JPH0499140A (en) * | 1990-08-03 | 1992-03-31 | Hitachi Ltd | Die material for plastic molding and its manufacture |
DE4226692A1 (en) * | 1991-08-13 | 1993-03-04 | Mitsubishi Materials Corp | Age-hardenable copper@ alloy - contains aluminium@, nickel@, silicon@, titanium@ and/or zirconium@, giving improved high-temp. tensile strength and electroconductivity |
JPH07268512A (en) * | 1994-03-30 | 1995-10-17 | Mitsubishi Materials Corp | Heat resisting copper alloy having excellent thermal conductivity, high-temperature hardness and oxidation resistance and firing mold consisting of such heat resisting copper alloy |
JP2010007174A (en) * | 2008-05-29 | 2010-01-14 | Nippon Mining & Metals Co Ltd | Cu-Ni-Si-BASED ALLOY PLATE OR BAR FOR ELECTRONIC MATERIAL |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2851353A (en) * | 1953-07-15 | 1958-09-09 | Ibm | Copper-base alloys |
US4378332A (en) * | 1981-06-15 | 1983-03-29 | Ford Motor Company | Aluminum hardened copper alloy |
US4692192A (en) * | 1984-10-30 | 1987-09-08 | Ngk Insulators, Ltd. | Electroconductive spring material |
JPH0238653B2 (en) * | 1986-01-27 | 1990-08-31 | Kobe Steel Ltd | PURASUCHITSUKUKANAGATAYODOGOKINOYOBISONOSEIZOHOHO |
JPS63210247A (en) * | 1987-02-27 | 1988-08-31 | Sumitomo Metal Mining Co Ltd | High strength copper alloy |
JPS63266033A (en) * | 1987-04-23 | 1988-11-02 | Mitsubishi Electric Corp | Copper alloy |
JP3383615B2 (en) * | 1999-08-05 | 2003-03-04 | 日鉱金属株式会社 | Copper alloy for electronic materials and manufacturing method thereof |
JP3465108B2 (en) | 2000-05-25 | 2003-11-10 | 株式会社神戸製鋼所 | Copper alloy for electric and electronic parts |
JP4728704B2 (en) | 2005-06-01 | 2011-07-20 | 古河電気工業株式会社 | Copper alloy for electrical and electronic equipment |
EP1873266B1 (en) * | 2005-02-28 | 2012-04-25 | The Furukawa Electric Co., Ltd. | Copper alloy |
JP4501818B2 (en) | 2005-09-02 | 2010-07-14 | 日立電線株式会社 | Copper alloy material and method for producing the same |
JP4408275B2 (en) * | 2005-09-29 | 2010-02-03 | 日鉱金属株式会社 | Cu-Ni-Si alloy with excellent strength and bending workability |
JP2007126739A (en) | 2005-11-07 | 2007-05-24 | Nikko Kinzoku Kk | Copper alloy for electronic material |
JP2008266787A (en) | 2007-03-28 | 2008-11-06 | Furukawa Electric Co Ltd:The | Copper alloy material and its manufacturing method |
JP4440313B2 (en) | 2008-03-31 | 2010-03-24 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr alloy for electronic materials |
JP5261122B2 (en) | 2008-10-03 | 2013-08-14 | Dowaメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
TWI515313B (en) * | 2010-12-13 | 2016-01-01 | 日本精線股份有限公司 | A copper alloy fine wire and copper alloy spring and a method of making the same |
-
2011
- 2011-12-13 WO PCT/JP2011/078786 patent/WO2012081573A1/en active Application Filing
- 2011-12-13 JP JP2012548789A patent/JP5743165B2/en active Active
- 2011-12-13 US US13/993,642 patent/US20130333812A1/en not_active Abandoned
- 2011-12-13 KR KR1020137015270A patent/KR101576715B1/en active IP Right Grant
- 2011-12-13 EP EP11848127.4A patent/EP2653574B1/en active Active
- 2011-12-13 CN CN201180059926.2A patent/CN103328665B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2051127A (en) * | 1979-04-30 | 1981-01-14 | Delta Enfield Metals | Precipitation hardening copper alloys |
JPH02179839A (en) * | 1988-12-29 | 1990-07-12 | Kobe Steel Ltd | High strength copper alloy having excellent impact resistance |
JPH03126829A (en) * | 1989-10-06 | 1991-05-30 | Sumitomo Metal Mining Co Ltd | Non-pyrophoric copper alloy for tool |
JPH03173730A (en) * | 1989-12-01 | 1991-07-29 | Sumitomo Metal Mining Co Ltd | Nonpyrophoric copper alloy for tool |
JPH0499140A (en) * | 1990-08-03 | 1992-03-31 | Hitachi Ltd | Die material for plastic molding and its manufacture |
DE4226692A1 (en) * | 1991-08-13 | 1993-03-04 | Mitsubishi Materials Corp | Age-hardenable copper@ alloy - contains aluminium@, nickel@, silicon@, titanium@ and/or zirconium@, giving improved high-temp. tensile strength and electroconductivity |
JPH07268512A (en) * | 1994-03-30 | 1995-10-17 | Mitsubishi Materials Corp | Heat resisting copper alloy having excellent thermal conductivity, high-temperature hardness and oxidation resistance and firing mold consisting of such heat resisting copper alloy |
JP2010007174A (en) * | 2008-05-29 | 2010-01-14 | Nippon Mining & Metals Co Ltd | Cu-Ni-Si-BASED ALLOY PLATE OR BAR FOR ELECTRONIC MATERIAL |
Non-Patent Citations (4)
Title |
---|
"Mechanical Properties of Intermetallic Compounds Formed Between Tin (Solder) and Copper or Nickel - Hardness as a function of temperature for Cu6Sn5, Cu3Sn, and Ni3Sn4", 23 July 2014 (2014-07-23), pages 1 - 2, XP002727695, Retrieved from the Internet <URL:https://www.msed.nist.gov/mechanical_properties/solder_mechanicalprop.html> [retrieved on 20140723] * |
GRYZIECKI JANUSZ ET AL: "The role of microadditions in the kinetic change of precipitation during the aging process of nickel-aluminium bronze", ARCHIVES OF METALLURGY,, vol. 48, no. 3, 31 December 2003 (2003-12-31), pages 245 - 259, XP009179304 * |
See also references of WO2012081573A1 * |
ZHU ZHI-YUAN ET AL: "Solid solution and aging of Cu-Ni-Al-Si alloy", JINSHU RECHULI - HEAT TREATMENT OF METALS, ZHONGGUO JIXIE GONGCHENG XUEHUI, RECHULI XUEHUI, BEIJING, CN, vol. 32, no. 4, 31 December 2007 (2007-12-31), pages 83 - 85, XP009179303, ISSN: 0254-6051 * |
Also Published As
Publication number | Publication date |
---|---|
KR20130089661A (en) | 2013-08-12 |
KR101576715B1 (en) | 2015-12-10 |
CN103328665B (en) | 2016-04-13 |
EP2653574A1 (en) | 2013-10-23 |
US20130333812A1 (en) | 2013-12-19 |
EP2653574B1 (en) | 2017-05-31 |
CN103328665A (en) | 2013-09-25 |
WO2012081573A1 (en) | 2012-06-21 |
JP5743165B2 (en) | 2015-07-01 |
JPWO2012081573A1 (en) | 2014-05-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2653574A4 (en) | Copper alloy and method for producing copper alloy | |
EP2597169A4 (en) | Aluminium alloy conductor and manufacturing method for same | |
EP2610359A4 (en) | Copper alloy sheet and method for producing same | |
EP2570505A4 (en) | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device | |
EP2728024A4 (en) | Silver-white copper alloy and method for manufacturing silver-white copper alloy | |
EP2554693A4 (en) | Cu-ni-si-co copper alloy for electronic material and process for producing same | |
EP2610358A4 (en) | Copper alloy sheet and manufacturing method for same | |
HK1177716A1 (en) | Aluminum copper clad material and manufacturing method thereof | |
EP2641983A4 (en) | Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRON MATERIAL AND METHOD FOR PRODUCING SAME | |
EP2752498A4 (en) | Copper alloy material and manufacturing method thereof | |
EP2761042A4 (en) | Leadless free-cutting copper alloy and method for producing the same | |
EP2759612A4 (en) | Copper alloy sheet and method for producing copper alloy sheet | |
ZA201203935B (en) | Method for producing low aluminium titanium-aluminium alloys | |
EP2455501A4 (en) | Method for producing alloy ingots | |
EP2570506A4 (en) | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device | |
EP2670875A4 (en) | Copper alloy material for seawater and method for preparing same | |
EP2772560A4 (en) | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment | |
EP2559777A4 (en) | Cu-si-co alloy for electronic materials, and method for producing same | |
EP2692878A4 (en) | Cu-si-co-base copper alloy for electronic materials and method for producing same | |
PL2552630T3 (en) | Method for producing shaped bodies from aluminium alloys | |
EP2679694A4 (en) | Ti-mo alloy and method for producing same | |
IL214202A (en) | Method for producing metal powders | |
EP2479297A4 (en) | Copper alloy wire and process for producing same | |
EP2528704A4 (en) | Method and arrangement for producing metal powder | |
EP2623619A4 (en) | Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING SAME |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130708 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: OMORI TOSHIHIRO Inventor name: SATO HIROKI Inventor name: KAINUMA RYOSUKE Inventor name: ISHIDA KIYOHITO Inventor name: MIYAMOTO TAKASHI Inventor name: OHNUMA IKUO |
|
DAX | Request for extension of the european patent (deleted) | ||
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01B 1/02 20060101ALI20140730BHEP Ipc: C22F 1/08 20060101ALI20140730BHEP Ipc: C22C 9/06 20060101AFI20140730BHEP Ipc: C22C 9/01 20060101ALI20140730BHEP |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140811 |
|
17Q | First examination report despatched |
Effective date: 20150318 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20161220 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 897551 Country of ref document: AT Kind code of ref document: T Effective date: 20170615 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602011038432 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: FP |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 897551 Country of ref document: AT Kind code of ref document: T Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170831 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170901 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170831 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170930 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602011038432 Country of ref document: DE |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20180301 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20171213 Ref country code: MT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20171213 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20180831 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20171231 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20180102 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20171213 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20171231 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20171231 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20171231 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20111213 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R082 Ref document number: 602011038432 Country of ref document: DE Representative=s name: MANITZ FINSTERWALD PATENT- UND RECHTSANWALTSPA, DE Ref country code: DE Ref legal event code: R082 Ref document number: 602011038432 Country of ref document: DE Representative=s name: HL KEMPNER PATENTANWALT, RECHTSANWALT, SOLICIT, DE |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R082 Ref document number: 602011038432 Country of ref document: DE Representative=s name: MANITZ FINSTERWALD PATENT- UND RECHTSANWALTSPA, DE |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230519 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20231220 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20231220 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20240227 Year of fee payment: 13 |